Abstract: A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.

Abstract: An optical keyless entry sensor system and method includes an optical sensor in association with a mirror that reflects light transmitted from the optical sensor, wherein reflected light is detectable by the optical sensor. An attenuation filter can be located between the mirror and the optical sensor, wherein the attenuation filter is configured to simulate a contamination of the optical sensor in order to determine an exact level of attenuation representative of contamination that causes a performance failure of the optical sensor, thereby providing data which is indicative of a dynamic range of the optical sensor, such that the dynamic range is utilized to enhance the performance of the optical keyless entry sensor system.

Abstract: A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-? directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern.

Abstract: A defect inspection apparatus enable to efficiently perform a temperature control without involving an enlarged size can be achieved. The parts constituting the defect inspection apparatus are classified into parts need temperature control and parts not to need temperature control; all the parts need temperature control are accommodated together into a temperature-controlled part accommodating section 604, and the parts not to need temperature control are arranged in a heat radiating unit 605. The temperature in the temperature-controlled part accommodating section 604 is measured by a temperature measuring instrument 603 and a control CPU 602 in a temperature control unit 601 carries out control according to the measured temperature so that the interior of the temperature-controlled part accommodating section 604 is kept at a fixed temperature.

Abstract: Reflected light caused by the state of the surface of a wafer, a foreign material or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. It has therefore been difficult to accurately measure the haze frequency component by use of a fixed threshold value. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.

Abstract: Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.

Abstract: A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.

Abstract: A particle inspection apparatus includes an irradiation unit configured to apply a light beam onto front and back surfaces of an object to be inspected, first and second detection units configured to detect scattering light from the surfaces, a calculation unit configured to conduct a particle inspection on the surfaces on the basis of outputs from the detection units, and a control unit configured to control the irradiation unit, the detection units, and the calculation unit. The irradiation unit can selectively apply the beam onto the front or back surface. The control unit causes the calculation unit to conduct the particle inspection on the inspection surface on which the light beam is selectively applied, on the basis of outputs made by the detection unit corresponding to simultaneous application and selective application of the light beam.

Abstract: An exposure apparatus includes a projection optical system configured to project light from an original, wherein the apparatus exposes a substrate to light through liquid filled in a gap between the last surface of the projection optical system and the substrate; and a detecting device configured to detect a droplet adhering to the exposed substrate. The detecting device includes a storage unit configured to prestore first image data corresponding to a surface of the substrate without the liquid and an image-capturing unit configured to capture an image of a surface of the exposed substrate. The detecting device detects the droplet based on a comparison between the first image data and second image data obtained by the image-capturing unit.

Abstract: An encoder configuration comprises an illumination portion, a scale comprising a scale track, and a signal processing electronics. The signal processing electronics may include a detector comprising a first set of three detector sub-portions that provide a first set of signals comprising three respective sub-portion signal subsets that have nominally the same signal characteristics when the scale track is not contaminated or defective. The processing electronics analyze the first set of signals and identify a least-similar sub-portion signal subset that has a corresponding signal characteristic value that is least similar to comparable signal characteristic values associated with more-similar sub-portion signal subsets of the first set of signals. Position measurements are based on valid signals including a plurality of the more-similar sub-portion signal subsets and not including the least-similar sub-portion signal subset if it is significantly different.

Abstract: In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.

Abstract: A feature of a workpiece can be identified. Two-dimensional data of at least a region of a workpiece and three-dimensional data of a portion of the region of the workpiece are acquired, such as by illuminating at least the region with at least a first light source disposed at a first angle of incidence relative to a plane of the region and illuminating the portion with a second light source, such as at least one laser, disposed at a second angle of incidence greater than the first angle of incidence. An estimated location of an attribute of a feature of the workpiece is determined from the three-dimensional data, and the feature is identified by analyzing the two-dimensional data in an area surrounding the estimated location of the attribute. Attributes of features can include without limitation a point along a line of an edge.

Abstract: An apparatus is disclosed for detecting defects on a sample inspected by different inspection apparatuses. A data processing unit receives position information of a first defects group in a first coordinate system, based on inspection of the sample under a first condition using a first defect inspection apparatus. The data processing unit receives position information of a second defects group in a second coordinate system, after least one processing step has been performed on the sample. Position information of the second defects group is obtained by inspecting the sample under a second condition using a second defect inspection apparatus which is different from the first defect inspection apparatus. A position correction unit corrects error of relative position information on the first defects group and the second defects group, and the first and second defects groups are checked.

Abstract: In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot.

Abstract: An apparatus for inspecting a pattern shape of a magnetic record medium or its stamper includes: a moving mechanism, on which an object to be inspected where a pattern is formed is placed and which moves the object to be inspected in a radial direction while rotating the object; an irradiating optical system that applies illuminating light of a wide band including far ultraviolet light to the object to be inspected moved in the radial direction while rotating the object by the moving mechanism in a polarized state suitable for the object to be inspected from an oblique direction; a detecting optical system that detects zero-order reflected light generated from the object to be inspected irradiated by the irradiating optical system; and a shape inspection unit that inspects a pattern shape formed on the object to be inspected based on a spectral reflectance waveform obtained by dispersing the detected zero-order reflected light, thereby inspecting the pattern shape at a high speed and with high sensitivity.

Abstract: A surface defect data display and management system comprises a risk score calculation unit for calculating the magnitude of an influence a surface defect on a wafer detected by a wafer inspection system or review system has upon a reduction in the yield of a final product as a risk score of the surface defect based on a defect size of the surface defect on the wafer and a pattern concentration obtained from design data of a pattern figure nearby a location corresponding to the position of the surface defect, and a correlation graph and defect image display unit for preparing a correlation graph showing the correlation between the defect size and the risk score of each defect, displaying the prepared correlation graph on the display apparatus and displaying additionally a defect image list of one or more defects selected by using the correlation graph.

Abstract: A spatial mask printer may be used in conjunction with an optical inspection tool. The tool can be used to obtain a Fourier image of an inspected object, and a filter mask image can be designed to block certain aspects of the object's image in the Fourier plane corresponding to repetitive aspects of the imaged object. The filter mask image can then be printed and used in the tool during the inspection process. The mask image may be designed by hand or by computer and may be stored for later use. Filters may be automatically placed into the optical path of the inspection tool by a filter wheel, or may be housed in other filter banks. The printer may be configured to operate in a clean room environment, and may be integrated into the optical inspection tool.

Abstract: A light source section outputs optical flux having two types of wavelength, which are a short wavelength and a long wavelength, while the intensity is made variable. The output from the first light intensity detecting section in irradiating the optical flux having a short wavelength is compared with the output from the first light intensity detecting section in irradiating the optical flux having a long wavelength. A disappearance level near a point where the detected signal from the internal subject disappears is calculated. The first intensity of optical flux having a long wavelength is set to level higher than the disappearance level. Based on the output from the first light intensity detecting section obtained by the optical flux having a long wavelength of the first intensity, a subject inside the body to be detected is measured.

Abstract: A defect inspection apparatus and method includes a darkfield illumination optical system which conducts darkfield illumination upon the surface of a sample with irradiation light having at least one of wavelength band, a darkfield detection optical system which includes a reflecting objective lens for converging the light scattered from the surface of the sample that has been darkfield-illuminated with the irradiation light having the at least one wavelength band, and imaging optics for imaging onto a light-receiving surface of an image sensor the scattered light that the reflecting objective lens has converged, and an image processor which, in accordance with an image signal obtained from the image sensor of the darkfield detection optical system, discriminates defects or defect candidates present on the surface of the sample.

Abstract: Provided are novel inspection methods and systems for inspecting unpatterned objects, such as extreme ultraviolet (EUV) mask blanks, for surface defects, including extremely small defects. Defects may include various phase objects, such as bumps and pits that are only about 1 nanometer in height, and small particles. Inspection is performed at wavelengths less than about 250 nanometers, such as a reconfigured deep UV inspection system. A partial coherence sigma is set to between about 0.15 and 0.5. Phase defects can be found by using one or more defocused inspection passes, for example at one positive depth of focus (DOF) and one negative DOF. In certain embodiments, DOF is between about ?1 to ?3 and/or +1 to +3. The results of multiple inspection passes can be combined to differentiate defect types. Inspection methods may involve applying matched filters, thresholds, and/or correction factors in order to improve a signal to noise ratio.

Abstract: Methods of obtaining dopant and damage depth profile information are disclosed using modulated optical reflectivity (MOR) measurements. In one aspect, the depth profile is constructed using information obtained from various measurements such as the junction depth, junction abruptness and dopant concentration. In another aspect, a full theoretical model is developed. Actual measurements are fed to the model. Using an iterative approach, the actual measurements are compared to theoretical measurements calculated from the model to determine the actual depth profile.

Abstract: An optical inspection apparatus irradiates a light beam onto the outer surface of an object to be inspected, in the form of an illumination spot having an illumination intensity which is higher in the outer peripheral part of the object to be inspected than in the inner peripheral part thereof while uniformly maintains a temperature rise caused by the irradiation of the light beam, over the outer surface of the object to be inspected, in order to prevent the effective entire signal value of a scattered light signal from lowering, without lowering the linear speed of a movable stage for the object to be inspected in the outer peripheral part of the object to be inspected, thereby it is possible to prevent lowering of the detectability for a foreign matter or a defect, for preventing lowering of inspection throughput.

Abstract: An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.

Abstract: Computer-implemented methods that include correlating a backside defect with a frontside defect detected on a specimen are provided. The defects are correlated if a portion of the backside defect on the backside of the specimen is opposite to a portion of the frontside defect on the frontside of the specimen. In particular, the defects are correlated if the portion of the backside defect is aligned with the portion of the frontside defect along an axis perpendicular to the frontside and the backside of the specimen. The method may also include altering a parameter of a process tool in response to the backside defect to reduce frontside defects on additional specimen processed in the process tool. Computer-implemented methods for analyzing data representing spatial characteristics of backside defects detected on a specimen to classify the backside defects are also provided. Analyzing the data may include spatial signature analysis of the data.

Abstract: A defect generated during a nano-imprint process is inspected by a scatterometry method. The scatterometry method is to illuminate the surface of a medium with light having a plurality of wave lengths by means of a first illuminator through a half mirror and an objective lens and cause light reflected on the medium to be incident on a spectrometer through the objective lens and the half mirror. A second illuminator illuminates a foreign material or scratch on the surface of the medium from an oblique direction with respect to the surface of the medium. Light is scattered from the foreign material or scratch and detected by first and second detectors. The first detector is placed in a direction defining a first elevation angle with the surface of the medium. The second detector is placed in a direction defining a second elevation angle with the surface of the medium.

Abstract: A method is disclosed for in-situ monitoring of an EUV mirror to determine a degree of optical degradation. The method may comprise the steps/acts of irradiating at least a portion of the mirror with light having a wavelength outside the EUV spectrum, measuring at least a portion of the light after the light has reflected from the mirror, and using the measurement and a pre-determined relationship between mirror degradation and light reflectivity to estimate a degree of multi-layer mirror degradation. Also disclosed is a method for preparing a near-normal incidence, EUV mirror which may comprise the steps/acts of providing a metallic substrate, diamond turning a surface of the substrate, depositing at least one intermediate material overlying the surface using a physical vapor deposition technique, and depositing a multi-layer mirror coating overlying the intermediate material.

Abstract: The disclosure relates to a system and device for evaluating imperfections in a lens for a display for an electronic device. The evaluation device comprises: a substrate; and a pattern imposed on the substrate. The pattern comprises a series of lines in a grid imposed on the substrate wherein when the pattern is viewed through the lens, the series of lines having thickness of between approximately 10 and approximately 150 microns, spaced in intervals between approximately 20 microns and approximately 300 microns from center to center, the pattern is distorted around an area where a defect is present in the lens. With the device, the lens is identifiable as being defective if the pattern appears as a moiré distortion in the area when viewed through the lens.

Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

Abstract: If an illuminance of a measurement spot is limited in order to prevent heat damage on an article to be inspected, since detection sensitivity and a detection speed are in a relation of trade-off, it is difficult to improve one of them without sacrificing the other or to improve both of them. Also, there is a problem that the detection sensitivity is lowered on an outer circumference portion than on an inner circumference portion of the article to be inspected. A plurality of measurement units comprising an illumination optics, a measurement spot, a collection optics, and a light detection optics are provided, inspection results obtained from the plurality of measurement spots are integrated, and light-amount distribution to each measurement spot is controlled according to a scan radial position.

Abstract: Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.

Abstract: Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen are provided. One inspection system configured to block specular reflection and suppress modulation in an image of a specimen includes an illumination subsystem configured to illuminate the specimen with a predetermined pattern of spatially incoherent light. The system also includes an optical element configured to block light reflected from periodic features formed on the specimen and at least some light diffracted from the periodic features. The system further includes a detector configured to detect light that passes through the optical element and to generate an image of the specimen in response to the detected light. The optical element blocks specular reflection and at least partially suppresses modulation in the image due to the periodic features. The system also includes a processor configured to detect defects on the specimen using the image.

Abstract: A method for detecting defects on an object includes an illumination optical unit which obliquely projects a laser focused onto a line on a surface of the object and white-color, a table unit which mounts the specimen and which is movable, a detection optical unit which detects with an image sensor an image of light formed by light reflected from the object and passed through a filter which blocks diffraction light resulting from patterns formed on the object, a signal processor which processes a signal outputted from the image sensor of the detection optical unit to extract defects of the object, and a display unit which displays information of defects extracted by the signal processor. The filter is adjustable.

Abstract: An inspection device for visually inspecting an image sensor of a digital recording device, such as a digital camera. The inspection device includes a tubular housing and a lens mounted therein. The housing is configured to engage a lens interface of a camera body. A lighting assembly is provided that is configured to illuminate the image sensor when the inspection device is coupled to a digital camera body so that the image sensor may be visually inspected for contamination.

Abstract: A device for detecting soiling, having a light source, which emits a light beam, and an opaque layer having a first boundary surface and a second boundary surface, whereby the light beam emitted by the light source first impinges on the first boundary surface, and part of a light beam fraction, which is scattered at the second boundary surface, impinges on a receiver and forms a measuring signal, and hereby the first boundary surface is set up to scatter part of the incident light beam, and the part impinging on the receiver of the light beam, scattered at the first boundary surface, forms a reference signal, and the device is set up further to determine a measure for the soiling of the second boundary surface from the comparison of the reference signal and measuring signal.

Abstract: An inspection apparatus includes a captured image acquiring unit configured to acquire a captured image that is acquired by shooting an inspection target, an acquiring unit configured to acquire from the captured image a first image region and a second image region whose intensity distributions of reflected light with respect to an incident angle of illumination light emitted to the inspection target are different, and an image processing unit configured to perform image processing for performing different surface inspections on the first image region and the second image region respectively.

Abstract: A foreign-matter inspection apparatus is implemented which allows the stable detection sensitivity to be maintained. A laser beam emitted from a laser apparatus is applied to a beam irradiation sample via an irradiation unit and a mirror. Then, the laser beam is captured into a beam-capturing camera via an image-forming lens and a beam-direction switching mirror. Based on the captured beam image, an image computational processing unit judges inclination of the laser beam, then adjusting the irradiation unit thereby to correct the inclination of the laser beam. Also, the beam is captured into the beam-capturing camera in specified number-of-times while focus of the laser beam is being changed by an arbitrary amount by the irradiation unit. Based on the captured beam, the focus of the laser beam is corrected by adjusting the irradiation unit.

Abstract: A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.

Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.

Abstract: The invention is directed to a method for illuminating an object and projecting its image on a ground glass screen. Optical comparators conventionally use incandescent illumination, either mercury arc or halogen. The use of an array of high intensity LED devices, provides many options for packaging the required optical components used in comparators.

Abstract: Defect image display screens are capable of accurately presenting features of defects. On a thumbnail display screen of a defect, images likely to most clearly indicating features of the defect are determined in units of the defect from, for example, inspection information and a defect type, and then are displayed. On a detail display screen of a defect, for example, images for being displayed so as to clearly indicate features of the defect, and the display sequence thereof are determined in accordance with, for example, inspection information and a defect type, and then are displayed. Further, steps for acquiring a display image during or after defect image acquisition by using, for example, a different defect image acquisition apparatus and a different imaging condition in accordance with preliminarily specified rules are added to an imaging sequence (procedure).

Abstract: A foreign substance inspection apparatus includes a light projecting unit, a detector which detects the intensity of scattered light of light projected onto the surface of an object to be detected by the light projecting unit, in association with the two-dimensional coordinate position on the surface, and a processing unit. The relationship between the intensity of the scattered light detected by the detector and the particle size of the foreign substance differs depending on the two-dimensional coordinate position on the surface. The processing unit determines, a conversion curve to convert the intensity of the scattered light detected by the detector into the particle size of the foreign substance, in accordance with the two-dimensional coordinate position of the foreign substance detected by the detector, and converts the intensity of the scattered light detected by the detector into the particle size of the foreign substance using the determined conversion curve.

Abstract: An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.

Abstract: A foreign matter detector and a foreign matter detecting method are provided, with which foreign matter detection performance can be improved. The foreign matter detector comprises: a means for irradiating first inspection light and second inspection light to an inspection area such that their incident planes are perpendicular to each other; a measuring means for measuring the spectrum of reflected light, the reflected light being a reflection of the inspection light at the inspection area; and a means for determining, by analyzing the spectrum of the reflected light, whether any foreign matter is intermingled or not.

Abstract: Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.

Abstract: A method for inspecting an object includes emitting light from at least one of a liquid crystal display (LCD) device and a liquid crystal on silicon (LCOS) device, phase-shifting light emitted from at least one of the LCD device and the LCOS device, projecting the phase-shifted light onto a surface of an object, receiving light reflected from the object surface with an imaging sensor, and analyzing the light received by the imaging sensor to facilitate inspecting at least a portion of the object.

Abstract: A reticle defect inspection apparatus that controls damage of a reticle by irradiation with an inspection light when the reticle is caused to be at rest is provided. The reticle defect inspection apparatus is a reticle defect inspection apparatus for inspecting for defects on a reticle using a pattern image obtained by irradiating the reticle on which a pattern is formed with light. The reticle defect inspection apparatus has a dose monitoring part for measuring a dose of the light to the reticle, a comparing part for comparing, after calculating accumulated irradiation from the dose measured by the dose monitoring part, the accumulated irradiation with a preset threshold, and a stop mechanism for stopping irradiation of the reticle with the light when, as a result of the comparison, the accumulated irradiation exceeds the threshold.

Abstract: A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.

Abstract: The invention provides an apparatus and a method each capable of highly accurately reviewing at a high speed very small foreign matters and pattern defects occurring during a device production process for forming a circuit pattern on a substrate of semiconductor devices, etc. An objective lens having high NA is installed inside a vacuum chamber for an inspection object having a transparent film formed on the surface thereof and an illumination optical path is formed inside the objective lens so that dark visual field illumination can be made and reflected and scattered light of foreign matters or defects on the surface of the inspection object can be detected with high sensitivity.

Abstract: An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.

Abstract: The disclosure provides a cleaning apparatus and detecting method thereof. The cleaning apparatus includes a fan, a motor, a detecting device and a control unit. The motor drives the fan to create an air flow through the cleaning apparatus. The detecting device is electrically connected to the motor, and is utilized detected an impedance of the motor. The control unit is electrically connected to the motor and the detecting device respectively, for comparing the impedance of the motor with a predetermined value and outputting a signal indicative of a comparison result.