Abstract: A holding device for encased capacitors used for electric drive engineering. The inventive holding device comprises integrateable and separable lower and top holding parts. Axially protruded retaining clamps are arranged on the top holding part around each encased capacitor. The lower holding part comprises an opening for the respective capacitor and each opening is surrounded with a sealing lip. The retaining clamps are pressed against the capacitors by the internal surface of the lower holding part. Sections protruded from the respective openings of the lower holding part are embodied in the form of the capacitor sections freely extending directly to a cold air flow of a device. The sealing lip is sealingly placed on the external wall of each encased capacitor in such a way that the penetration of solid or liquid materials inside the lower holding part is prohibited, thereby preventing a high IP protection degree.

Abstract: A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.

Abstract: A high-voltage sensing capacitor as an interface apparatus that may be used to attach an indicator unit to a high-voltage AC electrical bus and to provide safety to maintenance personnel. The high-impedance nature of the sensing capacitor effectively isolates the indicator unit from the high-voltage source to which it is connected. Multiple electrical phases can be interfaced using a plurality of such sensing capacitors. The sensing capacitor can be directly mounted to a high-voltage busbar. The indicator unit may provide visual and/or audible alerts to maintenance personnel when high voltage conditions are detected on the busbar by the sensing capacitor. The sensing capacitor is comprised of a portable, unitary capacitive structure that includes a molded insulator body encapsulating two electrodes. The electrodes of the capacitor only partially or incompletely overlap within the insulator body.

Abstract: A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electrode of the capacitor element. The busbar has a terminal. The package is made of norbornene-based resin and covers the capacitor-element assembly while exposing the terminal of the busbar. The supporter has first and second end section and is made of heat-conductive insulating material. The first end section contacts the capacitor-element assembly. The second end section is exposed from the package. This molded capacitor has high heat resistance and a small, light-weighted body, and can be manufactured inexpensively.

Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

Abstract: A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of ceramic fillers having different x values in the following Reaction Scheme 1. In this way, a dielectric body having a stable dielectric constant as well as a high dielectric constant against the change in temperature can be manufactured. Ba1-xSrxTiO3??[Reaction Scheme 1] whereas 0?x?1.

Abstract: Provided are an embedded capacitor, an embedded capacitor sheet using the embedded capacitor, and a method of manufacturing the same that may increase a surface area to thereby increase a capacity for each unit area and may provide an embedded capacitor in a sheet to thereby readily lay the embedded capacitor on an embedded printed circuit board. The embedded capacitor may include: a common electrode member 11 including a plurality of grooves 11a; a sealing dielectric layer 12 being formed by sealing a nano dielectric powder with a high dielectric constant in the plurality of grooves 11a formed in the common electrode member 11; a buffer dielectric layer 13 sealing and smoothing an uneven portion of the sealing dielectric layer 12 by applying a paste or a slurry including epoxy of 20 Vol % through 80 Vol % and dielectric powder of 20 Vol % through 80 Vol % with respect to the sealing dielectric layer 12; and an individual electrode member 14 being formed on the buffer dielectric layer 13.

Abstract: A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor.

Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.

Abstract: A copper-clad laminate with a capacitor, a printed circuit board having the same and a semiconductor package having the printed circuit board are presented. The copper-clad laminate with the capacitor includes a first and second conductive layers, a film body, and thickness uniformity improving members. The first and second conductive layers are aligned to be substantially in parallel to each other and thus oppose each other. The film body is interposed between the first and the second conductive layer. The thickness uniformity improving members are also interposed between the first and second conductive layers and are inserted within the film body. The thickness uniformity improving members have one end connected to the first conductive layer and have the opposing ends connected to the second conductive layer.

Abstract: A rolled film capacitor is disclosed which includes a first dielectric film and a second dielectric film, which are wound along their length dimension to form alternating turns of the winding. A plurality of first conductive segments are arranged on a first surface of the first dielectric film along the length dimension of the first dielectric film, and a plurality of second conductive segments are arranged on a surface of the second dielectric film along the length dimension of the second dielectric film, or on a second surface of the first dielectric film along the length dimension of the first dielectric film. The first conductive segments can have a progressively increasing length along the length dimension of the first dielectric film, and the second conductive segments have a progressively increasing length along the length dimension of the first or second dielectric film. The number of the first and/or second conductive segments per turn of the winding can be equal to or more than one.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.

Abstract: An embedded capacitor including a dielectric layer disposed between opposing faces of electrodes, in which the dielectric layer includes a high-loss dielectric layer and one or more insulating layers in contact with the high-loss dielectric layer. The dielectric layer may have a two-layer structure or a three-layer structure in which an insulating layer is additionally interposed between the high-loss dielectric layer and the electrode, thereby decreasing the dielectric loss while maintaining a high dielectric constant, compared to capacitors including a single-layer dielectric structure.

Abstract: A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion at which the lead frame projects the package. Concave portions can be provided in at least one lead of a pair of leads that project laterally from side faces of the package. The concave portions can be arranged at positions where the leads are bent approximately perpendicularly along the side faces of the package at respective central portions of the leads. Thus, a cross-sectional area of a bending portion of the lead can be reduced, thereby enabling the lead (or leads) to be easily bent with a smaller bending load. Therefore, a surface mount semiconductor device can be achieved which prevents disconnection without impairing a heat radiation property and which has good moisture resistance.

Abstract: A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plurality of terminal electrodes are connected to the first principal surface and define a first terminal electrode group, and at least two of the plurality of terminal electrodes are connected to the second principal surface and define a second terminal electrode group. One terminal electrode in the first terminal electrode group is electrically connected to one terminal electrode in the second terminal electrode group via the internal electrodes, and capacitance is provided by a pair of the terminal electrodes in the first terminal electrode group via the dielectric layer, and capacitance is provided by a pair of the terminal electrodes in the second terminal electrode group via the dielectric layer.

Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.

Abstract: A deep trench is formed in a semiconductor substrate and a pad layer thereupon, and filled with a dummy node dielectric and a dummy trench fill. A shallow trench isolation structure is formed in the semiconductor substrate. A dummy gate structure is formed in a device region after removal of the pad layer. A first dielectric layer is formed over the dummy gate structure and a protruding portion of the dummy trench fill and then planarized. The dummy structures are removed. The deep trench and a cavity formed by removal of the dummy gate structure are filled with a high dielectric constant material layer and a metallic layer, which form a high-k node dielectric and a metallic inner electrode of a deep trench capacitor in the deep trench and a high-k gate dielectric and a metal gate in the device region.

Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive elements and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals.

Abstract: The present invention has an object to provide a method for forming an oxide dielectric layer, which dielectric layer is formed by applying the sol-gel method, and is hardly damaged by an etching solution and excellent in dielectric characteristics such as a large electric capacitance. To achieve the object, the forming method of an oxide dielectric layer by applying a sol-gel method characterized by being provided with the following processes (a) to (c) is employed. Process (a): A solution preparing process of preparing a sol-gel solution for manufacturing an aiming oxide dielectric layer. Process (b): A coating process wherein stages of the sol-gel solution coating on the surface of a metal substrate followed by drying in an oxygen-containing atmosphere followed by pyrolysis in an oxygen-containing atmosphere sequentially is made one unit step; the one unit step is repeated twice or more times; and a pre-baking stage at 550-deg.C to 1000-deg.

Abstract: A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated terminal plate (3) that includes, at the outer surface thereof, an insertion hole (2a) to which a pair of lead wires (2) introduced from a sealing member of a capacitor body are inserted and a first concave groove (2a) for storing lead wires (2) inserted to the hole while lead wires (2) being bent in an orthogonal direction. Insulated terminal plate (3) is attached to the capacitor so as to be abutted with the above sealing member. Metal electrode (4) is buried in an inner face of first concave groove (2a) provided in insulated terminal plate (3) and the periphery thereof.

Abstract: A capacitor assembly includes a first electrode, a second electrode, a dielectric portion, a body and a conductive cover. The second electrode overlaps the first electrode. The dielectric portion is interposed between the first and second electrodes. The body surrounds an outer surface of the dielectric portion, the first electrode and the second electrode, and partially exposes end portions of the first and second electrodes. The conductive cover covers a side surface of the body, and has a greater width than a width of each of the end portions of the first and second electrodes. Therefore, yield of the capacitor assembly is increased, and defects are decreased.

Abstract: It is an object of the present invention to provide a capacitor layer forming material which is applicable to printed wiring boards manufactured through a high-temperature processing of 300° C. to 400° C. of a fluorine-contained resin substrate, a liquid crystal polymer and the like, and exhibits no deterioration of the strength after a high-temperature heating. In order to achieve the object, a capacitor layer forming material for a printed wiring board which comprises a first conductive layer used for forming a top electrode, a second conductive layer used for forming a bottom electrode and a dielectric layer between the first and second conductive layers, characterized in that for the second conductive layer, a nickel layer or a nickel alloy layer is employed. The nickel layer or the nickel alloy layer as the second conductive layer preferably has a thickness of 10 micron meter to 100 micron meter.

Abstract: An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture resistance and low gas and moisture permeability to protect the electric element from short and long term moisture degradation effects. A known case layer is located adjacent to the coating layer. The case layer is a metal, epoxy-based, silicone-based, or polymer material that encapsulates the coating layer and the electric element to protect the coating layer and electric element from physical damage.

Abstract: Provided are a tunable inter-digital capacitor (IDC) and a method of manufacturing the same. The tunable IDC includes: a first dielectric layer formed on a substrate and having electrode pattern grooves of an IDC including a ground line and a signal line formed therein; electrode metal patterns formed in the electrode pattern grooves of the IDC including the ground line and the signal line formed in the first dielectric layer; and a second dielectric layer formed on an upper surface of the first dielectric layer to cover all of the electrode metal patterns except for parts of the ground and signal lines. Therefore, it is possible to increase tunability of the IDC and reduce drive voltage.

Abstract: Disclosed is an organic encapsulant composition that, when applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards, allows the capacitor to resist printed wiring board chemicals and survive accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.

Abstract: The present invention provides an electric double layer capacitor. An electric double layer capacitor element sandwiches a separator between a cathode and an anode, arranged inside a container comprising a concave shaped containing portion and lid. A first conductive layer on the inner bottom face of a containing portion is covered by an insulating layer, and opening portions formed on the insulating layer penetrate to the first conductive layer. A second conductive layer is formed on the insulating layer and inside the opening portions, and is connected to a cathode through a conductive adhesive. The first conductive layer penetrates through the side wall of the containing portion, and is connected to a connecting terminal. An anode is connected to a third conductive layer through a conductive adhesive, and a collector is connected to a connecting terminal by extending between the containing portion and the lid.

Abstract: Apparatus and method for depositing a banding material on the interior substrate of a tubular device, and the products formed therefrom. The tubular device is, generally, of relatively small diameter and comprises at least one band deposited from a first composition on the interior substrate. When the tubular device is a tubular capacitor and the band is a plating mask, the tubular capacitor comprises at least two electrodes deposited on the substrate in the presence of a deposited plating mask and comprises at least one conductive layer, deposited from a first composition, on the substrate and separated by the plating mask.

Abstract: According to some embodiments, a capacitor includes a first external capacitor plane including a first at least one terminal of a first polarity, and a first internal capacitor plane including a second at least one terminal of the first polarity. The second at least one terminal of the first polarity may be electrically coupled to the first at least one terminal of the first polarity, and a total area of the second at least one terminal of the first polarity may be less than a total area of the first at least one terminal of the first polarity.

Abstract: A self protected fluid filled capacitor that includes a capacitor section. Preferably, the capacitor section is configured to attach to a cover that can be placed on a capacitor housing. The capacitor contains an insulating fluid that surrounds the capacitor section when the capacitor section is inserted in the capacitor. A capacitor chamber that is configured to contain a retained portion of the insulating fluid and the capacitor section is also included. Also contained in the capacitor is an overflow chamber region in communication with the capacitor chamber. The capacitor chamber is configured to provide a capacitor chamber opening near a top portion, through which excess fluid contained in the capacitor chamber can flow. The overflow chamber region communicates with the capacitor chamber opening to receive excess insulating fluid, thereby providing a fluid volume margin to assure that the capacitor section is completely covered.

Abstract: An electrolytic capacitor is provided having a metal-glass-metal hermetic seal and a liquid seal, which protects the hermetic seal from the electrolyte solution in the capacitor. The liquid seal is formed by compressing an elastomeric ring between the underside of the lid of the capacitor and a terminal plate, connected to the capacitor element, whereby compression of the elastomeric seal is maintained by the lead, which connects the terminal plate and a metal post in the hermetic seal.

Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive element and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals.

Abstract: A structure and method are provided for reducing the equivalent series resistance of a capacitor. A capacitor includes one or more conductive interconnections contacting an active region of a first conductive plate of the capacitor at a plurality of locations along a lengthwise direction, such that every portion of the active region of the first conductive plate lies within a maximum distance from one of the locations, the maximum distance being less than the lateral dimension of the active region.

Abstract: An electronic component includes plural elements, a pair of terminal sections provided to each one of the elements, and a packaging material covering the elements and parts of the terminal sections. A non-conductive shielding section is provided between the terminal sections led outside the packaging material. The presence of the shielding section allows the electronic component to downsize the electronic apparatus, embody a greater density in mounting, and eliminate adverse influence to the apparatus for achieving higher performance as well as improving the durability.

Abstract: An electrolytic capacitor comprising a plurality of polymeric structures molded about the periphery of the anode pellet is described. The polymeric structures contact between a weld strap surrounding the butt seam between mating “clamshell” casing portions and the anode pellet sidewall. That way, the anode pellet is restrained from moving along both an x- and y-axes inside the casing. Having the cathode active material contacting the opposed major casing sidewalls being in a closely spaced relationship with the anode pellet through an intermediate separator prevents movement along the z-axis. The resulting capacitor is particularly well suited for use in high shock and vibration conditions.

Abstract: In a chip-type electronic component of the present invention, at least one surface of a ceramic body is a convexly curved surface. Specifically, at least one surface in a thickness direction of the ceramic body may be convexly curved, and the side surface of the ceramic body may be concavely curved. Alternatively, only one surface may be a convexly curved surface. This chip-type electronic component has a high visibility and a high mechanical strength, though it is small. Moreover, in a chip-type electronic component comprising a ceramic body that is formed by alternately laminating insulating layers and conductor layers, and a pair of external electrodes, the thickness in a laminate direction at the central part between external electrodes of the ceramic body is made greater than the thickness of the end surface. This prevents breakage of the external electrodes and also enlarges the ceramic body.

Abstract: Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion, spacer ribs, and optional side walls. Spacer ribs may be connected or provided in opposing spacer rib portions to effectively isolate adjacent component terminations. Standoff features may be incorporated into select embodiments of the disclosed technology to aid in device mounting and to facilitate post-affixment cleaning and visual termination contact. Discrete passive components in accordance with the present subject matter may include select combinations of resistors, capacitors, inductors, and other suitable devices.

Abstract: A high voltage sign ballast capacitor assembly is disclosed. The assembly includes two components for the sign ballast operation, namely a main capacitor element for power factor correction and up to six starting capacitors for aiding in starting under cold weather conditions. The main capacitor element is arranged and configured to divide the necessary capacitance into several capacitors connected in series. By doing so, the voltage is divided across each of the series capacitors resulting in reduced voltage stress and a reduction in the risk of corona arcing. The assembly is preferably constructed as a modular printed circuit board and a sleeve that houses the circuit board. The circuit board allows for the incorporation of multiple lead configurations, multiple start capacitors, and bleed resistors.

Abstract: A C-shaped combination capacitor assembly has a C-shaped shell, multiple capacitors, two conducting wires, two lead wires and encapsulant. The capacitors are mounted in the C-shaped shell. The conducting wires connect the capacitors in parallel. The two lead wires connect respectively to the conducting wires and protrude from the C-shaped shell. The encapsulant fills the C-shaped shell and covers and seals the capacitors, the conducting wires and the lead wires inside the C-shaped shell.

Abstract: An electronic component is provided which has a plurality of elements, a pair of terminal parts which are disposed on the element, and an armoring material which covers the elements and a part of the terminal parts. The electronic component has a configuration such that the plurality of elements are disposed in the armoring material at a predetermined interval, and a guiding part for guiding the armoring material toward an opposed region of the element is disposed on opposed surfaces between the elements.

Abstract: The invention provides an electric double layer capacitor which has a container made from a resin in a substantially rectangular parallelepipedal form by joining a first container half segment and a second container half segment each in the form of a box. The second container segment is provided at one end thereof with an extension extending along an outer side surface of the first container segment to the bottom outer surface thereof. A first lead member has a portion closer to one end thereof, embedded in the first container segment, the first lead member portion, bent as embedded in the first container segment and led out of the container to outside thereof. A second lead member has a portion closer to one end thereof, embedded in the second container segment, bent as embedded in the second container segment and extending through the extension to outside of the container.

Abstract: A technique of increasing the corona inception voltage (CIV), and thereby increasing the operating voltage, of film/foil capacitors is described. Intentional venting of the capacitor encapsulation improves the corona inception voltage by allowing internal voids to equilibrate with the ambient environment.

Abstract: An enclosure for an electrical energy storage device such as a wet tantalum electrolytic capacitor or an electrochemical cell such as a lithium/silver vanadium oxide cell is described. The enclosure comprises two metallic casing components or portions. The first is a drawn member having a planar face wall supporting a surrounding sidewall and is shaped to nest the anode, cathode and intermediate separator components. The surrounding sidewall has an annular flange at its outer periphery. A mating cover is a stamped planar piece of similar material whose periphery fits inside the annular flange or rim as a complementary piece.

Abstract: A stacked capacitor includes a dielectric member, a plurality of internal electrodes, a plurality of extraction electrodes, and a plurality of external electrodes. The dielectric member is a stacked member formed of stacked dielectric layers and having a side surface. The internal electrodes are stacked alternately with the dielectric layers. The extraction electrodes have a width W1 and lead from the internal electrodes to the side surface. The external electrodes have a width W2 and are connected to the extraction electrodes at the first side surface. The extraction electrodes are separated from each other by a distance P. The widths W1 and W2 and distance P are set such that 0.6P?W1<W2 and 0.7P?W2<P.

Abstract: A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

Abstract: The present invention relates to a structure of chip type electrolytic capacitor, which comprises a casing cover and a partition to separate space of casing cover into a dielectric chamber and a buffer chamber, a dielectric which includes lead pins, holes on the partition for the lead pins pass through. The dielectric is installed in the dielectric chamber, and lead pins pass through the holes on partition and extend to the buffer chamber. The buffer chamber is sealed with a bottom cover which also includes holes for lead pins. A stuff of epoxide is filled into the buffer chamber to fix the dielectric and its lead pins. A top cover is to seal the dielectric chamber for filling electrolyte. The casing cover is made with high strength engineering plastic by plastic injection machine. A supersonic welding and the epoxide adhesive solidification package technologies replace rubber packing.

Abstract: A capacitor mounting structure is proposed which can easily relieve a stress given to an extraction lead when ambient temperature is changed, soldering is made, or vibration is given, and can prevent breakage of the extraction lead. An outside holder is provided at an outside of a resin case housing a capacitor covered with a filler, and an inside holder is provided. The outside holder includes an upper outer wall bonded to an upper resin wall of the resin case. Lower openings of the resin case and the outside holder overlap with each other and form a lower space. An extraction lead is disposed in the lower space.

Abstract: A housing for an electrical component includes an electrically conductive cup which includes a wall, a floor, and a cover having electrical terminals. The housing also includes an electrically insulating coating applied to an outside of the floor and adjoining regions of the wall, and an electrically insulating covering which covers the wall at least partially and which overlaps the electrically insulating coating. The electrically insulating covering is on the electrically insulating coating and does not coat the floor. A mounting plate is also included on which the floor is positioned.

Abstract: A family of spacers of various sizes for securing a standardized terminating electrical protection device (such as one of the “snap-cap” type) to an electrical energy power source (i.e., a lithium electrochemical cell) is described. The terminating protection device is mounted on a header for an electrochemical cell and contains a circuit board provided with electrical components, such as diodes and fuses. The function of the circuit board is generally to protect the cell from being overcharged or too rapidly discharged, and the like. The spacers are sized to take up the space between the edge of the cell and the edge of the terminating protection device. That way, only variously sized spacers need to be stocked. The spacers are relatively simple to manufacture and inexpensive to stock.