Ic/circuit Component On Suspension Element Patents (Class 360/244.1)
-
Publication number: 20020149881Abstract: A disk drive including a housing, an actuator arm rotatably mounted in the housing, a suspension fixed at a base end portion thereof to a front end portion of the actuator arm, a head slider mounted on a front end portion of the suspension and having an electromagnetic transducer, and a head IC mounted on the suspension in adjacent relationship with the head slider. The disk drive further includes a radiating flexible printed circuit sheet mounted on the suspension and the actuator arm, the radiating flexible printed circuit sheet having a first end portion fixed to the suspension and thermally connected to the head IC and a second end portion fixed to the actuator arm.Type: ApplicationFiled: September 13, 2001Publication date: October 17, 2002Applicant: FUJITSU LIMITEDInventor: Keishi Shimizu
-
Publication number: 20020131210Abstract: In a head suspension assembly manufacturing method, a wiring pattern is formed, and a head amplifier IC is mounted on the wiring pattern. The wiring pattern, mounted with the head amplifier IC, is fixed on a suspension and an arm of the head suspension assembly.Type: ApplicationFiled: March 7, 2002Publication date: September 19, 2002Inventor: Masaaki Habata
-
Patent number: 6437944Abstract: A suspension has an extending end and an other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.Type: GrantFiled: March 19, 1999Date of Patent: August 20, 2002Assignee: Fujitsu LimitedInventors: Takeshi Ohwe, Toru Watanabe, Ryosuke Koishi
-
Publication number: 20020093766Abstract: A structure and method of coating a chip where thickness can be accurately controlled. In a disclosed embodiment, a chip on suspension is flip-chip mounted in a hard disk drive and conformal coated with a uniform thickness with a material chosen from materials that have a proven acceptance for use in the disk drive environment. The invention includes a “shrink wrap” technique to apply the conformal coating on the flip-chip device.Type: ApplicationFiled: December 15, 1999Publication date: July 18, 2002Inventor: KURT P. WACHTLER
-
Patent number: 6404575Abstract: A read/write driver with a read/write head made of semiconductor material for writing and reading data from data media with a preamplifier forming a part of the read/write head for processing write signals from said read/write driver and driving a magnetic coil for writing, with power connections to the preamplifier thereby powering the coil. Also, a process for making the read/write head of the invention is described.Type: GrantFiled: September 24, 1999Date of Patent: June 11, 2002Assignee: Seagate Technology LLCInventor: Edward Tsing-Chien Yen
-
Patent number: 6388840Abstract: A wiring pattern having a small inductance and a small capacitance can be formed without increasing an equivalent mass of a suspension supporting a head slider in a disc apparatus. The suspension elastically supports the head slider having a head. A base portion of the suspension is mounted to an arm driven by an actuator. The head slider is mounted on a head slider mounting portion formed on an end of the suspension opposite to the base portion. A tongue portion is formed along a side of the base portion. The tongue portion uprightly protrudes from the base portion. A head IC chip is mounted on a head IC chip mounting portion formed in the tongue portion.Type: GrantFiled: August 22, 2000Date of Patent: May 14, 2002Assignee: Fujitsu LimitedInventor: Takeshi Ohwe
-
Patent number: 6369985Abstract: A head slider and head IC are mounted on a head suspension, the head IC being mounted on a head IC mounting surface. One or more through holes are provided on the head IC mounting surface of the head suspension and the head IC is mounted by injecting a bonding agent between the mounting surface and the head IC through the through holes. The bonding agent is evenly distributed beneath the head IC, so that the head suspension is well balanced.Type: GrantFiled: February 22, 2000Date of Patent: April 9, 2002Assignee: Fujitsu LimitedInventors: Akio Gouo, Hidehiko Kira, Norio Kainuma, Takeshi Ohwe
-
Publication number: 20020039257Abstract: There is provided a pre-amplifier with a baseplate configured for mounting to an actuator in a disc drive. The baseplate is directly fixed to the actuator at one point, with a damping layer between a second surface of the baseplate and the actuator. The damping layer helps to constrain the baseplate from rotational movement relative to the actuator. Preferably, the baseplate is fixed to the actuator by a grounding pin coupled to the baseplate.Type: ApplicationFiled: June 26, 2001Publication date: April 4, 2002Inventors: Yiren Hong, CheeWai SeeToh, Mo Xu, KongBeng Thia
-
Publication number: 20020034050Abstract: There is disclosed a head suspension assembly in which a trace having a wiring pattern is disposed on an arm and a suspension. A slider with a magnetic head formed thereon, and a head amplifier IC are mounted on the wiring pattern. An under fill is charged between the head amplifier IC and the wiring pattern, and an outer surface of the head amplifier IC is coated with a resin.Type: ApplicationFiled: September 19, 2001Publication date: March 21, 2002Inventors: Seishiro Fujiwara, Katsuhiko Kaida
-
Patent number: 6356413Abstract: The invention provides greatly shortened electrical paths for the wires or traces connecting a disk drive suspension slider to the preamplifier circuit chip without problems of chip wastage by supporting the disk drive suspension assembly of a slider, a flexure, a load beam and a mounting plate, all in operative association on the preamplifier circuit chip, and supporting the chip on the actuator arm.Type: GrantFiled: October 15, 1998Date of Patent: March 12, 2002Assignee: Magnecomp Corp.Inventors: Warren Coon, Amanullah Khan
-
Publication number: 20020024767Abstract: To restrain temperature rise by controlling heat radiation from an IC. More specifically, an area of junctioning pads which are in contact with an IC is enlarged to substantially overlap the whole or at least half or more of the area of the IC. Further, the IC is covered with an overcoat which protrudes to other parts of a head supporting mechanism.Type: ApplicationFiled: July 31, 2001Publication date: February 28, 2002Inventors: Shigeo Nakamura, Kousaku Wakatsuki, Haruhide Takahashi, Hitoshi Shindo, Hiromitsu Masuda, Mikio Tokuyama, Toshihiko Shimizu
-
Patent number: 6351347Abstract: Disclosed is a magnetic head in which the junction portion between a dummy pad and a dummy bump not adapted to transmit electrical signals between a head element and a flexible cable and provided on the lead-out side of the flexible cable, absorbs any distortion due to deflection of the flexible cable.Type: GrantFiled: July 13, 1999Date of Patent: February 26, 2002Assignee: Alps Electric Co., Ltd.Inventors: Yuki Ohno, Haruo Kurai
-
Publication number: 20020021531Abstract: A magnetic head apparatus including a magnetic head slider having at least one thin film magnetic head element, a suspension mounting the magnetic head slider on one face thereof, an IC chip mounted with a circuit for the thin film magnetic head element and a support arm fixedly supporting the suspension in which the IC chip is mounted on the one face of the suspension and is thermally coupled to the support arm.Type: ApplicationFiled: August 9, 2001Publication date: February 21, 2002Applicant: TDK CORPORATIONInventors: Masashi Shiraishi, Takeshi Wada, Mitsuyoshi Kawai, Takashi Honda, Norikazu Ota, Takao Matsumoto, Atsushi Hirose
-
Patent number: 6339519Abstract: There is disclosed a magnetic head device in which a head IC chip may be located relatively closer to a magnetic head and a thermal effect may be controlled to be within a range of acceptable degree. Said magnetic head device comprises a head slider having a magnetic head, a suspension member which is made of thin resilient material and supports the head slider at one end thereof, and a head IC chip, wherein the suspension member is attached to other member at the other end thereof. The IC chip is mounted on the suspension member. When the IC chip is selected to have appropriate disc side area and is mounted on the suspension member, the temperature of the IC chip itself may be maintained within a range of acceptable degree and that of the magnetic head may be also kept to be lower. When the electric power consumption of the IC chip is equal to or less than 410 mW, the disc side area thereof should be equal to or more than 1.1 mm2.Type: GrantFiled: November 10, 1999Date of Patent: January 15, 2002Assignee: TDK CorporationInventors: Izumi Nomura, Haruyuki Morita, Masashi Shiraishi, Mitsuyoshi Kawai, Takeshi Wada
-
Publication number: 20010053047Abstract: An actuator assembly of a disc drive having an actuator arm rotatably mounted adjacent a data disc. The actuator arm has a top surface and a bottom surface, and includes a head gimbal assembly support portion located at one end of the actuator arm. The actuator assembly further includes an arm circuit fastened to the top surface of the actuator arm. The actuator assembly may additionally include a head gimbal assembly that electrically couples the data transducer and the arm circuit. The gimbal circuit is partially routed along the head gimbal assembly and over the top surface of the actuator arm. Alignment apertures on the arm circuit and the head gimbal circuit and alignment pins on the actuator arm may be used for positioning of the circuits over the top surface of the actuator arm.Type: ApplicationFiled: June 11, 2001Publication date: December 20, 2001Applicant: Seagate Techhnology, LLCInventors: CheeWai Seetoh, WaiOnn Chee, Jierapipatanakul Niroot, Andre Yl Liem, Michael JooChiang Toh
-
Publication number: 20010043419Abstract: A head suspension assembly 4 having an arm 17 supported so as to rotate, an elastically flexible suspension 16 of which one end is fixed to an end of the arm and other end mounts a magnetic head 2, and a signal transmission line 18 fixed on the suspension and the arm which connects the magnetic head with a main FPC, wherein a head amplifier 8 which transmits and receives signals to and from the magnetic head and a nonvolatile memory 9 which stores optimized control parameters of the magnetic head and the head amplifier are mounted together on the head suspension assembly and the head amplifier and the nonvolatile memory are electrically connected to the signal transmission line.Type: ApplicationFiled: February 20, 2001Publication date: November 22, 2001Inventor: Akira Osaki
-
Publication number: 20010043439Abstract: A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.Type: ApplicationFiled: March 19, 1999Publication date: November 22, 2001Applicant: FUJITSU LIMITEDInventors: TAKESHI OHWE, TORU WATANABE, RYOSUKE KOISHI
-
Publication number: 20010036040Abstract: This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.Type: ApplicationFiled: December 27, 2000Publication date: November 1, 2001Applicant: FUJITSU LIMITEDInventor: Akio Gouo
-
Publication number: 20010030836Abstract: A head actuator assembly comprises a plate-like suspension having a distal end portion mounting with a magnetic head, and a trace having a relay FPC attached to the suspension through a lining plate. A head IC is mounted on the relay FPC and positioned near the magnetic head. In an area which faces the head IC, insulation layers of the FPC are removed, and an opening is formed in the lining plate and suspension. A wiring pattern of the relay FPC is exposed through this opening.Type: ApplicationFiled: March 15, 2001Publication date: October 18, 2001Inventor: Makoto Katsumata
-
Publication number: 20010022708Abstract: A HGA includes a magnetic head slider having at least one thin-film magnetic head element, an IC chip having a circuit for the at least one thin-film magnetic head element, and a suspension for supporting the magnetic head slider and the IC chip. All surfaces of the IC chip are coated by additional insulation layers. (FIG.Type: ApplicationFiled: February 13, 2001Publication date: September 20, 2001Inventors: Takeshi Wada, Mitsuyoshi Kawai, Takao Matsumoto, Atsushi Hirose, Masashi Shiraishi
-
Patent number: 6282062Abstract: A magnetic head apparatus includes a slider with at least one magnetic head element, a suspension having one end section, for supporting the slider at the one end section, a head IC chip mounted on the suspension, and a shock absorption layer for covering side surfaces and/or corner sections of head IC chip.Type: GrantFiled: February 22, 1999Date of Patent: August 28, 2001Assignee: TDK CorporationInventor: Masashi Shiraishi
-
Patent number: 6278583Abstract: A disk drive system includes a base, a disk rotatably attached to the base, and an actuator assembly pivotally attached to the base. The actuator assembly moves the transducer to selected areas of the disk where information representative of data is to be written or read. The actuator assembly maintains the transducer in a transducing relationship with the disk. The actuator assembly includes an arm and a head gimbal assembly. The head gimbal assembly includes a suspension. The arm has a length from the point where it pivots to the end of the arm. The arm and suspension can be thought of as having a fixed length for a certain sized disk drive. The length of the arm is greater than 4.0 times the length of the suspension. The ratio of the length of the arm to the length of the suspension is in the range of 4.0 to 20.0. The arm is made of a material with a stiffness-to-mass ratio in the range of 6.0 to 20.0×106 m.Type: GrantFiled: October 5, 1999Date of Patent: August 21, 2001Assignee: Questek Innovations, Inc.Inventor: James M. Adley
-
Patent number: 6266213Abstract: A suspension has a head slider loading prearranged portion on which a head slider integrally having a head is loaded, a head IC chip mounting prearranged portion on which a head IC chip is mounted, and wiring patterns which extend from the head slider loading prearranged portion. The head slider is loaded and supported on the head slider loading prearranged portion of the suspension. The head IC chip is mounted on the head IC chip mounting prearranged portion of the suspension. The head IC chip mounting prearranged portion includes through holes formed in the suspension and head IC chip mounting terminals on a surface of the suspension, which surface is opposite to a surface on which the head slider loading prearranged portion is provided, the terminals being electrically connected with the extending ends of said wiring patterns via the through holes, the terminals being provided in an arrangement corresponding to terminals of the head IC chip.Type: GrantFiled: March 19, 1999Date of Patent: July 24, 2001Assignee: Fujitsu LimitedInventor: Shinji Hiraoka
-
Patent number: 6259573Abstract: A preamplifier circuit to improve the ESD immunity of magnetic recording devices having magnetoresistive (MR) sensors, without degrading the sensor's high-frequency characteristics. The preamplifier circuit is coupled to an MR sensor having one terminal grounded. The preamplifier circuit includes a varistor coupled between a power supply line and a ground terminal. If a high voltage, exceeding the varistor voltage, is applied to the chassis (ground), it is discharged through the varistor between the power supply voltage line and the ground terminal, instead of through the MR head or the arm electronics module. The present invention thereby protects the MR head and the arm electronics module from ESD damage.Type: GrantFiled: February 22, 1999Date of Patent: July 10, 2001Assignee: International Business Machines CorporationInventors: Kazushi Tsuwako, Yoshiro Amano, Takao Matsui, Tsuyoshi Miura
-
Patent number: 6252743Abstract: Amplifier chips for heads in a disk drive are interspaced adjacent to junctions between actuator arms and suspension arms that hold the heads. This allows decreased spacing between plural disks in the drive system and accelerated data rates. This also decreases assembly steps and damage to the chips as they are further removed from mechanical processes such as swaging that attach the suspension arms to the actuator arms. Damage to the disks or chips during operation is also averted, as the chips are removed from each other and from the rapidly spinning disk surfaces with which the suspension arms and heads are proximate. The interspacing can also improve performance characteristics of the preamplifier chips, which do not need to be made as thin in order to fit between disks, decreasing costs and problems such as overheating of the chips.Type: GrantFiled: November 2, 1998Date of Patent: June 26, 2001Assignee: Read-Rite CorporationInventor: Jamshid Bozorgi
-
Publication number: 20010000445Abstract: A magnetic recording and reading device which has a transfer rate of not less than 50 MB/s and which includes a magnetic recording medium having an absolute value of normalized noise coefficient per recording density of not more than 2.5×10−8 (&mgr;Vrms)(inch)(&mgr;m)0.5/(&mgr;Vpp). The magnetic recording and reading device also includes a magnetic head which is mounted on an integrated circuit suspension so that a total inductance is reduced to be not more than 65 nH and has a magnetic core which is not more than 35 &mgr;m of length. A part of the magnetic core being formed by a magnetic film having a resistivity exceeding at least 50 &mgr;&OHgr;cm or by a multilayer film consisting of a magnetic film and an insulating film. A fast R/W-IC having a line width of not more than 0.Type: ApplicationFiled: November 29, 2000Publication date: April 26, 2001Inventor: Yoshihiro Shiroishi
-
Patent number: 6181520Abstract: A disk storage unit includes an electro-magnetic slider which has a contact detecting function. The unit includes a rotating recording disk, a slider body having a head for reading and writing information with respect to the recording disk, a suspension for supporting the slider body in such a manner that the slider body is opposed to the recording medium and flies above recording medium with a small gap therebetween owing to an air flow generated by a rotation of the recording disk. The suspension, on which the slider is mounted, has an electric resistance pattern formed on the suspension for detecting a strain generated on the resistance pattern when the slider body comes into contact with the disk recording medium.Type: GrantFiled: March 12, 1998Date of Patent: January 30, 2001Assignee: Fujitsu LimitedInventor: Katsuyuki Fukuda