Abstract: An optical imaging lens set includes a first lens element to a plastic fifth lens element from an object side toward an image side along an optical axis. The second lens element has an image-side surface with a convex portion in a vicinity of its periphery. The fourth lens element has an image-side surface with a concave portion in a vicinity of the optical axis and a convex portion in a vicinity of its periphery.

Abstract: Certain exemplary embodiments can provide a system, machine, device, manufacture, circuit, composition of matter, and/or user interface adapted for and/or resulting from, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise and/or relate to, managing one or more images, such as those related to an optical system.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A backside illumination image sensor that includes a semiconductor substrate with a plurality of photoelectric conversion elements and a read circuit formed on a front surface side of the semiconductor substrate, and captures an image by outputting, via the read circuit, electrical signals generated as incident light having reached a back surface side of the semiconductor substrate is received at the photoelectric conversion elements includes: a light shielding film formed on a side where incident light enters the photoelectric conversion elements, with an opening formed therein in correspondence to each photoelectric conversion element; and an on-chip lens formed at a position set apart from the light shielding film by a predetermined distance in correspondence to each photoelectric conversion element. The light shielding film and an exit pupil plane of the image forming optical system achieve a conjugate relation to each other with regard to the on-chip lens.

Abstract: A zoom lens includes, in order from an object side to an image side, a first lens unit having negative refractive power, a second lens unit having positive refractive power, a third lens unit having negative refractive power, and a fourth lens unit having positive refractive power, in which each lens unit moves during zooming from a wide-angle end to a telephoto end, and a focal length of the first lens unit, a focal length of the second lens unit, and a focal length of the entire zoom lens at the wide-angle end are appropriately set.

Abstract: In one implementation, an image sensor is calibrated by determining a spectral characterization for each image window of an image sensor, correlating the spectral characterization for each image window of the image sensor with a spectral property of a target illuminant, and generating a scale factor for each image window of the image sensor. The scale factor for each image window of the image sensor is generated based on the correlating.

Abstract: A mask acquisition unit acquires a mask (region information) that matches photography setting information acquired by a photography setting acquisition unit, the mask defining a sub-image region of a light field image acquired by an LFI acquisition unit. A prototype definition unit disposes a prototype of a reconstructed image at a position of reconstruction setting in a reconstruction setting storage unit. A reconstructed pixel selecting unit selects a pixel of interest from pixels of a reconstructed image. A corresponding pixel extracting unit extracts, as a corresponding pixel, a pixel that corresponds to the pixel of interest and is included in a sub-image region of the acquired mask. A pixel value calculation unit calculates a pixel value of the pixel of interest from a pixel value of the corresponding pixel. An output unit decides pixel values of all reconstructed pixels as pixels of interest and generates and outputs a reconstructed image.

Abstract: A compressive imaging system for optimizing dynamic range during the acquisition of compressed images. A light modulator modulates incident light with spatial patterns to produced modulated light. A light sensing device generates an electrical signal representing intensity of the modulated light over time. The system amplifies a difference between the electrical signal and an adjustable baseline voltage and captures samples of the amplified signal. The adjustable baseline voltage is set to be approximately equal to the average value of the electrical signal. A compressive imaging system for identifying and correcting hot spot(s) in the incident light field. Search patterns are sent to the light modulator and the corresponding samples of the electrical signal are analyzed. Once the hot spot is located, the light modulating elements corresponding to the hot spot may be turned off or their duty cycle may be reduced.

Abstract: An imaging system for imaging a range of field points over on- and off-axis fields includes an image sensor for capturing image data, and first and second optical elements that are spaced apart and cooperate to image light at the image sensor. The first and second optical elements are configured to jointly modify phase of the light transmitted therethrough such that point-spread functions (“PSFs”) corresponding to the range field points are substantially uniform over on- and off-axis fields.

Abstract: There is provided a lens module including: a plurality of lenses; and a plurality of interval maintaining members disposed between the plurality of lenses, respectively, and having light-shielding holes formed therein, respectively, so that light input through the plurality of lenses passes therethrough, wherein sizes of the respective light-shielding holes are increased in a downward optical axis direction, and at least one of the plurality of light-shielding holes has a rectangular shape.

Abstract: An optical system includes, in order from the object side, an aperture, a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a positive refractive power and having a meniscus shape with a convex surface facing the image side, and a fifth lens having a negative refractive power. The optical system satisfies a certain condition.

Abstract: A color image pickup device is provided with four pixel groups i.e. first to fourth pixel groups. The first pixel group is composed of nine pixels of 3×3 each having one of color filters, and the pixels are arranged in a Bayer pattern. The second pixel group is adjacent to the bottom of the first pixel group. The third pixel group is adjacent to the right of the second pixel group. The fourth pixel group is adjacent to the top of the third pixel group. The second pixel group, the third pixel group, and the fourth pixel group have such array patterns of the color filters that the array pattern of the first pixel group is turned by 90 degrees, 180 degrees, and 270 degrees counterclockwise, respectively. By using the pixels of 6×6 including the first to fourth pixel groups as a basic unit, an imaging surface is configured.

Abstract: An imaging apparatus and method enables an automated extended depth of field capability that automates and simplifies the process of creating extended depth of field images. An embodiment automates the acquisition of an image “stack” or sequence and stores metadata at the time of image acquisition that facilitates production of a composite image having an extended depth of field from at least a portion of the images in the acquired sequence. An embodiment allows a user to specify, either at the time of image capture or at the time the composite image is created, a range of distances that the user wishes to have in focus within the composite image. An embodiment provides an on-board capability to produce a composite, extended depth of field image from the image stack. One embodiment allows the user to import the image stack into an image-processing software application that produces the composite image.

Abstract: An image sensor that output a signal for detecting a focus state of a photographing lens. The image sensor includes a microlens; a light-receiving pixel; a first focus state detection pixel pair for outputting a focus state detection signal, in which aperture areas of the first focus state detection pixel pair are small in comparison to the light-receiving pixel; and a second focus state detection pixel pair for outputting a focus state detection signal, in which aperture areas of the second focus state detection pixel pair are small in comparison to the light-receiving pixel, wherein the second focus state detection pixel pair is arranged at a position that is shifted by a predetermined amount relative to each aperture position, with respect to the microlens of the first focus state detection pixel pair.

Abstract: The present invention comprises a system for and method of frequency prefiltering comprising a camera shutter capable of continuously variable illumination during a single exposure of the sensor. The shutter comprises a continuously variable exposure effector which in disposed in an image path, either in front of a lens or between a lens and a sensor. The system for frequency prefiltering further comprises a synchronization cable that synchronizes a drive system with a sensor or with film. The shutter further comprises a postfilter. The postfilter comprises a digital finite impulse response convolutional filter.

Abstract: Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package.

Abstract: The invention relates to an electronic device for performing imaging, including a camera means for creating image data (ID) from an imaging target (IT), the imaging target (IT) including at least one primary image object (I1) and at least one secondary image object (I2), an image-processing chain arranged in connection with the camera, for processing the image data created from the imaging target, and a focussing unit for focussing the camera on at least the primary image object. In addition, a blurring unit is arranged in the image-processing chain, to blur at least some of the said secondary image objects in the image data, and arranged to use the information produced by the focussing unit.

Abstract: An image pickup lens includes, an aperture stop, a first meniscus lens having positive refractive power with a convex surface facing the object, a second lens having positive refractive power with a concave surface facing the object, a third lens having negative refractive power with a convex surface facing the object, the both surfaces of the third lens are aspheric and having at least one pole-change point, and following conditional expressions are satisfied: TTL<3.0??(1) 0.80<f1/f<0.93??(2) 0.35<bf/TTL<0.42??(3) 0.70<TTL/(2IH)<0.85??(4) where TTL: a length from the surface closest to the object to an image plane, f: a focal length of an overall optical system, f1: a focal length of the first lens, bf: a length from the image-side surface of the third lens to the image plane, and IH: a maximum image height.

Abstract: A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

Abstract: A solid-state image sensing device includes a light receiving layer and a shutter layer. The light receiving layer has a photoelectric conversion part arranged in a plane state and configured to convert received light into an electric signal. The shutter layer is configured to control transmission of the light to be incident on the light receiving layer. In the solid-state image sensing device, an interval between the light receiving layer and the shutter layer is less than or equal to a length of a shutter element formed in the shutter layer.

Abstract: A solid-state image capture device including: at least one photoelectric converter at an image capture surface of a substrate; at least one on-chip lens at the image capture surface of the substrate and above a light-receiving surface of the photoelectric converter; and an antireflection layer on an upper surface of the on-chip lens. The antireflection layer contains a binder resin having a lower refractive index than that of the on-chip lens and low-refractive-index particles having a lower refractive index than that of the binder resin.

Abstract: A measuring device for measuring a response speed of a display panel is provided. The measuring device includes a microcontroller and at least one photo sensor. The microcontroller provides a control command, according to which a display controller of the display panel provides test pattern to the display panel. The photo sensor senses a test frame displayed corresponding to the test pattern by the display panel, and provides a corresponding sensing signal associated with brightness and a response signal. According to the response signal, the response speed of the display panel is calculated.

Abstract: Embodiments of the invention describe an enclosure for an image capture system that includes an image capture unit and a solid state die to provide focusing capabilities for a lens unit of the image capture unit. The enclosure may electrically couple the solid state die to the image capture unit and/or other system circuitry. The enclosure may further serve as EMI shielding for the image capture system.

Abstract: A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

Abstract: A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.

Abstract: A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

Abstract: The present disclosure provides a method of manufacturing a photoelectric conversion device, including, a first step of forming a plurality of photoelectric conversion regions on a surface on one side of a semiconductor wafer, a second step of preparing a light-blocking wafer having insertion openings, a third step of bonding the one-side surface of the semiconductor wafer and a surface on the opposite side to a surface on the one side of the light-blocking wafer to each other to form a bonded wafer body, and a fourth step of dividing the bonded wafer body in peripheries of the photoelectric conversion regions, to obtain bonded-body chips each having the photoelectric conversion region.

Abstract: An imaging device, comprising: an imaging unit having first pixels configured to photoelectrically convert a subject image which is imaged with a photographic lens and to output a first image signal, and second pixels configured to be placed discretely between the first pixels so as to photoelectrically convert each of a plurality of subject images which come from divided pupil regions formed by dividing a pupil region of the photographic lens and to output second image signals having a phase difference; an imaging control unit; a parallax information calculation unit; a plane image generation unit; and a blurring processing unit configured to determine target pixels in the plane image which are to be subjected to blurring processing, based on the parallax information calculated by the parallax information calculation unit, and to perform blurring processing on the determined target pixels in the plane image.

Abstract: In a back-illuminated solid-state image sensing element, the areas of the front surface sides of individual pixels are the same as one another, regardless of the colors of light components dispersed by filters and entering the individual pixels, and the areas of the rear surface sides of pixels which a dispersed red light component enters are larger than the areas of the rear surface sides of pixels which a green or blue light component enters.

Abstract: An imaging device is provided that includes a camera body, a lens barrel, a lens barrel information transmitter, and an image sensor driver. The image sensor is housed in the camera body. The lens barrel is attachable to and detachable from the camera body. The lens barrel information transmitter regularly transmits information of the lens barrel to the camera body. The image sensor driver drives the image sensor at one of at least two different frame rates where a second frame rate is higher than a first frame rate. The amount of data being transmitted is reduced by the lens barrel information transmitter when the image sensor is driven at the second frame rate, compared to the amount transmitted when the image sensor is driven at the first frame rate.

Abstract: A zoom lens includes, in order from an object side to an image side, a positive first lens unit, a negative second lens unit, an aperture stop, a positive third lens unit, and a positive fourth lens unit. The third lens unit includes, in that order, a positive first lens sub-unit, and a negative second lens sub-unit. The second lens sub-unit is movable in a direction having a component perpendicular to an optical axis to change an image forming position in a direction perpendicular to the optical axis. A distance on the optical axis between the aperture stop and the third lens unit at a wide-angle end, a composite focal length of the first lens unit and the second lens unit at the wide-angle end, a focal length of the first lens sub-unit, and a focal length of the second lens sub-unit are appropriately set.

Abstract: Embodiments of the invention describe providing image focusing capabilities for a lens unit of an image capture system by disposing a solid state die over the lens unit. The solid state die may include a plurality of electrodes to receive a voltage or electric signal to generate an electric field. The refractive index of the solid state die will change in response to the generated electric field to focus the image or scene captured by the lens unit. The solid state die is mounted to a folded flexible printed circuit board in a housing or a molded housing having electrodes on its inner wall.

Abstract: In an imaging device having an objective and a stage for holding a sample to be imaged, a method for autofocusing is presented. The method includes determining a measured focus value corresponding to at least a first of a plurality of logical image segments. Further, the method includes imaging the first logical image segment using the measured focus value. The method also includes determining a predicted focus value for a second of the plurality of logical image segments using the measured focus value and a stored focus variation parameter. In addition, the method includes imaging the second logical image segment using the predicted focus value.

Abstract: The present invention provides an optical member including a porous glass layer on the base member, wherein a ripple is suppressed. The optical member includes the porous glass layer which is disposed on the base member and which has a thickness of 400 nm or more, wherein the porous glass layer includes at least a gradient region having a porosity increasing from the interface between the base member and the porous glass layer toward the surface of the porous glass layer, the porosity is continuous in the thickness direction from the base member to the surface of the porous glass layer, and a specific relational expression is satisfied.

Abstract: An imaging device includes: an imaging area in which a plurality of pixels used to acquire an image are provided; a spectrum area in which a plurality of pixels used to acquire a color spectrum are provided; and a filter that is formed above the pixels provided in the spectrum area and allows an electromagnetic wave with a desired wavelength to pass, wherein the filter is formed of a plasmon resonator that is a conductive metal structure having an unevenness structure at a predetermined pitch, and the imaging area and the spectrum area are provided on a single chip.

Abstract: Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. An imaging device in accordance with one embodiment of the invention includes at least one imager array, and each imager in the array comprises a plurality of light sensing elements and a lens stack including at least one lens surface, where the lens stack is configured to form an image on the light sensing elements, control circuitry configured to capture images formed on the light sensing elements of each of the imagers, and a super-resolution processing module configured to generate at least one higher resolution super-resolved image using a plurality of the captured images.

Abstract: Electronic devices may include super-resolution imaging systems for capturing multiple relatively low-resolution images and combining the captured images to form a high-resolution image. The imaging system may include image sensors configured to capture information above the Nyquist frequency of the image sensor by providing each image sensor pixel in an array of image sensor pixels with structures for reducing the size of the clear pixel aperture below the size of the image sensor pixel. The structures may be configured to pass light that is incident on a central region of the image sensor pixel to a photo-sensitive element through a color filter element and to reject light that is incident on a surrounding edge region. The structures may include a microlens configured to reject light that is incident on the edge region or a combination of a microlens and masking structures. Masking structures may be absorbing, reflecting, or interfering structures.

Abstract: A zoom lens includes a negative lens unit having a negative refractive power and a positive lens unit having a positive refractive power arranged in order from an object side to an image side. For focusing from infinity to a closest distance, the negative lens unit moves towards the image side and the positive lens unit moves towards the object side. Predetermined mathematical conditions are satisfied to obtain high optical performance over the entire focusing range.

Abstract: A dust removing device generates vibrations at least at a wavelength ? in a vibrating member by applying alternating voltages to a first piezoelectric element and a second piezoelectric element, respectively. The first piezoelectric element is provided on a first surface of the vibrating member that is on a side having a target surface. The second piezoelectric element is provided on a second surface of the vibrating member that is opposite the first surface. When the first piezoelectric element and the second piezoelectric element are projected in a direction that is normal to the target surface, a distance dL1 between a vibration generating end of the first piezoelectric element and a vibration generating end of the second piezoelectric element is expressed in the form dL1>0, where dL1?n?/2 and n is a positive integer.

Abstract: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.

Abstract: An optical unit may include a fixed body; a movable module which holds an optical element; and a shake correction drive mechanism which is structured to generate a drive force for swinging the movable module with respect to the fixed body. The shake correction drive mechanism may include a plurality of permanent magnets which are provided on an outer peripheral face of the movable module at positions separated in a circumferential direction around an optical axis of the optical element; and a sheet-shaped coil which is extended in a circumferential direction in the fixed body and is integrally provided with a plurality of coil parts facing the permanent magnets and a terminal part electrically connected with the coil parts.

Abstract: A camera module includes a lens system, an image sensor, and an actuator. The actuator is fixed relative to the image sensor, and the actuator moves the lens system relative to the image sensor to achieve focus. Components that move relative to each other result in gaps or spaces between the components, an in particular there is a gap between the lens system and the actuator. Such a gap provides a traveling path for foreign material, or particulates, to enter the camera module and reach the image sensor, or other intermediate optical components between the lens system and the image sensor. A camera contamination reduction apparatus is implemented as a protective membrane that prevents foreign material from reaching the internal optical components through the traveling path.

Abstract: An electrically controllable optical lens apparatus makes use of fixed lenses and an active optical element together in a lens enclosure. The enclosure may be a barrel structure that is easily mounted to a camera device having an image sensor. The active optical element, such as a tunable liquid crystal lens, receives an electrical signal from the camera device via electrical conductors integral with the lens enclosure that provide electrical pathways between the active element on the interior of the enclosure and surface contacts on the camera device. The enclosure may be a two-piece structure, and the electrical conductors may be attached to either piece of the structure. The lens enclosure may also be threaded for attachment to the camera device. The electrical conductors may also use spring loaded contact portions or molded interconnect devices.

Abstract: The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.

Abstract: A solid-state imaging device includes: a light-receiving element; and a multilayer film which is disposed on a side of a light-receiving surface of the light-receiving element and is formed by laminating a plurality of layers made of materials having different refractive indices, in which a defect layer is included in at least one of the laminated layers, wherein in the defect layer, a plurality of kinds of materials having different refractive indices coexist in a surface parallel to the light-receiving surface.

Abstract: An electrical drive device for a bending photographing optical system, the bending photographing optical system including a movable optical element that is movable in an optical axis direction and a reflection optical element positioned on the optical axis, the electrical drive device includes a motor provided with a leadscrew which extends therefrom in a direction parallel to the optical axis and drives the movable optical element to move in a direction of the optical axis. The leadscrew includes a threaded portion which screw-engages with a nut member provided on the movable optical element, and a small-diameter portion having a smaller diameter than that of the threaded portion, the small-diameter portion being positioned beside a side surface of the reflection optical element.

Abstract: A liquid crystal optical device includes: a first electrode unit including a first substrate transparent to light, a light-transmitting layer formed on the first substrate, and a first electrode formed on the light-transmitting layer and being transparent to light, the light-transmitting layer including recesses formed on a surface facing the first electrode, arranged in a first direction, and extending in a second direction; a second electrode unit including a second substrate, the second substrate being transparent to light, and two second electrodes formed on the second substrate, the second electrodes being arranged in the second direction and extending along the first direction; a liquid crystal layer located between the first and second electrode units; a first polarizing plate located on an opposite side of the second electrode unit from the liquid crystal layer; and a drive unit that applies voltages to the first and second electrodes.

Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.

Abstract: Provided is a small-sized five-element image pickup lens which ensures a sufficient lens speed of about F2 and exhibits various aberrations being excellently corrected. The image pickup lens is composed of, in order from the object side, a first lens with a positive refractive power, including a convex surface facing the object side; a second lens with a negative refractive power, including a concave surface facing the image side; a third lens with a positive or negative refractive power; a fourth lens with a positive refractive power, including a convex surface facing the image side; and a fifth lens with a negative refractive power, including a concave surface facing the image side. The image-side surface of the fifth lens has an aspheric shape, and includes an inflection point at a position excluding an intersection point with the optical axis.

Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.