Abstract: A ceramic heater for a gas sensor has a heater substrate, a laminating substrate made of the same material as the heater substrate, and an electrode made of platinum and at least one lanthanide oxide disposed between the heater substrate and the laminating substrates. The ceramic heater exhibits improved durability without migration patterns, is free of cracks on the substrate, is free of short circuits in the heat electrode and is low in production cost.

Abstract: An electrically resistive heating element for liquids and a method of fabricating same. The heating element comprises a substrate formed of an electrically insulating material or formed of an electrically conductive material provided with an electrically insulating coating, whereby in both cases the substrate presents an electrically non-conductive surface on at least one side. First and second laterally spaced contact areas are disposed over the electrically non-conductive surface and a thermally sprayed resistive oxide layer is applied to the electrically non-conductive surface and disposed over or under parts of the contact areas to enable an electric current to be passed through the resistive oxide layer via these first and second contact areas.

Abstract: A force transducer includes an elongated lever arm attached to a substrate having a central portion and substantially planar tab regions that project outwardly from the central portion along first and second orthogonal force-detecting axes. The substrate undergoes localized strain approximately at the junctions of the tab regions and the central portion when an external force is applied to the free end of the lever arm. A thick film strain gauge material is screen printed directly onto the substrate in at least a first location and a second location and conductive pads on the substrate are electrically coupled to the thick film strain gauge material at each location to define a first strain gauge oriented along the first force detecting axis and a second strain gauge oriented along the second force detecting axis. The lever arm can be of a compliant construction to provide proprioreceptive feedback to a user.

Abstract: A connecting board to be interposed between a base plate and a mounting board for bonding or joining them together is provided. A connecting board has a heating wire disposed inside a substrate thereof, a plurality of soft metal bodies which are easily deformable, and a first solder layer and a second solder layer formed on a first surface side protruded portion and a second surface side protruded portion of each of the soft metal bodies. By energizing the heating wire and melting the first and second solder layers, the connecting board can be bonded on a first surface side of the substrate to the base plate and on a second surface side of the substrate to the mounting board all at once. By energizing the heating wire, the base plate and/or mounting board can be separated from the connecting board with ease.

Abstract: In a method of manufacturing a multilayered ceramic substrate, a capacitor layer is formed on a green sheet of a low temperature co-firable ceramic by means of printing. The green sheet with the capacitor layer and a plurality of other green sheets are laminated together into a substrate laminate. Two release green sheets of alumina system each unsintered below 1,000.degree. C. are further laminated to the top and the bottom of the substrate laminate respectively. The obtained laminate is fired at a temperature ranging between 800.degree. and 1,000.degree. C. under pressure ranging between 2 and 20 kgf/cm.sup.2. The release green sheets adherent to the side surfaces of the substrate are removed after the firing. Subsequently, a wiring pattern is printed on the substrate, which is then fired at a temperature ranging between 800.degree. and 1,000.degree. C.

Abstract: A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.

Abstract: A resistor trimming method includes the steps of: forming a first slit from an edge of a resistor interconnecting first and second electrodes provided on an insulating substrate in the proximity of and parallel to the first electrode; forming a second slit as a continuation of the first slit toward to the second electrode perpendicularly to the first slit; forming a third slit from a point of the edge of the resistor and parallel to the first electrode, the point being shifted from the first slit toward the second electrode, the third slit having a greater length than the first slit in a direction along the first electrode; and forming a fourth slit as a continuation of the third slit toward to the second electrodes perpendicularly to the first slit.

Abstract: The present invention involves adding additional structures to a polysilicon resistor which do not significantly affect the resistance of the polysilicon resistor. These additional structures add to the area of the polysilicon resistor, and therefore reduce the self-induced temperature change caused by the voltage across the resistor. Since the resistance of the polysilicon resistor depends on its temperature, the reduction of the self-induced temperature change lowers the variation in the resistance value at different voltages.

Abstract: A thermistor type temperature sensor having a substrate made from an electrically insulating ceramic plate. A thin or thick film detecting resistor is printed on the substratum. A thick or thin film pull-up resistor may also be printed on the substratum, and trimming of the resistors is possible. The ratio of B-constant values for the detecting resistor and the pull-up resistor may be selected so that it is locate between 0.4 to 0.9 or 1.1 to 1.5. The detecting resistor may be constructed from thermistor sections of the same composition and the sections may be connected in parallel or in series. The thermistor sensor can be connected to the pipe through which a gas passes. When the sensor is connected to the pipe, the angle of the measuring plane may be adjusted, so that a precise measurement can be obtained.

Abstract: A heater includes a base plate, and a resistor, extending in a longitudinal direction of the base plate, for generating heat when a power supply is applied thereto. A recess, such as a hole or groove, is formed in the base plate in a longitudinal portion of the resistor, to bias the base plate to break at the longitudinal portion and to open a circuit including the power supply and the resistor, to safely prevent overheating or smoking of the heater.

Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.

Abstract: A process for producing an electric heating element is disclosed whereby metallic heating conductors are embedded between ceramic insulating layers, and, as power supply leads and power outlet leads, contact recesses in the ceramic insulating layers are filled with an electrically conductive composition. The heating conductors, the power supply leads and the power outlet leads are applied to the ceramic layers in the green state as metallizing paste containing from 60 to 95% by weight of metal particles and from 5 to 40% by weight of inorganic powder, based on the total solids content of the paste. The ceramic layers with the applied metallizing pastes are then stacked on top of one another and then sintered.

Abstract: A kettle which includes a vessel that provides a chamber for holding water, a pouring spout for dispensing water from the chamber, and a handle for lifting and tilting the vessel during pouring, also includes an electric heating element in the form of a conductive track of a thick film printed circuit on a metal substrate that forms a heated portion of the vessel, the electric heating element being located externally of the chamber.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: A polysilicon resistor structure and a method by which the polysilicon resistor structure may be formed. A polysilicon resistor is formed upon the surface of a semiconductor substrate. A pair of dummy polysilicon layers is formed along opposite edges and separated from the polysilicon resistor. A pair of metal sidewalls is then formed upon the upper surfaces of the pair of dummy polysilicon layers, and a top metal layer is formed bridging the upper surfaces of the pair of metal sidewalls. The pair of dummy polysilicon layers, the pair of metal sidewalls and the top metal layer form an open ended cavity upon the semiconductor substrate within which structure the polysilicon resistor resides. The polysilicon resistor is separated from the structure by an insulating material which is not susceptible to outgassing of hydrogen.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: An inverted thin film resistor structure comprises a metallic interconnect layer having predetermined patterns delineating two or more metallic interconnect leads (e.g. Al 36) overlaying a supporting layer (e.g. SiO.sub.2 32), an interlevel dielectric layer (e.g. SiO.sub.2 40) overlaying the supporting layer, and planarized so as to expose a top contact portion of the metallic interconnect leads, and an inverted thin film resistor (e.g. TaN 44) overlaying a portion of the planarized interlevel dielectric layer and overlaying the exposed top contact portions of the metallic interconnect leads. The novel inverted thin film resistor structure does not require a protective metal layer and does not require any vias in direct contact with the resistor. In addition, both the thin film resistor and the metallic interconnect can be formed with pattern and etch techniques.

Abstract: A resistive body of a hybrid integrated circuit has a resistance pattern on a resin film. Bonding pads permit connection of current through the resistance pattern. The resistance pattern may form part of a detecting bridge for overcurrent detection. One embodiment of the invention uses a rectangular resistance pattern with an opening in the center to force current to flow on a perimeter path for minimizing maximum temperature. Another embodiment uses a serpentine resistance pattern. A face-down resistance patter reduces interference. A direct-connection bonding pad reduces the voltage generated in a parasitic capacitance to improve the resistance of the resin film to voltage breakdown.

Abstract: A design and fabrication methodology, for silicon micromachined micro-hotplates which are manufactured using commercial CMOS foundries techniques with additional post-fabrication processing. The micro-hotplates are adaptable for a host of applications. The methodology for the fabrication of the micro-hotplates is based on commercial CMOS compatible micromachining techniques. The novel aspects of the micro-hotplates are in the design, choice and layout of the materials layers, and the applications for the devices. The micro-hotplates have advantages over other similar devices in the manufacture by a standard CMOS process which include low-cost and easy integration of VLSI circuits for drive, communication, and control. The micro-hotplates can be easily incorporated into arrays of micro-hotplates each with individualized circuits for control and sensing for independent operation.

Abstract: A thick film hydrogen sensor element includes an essentially inert, electrically-insulating substrate having deposited thereon a thick film metallization forming at least two resistors. The metallization is a sintered composition of Pd and a sinterable binder such as glass frit. An essentially inert, electrically insulating, hydrogen impermeable passivation layer covers at least one of the resistors.

Abstract: In an oxygen sensor of the type having an oxygen ion conductive tube of solid electrolyte, a ceramic heater disposed within the oxygen ion conductive tube for heating the same is in the form of a quadrangular prism or a bar of a rectangular cross section. The ceramic heater is formed by piling up ceramic green sheets with metallic thick-film patterns for heat generating resistors interposed between adjacent two of the ceramic green sheets. The ceramic heater is so shaped as to satisfy the relation of b/a=0.75.about.1 where "a" is the width and "b" is the thickness of the ceramic heater. The metallic thick films, which the metallic thick-film patterns are turned to by firing, are arranged so as to be parallel to the side surfaces opposed in the thickness direction of the ceramic heater.

Abstract: An improved temperature sensor is designed for the sensitive detection of temperature changes. The temperature sensor includes a frame 9 of monocrystalline silicon and a dielectric diaphragm 13 stretched on it. A monocrystalline silicon structure 35 is disposed on or under the dielectric diaphragm which is used for measuring the temperature. In the course of this, the Seebeck effect, as well as the temperature dependence of the electrical resistance, can be used for detection of any temperature changes.

Abstract: A manufacturing method for a thin film resistor is disclosed. An insulating layer is formed on a substrate having a contact region. The insulating layer above the contact region is removed by etching to expose the contact region. A metal layer and an interlayer are then formed in sequence on the surface of the structure. The metal layer and the interlayer above the region where the resistor will be formed is next removed, and then a resistor layer is formed on the surface of the structure. The thin film resistor is completed by etching away the resistor layer except for the predetermined region where the resistor is to be formed.

Abstract: A positive temperature coefficient temperature sensor for use in exhaust-gas systems of internal-combustion engines includes a sensor element having a multilayer laminate composite structure with a positive temperature coefficient thermistor, formed by at least two resistor tracks arranged one above another and electrically insulated from one another. One of the layers of the multilayer structure is an insulating ceramic base film, and a first one of the at least two resistor tracks, with a supply lead, is printed onto the insulating ceramic base film. A second one of the at least two resistor tracks is disposed separately on the insulating ceramic base film by means of at least one insulating layer printed above the first one of the at least two resistor tracks. The at least two resistor tracks disposed one above another are connected by a land guided through the at least one insulating layer.

Abstract: An inverted thin film resistor structure comprises a metallic interconnect layer having predetermined patterns delineating two or more metallic interconnect leads (e.g. Al 36) overlaying a supporting layer (e.g. SiO.sub.2 32), an interlevel dielectric layer (e.g. SiO.sub.2 40) overlaying the supporting layer, and planarized so as to expose a top contact portion of the metallic interconnect leads, and an inverted thin film resistor (e.g. TaN 44) overlaying a portion of the planarized interlevel dielectric layer and overlaying the exposed top contact portion of the metallic interconnect leads. The novel inverted thin film resistor structure does not require a protective metal layer and does not require any vias in direct contact with the resistor. In addition, both the thin film resistor and the metallic interconnect can be formed with pattern and etch techniques.

Abstract: A hydrogen sensor element comprises an essentially inert, electrically-insulating substrate having a thin-film metallization deposited thereon which forms at least two resistors on the substrate. The metallization comprises a layer of Pd or a Pd alloy for sensing hydrogen and an underlying intermediate metal layer for providing enhanced adhesion of the metallization to the substrate. An essentially inert, electrically insulating, hydrogen impermeable passivation layer covers at least one of the resistors, and at least one of the resistors is left uncovered. The difference in electrical resistances of the covered resistor and the uncovered resistor is related to hydrogen concentration in a gas to which the sensor element is exposed.

Abstract: A double sided primed circuit board is shown wherein one side is etched for receiving a plurality of surface mounted components constituting a control circuit. In one embodiment the control circuit provides for regulating the operation of a plurality to the beverage dispensing valves. An op-amp monitors the conductor for sensing the operation of the beverage dispensing valves as a function of a voltage drop there across. The conductor operates as a resistor, and any heating thereof that occurs as a result of the operation of the beverage dispensing valves is dissipated over the entire surface area of the circuit board. The control circuit also operates a dump valve for periodically dumping beverage if any of the valves have not been operated for a set period of time. The control circuit deactivates the operation of the dump valve during any sensed operation of one of the beverage dispense valves.

Abstract: The material to be used in a semiconductor resistor is produced by successively depositing multiple layers of substantially intrinsic polycrystalline semiconductor material. The deposition process is stopped between layers to create an interruption of the polycrystalline structure of the semiconductor material. This interruption reduces the modulation experienced by the resistor when it is located above an underlying conductor in a semiconductor circuit. Such a configuration typically exists in a memory cell where the load resistor of a field-effect transistor is located over the gate of the transistor.

Abstract: Planar forms of chemically-sensitive materials have been combined, under temperature control, with the pixels of a specially-designed micro-hotplate array to produce a miniature device capable of analyzing chemical mixtures. The device uses integrated multiple elements having different adsorption properties and temperatures to collectively achieve chemical selectivity in sensing. The method of making and using selectively in sensing. The device of the present invention is manufactured by standard CMOS foundry techniques which allow the production of a range of devices that have improved sensing performance.

Abstract: A resistor bank consisting of a group of resistors formed on the surface of die, all electrically connected together in parallel. All of the resistors have identical individual resistances, but each has a unique energy dissipating capacity. When an event subjects the resistor bank to a surge of current, some of the resistors blow out, thereby changing the resistance of the bank. By measuring the resistance of the bank before and after an event the energy of the surge can be determined.

Abstract: A thin film resistor with an insulating layer disposed between a substrate material and a resistor material is disclosed. Also, disclosed is a technique for fabricating this thin film resistor. In accordance with the preferred embodiment, the thin film resistor employs an insulating layer of silicon nitride with a thickness of 2000 .ANG.. The insulating layer prevents the resistor layer from diffusing into the substrate material which, in turn, significantly reduces variations in the resistor value during accelerated life testing. Compared to thin film resistors with a resistor layer evaporated directly upon a substrate material, reliability is increased from a few hundred hours up to thousands of hours. Also, the maximum current handling capability is increased by greater than one order of magnitude, which results in a thin film resistor which requires less surface area of a wafer.

Abstract: A heater for heating a moving sheet material by contact therewith is used, for example, in electrophotographic apparatus for fixing toner to printing paper. The heater comprises an insulating substrate formed with a striplike heating element on its upper surface, and a support plate for supporting the substrate. A higher heat preserving property is given to the opposite end portions of the heating element than to a longitudinal intermediate portion thereof to thereby compensate for a temperature reduction at the element end portions and make the heating element uniform in temperature over the entire length thereof.

Abstract: A printed circuit board includes a wiring pattern formed on an insulating board according to a predetermined electric circuit, and a cover member covering a portion of the wiring pattern used as a contact, the cover member being formed of an electrically conductive and non-solderable material. Due to the presence of the covering member, the wiring pattern portion is not covered with solder when the printed circuit board is subjected to dip soldering to attach various electric components to the printed circuit board. Since the covering member is electrically conductive, the wiring pattern portion can readily be used as a contact when the dip soldering is completed.

Abstract: Multilayer, thin film multijunction integrated micropotentiometers are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, integrated structures are formed to include either single elongate heater elements, bifilar heater elements, or trifilar heater elements with multiple return paths. Multijunction thermopiles and resistors are formed with the heater. The individual layers of silicon oxide or silicon nitride, are formed with conventional chemical vapor deposition, sputtering and other known techniques.

Abstract: A submicron resistor having negligible parasitic capacitance includes an isolated released beam carried on a single crystal silicon wafer. The resistor is fabricated by defining a resistor region in the substrate, doping the region to produce the desired resistivity, and etching around the region to produce a resistive island. The island is then isolated from the substrate by oxidation, and is released by removing the oxide to produce an isolated, released resistor beam.

Abstract: A heater comprises an insulating substrate which carries a pair of transversely conductor strips, a resistor line extending between the respective conductor strips. The respective conductor strips are connected to the resistor line by electrode teeth spaced longitudinally of the main resistor line and arranged in staggered relation on both sides of the resistor line.

Abstract: A layer of ceramic material such as alumina is plasma-deposited on a sheet member such as molybdenum or a composite laminate of molybdenum and graphite or other material of low thermal expansion to form a circuit unit substrate having a thick, adherent, electrically-insulating coating on a light, rigid and thermally-conducting base. Thick and thin film materials are deposited and fired on the insulating coating to provide conductors, insulators or resistors or the like in a circuit unit. The materials of the sheet member and of the insulating coating are selected to have matching thermal expansion coefficients so that the substrate remains flat and free of bowing during the firing of the thick and thin film materials. The plasma-deposited electrically-insulating layer is sealed to prevent moisture absorption during use.

Abstract: The present invention relates to a resistance unit for controlling a motor speed of driving a blower of an automobile air conditioner. The resistance unit includes a resistance circuit board printing a plurality of resistors in the form of double layers on both sides thereof, a supporting plate for mounting the board and a plurality of lead frames each of which is electrically connected to a corresponding terminal of the resistors, and a socket, combined with the supporting plate, taking a part of each lead frame therein.

Abstract: A thick film resistive element superior in moisture resistance characteristic is provided, which includes a pair of film-like conductors formed on an insulating substrate, a film-like resistor formed on the substrate so as to be partially laminated on the electrode portions of the pair of conductors thereby covering the surfaces of the electrode portions, and a first covering member formed of a material containing a crystal glass as a main ingredient thereof which covers the other portions of the pair of conductors than said electrode portions. As a result, there does not exist such an area that is covered with a porous amorphous glass film only, so that even if a protection film of an organic resin is not provided, there is no possibility that the moisture in the application environment affects on the conductors to degrade the insulation resistance therebetween.

Abstract: An SMD-resistor includes a ceramic substrate having two main faces, two side faces and two end faces which are intergranular fracture faces, two contact layers provided on two ends of a main face adjoining the end faces, a resistive layer situated on this main face and electrically contacting both contact layers are two end contacts, covering both end faces and electrically contacting the contact layers.

Abstract: The effective parasitic end resistance of small-value precision integrated circuit resistors is reduced by providing N resistors connected in parallel and causing at least two of the resistors to share a terminal contact. The resulting integrated circuit resistor includes multiple terminal contacts of any number n greater than two. Of the n terminal contacts, N-1 terminal contacts are shared amongst said resistors. The parasitic end resistances are diminished by a factor equal to the number of resistors connected in parallel. By increasing the length of the active area of the N resistors by a factor equal to the number of the resistors, the desired resistance value remains undiminished. As a result, the parasitic end resistances may be made negligible compared to the desired resistance even for small value resistors.

Abstract: This is to introduce a strain sensor of high quality and excellent durability. This strain sensor is composed of a basic metal body, a crystallized glass layer formed over the surface of the basic metal body, and a resistance element that changes its resistance value by strain changes and is built on the glass layer surface. By this structure, where the crystallized glass layer fired at a high temperature is employed, both of the composition, the basic metal body and the glass layer, are fused with each other at the boundary plane, making their adhesion very strong. No peeling between the basic metal body and the glass layer will take place even under the severe environmental conditions such as high temperature and heavy load.

Abstract: A semiconductor processing method of forming a resistor device includes, a) providing a layer of conductively doped polysilicon atop a substrate to a selected thickness, the layer of polysilicon having an upper surface and a base, the layer of polysilicon having grain boundaries therewithin which extend from the upper surface to the base and define polysilicon grains; b) oxidizing the polysilicon layer at a temperature from about 850.degree. C. to about 1050.degree. C. for a selected period of time to form SiO.sub.x within the polysilicon layer along the grain boundaries and down to the base to separate individual grains of polysilicon within the layer; and c) patterning the oxidized polysilicon layer to form a resistor device within an integrated circuit.

Abstract: A thin-film thermistor element which has an electrically insulating substrate having first and second surfaces opposite to each other and also having a pair of through-holes defined therein so as to extend completely across the thickness thereof, and a pair of electrode films each including a body portion of large surface area and a generally comb-shaped portion continued outwardly from the body portion. The electrode films are formed by the use of a firing process on the first surface of the substrate with the respective comb-shaped portions thereof confronting with each other. First and second electroconductive films are also formed on respective surrounding wall faces defining the corresponding through-holes in the substrate in electrically connected relationship with the body portions of the associated electrode films. A temperature sensitive resistance film is formed by the use of a high frequency sputtering process on the first surface of the substrate so as to overlay the electrode films.

Abstract: An electrical resistor which is fabricated from traces of resistive material on a substrate of insulating material. The traces are interconnected electrically in series by first links and in parallel by second alternating links, which are connected to different terminals on the substrate. The second links are cut, preferably by laser trimming, so as to select the value of resistance of the resistor by reducing the number of traces connected in parallel and increasing the number of traces connected in series. Where the resistance of each trace is "R", the value of the resistance is adjustable by severing the second links from R/n to nR, where n is the number of traces.

Abstract: A resistor in an integrated circuit having a conductive shield layer between the resistor and an insulative layer. The contacts of the resistor may also contact the conductive shield layer. The shield layer may be formed during a single or double level polysilicon bipolar transistor fabrication process.

Abstract: A PTC resistive strip is mounted on a wall of a washer tub. Water in the tub carries away heat from the energized strip thereby reducing its resistance. The water level in the tub is measured by measuring the voltage drop across the strip. The resistance of the strip can be compared to the resistance across a variable resistance or resistor to indicate that the water has reached a desired level. A comparator output can be used to control the water level and washer motor operation via a control circuit which operates the water supply valves and motor switch. A second PTC resistive element is also provided for sensing overfill.

Abstract: In a thick film water track, irrespective of track thickness or the material of which the track is constructed, the optimum track width is found to be in the range of from 1.2 mm to 2.1 mm. Further, for a given resistance, the track is longer and may be conformed to a pattern to give improved temperature distribution. Additionally disclosed is a heating element having a number of thick film electrically resistive tracks applied to the surface of an electrically insulative substrate and a switch for selectively connecting one or more of the tracks to a power supply. The resistance and hence the operating temperature of the heating element may be varied by changing the track or tracks connected to the switch.

Abstract: Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.

Abstract: A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value, each is provided at its ends with a termination of a composition similar to that used for the low value resistors. This provides a relatively low resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The composition of high and low resistivities are adapted to permit firing of both compositions in a single firing step.