Electrical Connector Means Patents (Class 347/50)
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Patent number: 9254656Abstract: A liquid ejecting head includes a basic wiring board which includes a first connection region and a second connection region, a plurality of head units, and a plurality of individual wiring boards each of which includes a first connection portion, a relay portion, and a second connection portion, and electrically connects the basic wiring board and each head unit, in which the second connection portion of an individual wiring board is fixed to the first connection region by being bent to the second connection region side, the second connection portion of an individual wiring board is fixed to the second connection region by being bent to the first connection region side, and an interval between the relay portions of the two individual wiring boards is large on the basic wiring board side compared to the head unit side.Type: GrantFiled: July 8, 2015Date of Patent: February 9, 2016Assignee: Seiko Epson CorporationInventors: Hiroaki Okui, Isamu Togashi
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Patent number: 9248647Abstract: A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifically, a gap between two support members is covered with the electrical wiring substrate so as to be able to prevent a sealing agent from flowing into the gap. As a result, even in the case where the size of the gap varies due to the variation in the dimensional accuracy and/or the variation in the assembly accuracy, the sealing agent will not enter this gap, and therefore the shape thereof can be made substantially uniform regardless of the positions. This results in a substantially uniform stress in curing and contracting of the sealing agent, and the variation in the mounting position of the printing element substrate can be suppressed.Type: GrantFiled: July 9, 2014Date of Patent: February 2, 2016Assignee: Canon Kabushiki KaishaInventors: Shuzo Iwanaga, Zentaro Tamenaga, Kazuhiro Yamada, Takuto Moriguchi, Takatsugu Moriya
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Patent number: 9243362Abstract: The invention relates to a method for mounting a panel (1) of an appliance, especially of a domestic appliance, comprising the steps: a) Arranging of a panel element (2); b) Applying a first adhesive (3) and a second adhesive (4) onto a surface of the panel element (2); c) Pressing a transparent pane element (5) against the surface of the panel element (2) in a mounting position so that the first and the second adhesive (3, 4) have contact with the panel element (2) as well as with the pane element (5); d) Activating the adhesion of the second adhesive (4) to bond the pane element (5) with the panel element (2); e) Applying a third adhesive (6) and a fourth adhesive (7) onto a surface of the pane element (5); f) Pressing a frame element (8) against the surface of the pane element (5) in a mounting position so that the third and fourth adhesive (6, 7) have contact with the pane element (5) as well as with the frame element (8); g) Activating the adhesion of the fourth adhesive (7) to bond the frame element (8)Type: GrantFiled: May 11, 2011Date of Patent: January 26, 2016Assignee: ELECTROLUX HOME PRODUCTS CORPORATION N.V.Inventors: Klaus Winkelmann, Heiko Meissner, Herbert Michel, Jurgen Feser, Gerhard Schaff, Michael Knab
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Patent number: 9238361Abstract: The liquid ejecting head includes a printing element board having a plurality of printing elements for producing energy used to eject liquid, a contact board having a contact terminal for electrically connecting to a liquid ejection printing apparatus, and a functional element, and a plurality of lands which are provided on a face of the contact board where the functional element is mounted, and to which terminals of the functional element are connected. In addition, a wiring member connects the printing element board to the contact board, a first terminal is configured to be electrically connected to the printing element board, and a second terminal is configured to not be electrically connected to the printing element board, with both terminals disposed on one edge of the contact board.Type: GrantFiled: April 19, 2013Date of Patent: January 19, 2016Assignee: Canon Kabushiki KaishaInventors: Chiaki Muraoka, Yukuo Yamaguchi, Satoshi Oikawa, Junji Tatsumi, Satoshi Kimura, Takuya Iwano
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Patent number: 9233536Abstract: A liquid ejection head including: a recording element substrate provided with an element; an electric wiring substrate having a bent portion, a connecting portion provided on one side of the bent portion and connected with the recording element substrate, and an input portion provided on the other side of the bent portion; and a housing having a first surface, a second surface, a depression provided on the second surface, and a member separated from a bottom surface of the depression and extending into an opening of the depression, wherein part of the other side of the electric wiring substrate is disposed between the bottom surface of the depression and the member.Type: GrantFiled: January 27, 2015Date of Patent: January 12, 2016Assignee: Canon Kabushiki KaishaInventors: Keiji Tomizawa, Takuma Kodoi, Takuya Iwano
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Patent number: 9221257Abstract: Provided is a liquid ejection head including a support member; a liquid chamber member being fixed onto the support member through an adhesive and including a liquid chamber configured to store liquid therein; and a recording element substrate being fixed onto the liquid chamber member through the adhesive and including an ejection orifice from which the liquid is ejected and a recording element configured to generate ejection energy. The support member and the liquid chamber member have different coefficients of linear expansion. The surface of the liquid chamber member on the recording element substrate side includes a first region on which the adhesive for fixing the recording element substrate is applied; and a second region being a region other than the first region. The first region has a parallelogram shape, and the second region has a rectangular shape.Type: GrantFiled: April 28, 2015Date of Patent: December 29, 2015Assignee: Canon Kabushiki KaishaInventors: Takatsugu Moriya, Kazuhiro Yamada, Zentaro Tamenaga, Takuto Moriguchi, Shingo Okushima, Akira Yamamoto
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Patent number: 9216578Abstract: A liquid ejection head includes a recording element substrate including an electrode at a first side portion; an electrical wiring substrate having a wire line; a connecting portion connecting the electrode and the wire line; and a sealing material provided between the first side portion of the recording element substrate and the electrical wiring substrate. A first line and a second line are out of alignment in a direction along a side of the recording element substrate. The first line orthogonal to the side passes through a center of gravity of the recording element substrate. A second line passes through a center of a part covered with the sealing material and extends parallel to the first line. Of a part of the sealing material, a first area on the first line side has a larger volume than that of a second area opposite to the first line side.Type: GrantFiled: May 11, 2015Date of Patent: December 22, 2015Assignee: Canon Kabushiki KaishaInventors: Zentaro Tamenaga, Takuto Moriguchi, Shuzo Iwanaga, Kazuhiro Yamada, Takatsugu Moriya, Akira Yamamoto
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Patent number: 9211714Abstract: Provided is a liquid ejecting head including: a plurality of actuator units, each including a connection terminal row; an interconnection substrate which is disposed to face the plurality of actuator units, is electrically connected to the connection terminal row of each of the plurality of actuator units, and extends in a second direction intersecting a first direction that is a transporting direction of a recording sheet; an external connection terminal row which is provided to the interconnection substrate; and a plurality of liquid flow passages which supply a liquid to each of the plurality of actuator units. The plurality of liquid flow passages are arranged on an outer side of the interconnection substrate in the first direction, and the external connection terminal row is arranged between the plurality of liquid flow passages in the second direction.Type: GrantFiled: March 27, 2015Date of Patent: December 15, 2015Assignee: Seiko Epson CorporationInventor: Yoichiro Kondo
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Patent number: 9199461Abstract: Various configurations of print head die are described. In an example, a first print head die has first print structures disposed along a major dimension thereof perpendicular to the media path, the first print structures including a leading print structure with respect to the media path. A second print head die independent of the first print head die has second print structures disposed along a major dimension thereof perpendicular to the media path, the second print head die being staggered with respect to the first print head die along the media path, the second print structures including a leading print structure with respect to the media path. A portion of the second print structures overlap a portion of the first print structures by an extent between a minimum value and a linear function of a separation between the respective leading print structures of the first and second print head dies.Type: GrantFiled: September 25, 2012Date of Patent: December 1, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mark H. Mackenzie, Garrett E. Clark
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Patent number: 9199462Abstract: A printhead includes a nozzle plate including a plurality of nozzles and a manifold body bonded to the nozzle plate. The manifold body includes a liquid channel in fluid communication with the plurality of nozzles. A cavity that dampens pressure modulation in liquid channel of the manifold body is located between the nozzle plate and the manifold body. The cavity is fluidically common to the plurality of nozzles.Type: GrantFiled: September 19, 2014Date of Patent: December 1, 2015Assignee: EASTMAN KODAK COMPANYInventors: Michael Frank Baumer, Chang-Fang Hsu, Todd Russell Griffin, Randy Lee Fagerquist, Ronald J. Hill, Robert Link, Gyanendra P. Sasmal, Qing Yang
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Patent number: 9168742Abstract: A liquid ejection head includes a substrate including a first supply port row in which a plurality of supply ports are arranged, a first energy generating element row in which a plurality of energy generating elements are arranged, a second supply port row in which a plurality of supply ports are arranged, a second energy generating element row in which a plurality of energy generating elements are arranged, a first wiring layer and a second wiring layer for driving the energy generating elements, and a through hole configured to electrically connect the first wiring layer and the second wiring layer. The first energy generating element row, the first supply port row, the second supply port row, and the second energy generating element row are arranged in parallel in this order and the through hole is arranged between the first supply port row and the second supply port row.Type: GrantFiled: December 2, 2014Date of Patent: October 27, 2015Assignee: Canon Kabushiki KaishaInventors: Masataka Sakurai, Ken Tsuchii
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Patent number: 9162470Abstract: Systems, methods and structures for remanufacturing inkjet printer cartridges and inkjet printer print heads by removing the print head and adhesive holding the print head to a used inkjet printer cartridge, preparing the cartridge housing for a new print head by routing out the used print head and used adhesive to create a new mounting surface for new adhesive and a new print head, placing the adhesive and new print head on the new mounting surface, curing the adhesive and assembling a re-manufactured cartridge from the cartridge housing having a new print head positioned thereon.Type: GrantFiled: January 12, 2015Date of Patent: October 20, 2015Assignee: CLOVER TECHNOLOGIES GROUP, LLCInventors: Yoel Wazana, Sagie Shanun, Joda Paulus
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Patent number: 9156263Abstract: A liquid ejection head includes a recording element substrate for ejecting liquid in response to an externally supplied electrical signal; an electrical wiring board having a first and second part mutually joined via a bent portion, the first part having an electrical joint portion for supplying the signal to the substrate, the second part having an electrical signal input portion into which the signal is input and to which the joint portion is connected; and a housing having first and second surfaces mutually adjoining, the first and second surfaces respectively supporting the first and second parts. The second part is fixed to the second surface at plural first fixing positions around the input portion. The second surface has a depressed portion formed closer to the bent portion than the first fixing positions. The second part is fixed to the housing at a second fixing position inside the depressed portion.Type: GrantFiled: October 21, 2014Date of Patent: October 13, 2015Assignee: Canon Kabushiki KaishaInventors: Takuma Kodoi, Takuya Iwano, Keiji Tomizawa
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Patent number: 9156250Abstract: Provided is a liquid discharging apparatus which includes a modulation circuit which generates a modulation signal which is obtained by pulse-modulating a source signal, a transistor which generates an amplified modulation signal by amplifying the modulation signal, a low pass filter which generates a drive signal by smoothening the amplified modulation signal, a piezoelectric element which is displaced by receiving the drive signal, and a multilayer circuit substrate on which the modulation circuit, the transistor, and the low pass filter are mounted. Furthermore, the multilayer circuit substrate has a multilayer configuration constituted of three or more layers which include at least one layer other than two surface layers. In addition, a feedback wiring pattern through which the modulation signal, the amplified modulation signal, or the drive signal is fed back to the modulation circuit is provided in the one layer.Type: GrantFiled: February 19, 2015Date of Patent: October 13, 2015Assignee: Seiko Epson CorporationInventors: Akira Abe, Hiroshi Sugita
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Patent number: 9144987Abstract: A plurality of pressure chamber space sections are formed at an interval therebetween on a pressure chamber substrate. The shortest distance between an opening edge of one pressure chamber space section and an opening edge of the other pressure chamber space section of adjacent pressure chamber space sections in a joining surface of a pressure chamber substrate to a communication substrate is 50 ?m or more. A recess section is formed to be separated from an ink flow path in a region interposed between these opening edges. At least one of the shortest distance between the opening edge of one pressure chamber space section and the recess section and the shortest distance between the opening edge of the other pressure chamber space section and the recess section is 30 ?m or less.Type: GrantFiled: February 10, 2015Date of Patent: September 29, 2015Assignee: Seiko Epson CorporationInventors: Shinsuke Ichikawa, Yuma Fukuzawa, Hitoshi Yamada
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Patent number: 9132653Abstract: An ink containing device comprises an ink cartridge and an adaptor. The ink cartridge comprises a first main body comprising a chamber configured to store ink, an ink outlet portion disposed on a first surface of the first main body configured to direct the ink from the chamber to an exterior of the first main body wherein the first surface faces a first direction, and an electrical interface disposed on the first main body. The adaptor is configured to be in an attached state with the ink cartridge. The adaptor comprises a second main body comprising a first contact disposed on a particular surface facing a particular direction, and a second contact disposed on a further surface and electrically connected to the first contact, wherein the second contact is electrically connected to the electrical interface in the attached state.Type: GrantFiled: August 23, 2013Date of Patent: September 15, 2015Assignee: Brother Kogyo Kabushiki KaishaInventors: Yuki Takagi, Tomohiro Kanbe, Yasuhiro Kato, Hirotake Nakamura, Hirofumi Kondo
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Patent number: 9126409Abstract: A liquid discharge head includes a plurality of first support members, a second support member that is jointed to the first support members and is provided with openings, a plurality of printing element substrates that are each positioned in the opening and are jointed on the first support members to discharge liquid, and an electrical wiring substrate that is jointed on the second support member and is provided with wiring for applying electrical signals on each of printing elements of the plurality of printing element substrates, wherein a linear expansion coefficient of the second support member is lower than that of the electrical wiring substrate.Type: GrantFiled: November 3, 2014Date of Patent: September 8, 2015Assignee: Canon Kabushiki KaishaInventors: Zentaro Tamenaga, Shuzo Iwanaga, Kazuhiro Yamada, Takuto Moriguchi, Takatsugu Moriya
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Patent number: 9085142Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.Type: GrantFiled: January 29, 2014Date of Patent: July 21, 2015Assignee: Canon Kabushiki KaishaInventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
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Patent number: 9070959Abstract: A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.Type: GrantFiled: August 10, 2012Date of Patent: June 30, 2015Assignee: MITSUBISHI ELECTRIC CORPORATIONInventor: Norio Okada
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Patent number: 9056466Abstract: An electrical circuit substrate, a first holding member holding the electrical circuit substrate, a head configured to discharge liquid, a flow path member having a flow path in which flows the liquid supplied to the head, and a second holding member holding the head and the flow path member are provided. The first holding member and the second holding member are detachably attached with each other.Type: GrantFiled: July 28, 2014Date of Patent: June 16, 2015Assignee: Seiko Epson CorporationInventors: Akihisa Wanibe, Jun Shimazaki
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Patent number: 9050803Abstract: A liquid ejection head includes nozzles, a channel member, a common liquid chamber member, a damper member, a damper chamber formation member, a first adhesive, and a second adhesive. The channel member includes individual liquid chambers communicated with the nozzles. The common liquid chamber member forms a common liquid chamber to supply liquid to the individual liquid chambers. The damper member has a deformable area forming a portion of a wall of the common liquid chamber. The damper chamber formation member forms a damper chamber disposed opposing the common liquid chamber via the deformable area. The first adhesive is disposed between the damper member and the common liquid chamber member. The second adhesive is disposed between the damper member and the damper chamber formation member. The deformable area of the damper member has a peripheral portion fringed with the first adhesive and the second adhesive.Type: GrantFiled: July 1, 2013Date of Patent: June 9, 2015Assignee: RICOH COMPANY, LTD.Inventor: Tomohiko Koda
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Patent number: 9050791Abstract: A liquid discharge head includes: a recording element substrate and a plurality of electric connection units; and an electric wiring member that includes a plurality of input terminals, a plurality wirings held between films and electrically connected to the plurality of input terminals, and a plurality of lead lines conducted to the plurality of wirings. In this case, the plurality of wirings include a power line for supplying power to the energy generation elements and a signal line for supplying a signal to the energy generation elements. Relationships of A>B and B<D are satisfied, in which A is a largest width of the signal line, B is a largest width of the lead line connected to the signal line, and D is a largest width of the lead line connected to the power line.Type: GrantFiled: July 3, 2013Date of Patent: June 9, 2015Assignee: Canon Kabushiki KaishaInventors: Keisuke Iinuma, Hiromasa Amma, Kyosuke Toda
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Patent number: 9039144Abstract: A full-line printhead includes a base in which a plurality of substrates each including arrayed print elements are arranged in the arrayed direction has the following arrangement. The base includes a terminal for inputting a first differential signal, a first pair of lines for transferring the first differential signal from the terminal to the substrates, a terminal for inputting a second differential signal, and a second pair of lines for transferring the second differential signal from the terminal to the substrates. Each substrate includes a first amplifier for amplifying the first differential signal transferred via the first pair of lines, and a second amplifier for amplifying the second differential signal transferred via the second pair of lines. Control is performed to change the gain of the first amplifier based on a control signal from outside.Type: GrantFiled: April 3, 2014Date of Patent: May 26, 2015Assignee: Canon Kabushiki KaishaInventor: Kengo Umeda
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Patent number: 9039143Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.Type: GrantFiled: March 31, 2014Date of Patent: May 26, 2015Assignee: Canon Kabushiki KaishaInventors: Mitsuru Chida, Kenji Fujii, Makoto Watanabe, Toshiaki Kurosu, Masataka Nagai, Takanobu Manabe
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Publication number: 20150138279Abstract: A printhead substrate comprising a plurality of printing portions and a plurality of ink supply ports, wherein the plurality of printing portions are divided into a plurality of groups, and the plurality of ink supply ports are arranged so as to correspond to the plurality of groups respectively, the printhead substrate also comprises a plurality of first voltage wiring portions provided in correspondence with the plurality of groups, and each first voltage wiring portion includes a first wiring pattern configured to connect the first terminals of the respective printing portions in the corresponding group with each other, and a second wiring pattern connected to the first wiring pattern and arranged between an ink supply port in the corresponding group and its neighboring ink supply port.Type: ApplicationFiled: October 20, 2014Publication date: May 21, 2015Inventors: Kazunari Fujii, Masanobu Ohmura
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Patent number: 9033467Abstract: A liquid jetting apparatus includes: a channel unit formed with a plurality of nozzles and a plurality of liquid channels communicating with the nozzles; an actuator including a plurality of drive sections, which are provided to correspond to the nozzles, include a plurality of connecting terminals, and are configured to apply jetting energy to a liquid in the liquid channels; and a flexible wiring member including a plurality of connecting portions joined to the plurality of connecting terminals of the actuator and a plurality of wires connected to the connecting portions. The wiring member includes a protrusion formed by bending a portion, different from a portion formed with the connecting portions, at which at least a part of the wires are formed, to project toward a side opposite to a connecting surface for connecting with the actuator.Type: GrantFiled: August 16, 2013Date of Patent: May 19, 2015Assignee: Brother Kogyo Kabushiki KaishaInventors: Hirofumi Kondo, Shuhei Hiwada, Kazuteru Kojima
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Patent number: 9033468Abstract: An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.Type: GrantFiled: March 13, 2014Date of Patent: May 19, 2015Assignee: RICOH COMPANY, LTD.Inventors: Kouji Ohnishi, Takahiko Kuroda, Manabu Nishimura, Kaichi Ueno
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Patent number: 9033469Abstract: A method and apparatus supply electrical current to a firing actuator of a printhead die across a high side switching transistor in a source follower arrangement and supply a regulated voltage, that is no greater than a concurrent voltage at a drain of the HSS transistor, to a gate of the high side switching transistor.Type: GrantFiled: October 14, 2011Date of Patent: May 19, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: James M. Gardner, Peter J. Fricke, Mark A. Hunter
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Publication number: 20150130875Abstract: A liquid discharge head includes a plurality of first support members, a second support member that is jointed to the first support members and is provided with openings, a plurality of printing element substrates that are each positioned in the opening and are jointed on the first support members to discharge liquid, and an electrical wiring substrate that is jointed on the second support member and is provided with wiring for applying electrical signals on each of printing elements of the plurality of printing element substrates, wherein a linear expansion coefficient of the second support member is lower than that of the electrical wiring substrate.Type: ApplicationFiled: November 3, 2014Publication date: May 14, 2015Inventors: Zentaro TAMENAGA, Shuzo lwanaga, Kazuhiro Yamada, Takuto Moriguchi, Takatsugu Moriya
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Publication number: 20150130873Abstract: A liquid ejection head, including a recording element substrate for ejecting liquid in response to an externally supplied electrical signal; an electrical wiring board having a first and second part mutually joined via a bent portion, the first part having an electrical joint portion for supplying the signal to the substrate, the second part having an electrical signal input portion into which the signal is input and to which the joint portion is connected; and a housing having a first and second surface mutually adjoining, the first and second surfaces respectively supporting the first and second parts. The second part is fixed to the second surface at plural first fixing positions around the input portion. The second surface has a depressed portion formed closer to the bent portion than the first fixing positions. The second part is fixed to the housing at a second fixing position inside the depressed portion.Type: ApplicationFiled: October 21, 2014Publication date: May 14, 2015Inventors: Takuma KODOI, Takuya Iwano, Keiji Tomizawa
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Publication number: 20150130874Abstract: A method of manufacturing a substrate for a liquid ejection head including an ejection port forming member which has formed therein ejection ports, includes the steps of: forming a first layer by using a first layer forming member; forming a second layer on the first layer by using a second layer forming member; and hardening a partial region of each of the first layer and the second layer and removing a region different from the partial region so as to form the ejection ports, resulting in that the first layer and the second layer constitute the ejection port forming member, and a member containing a solvent to dissolve the first layer forming member and a photo-acid-generating agent having an acid strength weaker than an acid strength of the photo-acid-generating agent contained in the first layer forming member is used as the second layer forming member.Type: ApplicationFiled: October 28, 2014Publication date: May 14, 2015Inventors: Kunihito Uohashi, Kenji Fujii, Kazuhiro Asai, Keiji Matsumoto
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Patent number: 9022528Abstract: A liquid ejecting head includes a head chip that ejects ink from a liquid ejecting surface. An inlet is disposed on the side opposite to the liquid ejecting surface. The liquid ejecting head includes an upstream flow path member, a downstream flow path member with an accommodating space that accommodates the head chip, a wiring member that is connected to a piezoelectric actuator in the head chip, and a wiring substrate. A first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the downstream flow path member, and the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the upstream flow path member side of the wiring substrate.Type: GrantFiled: August 12, 2014Date of Patent: May 5, 2015Assignee: Seiko Epson CorporationInventors: Shunsuke Watanabe, Katsumi Enomoto, Yasuo Inaoka, Ryota Kinoshita
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Patent number: 9022527Abstract: A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.Type: GrantFiled: March 24, 2014Date of Patent: May 5, 2015Assignee: Seiko Epson CorporationInventors: Tatsuro Torimoto, Kazushige Hakeda, Tadao Furuta, Motoki Takabe
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Patent number: 9022540Abstract: A cartridge configured to be mounted to a liquid ejection apparatus that has an electrical connection portion and an engagement portion, and having an engaging portion for engaging the engagement portion and a plurality of electrodes for connecting to the connection portion. The electrodes have contact portions for contacting the connection portion, with a first group of a plurality of the contact portions constituting a first array whose contact portions are aligned in an X-axis direction intersecting a mounting direction of the cartridge, and a second group of the plurality of the contact portions constituting a second array whose contact portions are aligned in the X-axis direction. The first and second arrays are aligned in a direction intersecting the X-axis direction, and the engaging portion and an area between the first array and the second array are aligned in the X-axis direction.Type: GrantFiled: February 28, 2014Date of Patent: May 5, 2015Assignee: Seiko Epson CorporationInventors: Shun Oya, Takayuki Shiota
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Patent number: 9016834Abstract: A liquid ejection head includes: a flow channel unit having a plurality of pressure chambers arranged in a plane; and piezoelectric actuators which change volume of the plurality of pressure chambers so as to apply pressure to liquid inside the plurality of the pressure chambers respectively, wherein the piezoelectric actuators comprise: a diaphragm which constitutes one wall of the plurality of pressure chambers; a common electrode formed on a surface of the diaphragm; a piezoelectric layer formed on a surface of the common electrode; a plurality of ring-shaped individual electrodes formed on a surface of the piezoelectric layer and formed in regions which overlap respectively with marginal portions which are non-central portions of the plurality of pressure chambers, as viewed from a direction perpendicular to the plane; and central electrodes connected electrically to the common electrode, and formed so as not to make contact with the plurality of ring-shaped individual electrodes in inner regions of the pType: GrantFiled: March 10, 2010Date of Patent: April 28, 2015Assignee: FUJIFILM CorporationInventor: Tsuyoshi Mita
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Patent number: 9012254Abstract: Methods for forming an enclosed liquid metal (LM) drop inside a sealed cavity by formation of LM components as solid LM component layers and reaction of the solid LM component layers to form the LM drop. In some embodiments, the cavity has boundaries defined by layers or features of a microelectronics (e.g. VLSI-CMOS) or MEMS technology. In such embodiments, the methods comprise implementing an initial microelectronics or MEMS process to form the layers or features and the cavity, sequential or side by side formation of solid LM component layers in the cavity, sealing of the cavity to provide a closed space and reaction of the solid LM components to form a LM alloy in the general shape of a drop. In some embodiments, nanometric reaction barriers may be inserted between the solid LM component layers to lower the LM eutectic formation temperature.Type: GrantFiled: July 31, 2012Date of Patent: April 21, 2015Assignee: Kadoor Microelectronics LtdInventors: Oren Aharon, Shai Feldman
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Patent number: 8998384Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.Type: GrantFiled: March 31, 2011Date of Patent: April 7, 2015Assignees: Hewlett-Packard Development Company, L.P., 3M Innovative Properties CompanyInventors: Lynn Walsh, Mark Walsh, Ronald L. Imken, Soon Yeng Chan, Alejandro Aldrin A. Narag, II
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Patent number: 8991980Abstract: An ink jet print head is configured to reduce the inclination of an ink ejection direction to make improper print conditions such as stripes and density unevenness unnoticeable. An individual wire is extended to lie under a common wire. Thus, wires under ink channels arranged on the respective opposite sides of a pressure chamber are symmetric. Consequently, an equivalent step structure is provided at the bottoms of the ink channels arranged on the respective opposite sides of the pressure chamber.Type: GrantFiled: April 17, 2014Date of Patent: March 31, 2015Assignee: Canon Kabushiki KaishaInventors: Shinji Kishikawa, Ken Tsuchii, Masataka Sakurai, Akiko Saito
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Patent number: 8991979Abstract: A unit head has a head main body having a nozzle surface, and a substrate case having a fastening surface fastened to a fixation frame of a frame and accommodating a relay substrate. The fastening surface of a substrate case is formed at a position closer to a surface of an opposite side to a fixation frame than a side surface of a fastening surface side of the head main body, and the head main body is positioned further at an ink ejecting side than the fixation frame with the faster surface being fixed to the fixation frame, the other end of a first cable whose one end is connected to the electrode terminal of a piezoelectric element is connected to the relay substrate, a second cable connected to the relay substrate is drawn to an opposite side to a nozzle surface from a position close to a surface of an opposite side to the fastening surface, and the other end of the second cable is connected to a drive substrate.Type: GrantFiled: March 24, 2014Date of Patent: March 31, 2015Assignee: Seiko Epson CorporationInventors: Hiroyuki Hagiwara, Hiroshige Owaki
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Patent number: 8991981Abstract: A liquid ejecting head includes a head chip in which two or more nozzle groups are disposed, a first inlet that communicates with one of the nozzle groups and a second inlet that communicates with the other nozzle group a wiring member that is disposed between the first second inlets, a first connection flow path that is connected to the first inlet, a second connection flow path that is connected to the second inlet, and a wiring substrate to which the wiring member is connected between the first connection flow path and the second connection flow path.Type: GrantFiled: August 6, 2014Date of Patent: March 31, 2015Assignee: Seiko Epson CorporationInventors: Katsumi Enomoto, Shunsuke Watanabe
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Patent number: 8991978Abstract: A printing system comprising an electrical interface for ink pens of an inkjet printer, the electrical interface including a first group of electrical contacts; a second group of electrical contacts, the second group of electrical contacts being arranged in an identical configuration as the first group of electrical contacts; and a number of electrical interconnects, in which each electrical contact from the first and second groups of electrical contacts is connected to one of the electrical interconnects via a conductive trace; in which at least one electrical contact from the first group of electrical contacts is connected to a same electrical interconnect as at least one electrical contact from the second group of electrical contacts.Type: GrantFiled: May 11, 2010Date of Patent: March 31, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Huston W. Rice, Kenneth Hickey, Jason M. Quintana, Trudy Benjamin, Joseph M. Torgerson
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Publication number: 20150085019Abstract: A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.Type: ApplicationFiled: September 26, 2013Publication date: March 26, 2015Applicant: XEROX CORPORATIONInventor: Peter J. Nystrom
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Patent number: 8985744Abstract: A recording head includes a substrate whose first surface has an element that generates energy used for ejecting liquid; a first portion that supports a second surface of the substrate; a wiring member having multiple electrode leads connected to multiple electrode pads provided in the substrate; a second portion that supports the wiring member; and a sealant that seals a section including a connection section between the electrode pads and the electrode leads. A region surrounded by the substrate, the second portion, and the electrode leads is provided with an ascending portion that increases in height in a direction extending from the second surface toward the first surface, the ascending portion increasing in height from a first end to a second end of the region in an arrayed direction of the electrode leads.Type: GrantFiled: November 12, 2010Date of Patent: March 24, 2015Assignee: Canon Kabushiki KaishaInventor: Rumi Akiyama
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Publication number: 20150077473Abstract: An electrical circuit substrate, a first holding member holding the electrical circuit substrate, a head configured to discharge liquid, a flow path member having a flow path in which flows the liquid supplied to the head, and a second holding member holding the head and the flow path member are provided. The first holding member and the second holding member are detachably attached with each other.Type: ApplicationFiled: July 28, 2014Publication date: March 19, 2015Inventors: Akihisa WANIBE, Jun SHIMAZAKI
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Publication number: 20150070433Abstract: A liquid ejection apparatus includes an energy generating element that generates energy for ejecting a liquid; a plurality of electroconductive protective films that are disposed so as to cover at least the energy generating element and that are in contact with the liquid; and an electrifying unit that is capable of electrifying the plurality of electroconductive protective films in such a way that surfaces of the electroconductive protective films in contact with the liquid serve as anodes.Type: ApplicationFiled: September 9, 2014Publication date: March 12, 2015Inventor: Kenji Yabe
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Publication number: 20150070439Abstract: A removable printhead assembly for a single-pass inkjet printer, the printhead assembly including: a body adapted for user removal and insertion in the printer; an elongate ink manifold assembly mounted in the body, the ink manifold assembly having a plurality of longitudinally extending ink channels, a plurality of outlets defined in a mounting surface; and a plurality of ink conduits connecting each ink channel to a corresponding set of outlets; a plurality of printhead chips mounted on the mounting surface; a plurality of pressure regulator assemblies for delivering ink to the printhead chips at a negative pressure; a plurality of electrical connectors; and a plurality of ink ports.Type: ApplicationFiled: November 19, 2014Publication date: March 12, 2015Inventors: Kia Silverbrook, Akira Nakazawa, Christopher Hibbard, Paul Ian Mackey, Norman Micheal Berry, Garry Raymond Jackson
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Publication number: 20150070438Abstract: A liquid ejection head includes a first recording element substrate, a second recording element substrate, and an electric wiring substrate. The first and second recording element substrates each includes an energy generating element that generates energy for ejecting a liquid, and an electroconductive protective film that is disposed so as to cover at least the energy generating element. The electric wiring substrate includes wiring for supplying electric power to the first and second recording element substrates. The electroconductive protective film of the first recording element substrate and the electroconductive protective film of the second recording element substrate are electrically connected to each other through the electric wiring substrate.Type: ApplicationFiled: September 8, 2014Publication date: March 12, 2015Inventors: Kenji Yabe, Yasuhiko Osaki
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Patent number: 8974039Abstract: A circuit substrate includes: a substrate body and an electrode. The substrate body has four sides including first and second sides extending in a first direction and opposing each other in a second direction. The substrate body has a top surface on which the electrode is mounted. The electrode has first and second outer points positioned closest to the first and second sides in the second direction respectively. The top surface has: a first area between the first side and a first imaginary line extending in the first direction and passing through the first outer point; a second area between the second side and a second imaginary line extending in the first direction and passing through the second outer point; and a third area interposed between the first area and the second area in the second direction, the substrate body being formed with a first opening in the first area.Type: GrantFiled: December 21, 2012Date of Patent: March 10, 2015Assignee: Brother Kogyo Kabushiki KaishaInventors: Yuki Takagi, Hirotake Nakamura
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Patent number: 8960863Abstract: A liquid ejection apparatus includes a channel unit with a plurality of nozzles and pressure chambers configured to communicate with respective nozzles, and a plate provided on the channel unit to cover pressure chambers in a first direction from the pressure chambers, the plate comprising a plate surface extending along a second direction perpendicular to the first direction. The liquid ejection apparatus includes a plurality of drive elements arranged over the pressure chambers. The liquid ejection apparatus includes a plurality of contact terminals electrically connected to their respective drive elements at a terminal placement surface which is non-parallel with the plate surface and includes a portion of the terminal placement surface that is offset from the plate surface. The liquid ejection apparatus includes a flexible wiring board configured to be electrically connected to the contact terminals.Type: GrantFiled: February 24, 2014Date of Patent: February 24, 2015Assignee: Brother Kogyo Kabushiki KaishaInventor: Toru Yamashita
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Patent number: 8960862Abstract: An actuator included in a head substrate of an ink-jet head receives, with an electrode on the surface of the actuator, power fed from the wiring of a wiring substrate arranged opposite the head substrate. A first electrode of the wiring substrate is electrically connected to the wiring, and protrudes to the side of the head substrate. A second electrode is electrically connected to the electrode on the surface of the actuator, protrudes to the side of the wiring substrate and is electrically connected to the first electrode. The head substrate and the wiring substrate are adhered to each other through an adhesive layer such that a space to which the first electrode and the second electrode are exposed is hermetically sealed. The hermetically sealed space is in a vacuum state or is filled with a gas containing a predetermined amount of water or less.Type: GrantFiled: April 4, 2012Date of Patent: February 24, 2015Assignee: Konica Minolta, Inc.Inventors: Ken Kitamura, Mitsuyoshi Miyai, Shinya Matsuda