Abstract: The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.

Abstract: A rotating buffer station for a chip mainly comprises an upper cover plate, a rotatable plate, a movable jaw member and a lower base. The upper cover plate is arranged on the lower base and formed with a guide slot. The rotatable plate is located between the lower base and the upper cover plate and formed with a cam slot. The rotatable plate is pivotally coupled to the lower base. The movable jaw member is slidably engaged with the cam slot and the guide slot. When the rotatable plate is rotated, the cam slot forces the movable jaw member to move radially along the guide slot so as to form a chip socket. Accordingly, with rotation of the rotatable plate, the cam slot forces the movable jaw member to move radially along the guide slot so that the chip socket can be resized to hold various differently-sized chips.

Abstract: A method for cleaning a semiconductor wafer, including: supplying a semiconductor wafer whose surface has an oxide film formed thereon with a cleaning solution capable of removing the oxide film; and cleaning, while rotating, the semiconductor wafer to remove the oxide film formed on the surface of the semiconductor wafer. The oxide film is removed such that a rotational speed of the semiconductor wafer is 300 rpm or more after the cleaning with the cleaning solution is started and before a water-repelling surface is attained, and then the rotational speed of the semiconductor wafer is changed to 100 rpm or less to completely remove the oxide film. A method for cleaning a semiconductor wafer by which both surface roughness improvement and surface defect suppression can be achieved.

Abstract: Disclosed is an alignment apparatus that aligns a treatment object having a notch. The alignment apparatus includes a support member on which the treatment object is positioned, a driving unit configured to rotate the support member, a pushing member configured to move the treatment object to a proper location on the support member by applying a force to a side surface of the treatment object positioned on the support member, a notch detecting unit configured to detect whether the notch of the treatment object is located at a specific location, and a controller configured to control the driving unit such that the notch of the treatment object is located at the specific location by rotating the support member.

Abstract: A heat treatment container (1) is provided with support members (6) for supporting a disc-shaped SiC substrate (2), which is an object, at a time of an etching treatment of the SiC substrate (2). Each of the support members (6) has an inclined surface (6F) for supporting a lower surface end (2E) of the SiC substrate (2), the inclined surface being inclined so as to increasingly approach the centerline of the SiC substrate (2) going downward. More specifically, each of the support members (6) is formed in a conical shape with a diameter that increases going downward, and a conical surface which is the peripheral surface of each supporting member forms the inclined surface (6F). A vertically-middle section of the inclined surface (6F) contacts the lower surface end (2E) of the SiC substrate (2).

Abstract: A substrate processing method includes a substrate holding step of horizontally holding a substrate having a first major surface and a second major surface at an opposite side of the first major surface, a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film which covers the first major surface, and a coating film cleaning step of cleaning a front surface of the coating film.

Abstract: A first holding plate and a second holding plate are provided. The first holding plate has a first flat plate portion facing a bottom surface of a substrate and holds the substrate so as to form a gap between the first flat plate portion and the substrate as a first gap, and the second holding plate has a second flat plate portion facing the bottom surface of the substrate and holds the substrate so as to form a gap between the second flat plate portion and the substrate as a second gap. Depending on a processing to be performed, any one of the first holding plate and the second holding plate is mounted on a rotational shaft of a shaft mechanism that includes a fluid supply unit configured to supply a fluid to the bottom surface of the substrate and the rotational shaft configured to rotate the substrate. The processing is performed on the substrate by supplying the fluid to the bottom surface of the substrate from the fluid supply unit.

Abstract: Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.

Abstract: A substrate is transported based on coordinates information indicating a receiving position of the substrate and a placement position of the substrate by a hand. If the substrate is shifted from a first position, the substrate is received by the hand while a center of the substrate is shifted from a normal position of the hand. The hand that holds the substrate is moved toward a second position. A plurality of portions at an outer periphery of the substrate are detected before the substrate is placed. A shift of the substrate with respect to the normal position of the hand is detected based on the detection result, and the coordinates information is corrected such that a shift between a position of the center of the substrate to be placed at the second position by the hand and the center of the second position is canceled.

Abstract: Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.

Abstract: [Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).

Abstract: A system and method for post-processing of polymeric items having a liquid component and a predetermined heat deflection temperature is provided. The system includes a washing station to spray water at elevated temperature and pressure on the items while maintaining the temperature of the item below the heat deflection temperature. Then using a water distillation system to separate the water from the water mixed with the liquid polymer component by evaporating the water using heating coils with surface that is not conducive to adhesion of the liquid polymer component and then condense the water vapor into liquid water. The system may further include a spin station to separate the liquid polymer component by spinning the item. The system may further include one or more processing stations to rinse the item, dry the item, cure the item, remove the item from a tray to which the item may be attached and clean trays after removing the item.

Abstract: The invention relates to a method for removing water from a mixture containing at least one compound having at least one group reactive towards isocyanate and containing water, the mixture being applied to the surface of a rotating body A, the mixture flowing over the surface of the rotating body A to an outer region of the surface of the rotating body A and water evaporating from the mixture. In particular, this method is suitable for removing water from alcohols and amines.

Abstract: A brake assembly for reducing the rotational velocity the spinning basket of a food spinning device applies a frictional force to an annular ridge on the lid of the spinning basket. A brake button movably disposed in a cover of the spinning device includes flexible pinching arms having cam surfaces. The cam surfaces of the flexible pinching arms extend through a guide aperture, thereby causing the pinching arms to flex toward each other when the brake button is depressed and to apply the frictional engagement to the annular ridge.

Abstract: A substrate processing method comprises the step of subjecting a substrate to drying processing in at least one of a processing section and an interface, wherein the step of subjecting the substrate to the drying processing comprises the steps of: rotating the substrate at a first rotational speed around an axis perpendicular to the substrate, while holding the substrate horizontally, forming a liquid layer on the substrate in a state where the substrate is rotated at the first rotational speed, gradually and continuously increasing the rotational speed of the substrate to a second rotational speed after the formation of the liquid layer, and starting discharging a gas to the liquid layer on the substrate while the substrate is rotated at the second rotational speed.

Abstract: A method and apparatus for drying produce in a centrifugal drier is described. The drier includes a housing and a drum configured to receive a multi-volume basket. The method includes loading produce into a first volume and a second volume of the multi-volume basket. The basket may include perforated walls, a closed lower end, and an open upper end. The interior volume of the basket is divided into at least a first volume and a second volume by a perforated inner divider that is oriented concentrically to the basket walls. The first volume is disposed inside the inner divider. The second volume is disposed between the inner divider and the basket walls. A drive assembly rotates the drum and the basket, loaded with produce in the first and second volumes, to cause fluids to drain out of the produce to yield dried produce.

Abstract: The present invention provides a disc drying device and a disc drying method that allow simultaneous and quick drying of plural discs by a batch process and realize miniaturization of the device. In the present invention, plural discs arranged along a single axis are simultaneously chucked at outer peripheries thereof so that central openings of the discs internally form a space; plural nozzles are disposed in the space so as to supply hot water from inner peripheral surfaces of two sides of each of the discs to heat the discs with the hot water; and the discs are simultaneously rotated to thereby move the hot water from inner peripheries to outer peripheries of the discs and discharge the hot water outwardly of the outer peripheries by centrifugal force. The discharged hot water flows through valley grooves provided in inner wall surfaces of a water receiving cover to the lower side of the discs to be discharged to the outside.

Abstract: The present invention provides a disc drying device and a disc drying method that allow simultaneous and quick drying of plural discs by a batch process and realize miniaturization of the device. In the present invention, plural discs arranged along a single axis are simultaneously chucked at outer peripheries thereof so that central openings of the discs internally form a space; plural nozzles are disposed in the space so as to supply hot water from inner peripheral surfaces of two sides of each of the discs to heat the discs with the hot water; and the discs are simultaneously rotated to thereby move the hot water from inner peripheries to outer peripheries of the discs and discharge the hot water outwardly of the outer peripheries by centrifugal force. The discharged hot water flows through valley grooves provided in inner wall surfaces of a water receiving cover to the lower side of the discs to be discharged to the outside.

Abstract: In one embodiment of the invention, an apparatus for collecting fluid within a wafer cleaning chamber is provided. The apparatus includes a rotatable annular manifold configured to support a wafer within an inner cavity defined by an inner surface of the annular manifold. The annular manifold includes a channel extending from an inner surface of the annular manifold to a floor of the annular manifold. The floor has at least one opening. The apparatus includes a catch basin having a base with at least one drain. The base has an inner sidewall and an outer sidewall extending therefrom. The catch basin is disposed under the annular manifold to capture fluid dispensed from the at least one opening of the floor of the annular manifold. A spin, rinse and dry module and a method for collecting a fluid delivered to the surface of a rotating wafer are provided.

Abstract: When chuck pins are in a releasing state, support pins for supporting a lower surface of a substrate at respective heights different from each other support the substrate in an inclined position. When the chuck pins are in a gripping state, substrate gripping parts grip a substrate sidewise to separate the substrate upwardly from a substrate rest part, thereby holding the substrate in a horizontal position at a predetermined gripping height. After a liquid mass covering the substrate is formed, the chuck pins are changed from the gripping state to the releasing state to support the substrate having been gripped in the horizontal position into an inclined position, thereby draining the liquid mass from the surface of the substrate. The substrate with the liquid mass drained from the surface thereof is held and rotated in a horizontal position. Thus, the substrate is dried.

Abstract: After rinsing, a liquid mixture (IPA+DIW) is supplied to a substrate surface while rotating a substrate at a first rotating velocity which is relatively high to thereby replace the rinsing liquid adhering to the substrate surface with the liquid mixture. In this way, the rinsing liquid adhering to the gaps between the patterns formed on the substrate surface is replaced with the liquid mixture. Subsequently, DIW is supplied to the substrate surface in a condition that the rotation of the substrate is stopped or that the substrate is rotated at a second rotating velocity which is relatively low to thereby form a puddle-like liquid layer with DIW. In this way, the liquid mixture of the surface layer part is removed from the substrate surface while leaving almost all the liquid mixture adhering to the gaps between the patterns. After that, the liquid layer is removed from the substrate surface to thereby dry the substrate surface.

Abstract: A spin head includes a rotatable plate, first chucking pins and second chucking pins for supporting a edge portion of a substrate loaded on the plate, and a driving unit for selectively driving the first and second chucking pins. The driving unit includes a first magnet connected to the first chucking pin and disposed at a first height, a second magnet connected to the second chucking pin and disposed at a second height, and a driving magnet for driving the first and second magnets. The driving magnet is elevated by means of an elevating member to selectively apply a magnetic force to the first or second magnet and moves in the radius outside direction of the first or second chucking pin due to a magnetic force.

Abstract: A rotor that may be used by itself or in a processing machine for processing semiconductor wafers includes two pairs of combs. A lock down mechanism has a lock bar, temporarily engaged and moved by a loading/unloading robot, drives a retainer against the edges of the wafers, to better hold them in place during processing. Contamination via generation of particles is reduced. Combs on the rotor have a resilient strip. The lower edges of the wafers compress slightly into or deflect the resilient strip, when urged into place by the lock down mechanism.

Abstract: A centrifugal dryer of the present invention includes: a chamber for performing drying processing for plural substrates; a cradle, installed inside chamber, and drying plural substrates by rotation driving in a state of being held therein; and an elastic wave sensor for detecting an elastic wave generating upon striking of a chip from plural substrates to said chamber during the processing therefor.

Abstract: An apparatus includes a rotatable chuck for supporting a substrate and a splash guard. The splash guard surrounds the chuck and surrounds a substrate mounted on the chuck. The splash guard has a portion that deflects fluid being flung off the substrate by centrifugal action in a manner so as to not splash back onto the substrate. The splash guard is moveable between a process position in which the upper annular edge of the splash guard extends above the chuck and a substrate on the chuck, and a load/unload position in which the splash guard is tilted so that one side of the upper annular edge is below an upper edge of the chuck. The movement of the splash guard facilitates loading and unloading of a substrate.

Abstract: A method and apparatus for rinsing and spin-drying a hydrophobic material such as a hydrophobic semiconductor wafer improves wafer drying while at the same time reduces the formation of residual contaminants on the dried surface of the wafer. This is accomplished by first establishing a safe-zone between a minimum rotational speed above which drying proceeds satisfactorily and a maximum rotational speed above which contaminants dry on the wafer's surface. A spin-rate profile can then be adopted such that the rinse/dry process proceeds within the safe zone.

Abstract: An apparatus for preparing a wafer is provided. The apparatus includes a wafer backside plate and a central shaft. The wafer backside plate has a top surface that includes a cylindrical edge lip, which defines a central aperture. The central shaft is designed to fit within the central aperture. The wafer backside plate is designed to automatically slide between an up position during rotational wager processing and a down position when the wafer is not in rotational wafer processing. A gap defined between the top surface of the wafer backside plate and the wafer is less when the wafer backside plate is in the up position than when the wafer backside plate is in the down position.

Abstract: A method and apparatus for rinsing and spin-drying a hydrophobic material such as a hydrophobic semiconductor wafer improves wafer drying while at the same time reduces the formation of residual contaminants on the dried surface of the wafer. This is accomplished by first establishing a safe-zone between a minimum rotational speed above which drying proceeds satisfactorily and a maximum rotational speed above which contaminants dry on the wafer's surface. A spin-rate profile can then be adopted such that the rinse/dry process proceeds within the safe zone.

Abstract: An apparatus for drying a generally flat substrate that has been cleaned has a rotatable support for supporting the substrate, a substrate drying assembly, and a controller. The substrate drying assembly includes a substrate drying assembly support arm, an outlet for applying liquid to an upper surface of the substrate, and an outlet for applying a drying vapor to the upper surface of the substrate. The substrate drying assembly is configured to position the liquid applying outlet and to position the vapor applying outlet above a portion of the substrate. The controller causes the substrate drying assembly to be retracted over the upper surface of the substrate at a faster rate near a center of the substrate than near a periphery of the substrate.

Abstract: An apparatus for attenuating physical damage to a substrate, along with an attendant method, comprises as a first component a base plate having defined therein a location for receiving a substrate cassette. The apparatus also comprises a substrate retainer movably attached to the base plate such that when the substrate cassette having a substrate contained therein is positioned on the base plate at the location for receiving the substrate cassette, and the substrate is subjected to a mechanical force, the substrate retainer moves such as to retain the substrate within the substrate cassette with a retaining force. Both the apparatus and the method are particularly applicable for attenuating damage to a substrate when spin-drying the substrate.

Abstract: Embodiments of the invention provide a spin rinse dry (SRD) chamber for a semiconductor processing system. The SRD chamber includes a selectively rotatable substrate support member having an upper substrate receiving surface formed thereon, and a selectively rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be selectively positioned proximate the upper substrate.

Abstract: A centrifugal processor includes an elongated inlet and outlet in fluid communication with a rotor housing having an eccentric bowl. A rotor having fan blades and adapted to hold flat media is rotatably disposed within the rotor housing. An intake gate is pivotably mounted to the rotor housing to swing about the rotor into a closed position during a rinse mode and into an open position during a drying mode. The gate has a wedge that is designed to almost contact the rotor when the gate is in the open position for drying. The geometry of the elongated inlet, outlet, and eccentric bowl, in combination with the design of the rotor and that of the intake gate, work together to create a cross flow fan having a flow path across the flat media and one that exposes the flat media to large volumes of incoming air only once.

Abstract: Spin drying of a stack of flats such as egg trays is performed within a housing by movement of a rotatable lifting head into engagement with the undersurface of the stack. A stack lifting device lifts the lifting head and the stack of flats positioned thereon vertically upwardly into engagement with a drive engagement device thereabove which is rotatably powered by a drive with an optional braking device. Operation of the drive will cause rotation of the lifting head, the stack of flats and the drive engagement device simultaneously. The stack of flats will be held between the lifting head engaging the lower surface thereof and the drive engagement device engaging the upper surface thereof for fixedly securing these three elements together during powered rotation thereof. The rotation will spin off any liquids remaining on the flats such as would be present after being washed.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

Abstract: Embodiments of the invention provide a spin rinse dry (SRD) chamber for a semiconductor processing system. The SRD chamber includes a selectively rotatable substrate support member having an upper substrate receiving surface formed thereon, and a selectively rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be selectively positioned proximate the upper substrate.

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

Abstract: A food drying device of the type which includes an outer housing, a perforated main container in the housing and a drive apparatus on the housing for rotating the main container relative to the housing, includes a perforated auxiliary container disposable in the main container, and including an open-top bowl-shaped base and a removable lid. The bottom of the base has plural radial grooves which mate with radial ribs on the bottom of the main container so that they rotate together without slippage. A central hub on the main container lid is receivable in a central recess on the auxiliary container lid to limit relative axial movement.

Abstract: A wafer dryer for drying a wafer includes a chamber and a support adapted to support the wafer in the chamber. A spray nozzle is disposed in the chamber. A source gas supply tank is in fluid communication with the spray nozzle. At least one heater is operable to heat the chamber and the source gas supply tank. A pumping line is in fluid communication with the chamber. Drive means are operable to rotate the chamber and the spray nozzle. A method for drying a wafer using a wafer dryer including a chamber and a revolving spray nozzle includes the steps of: loading the wafer in the chamber; reducing the pressure in the chamber in which the wafer is loaded to a near vacuum state; creating a temperature controlled atmosphere in the pressure-reduced chamber to quicken drying of the wafer; and spraying the source gas on the wafer while rotating the chamber and the revolving spray nozzle in opposite directions in the pressure-reduced temperature controlled atmosphere.

Abstract: The present invention relates to a process for drying protein crystals starting from an aqueous protein crystal suspension, which comprises drying the protein crystal suspension in a centrifugal dryer, where the protein crystals, after they have been filtered off from the protein crystal suspension, are brought into contact with a drying medium which consists of a mixture of water and a nonaqueous solvent which is miscible with water in any ratio and which has a lower vapor pressure than water. In the process, a drying gas which has been moistened with water is advantageously used. The protein crystal suspension is advantageously converted into a fluidized bed for the purpose of drying.

Abstract: Apparatus for spinning a work piece such as a semiconductor wafer includes a work piece platform that is configured to be rotated about a central axis. Arrayed about the periphery of the platform is a plurality of spaced apart, symmetrically positioned work piece supports. Each of the supports includes a resilient bumper that serves both to support the work piece and as a friction brake to retard slippage of the work piece relative to the platform when the platform and work piece are rotating, and especially when the platform is accelerating or decelerating. Also arrayed about the periphery of the work piece platform is a plurality of work piece gripper assemblies configured to center the work piece in contact with the work piece supports when the platform is rotating. The gripper assemblies include a gripper finger that is configured to pivot about a pivot axis from a non work piece gripping position to a work piece gripping position in response to centrifugal force generated by the rotation of the platform.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: A substrate transporting device and method 19 transports a plurality of wafers W standing upright in a row, from a previous process, i.e., a cleaning process. A substrate holder 40 is carried by a transporting device 50 arranged outside a drying chamber 20. The substrate holder 40 receives the wafers W from the substrate transporting device 19 while maintaining a posture of the wafers W. The transporting device 50 lowers the substrate holder 40 and sequentially moves it into the drying chamber 20 through an unloading and loading port 21 above the drying chamber 20. Thereafter, the substrate holder 40 is fixed to a rotor 30. After closing the unloading and loading port 21 with a lid body 25, the rotor 30 is rotated. In this way, moisture sticking to surfaces of the wafers W is eliminated.

Abstract: A device and method for planarizing a film layer device on a silicon wafer. The device has a circular track whose surface faces the track center, a carrier capable of moving along the track and carrying wafers around with their front surfaces facing the center, and a set of heating elements for heating the film layers on the wafers to make them fluid. Utilizing the centrifugal force on the film layer generated by the circular movement and the fluidity of the film layer provided by heating, planarization of the film layer is achieved.

Abstract: A process for drying semiconductor wafers includes loading a wafer wetted with rinsing fluid into a rotor and orientating the wafer along a substantially vertical plane. A gas saturated with a solvent vapor is passed over the wafer surfaces until condensation forms on the wafer and displaces residual fluid. The rotation of the wafer by the rotor at a first rotation speed to aids the flushing and displacement of residual fluid. The passage of a dry gas over the wafer combined with the rotation of the wafer at a second rotation speed promotes drying of solvent condensed on the wafer. The first rotation speed is limited to a rate that does not cause the condensed solvent film to evaporate as quickly as it forms. The second rotation speed may exceed that of the first rotation speed to complete the drying of the wafer. The rotor and process chamber are optionally pre-saturated with condensed solvent vapor prior to the introduction of a wafer to hasten the drying process.

Abstract: A dryer for processing semiconductor substrates which rotates a carrier containing the substrates within a housing in combination with a bubbler which heats and directs a gas containing a water tension reducing vapor to the housing to contact the substrates and thereby hasten drying, decrease water marking, and decrease contamination.

Abstract: A cover is provided to an opening of a chamber in such a manner to open and close the opening and when the cover closes the opening, the chamber and the cover form a sealed drying process space. In this drying process space, nitrogen gas is supplied to purge the gas in the drying process space to turn into an inert gas filled space. Thereafter, substrates to be treated are brought into the drying process space. nitrogen gas is further supplied to the drying process space and then the substrates are being rotated to dry the same.

Abstract: A spin dryer assembly for drying workpieces such as semiconductor wafers includes a workpiece platform for receiving a workpiece to be dried. A motor is coupled to and spins the platform to effect removal of water and particulates from the workpiece. Gripping fingers are pivotally mounted around the platform and securely grip the workpiece during drying. Spring loaded plungers maintain the gripping fingers in a secured position during drying. A cam ring is vertically movable into and out of contact with the gripping fingers to bias the gripping portions of the fingers outwardly to a release position after drying.

Abstract: In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

Abstract: A method of processing a disk-shaped substrate, or wafer, during a chemical vapor process includes a backside purge of the substrate with a purge gas. The backside purge is obtained by spinning the substrate about a central axis, directing a flow of the purge gas over the backside of the spinning substrate, and causing the purge gas to flow in an outward radial direction with the spinning substrate. An apparatus in a vapor processing system structured for conducting the backside purge includes a support mechanism structured and arranged to support the substrate and spin the substrate about a central axis, and a conduit coupled to a source of purge gas, structured and arranged to direct a flow of the purge gas over a backside of the substrate while the substrate is spinning such that the spinning substrate causes the purge gas to flow radially outward.