Abstract: This disclosure relates to calibrating a volumetric estimation device for determining dimensions of an object. Two laser sources project two laser lines onto the object to form a rectangular calibration target. A camera captures an image of the rectangular calibration target and has a camera image plane and a camera image plane centre point. A processor measures the camera distortion effects to generate a filter to remove the distortion effects to approximate a pinhole camera. The camera image plane centre point and the points of projection of the laser sources are not collinear. The point of laser projection are not collinear with the camera image plane centre point. The processor uses locations of laser projected crosslines to determine a deviation angle from a direction perpendicular to the camera image plane and the distance between the camera image plane centre point and each laser source.

Abstract: An image processing apparatus includes: a first circuit which calculates values f(RPi), f(GPi) and f(BPi) by applying a function f(x) to an R grayscale value RPi, a G grayscale value GPi and a B grayscale value BPi of each pixel i of a first image; a second circuit which calculates values f(RQi), f(GQi) and f(BQi) by applying the function f(x) to an R grayscale value RQi, a G grayscale value GQi and a B grayscale value BQi of each pixel i of a second image; and a similarity calculation circuit which calculates a degree of similarity between the first and second images depending on |f(RPi)?f(RQi)|, |f(GPi)?f(GQi)| and |f(BPi)?f(BQi)| associated with each pixel i of the first and second images. The function f(x) is a convex function monotonically non-decreasing in the domain of definition.

Abstract: A method of measuring at least one point on an artefact to be inspected that is located within a positioning apparatus' measurement volume, the method comprising, obtaining at least two images of the artefact obtained from different perspectives and, based on a given nominal location of a predetermined point to be measured within said positioning apparatus' measurement volume, determine the location of said predetermined point in each of the at least two images.

Abstract: The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.

Abstract: A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.

Abstract: A display device may include a display having a pixels and a processor. The processor may receive image data, determine a digital offset value for a pixel based on a location of the pixel, such that the digital offset value compensates for one or more non-uniformity properties of the pixel. The processor may determine a scale factor associated with the pixel based on at least two of a luminance setting for the display, a driving mode of the display, and a gray level value for the pixel. The processor may then generate correction image data by applying the scale factor to the digital offset value, generate compensated image data based on the correction image data and the image data, and provide the compensated image data to the display.

Abstract: An inspection system inspects points of interest on an item. A two-axis gimbal holds the item and is controlled to adjust an angle of incidence and angle of approach of a line of sight of an imaging device with respect to the point of interest. A Y-axis actuator adjusts a position of the imaging device along a Y-axis of the item, and an X-axis actuator adjusts a position of the imaging device along an X-axis of the item. A controller controls the gimbal, the Y-axis actuator and the X-axis actuator. Upon selecting a point of interest, angle of incidence, and angle of approach, the imaging device displays and/or captures an image, and the image can be inspected by a human inspector or automated inspection system.

Abstract: A method for emission testing of a semiconductor device (DUT), by mounting the DUT onto an test bench of an emission tester, the emission tester having an optical detector; electrically connecting the DUT to an electrical tester; applying electrical test signals to the DUT while keeping test parameters constant; inserting an optical filters into an optical path of the emission tester and collecting emission test signal from the optical detector; removing the filter from the optical path and collecting emission test signal from the optical detector. Comparing the images obtained with and without the filter. The filter may be shortpass to obtain emission signal, a bandpass for detecting forward bias, or longpass to obtain thermal signal.

Abstract: A defect classification method in accordance with the present invention uses two types of images output from the defect inspection device 150 (i.e., the first inspection image generated from a luminance signal sequentially output from a detector SE and the second inspection image generated from a difference of the signals from an adjacent portion in a region where the defect exists). The first inspection image includes information for discriminating unevenness of the defective shape. Also, while it is difficult to discriminate unevenness of the defective shape by the second inspection image, the second inspection image includes information on a luminance distribution emphasizing a defective section. The region of the defective section is extracted from the second inspection image to be applied to the first inspection image and thereby define an arithmetic processing area, and the image processing is performed within the arithmetic processing area to compute a feature amount.

Abstract: A lighting device is disclosed having a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation. A heat sink having an arcuate surface shaped to approximate the arcuate orientation of the flexible substrate is coupled to the flexible substrate between complementary arcuate surfaces. A luminescent coating is disposed about a top surface of the arcuate single planar flexible substrate.

Abstract: Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

Abstract: Methods and systems for classifying defects detected on a specimen with an adaptive automatic defect classifier are provided. One method includes creating a defect classifier based on classifications received from a user for different groups of defects in first lot results and a training set of defects that includes all the defects in the first lot results. The first and additional lot results are combined to create cumulative lot results. Defects in the cumulative lot results are classified with the created defect classifier. If any of the defects are classified with a confidence below a threshold, the defect classifier is modified based on a modified training set that includes the low confidence classified defects and classifications for these defects received from a user. The modified defect classifier is then used to classify defects in additional cumulative lot results.

Abstract: A device for detecting a connector mounting failure includes a detection unit and a connection member that interconnects the detection unit and a connector device. The connection member includes a connection connector inserted into and seated in the connector device, and a connection line unit that interconnects the connection connector and the detection unit. The connection line unit also delivers a detection value of the connection connector to the detection unit.

Abstract: A method and device for real-time generation of a multiresolution representation of a digital image for real-time generation are disclosed. A sequence of main representations of the digital image is stored at successive different main resolutions in a main memory. A part of a current main representation is loaded from the main memory into a local memory via a bus. A current main representation is processed by determining a corresponding part of an intermediate representation of the image having an intermediate resolution lying between the resolution of the current main representation and the resolution of the subsequent main representation. The loading and processing steps are repeated for other parts of the current main representation until all parts of the current main representation have been successively loaded and processed.

Abstract: An information processing method and an electronic device are provided. The method comprises: detecting a first movement parameter value of an image capture unit of the electronic device in its current movement state, the first movement parameter value being associated with the current movement state of the image capture unit; determining a first capturing frame rate corresponding to the first movement parameter value based on a correspondence between movement parameter values and capturing frame rates; and controlling the image capture unit to capture an image at the first capturing frame rate.

Abstract: A board production work method which includes a position detection process which detects an arrangement position of a detection target provided on a printed circuit board, and a work executing process which subjects the printed circuit board to predetermined production work based on the detected arrangement position, in which the position detection process includes an image acquisition step of imaging the printed circuit board under multiple imaging conditions and acquiring multiple items of original image data containing luminance values of each pixel arranged in two-dimensional coordinates, a difference calculation step of using two of the multiple items of original image data as calculation targets, calculating differences between luminance values of pixels with same coordinate values, and acquiring difference image data which is formed of luminance difference values of each of the pixels, and a position determination step of determining the arrangement position based on the difference image data.

Abstract: A system, method, and device may include software and hardware which simplify and quicken configuration of the system for testing a device, enhance testing procedures which may be performed, and provide data via which to easily discern a cause and nature of an error which may result during testing. A camera may capture still images of a display screen of a tested device and another camera may capture video images of the tested device and a partner device. A wizard may be used to generate a configuration file based on one previously generated for a similar device. A mount for a tested device may be structured so that: it is suitable for mounting thereon a plurality of differently structured devices; and adjustments in a vertical direction and a horizontal direction in a plane and adjustments of an angle of the device relative to the plane may be easily made.

Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.

Abstract: The present disclosure provides a method and a device for measuring mura levels of liquid crystal display devices. The method includes steps of: acquiring correspondence between standard brightness data differences and standard mura levels; acquiring a measurement brightness data difference of a test image displayed by a to-be-tested liquid crystal display device before and after the measurement; and acquiring a mura level corresponding to the measurement brightness data difference in accordance with the correspondence.

Abstract: The invention provides a laser scanner system, which comprises two or more laser scanners installed on a movable object and a main control device, wherein the laser scanner is arranged as a TOF type which performs distance measurement by rotary projection of a pulsed light, and wherein the main control device produces a selection signal, the laser scanner, which is alternately selected based on the selection signal, performs distance measurement by emitting a pulsed light, wherein the laser scanner, which performs distance measurement at the same time, is a selected one.

Abstract: An inspection system includes a detection device arranged between a connector that couples a plurality of optical fibers to a port and the port; and a determination device that determines whether there is dart between the connector and the port, based on an output from the detection device, wherein the detection device includes a plurality of diodes that convert light that is output from each of the plurality of optical fibers to an electrical signal indicating intensity and distribution of the light, and the determination device includes a processor configured to determine whether there is dart between the connector and the port, based on the intensity and distribution of the light, which are indicated by the electrical signal.

Abstract: A system for detecting defects on a semiconductor sample includes an illumination module for directing a nonzero-order Gaussian illumination beam towards a plurality of locations on a sample and a collection module for detecting light scattered from the sample in response to the nonzero-order Gaussian illumination beams and generating a plurality of output images or signals for each location on the sample. The system further comprises a processor system for detecting defects by (i) processing the output images or signals so as to retain filtered image or signal portions that substantially match a point spread function of the one or more nonzero-order Gaussian illumination beams, and (ii) analyzing the filtered image or signal portions to detect defects on the sample.

Abstract: An automated optical inspection (AOI) system can comprise aligning a wafer comprising a plurality of unit specific patterns. A plurality of unique reference standards can be created as a plurality of electrical nets by generating with a computer an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point. An image of each of the plurality of unit specific patterns can be captured with a camera. The image can be processed with the computer to provide a plurality of extracted boundaries of contiguous electrically conductive regions. Defects in the plurality of unit specific patterns, if present, can be detected by comparing each of the extracted boundaries of contiguous electrically conductive regions to a corresponding one of the plurality of unique reference standards. An output of known good die can be created.

Abstract: A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide a

Abstract: Surface image data of a non-defective sample substrate is acquired, and surface image data of a substrate to be inspected is acquired. Differences between gradation values are calculated for pixels of the surface image data of the substrate to be inspected and corresponding pixels of the surface image data of the sample substrate. A constant value is added to the difference between gradation values of each pixel. In the case where the value acquired by addition is in a predetermined allowable range, it is determined that there is no defect for the substrate to be inspected. In the case where the value acquired by addition is outside of the allowable range, it is determined that the substrate to be inspected is defective. A defect in appearance on the substrate to be inspected is detected based on a pixel of which the value is outside of the allowable range.

Abstract: A method of detecting defects of a photomask includes measuring registration errors of the photomask, correcting the measured registration errors using a registration control process with a laser beam, extracting deformation data of the photomask deformed by the registration control process, reflecting the extracted deformation data in defect detection parameters to obtain compensated defect detection parameters, and detecting defects of the photomask using the compensated defect detection parameters.

Abstract: Provided is a lighting fixture, which belongs to the technical field of display equipment detection and can be used for solving the problem that an existing lighting fixture is liable to damage a detection probe in a detection process. The lighting fixture includes a work load platform, a lifting unit and a lighting test unit, wherein the work load platform is used for loading a display panel to be subjected to lighting test; the lifting unit is connected with the lighting test unit and used for driving the lighting test unit to ascend and descend; and the lighting test unit is provided with a plurality of probes and is driven by the lifting unit to contact the probes with a circuit test point on the display panel, in order to carry out the lighting test on the display panel. The lighting fixture is intelligent, flexile and strong in adaptability.

Abstract: In one embodiment, a writing data verification method is for verifying a conversion error due to data conversion from first writing data in a vector format based on design data to second writing data in a pixel format. The method includes converting the second writing data to third writing data in a vector format, performing an exclusive OR operation on the first writing data and the third writing data, enlarging a graphic of the first writing data to obtain an enlarged graphic and generating a tolerance region graphic from a difference between the enlarged graphic and the graphic of the first writing data, and detecting a defect by performing a mask process on a graphic generated by the exclusive OR operation with the tolerance region graphic.

Abstract: Video clips and images captured by one device (e.g., a camera) are associated with one or more synchronization labels such as synchronization device labels and synchronization time labels determined by the device. Synchronization device labels can be used to identify devices that are synchronized. Synchronization time labels indicate relative timing between the devices that are synchronized. When a device is on, it transmits a synchronization signal and receives another synchronization signal transmitted by another device in response to receiving the synchronization signal it has transmitted. The two devices each calculate a synchronization device label and a synchronization time label using the synchronization signals and associate the synchronization device label and synchronization time label with video frames and images captured. Video clips and images can subsequently be aligned using the associated synchronization device labels and the synchronization time labels.

Abstract: Providing an equipment manufacture supporting technique in which a plurality of departments that cooperate with one another can unify management of components constituting equipment.

Abstract: An image processing method includes acquiring a feature defining a distribution of similar forms in a first image; and restoring a hole included in a second image based on the feature. The feature may include structure information on a background included in the first image. The restoring may include determining, based on the feature, candidate blocks corresponding to a restoration block and restoring the restoration block based on the candidate blocks. The restoration block may include at least a portion of the hole.

Abstract: The present invention provides a quick processing system and method for SMT equipment, that is: firstly read PCB design files and BOM files inputted, and generate core data including text data and graphic data of all components to be assembled; then search the component data matched with each component to be assembled in the local database on basis of the core data, and link the found component information with the corresponding component to be assembled, and mark the component information as an available component, and create component information on basis of the core data of the component to be assembled, and stored to the local database, then mark the component information as an available component, and recover the component information on basis of the graphic data in the core data as an error is checked out; finally output the validated component information to the SMT equipment system.

Abstract: A method of inspecting a unit under test containing brazed dielectric to metal bond, includes providing at least one image of the bond and determining a characteristic of the bond based on at least one of a presence and size of a glassy phase in or adjacent to the bond.

Abstract: There is provided an electronic component handling apparatus which can be reduced in size or can improve the throughput when the number of contact arms is increased. A handler comprises: a plurality of contact arms which are arrayed along a first direction, each of the plurality of contact arms including a holding part which holds a DUT and including an adjustment unit which moves the holding part relative to a base part of each contact arm; an imaging unit capable of imaging the DUT and the holding part; an operation unit which operates the adjustment unit; and a moving unit which moves the imaging unit and the operation unit along an X direction. The adjustment unit adjusts the relative position of the holding part according to an operation of the operation unit.

Abstract: A method for mounting an electronic component (180) onto a component carrier (179) is described.

Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

Abstract: A controller in a printer operates one or more printheads in the printer with reference to a predetermined height of material above a surface of a member and a height of a top layer of material above the surface of the member. The height of the top layer is identified with reference to a first sensor that generates data corresponding to a height of a face of one of the printheads above the surface of the member and a second sensor that generates data corresponding to a distance between the face of one of the printheads and the top layer of material.

Abstract: Correction of an initial three-dimensional image of a deformed object comprises the provision of a model of the undeformed object comprising first zones, the determination in the initial three-dimensional image of second zones corresponding to the first zones, the determination of a first geometric transformation which maps the second zones to the first zones and the determination of a three-dimensional image corrected on the basis of the first geometric transformation and of the initial three-dimensional image.

Abstract: Methods for fast and accurate mapping of passivation defects in a silicon wafer involve capturing of photoluminescence (PL) images while the wafer is moving, for instance, when the wafer is transported on a belt in a fabrication line. The methods can be applied to in-line diagnostics of silicon wafers in solar cell fabrication. Example embodiments include a procedure for obtaining the whole wafer images of passivation defects from a single image (map) of photoluminescence intensity, and can provide rapid feedback for process control.

Abstract: A dictionary for detection of an object is created from an image obtained by performing an image process, which depends on a first image process parameter, on the training image of the detection target object. The dictionary created based on the image process depending on the first image process parameter is determined, based on a result of detecting the object from an image obtained by performing an image process, which depends on the first image process parameter, on a photographed image based on the dictionary. A second image process parameter is determined, based on a result of detecting the object from an image obtained by performing an image process, which depends on the second image process parameter, on the photographed image using the determined dictionary.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

Abstract: Systems and methods for inspecting wound optical fiber to detect and characterize defects are disclosed. The method includes illuminating the wound optical fiber with light from a light source and capturing a digital image based on measurement light that is redirected by the wound optical fiber to a digital camera. The method also includes processing the digital image with a computer to detect and characterize the defects. The types of defects that can be detected using the systems and methods disclosed herein include bubbles, abrasions, punctures, scratches, surface contamination, winding errors, periodic dimensional errors, aperiodic dimensional errors and dents.

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Abstract: Provided is a method of detecting a defect of a pattern using vectorization to increase accuracy and efficiency in OPC modeling and OPC verification. The method includes acquiring a target layout image associated with a target pattern, acquiring a pattern image associated with a pattern formed on a substrate, extracting an edge image from the pattern image, producing a first vector form based on the target layout image, producing a second vector form based on the edge image, and comparing the first vector form with the second vector form.

Abstract: A method for recognizing a known object in a field of view of a three-dimensional (3D) vision system includes capturing a bitmap image file of the field of view and executing a first feature extraction to generate appearance features including a color histogram and an edge direction histogram. A reduced search space is identified based upon the appearance features including the color histogram and the edge direction histogram. A second feature extraction of the bitmap image file is executed to identify geometric features including a viewpoint feature histogram and an ensemble of shape functions. The appearance features and the geometric features are fused with contents of the reduced search space. The fused appearance features, geometric features and contents of the reduced search space are compared with a plurality of predetermined partial views of a plurality of known objects to recognize one of the known objects.

Abstract: A scanning projective lensless microscope device comprises a specimen surface, a scanning illumination source with a light element, a light detector outside the specimen surface, and a processor. The scanning illumination source scans the light element to a plurality of scanning locations to provide illumination to an object on the specimen surface. The light detector samples a sequence of sub-pixel shifted projection object images corresponding to the plurality of scanning locations. The processor constructs a high resolution image of the object based on the sequence of sub-pixel shifted projection images and a motion vector of the projections at a plane of interest.

Abstract: A measurement device includes an image capturing unit which includes a photoelectric unit and captures multiple images corresponding to different photoelectric areas of the photoelectric unit, multiple reflecting units arranged at different positions and configured to reflect light traveling from a projection area, changing units which change image capture angles of the reflecting units, a light condensing unit which condenses the light reflected off the different reflecting units to the different photoelectric areas, an obtaining unit which obtains the captured images corresponding to the photoelectric areas and corresponding image capture angles of the reflecting units, a selection unit which selects, from the captured images, two or more images in each of which a measurement subject is captured, and a calculation unit which calculates a position of the measurement subject in a 3D space from the selected captured images and the image capture angles corresponding to the captured images.

Abstract: A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise providing a plurality of semiconductor die formed as a reconstituted wafer. A plurality of unit specific patterns can be formed by forming a unit specific pattern over each of the plurality of semiconductor die, wherein each of the unit specific patterns is customized to fit its respective semiconductor die. A plurality of images can be acquired by acquiring an image for each of the plurality of unit specific patterns. A plurality of unique reference standards can be created by creating a unique reference standard for each of the plurality of unit specific patterns. Defects can be detected in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the plurality of unit specific patterns.