Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

Abstract: A pixel circuit is provided. The pixel circuit may comprise a photodiode, a comparator circuit, a capacitor, a first switch circuit, a second switch circuit and a third switch circuit. The photodiode is arranged to accumulate charges in response to incident radiation, to generate a photodiode signal. The comparator circuit is arranged to generate an output signal according to a voltage level of a specific node within the pixel circuit during a read-out phase of the pixel circuit. The capacitor is coupled between a control voltage terminal of the pixel circuit and the specific node, the first switch circuit is coupled between the photodiode and the specific node, the second switch circuit is coupled between the specific node and an output terminal of the pixel circuit, and the third switch circuit is coupled between the output terminal and the comparator circuit.

Abstract: A method for reconstructing a hyperspectral image and a system therefor are provided. The method includes obtaining a dispersion model for dispersion created by a prism included in a camera, the prism including no coded aperture, and reconstructing a hyperspectral image corresponding to a captured image based on the dispersion model.

Abstract: The size of the camera sensor devices allows a great number of applications such as medical applications. The image sensor itself is approximately the size of a cube of 1 mm3. Such devices are used for endoscopy in the medical field or to be integrated in alarm clock or a watch for surveillance purpose.

Abstract: The present disclosure relates to a detection panel, a manufacturing method thereof and a detection device. The detection panel comprises: a base substrate and a photoelectric conversion structure located on the base substrate, and a display structure located on a side of the photoelectric conversion structure facing away from the base substrate and electrically connected to the photoelectric conversion structure; wherein the photoelectric conversion structure is configured to convert an optical signal into an electrical signal, and the display structure is configured to perform image display according to the electrical signal.

Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.

Abstract: An image sensor system includes a timing control circuit, an image sensor and a modulation circuit. The timing control circuit is arranged to determine if a coding condition is fit according to an input signal and generate a control signal when the coding condition is fit. The input signal has a signal value updated in response to each pulse of a clock signal. The image sensor is coupled to the timing control circuit, and includes a plurality of pixels. One of the plurality of pixels receives the control signal from the timing control circuit and outputs a sensing signal. The modulation circuit is coupled to the image sensor, and arranged to receive the sensing signal and generate an output signal according to the sensing signal.

Abstract: Provided is a solid state imaging device including a pixel in which the pixel has a photoelectric conversion unit provided in a semiconductor substrate and a light guide having a bottom that emits an incident light to the photoelectric conversion unit. The photoelectric conversion unit includes a first semiconductor region of a first conductivity type provided at a first depth of the semiconductor substrate, and second and third semiconductor regions of a second conductivity type provided at a second depth located under the first depth of the semiconductor substrate and spaced apart from each other by a first region. Each of the second semiconductor region, the third semiconductor region, and the first region overlaps with a part of the first semiconductor region in a planar view. At least a part of the bottom and at least a part of the first region overlap with each other in the planar view.

Abstract: An imaging device includes: a pixel including a photoelectric converter including a pixel electrode, a counter electrode, and a photoelectric conversion fila converting light into a charge, an amplification transistor a first gate of which is connected to the pixel electrode, a reset transistor one of second source and drain of which is connected to the pixel electrode, and a feedback transistor one of third source and drain of which is connected to the other of the second source and drain; and a first voltage supply circuit supplying a first voltage to the counter electrode. The reset transistor has such a characteristic that when a voltage equal to or higher than a clipping voltage is supplied between the second gate and the one of the second source and drain, the reset transistor is turned off. The clipping voltage is lower than the first voltage.

Abstract: An AD converter includes a comparator that compares a potential of a pixel signal line with a reference potential that is a potential of a ramp waveform changing with time, a counter that stops a counting operation in response to a change in an output of the comparator, and an all-bit latch unit that holds all bits of a count value subsequent to stopping the counting operation during the second count period. The counter sets an initial value for the counting operation during the first count period to be a negative value, and prior to the counting operation during the second count period, inverts all bits of the count value subsequent to stopping the counting operation during the first count period.

Abstract: Some embodiments provide a novel compressive-sensing image capture device and a method of using data captured by the compressive-sensing image capture device. The novel compressive-sensing image capture device includes an array of sensors for detecting electromagnetic radiation. Each sensor in the sensor array has an associated mask that blocks electromagnetic radiation from portions of the sensor. In some embodiments, an array of passive masks is used to block a particular set of areas of each sensor in the sensor array. In some embodiments, the image capture device also includes an array of lenses corresponding to the sensors of the sensor array such that each sensor receives light that passes through a different lens. Some embodiments of the invention provide a dynamic mask array. In some embodiments, a novel machine trained network is provided that processes image capture data captured by the compressive-sensing image capture device to predict solutions to problems.

Abstract: An image capture device may detect and repair banding artifacts in a video. The image capture device may include an image sensor and an image processor. The image sensor may capture a frame that includes a sinusoidal light waveform banding artifact. The image processor may detect a sinusoidal light waveform in the frame. The image processor may perform a sinusoidal regression. The image processor may obtain an inverted gain map. The image processor may apply the inverted gain map to the frame. The image processor may output the frame.

Abstract: A method of synchronizing images from multiple image sensors having different properties is described. The method comprises synchronizing a capture of a first image using a first image sensor and a capture of a second image using a second image sensor; and storing at least one of (a) the captured first image on an on-sensor memory of the first image sensor, or (b) the captured second image on an on-sensor memory of the second image sensor.

Abstract: A photoelectric conversion apparatus according to one aspect of the present invention includes a first substrate including a photoelectric conversion region and a surrounding region, and a second substrate including a circuit for processing a signal from the photoelectric conversion region, and overlapping the first substrate. In this case, the circuit for processing a signal from the photoelectric conversion region includes a first circuit and a second circuit with a higher drive frequency than that of the first circuit. In an orthogonal projection, the second circuit is only provided in the photoelectric conversion region.

Abstract: An imaging apparatus includes an imager, an imaging controller and a display controller as defined herein, a time required for the first rolling readout drive is longer than a time required for each of the rolling reset drive, the rolling shutter drive and the second rolling readout drive, and in an imaging mode in which the imaging controller performs the first drive while continuously performing the second drive, the imaging controller sets a first start timing of the second drive performed first after a start of the first drive to be during an implementation period of the first rolling readout drive in the first drive, and synchronizes a second start timing of the rolling shutter drive performed first after the start of the first drive with the display update timing that comes first after an end of the first rolling readout drive.

Abstract: An image sensing device includes: a first source ramp voltage generation circuit suitable for generating a first source ramp voltage that is adjusted a first voltage unit for each first period, a second source ramp voltage generation circuit suitable for generating a second source ramp voltage that is adjusted the first voltage unit for each first period and has a set voltage difference from the first source ramp voltage, and a ramp voltage generation circuit suitable for generating a ramp voltage that is adjusted a second voltage unit that is less than the first voltage unit for each second period that is shorter than the first period based on the first and second source ramp voltages and a plurality of first control signals.

Abstract: An image sensor may include a pixel array including a plurality of pixel blocks structured to convert light into electrical signals. Each of the plurality of pixel blocks may include a first light receiving circuit including a plurality of unit pixels which share a first floating diffusion; a second light receiving circuit arranged adjacent to the first light receiving circuit in a second direction, and including a plurality of unit pixels which share a second floating diffusion; a first driving circuit and a second driving circuit positioned between the first light receiving circuit and the second light receiving circuit, and aligned in a first direction crossing the second direction; and an intercoupling circuit configured to electrically couple the first floating diffusion, the second floating diffusion, the first driving circuit and the second driving circuit.

Abstract: An image pickup device includes: a first electrode film; an organic photoelectric conversion film; a second electrode film; and a metal wiring film electrically connected to the second electrode film, the first electrode film, the organic photoelectric conversion film, and the second electrode film all provided on a substrate in this order, and the metal wiring film coating an entire side of the organic photoelectric conversion film.

Abstract: According to one embodiment, an edge of the second opening is recessed further than an edge of the first opening away from a center of the first opening. The recess has an opening and a concave surface and is disposed in a region inward from the edge of the second opening. The opening has a circular configuration. The concave surface has a curvature.

Abstract: An image sensor includes a sensor portion and an ASIC portion bonded to the sensor portion. The sensor portion includes a first substrate having radiation-sensing pixels, a first interconnect structure, a first isolation layer, and a first dielectric layer. The ASIC portion includes a second substrate, a second isolation layer, and a second dielectric layer. The material compositions of the first and second isolation layers and the first and second dielectric layers are configured such that the first and second isolation layers may serve as barrier layers to prevent copper diffusion into oxide. The first and second isolation layers may also serve as etching-stop layers in the formation of the image sensor.

Abstract: An optical filter includes an absorption layer which increases a visible light transmittance while having a good near-infrared blocking characteristic, and which is excellent in not only adhesiveness with respect to a layer to be abutted, but also light resistance. The optical filter includes: an absorption layer containing a near-infrared absorbing dye containing a squarylium-based dye and a transparent resin; and an inorganic or organic material in contact with the absorption layer. The squarylium-based dye has a squarylium skeleton and condensed ring structures bonded thereto respectively on both sides thereof, the condensed ring structures each including a benzene ring and a nitrogen atom as an annular atom, each benzene ring having an urethane structure in the second position.

Abstract: While realizing a broad dynamic range, the present technology relates to a solid-state image pickup device and control method therefor, and electronic apparatus aiming at enabling an influence of PLS to be suppressed. The solid-state image pickup device includes a pixel array unit in which a plurality of pixels are arrayed. A portion of pixels in the pixel array unit are a unit pixel at least having one photoelectric conversion element and over flow integration capacitor. Further, the solid-state image pickup device includes one AD converter for one or more unit pixels in the pixel array unit. The present technology is applicable to, for example, the solid-state image pickup.

Abstract: An imaging device includes a photoelectric converter including a pixel electrode, a counter electrode, and a photoelectric conversion layer between the pixel electrode and the counter electrode, the photoelectric conversion layer converting incident light into an electric charge; and a voltage application circuit that applies a first voltage between the pixel electrode and the counter electrode in a first frame and that applies a second voltage between the pixel electrode and the counter electrode in a second frame different from the first frame, the first voltage being a constant voltage, the second voltage being a pulse-shaped voltage.

Abstract: Image quality can be improved. In a case where light is focused on the center of an opening, sensitivity can be decreased by extending any side of a light-shielding film to the center. Namely, in the case of adjusting the sensitivity to be decreased, there is no need to simultaneously change all the sides, but the adjusting may be achieved by moving only a specific side. Further, since each side is regarded as individual adjusting parameter, a complicated inside-angle-of-view distribution can be corrected. The present disclosure can be applied to, for example, a CMOS solid-state imaging device to be used in an imaging device such as a camera.

Abstract: An optical imaging device for imaging a biometric input object is disclosed. The optical sensor includes an array of sensing elements. The optical sensor is configured to read a subset of sensing elements in the array of sensing elements; analyze the reading of the subset of sensing element to determine if one or more sensing elements of the subset is saturated; alter an operating point of the optical imaging device; and image the input object.

Abstract: An image sensor, comprising a pixel region in which a plurality of pixel units are arranged, each pixel unit having first and second photoelectric conversion portions, a first output portion that outputs, outside of the image sensor, a first signal based on a signal from the first photoelectric conversion portion of the pixel units, and a second output portion that outputs a second signal based on a signal from the first photoelectric conversion portion and a signal from the second photoelectric conversion portion of the pixel units, wherein output of the first signal from the first output portion and output of the second signal from the second output portion are performed in parallel.

Abstract: This disclosure relates to a real-time video extensometer. Typically, the apparatus of the disclosure combines the image source, data processing and electrical output on to a single processing board in order to achieve high frequency images and low latency times on data flow. Further, the video processing engine processes the image on a pixel basis and updating the output the intermediate extension/strain result so that after receipt of the final image pixel, a final extension/strain value is achieved and immediately output for evaluation.

Abstract: An image sensor includes a pixel including a reset circuit and a floating diffusion node, and outputting a pixel signal that is generated based on a voltage at the floating diffusion node, the pixel signal including a reset output that is generated based on the voltage at the floating diffusion node being reset by the reset circuit. The image sensor further includes a sampler sampling the output pixel signal to generate a sampling signal having a time interval corresponding to a magnitude of the output pixel signal, and a counter counting the generated sampling signal, based on a counter clock, to generate a counting value corresponding to the time interval of the sampling signal. The sampler samples the reset output of the output pixel signal n times to generate first to n-th reset sampling signals, where n is an integer of 2 or more.

Abstract: A pixel circuit includes a floating diffusion layer of a first conductivity-type between a drain/source of a second conductivity-type and a source/drain of the second conductivity-type. The source/drain and the drain/source touch the floating diffusion layer. A cathode of a photoelectric converter is electrically connected to the floating diffusion layer. An anode of the photoelectric converter touches the cathode. The cathode is of the first conductivity-type and the anode is of the second conductivity-type.

Abstract: To realize miniaturization of a pixel, reduction in noise, and high quantum efficiency, and to improve short-wavelength sensitivity while suppressing inter-pixel interference and variations for each pixel. According to the present disclosure, there is provided an imaging device including: a first semiconductor layer formed in a semiconductor substrate; a second semiconductor layer of a conductivity type opposite to a conductivity type of the first semiconductor layer formed on the first semiconductor layer; a pixel separation unit which defines a pixel region including the first semiconductor layer and the second semiconductor layer; a first electrode which is connected to the first semiconductor layer from one surface side of the semiconductor substrate; and a second electrode which is connected to the second semiconductor layer from a light irradiation surface side that is the other surface of the semiconductor substrate, and is formed to correspond to a position of the pixel separation unit.

Abstract: An imaging device is often paired with a readout integrated circuit (ROIC), which provides processing and data transfer functionality. The circuitry of a ROIC is typically specialized to meet the requirements of an application, which limits the ROIC to a few modes of operation and restricts compatibility to only certain types of imaging devices and applications. Furthermore, the circuitry supporting the processing functionality is limited due to size constraints on the ROIC. These shortcomings can be overcome with a field programmable imaging array (FPIA), which can be implemented as an integrated circuit combining customized ROIC sensor interface circuitry with field programmable gate array (FPGA) circuitry to enable post-fabrication definition of ROIC operational modes. An FPIA chip may form part of a three-chip stack that also includes an analog sensor interface chip for analog-to-digital conversion and an imaging device.

Abstract: An imaging device includes pixels including a photoelectric conversion unit, a holding unit holding charge transferred from the photoelectric conversion unit, and an amplifier unit outputting signal based on the charge. The pixels output a first signal based on charge generated in a first exposure period and a second signal based on charge generated in a second exposure period of different length. In the first exposure period, the photoelectric conversion unit accumulates the generated charge, and charge held by the holding unit is transferred to the amplifier unit. The second exposure period includes a period of accumulating the generated charge only in the photoelectric conversion unit and a period of holding the generated charge in the photoelectric conversion unit and the holding unit. In the period of accumulating the generated charge only in the photoelectric conversion unit, the charge held by the holding unit is transferred to the amplifier unit.

Abstract: A method and a system for recording a Super Slow Motion (SSM) video in a portable electronic device are provided. A SSM video recording system detects presence of motion in the image frames captured by the image capturing device. Upon detecting the presence of motion, the SSM video recording system generates a trigger, subsequent to which, a first and fourth set of image frames for performing a frame skipping mechanism, and a second and third set of image frames for performing an interpolation mechanism are selected. The image frames of desired frame rate generated by performing the frame skipping mechanism and the interpolation mechanism are transmitted to an encoder in an order, for encoding and recording. The method and system allow SSM even in mid-tier and low-tier models of smartphones, without the need of expensive specialized image sensors.

Abstract: A photo sensor includes a plurality of pixel blocks, each including one or more anchor pixels and one or more non-anchor pixels. The anchor pixels produce first sensor signals and the non-anchor pixels produce second sensor signals. An amplifier circuit amplifies the first and second sensor signals. A variable bit-depth analog to digital converter (ADC) circuit quantizes amplified versions of the first sensor signals into first digitized sensor signals with a first bit-depth. The ADC circuit also quantizes amplified versions of the second sensor signals into second digitized sensor signals with a second bit-depth that is lower than the first bit depth. The second bit-depth may be selected based on anchor pixel statistics derived from the one or more first digitized sensor signals.

Abstract: According to the present invention, an imaging device and a reproducing device that allow for high quality reproduction of images generated by using two image signals having different lengths of accumulation periods output form a single imaging element are provided. A solid state imaging device of the invention includes a pixel array including a pixel having first and second photoelectric conversion units; a scanning unit that drives the pixel such that an accumulation period of an intermediate time of the first photoelectric conversion unit matches an intermediate time of an accumulation period of the second photoelectric conversion unit; a readout unit that reads out a first image signal from the first photoelectric conversion unit and reads out a second image signal from the second photoelectric conversion unit; and a generating unit that generates images by using the first and second image signals whose accumulation periods have the matched intermediate time.

Abstract: The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.

Abstract: A zoom lens consists of, in order from an object side, a positive first lens group fixed relative to the image surface during zooming, at least two movable lens groups including a negative second lens group being adjacent to the first lens group, the at least two movable lens groups being movable by changing a distance in an optical-axis direction to an adjacent group during zooming; and a final lens group arranged on the most image side and fixed relative to the image surface during zooming. The first lens group has, continuously in order from the most object side, a first negative lens having a concave surface facing an image side, a second negative lens, and a third positive lens. A predetermined conditional expression relating to the first lens group is satisfied.

Abstract: An optical image capturing system comprising, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with negative refractive power has a concave image-side surface. The second lens element, the third lens element and the fourth lens element have refractive power. The fifth lens element has refractive power. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region and includes at least one convex shape in an off-axial region, wherein the surfaces thereof are aspheric. The seventh lens element with refractive power has an image-side surface being concave in a paraxial region and includes at least one convex shape in an off-axial region, wherein the surfaces thereof are aspheric.

Abstract: The present application discloses an imaging camera, including in a sequence: a first lens, a shielding, and a second lens. The shielding includes a first part extending horizontally, and a second part obliquely extending from the first part toward an optical axis of the imaging camera, and a third part extending horizontally from the second part toward the optical axis. Each of the first and second lenses includes a plane abutting against the first part and another plane abutting against the third part.

Abstract: HDR image generating processing is performed which generates one image from a plurality of images captured with different exposures within an image pickup device so that increases of power consumption and frame rate reduction can be improved.

Abstract: An image sensor, comprising: a pixel array in which a plurality of pixels are arranged, wherein at least one of the plurality of pixels includes: a substrate including a photoelectric transformation element having a light receiving region and a light shielding region; and a first hafnium-containing layer formed to contact the substrate corresponding to the light shielding region.

Abstract: Comprising a positive first lens group G1 disposed at a most object side, a negative intermediate group G2 disposed at an image side of the first lens group G1, a positive focusing group G3 disposed at an image side of the intermediate group G2, the focusing group G3 being moved upon focusing, and a positive image side group G4 disposed at an image side of the focusing group G3; upon varying magnification, a distance between the first lens group G1 and the intermediate group G2, a distance between the intermediate group G2 and the focusing group G3 and a distance between the focusing group G3 and the image side group G4 being varied; and the image side group G4 comprising, in order from an object side, a positive A group G4A, a negative B group G4B satisfying a predetermined conditional expression with respect to the A group G4A, and a C group G4C, whereby a variable magnification optical system having excellent optical performance and a focusing lens group reduced in weight in order to attain high speed focu

Abstract: Sensor units can be disposed in a support member. Each of the sensor units can include a folded flex board having a plurality of laminations and an aperture and a sensor disposed in the folded flex board such that the sensor is positioned over the aperture. The system can be used in broad band plasma inspection tools for semiconductor wafers.

Abstract: In a solid state imaging device having a plurality of pixels arranged in a matrix on a substrate, each of the plurality of pixels includes a photoelectric conversion region and an element separation region separating the photoelectric conversion region. The substrate includes a semiconductor substrate, a first epitaxial layer formed on the semiconductor substrate, and a second epitaxial layer formed on the first epitaxial layer. The photoelectric conversion region and the element separation region are formed over the first epitaxial layer and the second epitaxial layer.

Abstract: The present technology relates to an information processing device and an information processing method, a solid-state imaging device and a solid-state imaging device operation method, a program, and an electronic apparatus in which an IC having an AF lens drive control unit mounted therein is made compatible with various communication specifications that vary with the types of lens driver ICs to be connected. A digital analogue converter (DAC) code for controlling a lens driver IC that controls driving of an actuator that drives a focusing lens is generated. A communication format related to serial communication is set in accordance with the lens driver IC, and is stored. The DAC code is buried in the communication format, to form a format compatible with the lens driver IC. Control is performed to cause the DAC code to be transmitted to the lens driver IC through serial communication. The present technology can be applied to imaging apparatuses.

Abstract: An imaging device provided with: a pixel including a photoelectric converter that converts light into charges, the pixel outputting a first signal corresponding to an amount of the charges; an output signal line coupled to the pixel, the first signal being transmitted through the output signal line; a load transistor having a source, a drain, and a gate, one of the source and the drain being coupled to the output signal line; and a voltage supply circuit coupled to the gate of the load transistor, the voltage supply circuit selectively supplying either a first voltage or a second voltage to the gate.

Abstract: A solid-state imaging device has a pixel sharing unit, and the pixel sharing unit includes a plurality of pixel units each including a plurality of photodiodes, floating diffusions, and a plurality of read transistors, a reset transistor and an amplification transistor shared by the plurality of pixel units, a plurality of read wirings, a connection wiring that connects the floating diffusions to each other. In the pixel sharing unit, the connection wiring and each of the plurality of read wirings are disposed to have overlapping areas in a plan view, and the connection wiring and the plurality of read wirings are disposed such that parasitic capacitors generated in the plurality of overlapping areas are approximately equal to one another.

Abstract: Provided are a solid-state imaging device, a method for driving a solid-state imaging device, and an electronic apparatus capable of achieving low power consumption with a simpler circuit and a smaller area, and capable of realizing high-speed charging. A voltage supply part includes an external capacitor in which a first electrode is connected to a first node and a second electrode is connected to a second node, a first switch connected between a first power-source potential vaa and the first node, a second switch connected between a second power-source potential vgnd and the second node, and a third switch connected between the first power-source potential vaa and the second node, and the first node is connected to a first power-source voltage terminal of a row driver.

Abstract: A zoom lens consists of, in order from an object side, a positive first lens group, a negative second lens group, a positive third lens group, a positive fourth lens group, and a positive fifth lens group. During zooming from a wide angle end to a telephoto end, the first lens group is fixed relative to an image surface, and distances between the respective lens groups change in predetermined manners. The second lens group consists of predetermined four lens components.

Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.