Abstract: An RF terminating resistor with a flange body, a planar layer structure, an upper face of a substrate, a resistance layer, an input conductor track, and an earth connection conductor track. The input conductor track electrically connected to opposite ends of the resistance layer. The substrate having a contact face, facing away from the layer structure. The flange body being bent around in a direction parallel to a first edge facing the earth conductor track, and a predetermined section bent around in a direction at right angles to this edge. The bent-around section extending in a space between a first plane, defined by the contact face, and a second plane, defined by the upper face, with the substrate abutting on the bent-around section connecting the contact face to the upper face and facing the earth connection conductor track on the upper face.

Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of ?65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.

Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of ?65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.

Abstract: A heating element (1) having an areal heating resistor (2) and two elongated contact areas (4, 4′), arranged at a distance from each other on the heating resistor (2) with the area (6, 6′) of the heating resistor (2) to be heated essentially between them. The heating element (1) includes at least one standard area (8, 8′) and at least one special area (10) in which the distances (12, 13) of the contact areas (4, 4′) from each other are different The heating element (1) includes at least one barrier area (16, 16′) electrically insulating the standard area (8, 8′) and the special area (10) from each other, and in the special area (10), the electrical conductivity of the heating resistor (2) is different from that of the standard area (8, 8′).

Abstract: A surface-mount positive coefficient thermistor includes a plate-like positive coefficient thermistor element, a pair of electrodes on the respective two main surfaces of the positive coefficient thermistor element, a pair of metal terminals each having a cutout at one end region connected to the corresponding electrode, the metal terminals including a metal having a low thermal conductivity, and solders each connecting the end region of the corresponding metal terminal to the outermost layer of the corresponding electrode. The metal terminal is readily and uniformly soldered to the electrode in a short period of time.

Abstract: A method for manufacturing a ceramic resistor wherein the resisting material of the resistor is a ceramic material prepared by a method comprising the steps of providing four or more types of substance, compound, or composite as starting raw materials, admixing the starting raw materials, forming the resultant mixture, and firing the formed material, characterized in that the admixing step is carried out in a mixing vessel (1) by the use of a first agitating blade (2) as a means for allowing the starting materials to flow over the whole mixing vessel and a second agitating blade (3) as a means for diaggregating the aggregates of the starting materials. The method can be employed for suppressing the variation of resistance values.

Abstract: Resistors for use in electrical circuits are formed of an alloy comprising from about 50 to about 95 mol percent aluminum, from about 5 to about 50 mol percent titanium and up to about 15 mol percent of at least one additional metal or a combination of two or more additional metals.

Abstract: A power resistor may be formed as a stacked arrangement of first and second terminal plates positioned on either side of a resistor plate and insulated therefrom by interposing first and second insulator plates. Preferably, the insulator plates are metallic plates with non-conductive surfaces. As an example, anodized aluminum plates may be used. The metallic insulator plates provide good thermal conduction paths between the resistor plate and the opposing terminal plates, allowing efficient heat transfer from the power resistor. Further, with metallic insulators, each layer in the stack may be made of metal with attendant structural advantages. For example, the stacked resistor may be subjected to significant compressive force in mounting without need for special precautions or load distribution measures, as might be required with ceramic insulating layers. Preferably, the stack includes interlayer features allowing it to be frictionally fitted together, thus simplifying assembly.

Abstract: A resistor having a generally planar substrate with a resistive element located on each side of the substrate and a plurality of terminals for connecting opposing portions of each of the resistive elements to an electronic circuit. The resistive elements have substantially equal dimensions and resistive properties such that they have substantially equal resistance values and exhibit substantially equal current densities for any given applied voltage. The substrate can be a ceramic-coated metal core with the resistive elements silk-screened onto opposite sides of the substrate. The resistive elements have a substantially uniform thickness so that they exhibit a uniform current density when subjected to an applied voltage. With this dual resistive layer design, thermal bending of the resistor due to differential thermal expansion at one of the ceramic layers is substantially offset by thermal bending due to differential thermal expansion at the other ceramic layer.

Abstract: A power resistor may be formed as a stacked arrangement of first and second terminal plates positioned on either side of a resistor plate and insulated therefrom by interposing first and second insulator plates. Preferably, the insulator plates are metallic plates with non-conductive surfaces. As an example, anodized aluminum plates may be used. The metallic insulator plates provide good thermal conduction paths between the resistor plate and the opposing terminal plates, allowing efficient heat transfer from the power resistor. Further, with metallic insulators, each layer in the stack may be made of metal with attendant structural advantages. For example, the stacked resistor may be subjected to significant compressive force in mounting without need for special precautions or load distribution measures, as might be required with ceramic insulating layers. Preferably, the stack includes interlayer features allowing it to be frictionally fitted together, thus simplifying assembly.

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract: A multi-layered heating device including a first container having a top layer and a bottom layer. A second container, containing heat retaining fluid, is positioned inside the first container and adjacent to the top layer thereof. Adjacent to the second container is an electrical heating element, and a layer of padding material is positioned between the electrical heating element and the bottom layer of the first container. A preferred embodiment of the heating device includes at least one thermostat, with the second container having a first layer and a second layer wherein at least one portion of each of the layers are secured together to form at least one depression which is devoid of the heat retaining fluid and which coincides with the at least one thermostat.

Abstract: A chip resistor whose resistive element provides a power density of at least 20 watts per square inch is provided with an air gap between the resistance element and the electrical contact junctions of the conductive strips electrically connected to the resistance element and terminals attached to the chip resistor. The air gap has a length approximately 70% of the distance between opposing edges of the planar body forming the chip to so restrict heat flow as to prevent the electrical contact junctions from exceeding a temperature of about 175.degree. C. when the resistive element is at a temperature of 350.degree. C. or more.