Resistance Element Extends Through Base Patents (Class 338/310)
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Patent number: 9059168Abstract: An adjustable meander line resistor comprises a plurality of series circuits. Each series circuit comprises a first resistor formed on a first doped region of a transistor, a second resistor formed on a second doped region of the transistor and a connector coupled between the first resistor and the second resistor. A control circuit is employed to control the on and off of the transistor so as to achieve the adjustable meander line resistor.Type: GrantFiled: February 2, 2012Date of Patent: June 16, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsiao-Tsung Yen, Yu-Ling Lin
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Patent number: 8624356Abstract: A group III nitride semiconductor substrate production method includes preparing a bulk crystal formed of a group III nitride semiconductor single crystal. The group III nitride semiconductor single crystal has one crystalline plane and an other crystalline plane. Hardness of the other crystalline plane is smaller than hardness of the one crystalline plane. The prepared bulk crystal is cut from the other crystalline plane to the one crystalline plane of the bulk crystal.Type: GrantFiled: March 30, 2009Date of Patent: January 7, 2014Assignee: Hitachi Metals, Ltd.Inventor: Yuichi Oshima
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Patent number: 8484832Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.Type: GrantFiled: June 1, 2010Date of Patent: July 16, 2013Assignee: Nippon Mektron, Ltd.Inventor: Garo Miyamoto
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Patent number: 7919734Abstract: A ceramic heater includes a core material and a ceramic sheet covering the core material, and wherein a side of the ceramic sheet opposite the core material is an outer side of the ceramic heater. A method for manufacturing the ceramic heater includes forming a through hole in a ceramic sheet which is diametrically enlarged from a first surface toward a second surface of the ceramic sheet, forming a via conductor, forming on the second surface a heating portion and lead portion for connecting the heating portion and the via conductor, and covering a core material with the ceramic sheet such that the first surface faces an outer side of the ceramic heater.Type: GrantFiled: July 23, 2007Date of Patent: April 5, 2011Assignee: NGK Spark Plug Co., Ltd.Inventors: Kikuo Sakurai, Eiji Kakamu
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Patent number: 7812289Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.Type: GrantFiled: December 5, 2007Date of Patent: October 12, 2010Assignee: NGK Insulators, Ltd.Inventor: Takeru Torigoe
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Patent number: 7765680Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.Type: GrantFiled: November 9, 2007Date of Patent: August 3, 2010Assignee: Nippon Mektron, Ltd.Inventor: Garo Miyamoto
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Patent number: 7158383Abstract: A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.Type: GrantFiled: November 18, 2003Date of Patent: January 2, 2007Assignee: General Electric CompanyInventors: Kevin M. Durocher, Richard J. Saia, Vikram B. Krishnamurthy
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Patent number: 7049929Abstract: Circuit panels are provided with resistors in vias extending between the top and bottom surfaces of the panels. The resistors may be formed by depositing a composite in each via, as by depositing a dispersion of a conductive material and a dielectric or by depositing one or more thin layers of a conductor. The resistors may be disposed at interior locations buried within a multilayer circuit board formed by laminating one or more panels having such resistors with one or more additional elements.Type: GrantFiled: May 1, 2002Date of Patent: May 23, 2006Assignee: Tessera, Inc.Inventor: Joseph Fjelstad
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Publication number: 20040113752Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.Type: ApplicationFiled: December 8, 2003Publication date: June 17, 2004Inventor: Israel Schuster
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Patent number: 6720859Abstract: A temperature compensating device comprises one or more columnar thermistors embedded within a substrate. Because the thermistors are substantially covered by the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, within the substrate the thermistors can be made thicker and smaller in lateral area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.Type: GrantFiled: January 10, 2002Date of Patent: April 13, 2004Assignee: Lamina Ceramics, Inc.Inventor: Joseph Mazzochette
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Patent number: 6597277Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.Type: GrantFiled: August 3, 2001Date of Patent: July 22, 2003Assignee: Cray Inc.Inventor: Steven V. R. Hellriegel
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Patent number: 6392530Abstract: A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.Type: GrantFiled: May 30, 2001Date of Patent: May 21, 2002Assignee: Yamaichi Electronics Co., Ltd.Inventor: Etsuji Suzuki
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Publication number: 20010054950Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.Type: ApplicationFiled: August 3, 2001Publication date: December 27, 2001Inventor: Steven V.R. Hellriegel
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Patent number: 6329065Abstract: A wiring board having an insulating substrate of aluminum oxide ceramics and a surface wiring layer formed on the surface of said insulating substrate, wherein the aluminum oxide ceramics constituting said insulating substrate contains a manganese compound in an amount of from 2.0 to 10.0% by weight in terms of MnO2, and has a relative density of not smaller than 95%, and said surface wiring layer contains copper in an amount of from 10 to 70% by volume and at least one high-melting metal selected from the group consisting of tungsten and molybdenum in an amount of from 30 to 90% by volume, and further contains copper as a matrix, said copper matrix having a diffusion structure in which are diffused the particles of said high-melting metal having an average particle diameter of from 1 to 10 &mgr;m.Type: GrantFiled: August 23, 1999Date of Patent: December 11, 2001Assignee: Kyocera CorporationInventors: Masanobu Ishida, Shigeki Yamada, Yasuhiko Yoshihara, Masamitsu Onitani
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Patent number: 6278356Abstract: A flat, built-in resistor and capacitor has a substrate (10) made of dielectric material; a copper layer (12) formed on each surface of the substrate (10) and having an etched image (30) formed in each of the copper layers (12); a dielectric material layer (40) printed onto the copper layer (12) and filling up the etched image; and a resistance layer (50) printed onto the copper layer (12) and the dielectric material layer (40).Type: GrantFiled: May 17, 2000Date of Patent: August 21, 2001Assignee: Compeq Manufacturing Company LimitedInventors: Wen-Yen Lin, Lin-Yeh Chen, Chin-Chi Chang, Shih-Ting Huang
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Patent number: 6104277Abstract: A resistor having a diffused impurity region in a semiconductor substrate, an insulated gate surrounding and defining the resistor, and a pair of separated conductive contacts to the diffused region within the boundary of the insulated gate for applying and receiving current passing through the resistor.Type: GrantFiled: May 30, 1997Date of Patent: August 15, 2000Assignee: PMC-Sierra Ltd.Inventors: Kris Iniewski, Brian D. Gerson, Colin Harris, David LeBlanc
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Patent number: 6100787Abstract: A multilayer electronic component (200) is provided. The component includes a substrate package assembly (202) with a set of stacked insulated sheets of a dielectric ceramic material (204, 206, 208, 210, 212). Also included are a set of embedded resistors (214), each of the embedded resistors including an electrical input port pad (216) and an electrical output port pad (218) provided in layers between the set of stacked insulated sheets. Each of the insulated sheets has a trough (220) of a predetermined length aligned between and transverse to the electrical input port pad (216) and the electrical output port pad (218). The trough (220) reduces the resistance value variability in the multilayer electronic component (200). The trough (220) is substantially filled with a resistive paste material and an internal circuit (222) connects the embedded resistors inside the substrate package assembly (202). A method of forming the substrate package assembly (202) is also provided.Type: GrantFiled: May 28, 1997Date of Patent: August 8, 2000Assignee: Motorola, Inc.Inventors: Rong-Fong Huang, Robert A. Burr
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Patent number: 5973390Abstract: The present invention is a chip electronic part having: a ceramic member; a conductor pattern formed on the surface of the ceramic member; an insulating protective layer formed on the conductor pattern; an external electrode which is formed at least one end face of the ceramic member, electrically connected to the conductor pattern, and composed of an undercoating layer formed by dry plating and at least one plating layer formed by wet plating; and at least one groove formed near an end face of the insulating protective layer so as to limit the formation of the undercoating layer.Type: GrantFiled: September 2, 1997Date of Patent: October 26, 1999Assignee: Murata Manufacturing Co., Ltd.Inventors: Keishiro Amaya, Kenichi Aoki
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Patent number: 5954979Abstract: A novel electrical smoking system and method of establishing resistance to draw upon a cigarette while smoking a cigarette in an electrical smoking system comprising the step of operatively interposing a frit between a source of ambient air and the cigarette.Type: GrantFiled: October 16, 1997Date of Patent: September 21, 1999Assignee: Philip Morris IncorporatedInventors: Mary Ellen Counts, William J. Crowe, John L. Felter, Grier S. Fleischhauer, Mohammad R. Hajaligol, Patrick H. Hayes, Willie G. Houck, H. Neal Nunnally
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Patent number: 5914559Abstract: A resistance element which is formed on a substrate by resistors and which divides and supplies high voltage to an electron gun of a cathode ray tube, wherein part or all of the substrate is covered by a high resistance conductive material layer as a topmost layer, and a cathode ray tube having the same.Type: GrantFiled: May 16, 1997Date of Patent: June 22, 1999Assignee: Sony CorporationInventors: Tsuneo Muchi, Kenichi Ozawa, Tsunenari Saito
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Patent number: 5867087Abstract: A three dimensional polysilicon resistor and a method by which the three dimensional polysilicon resistor is manufactured. A semiconductor substrate has formed upon its surface an insulating layer. The insulating layer has a minimum of one aperture formed at least partially through the insulating layer. A polysilicon layer is formed upon the insulating layer and formed conformally into the aperture(s) within the insulating layer. The polysilicon layer is then patterned to form a resistor which includes the portion of the polysilicon layer which resides within the aperture(s).Type: GrantFiled: January 30, 1997Date of Patent: February 2, 1999Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shou-Gwo Wuu, Mong-Song Liang, Chen-Jong Wang, Chung-Hui Su
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Patent number: 5856775Abstract: The present invention includes a programmable thin film filament resistor and method of constructing same. The finished construction includes: a core member of hydrogenated amorphous silicon; upper and lower electrodes made of a barrier metal such as molybdenum or tungsten applied to the upper and lower surfaces of the core member; and, backing layers, typically made of aluminum, applied to the outside surfaces of the electrodes. An insulator may be added to the upper surface of the core member. A programming voltage is applied to the electrodes, creating a discharge path between the upper and lower electrodes. When a critical current is reached, a filament is formed as the aluminum of the backing layers, the barrier metal of the electrodes, and the amorphous silicon are fused together. The result is a filament resistor with linear properties within a defined operating range. In an alternate embodiment, the upper and lower electrodes are overlapped in an alternating pattern, creating fusion zones.Type: GrantFiled: June 18, 1996Date of Patent: January 5, 1999Assignee: Pico Systems, Inc.Inventor: Herbert Stopper
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Patent number: 5591368Abstract: A provided heater comprises a supporting hub and a plurality of electrically resistive heater blades defining a receptacle to receive an inserted cigarette. Each blade comprises a first heater blade leg having a first end and a second end and extending at the first end from the supporting hub, a second heater blade leg having a first end and a second end, and a connecting section connecting the second end of the first leg and the first end of the second leg. The second end of the second leg extends toward the supporting hub and is electrically insulated therefrom. A resistive heating circuit is formed to heat the electrically resistive heater blade which in turn heats the inserted cigarette. The first and second legs are separated by a gap to permit entrainment of flavor substances into the heated cigarette upon drawing by a smoker.Type: GrantFiled: April 20, 1995Date of Patent: January 7, 1997Assignee: Philip Morris IncorporatedInventors: Grier S. Fleischhauer, Patrick H. Hayes, Constance H. Morgan, Mohammad R. Hajaligol, Michael L. Watkins, Walter A. Nichols, David E. Sharpe, Mary E. Counts
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Patent number: 5560098Abstract: A method of making an electrical connection of a conductor (1) to a thick film track (2) mounted on a substrate (3) includes the steps of heating the conductor (1) to a temperature at which it may melt the glass constituent of the track (2), and inserting it into the track (2) such that it sinks in and contacts the metallic constituent of the track. The glass sets, fixing the conductor in place. Thus the need for a second firing operation is avoided.Type: GrantFiled: January 20, 1995Date of Patent: October 1, 1996Assignee: Central Research Laboratories LimitedInventor: Ian Robins
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Patent number: 5287081Abstract: Multilayer, thin film multijunction integrated micropotentiometers are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, integrated structures are formed to include either single elongate heater elements, bifilar heater elements, or trifilar heater elements with multiple return paths. Multijunction thermopiles and resistors are formed with the heater. The individual layers of silicon oxide or silicon nitride, are formed with conventional chemical vapor deposition, sputtering and other known techniques.Type: GrantFiled: January 13, 1993Date of Patent: February 15, 1994Assignee: The United States of America as represented by the Secretary of CommerceInventors: Joseph R. Kinard, De-xiang Huang, Donald B. Novotny
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Patent number: 5164699Abstract: Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.Type: GrantFiled: December 17, 1990Date of Patent: November 17, 1992Assignee: Hughes Aircraft CompanyInventors: Hal D. Smith, Robert F. McClanahan, Andrew A. Shapiro, Raymond Brown
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Patent number: 5111178Abstract: An electrically conductive polymer film composition includes a polymeric resin, an electrically conductive substance intimately mixed in sufficient quantity with the polymeric resin to render the polymeric resin electrically conductive, and particles, such as fibers or spheres of appropriate size, admixed with the polymer composition in sufficient quantity so that in the cured polymer film the particles protrude from the surface of the film and render the surface uneven on a micro scale. The cured polymer film composition of the invention is incorporated in potentiometers and similar electric and electronic devices as a thick film where a contact wiper rides substantially continuously in contact with the protruding fibers.Type: GrantFiled: June 15, 1990Date of Patent: May 5, 1992Assignee: Bourns, Inc.Inventor: Wayne P. Bosze
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Patent number: 4733055Abstract: An electric heating element with a resistance element, a metal sheath in heat transfer relation to the resistance element on one side of the sheath and a thin, dry coating of refractory material major proportion by weight of which is boron nitride on another side of the sheath to be placed in heat transfer relation to an object to be heated. A method of enhancing the heat-transfer qualities of a metal sheathed electric heating element includes coating the metal sheath, on a surface to be placed in heat-transfer relation to an object to be heated, with a liquid slurry of refractory material a major proportion of which is boron nitride, drying and outgassing the coating and mounting the sheathed element on an object to be heated with the coating in contact with the object.Type: GrantFiled: August 25, 1986Date of Patent: March 22, 1988Assignee: Emerson Electric Co.Inventor: Donald M. Cunningham
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Patent number: 4733056Abstract: A heater backed with a ceramic substrate having a ceramic substrate as a base plate and heating element formed thereon, which comprises a conductor for retaining ionized elements, said conductor branching from a terminal lead portion of the minus side connected to the heater element under an applied electric current and extending at the back side of the base plate, along the heating element pattern at least partly thereof. A protecting layer may be provided on the surface of said conductor. The conductor is connected with the lead portion through a conducting through hole.Type: GrantFiled: August 15, 1986Date of Patent: March 22, 1988Assignee: NGK Spark Plug Co., Ltd.Inventors: Takao Kojima, Hiroyuki Ishiguro
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Patent number: 4688015Abstract: A roughened surface is formed on an insulating ceramics substrate having an electrode pattern by bonding or partially thrusting ceramics particles to or in the substrate, and a gas-sensitive metal oxide thick film is firmly bonded to the roughened surface.Type: GrantFiled: October 25, 1984Date of Patent: August 18, 1987Assignee: NGK Spark Plug Co., Ltd.Inventors: Takao Kojima, Akira Nakano, Toshitaka Matsuura, Akio Takami
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Patent number: 4682250Abstract: A video signal recording and reproducing apparatus comprises a first sampling circuit for sampling a recording video signal which has a band with an upper limit frequency f.sub.a and is to be recorded by a sampling signal having a frequency f.sub.s, where the frequencies f.sub.a and f.sub.s satisfying a relation f.sub.a <f.sub.s <2f.sub.a and an equation f.sub.s =(2n+1)f.sub.H /2, n is an integer, and f.sub.H is a horizontal scanning frequency of the recording video signal, a recording and reproducing circuit for recording an output signal of the first sampling circuit on a recording medium and for reproducing the signal from the recording medium, a delay circuit for delaying the signal which is reproduced from the recording medium by the recording and reproducing circuit by a delay time of one horizontal scanning period, a second sampling circuit for alternately sampling input and output signals of the delay circuit by a sampling signal having the frequency f.sub.Type: GrantFiled: June 13, 1984Date of Patent: July 21, 1987Assignee: Victor Company of Japan, Ltd.Inventor: Akira Hirota
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Patent number: 4317104Abstract: A precision resistor for use in electrical circuits arranged on printed circuit boards is produced from a band of thermally conductive alloy. The band is selectively surface treated with a conductive coating to improve solderability in the region of the resistor where it is connected to conductors of the circuit board.Type: GrantFiled: November 7, 1979Date of Patent: February 23, 1982Assignee: Firma Leopold KostalInventors: Eduard Bergmann, Wolfgang Bonczek
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Patent number: 4088799Abstract: The process by which this device is made comprises the implantation of ions into an insulator. Surface charge on the insulator is discharged during implantation by an electron beam or by a thin conductive surface layer previously deposited on the insulator. Ion energy and dose are selected to embed ions into the insulating lattice to a sufficiently high local concentration to produce a zone of lower resistance which is the implanted zone. The dosage which presently appears to be a minimum dosage for providing a conductive zone in the insulative body is the order of 10.sup.18 ions per square centimeter. Beam currents upward from 10 microampers per centimeter square implanted areas are satisfactory.Type: GrantFiled: February 1, 1974Date of Patent: May 9, 1978Assignee: Hughes Aircraft CompanyInventor: Stephen L. Kurtin