Abstract: A thin film capacitor comprises: a laminated body that has a base electrode, a dielectric layer and an upper electrode layer; a protective layer covering the base electrode, the dielectric layer and the upper electrode layer, and includes a first through-hole that reaches the base electrode, and a second through-hole that reaches the upper electrode layer; a first extraction electrode in the first through-hole and electrically connected with the base electrode; a second extraction electrode in the second through-hole and electrically connected with the upper electrode layer; a first terminal electrode on the protective layer, and connected with the base electrode through the first extraction electrode; and a second terminal electrode on the protective layer, and connected with the upper electrode layer through the second extraction electrode. Young's modulus of the protective layer is equal to or higher than 0.1 GPa and equal to or lower than 2.0 GPa.

Abstract: A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers.

Abstract: Provided is a granular activated carbon having many mesopores that can be used for applications similar to sine chloride-activated carbons, and also provided is a method for manufacturing the same. The granular activated carbon is obtained by bringing an activated carbon into contact with a calcium component, followed by activation and washing.

Abstract: Feedthrough assemblies for medical devices having various embodiments of strain relief members extending around portions of the feed through pin are described.

Abstract: An integrable electrochemical capacitor and methods for manufacturing the same are disclosed. The electrochemical capacitor comprises a first electrode comprising a first rigid piece having a first porous portion, a second electrode comprising a second rigid piece having a second porous portion, and an electrolyte in contact with the first porous portion and the second porous portion. The structure allows the electrochemical capacitor to be manufactured without a separator film between the electrodes and is compatible with semiconductor manufacturing technologies. The electrochemical capacitor can also be manufactured within a SOI layer 8.

Abstract: According to various embodiments, a semiconductor device may include: a layer stack formed at a surface of the semiconductor device, the layer stack including: a metallization layer including a first metal or metal alloy; a protection layer covering the metallization layer, the protection layer including a second metal or metal alloy, wherein the second metal or metal alloy is less noble than the first metal or metal alloy.

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

Abstract: A carbonaceous composition usable to constitute a supercapacitor cell electrode, a porous electrode usable to equip such a cell, a process for manufacturing this electrode and one such cell incorporating at least one such electrode, for example in order to equip an electric vehicle. This composition is usable to be in contact with an aqueous ionic electrolyte, is based on a carbonaceous powder and comprises a hydrophilic binder-forming system. The system may include between 3% and 10% by weight a first crosslinked polymer having a number-average molecular weight Mn of greater than 1000 g/mol and having alcohol groups, and between 0.3% and 3% by weight a second polymer of at least one acid and which has a pKa of between 0 and 6 and a number-average molecular weight Mn of greater than 500 g/mol, the first polymer being crosslinked thermally in the presence of the second polymer.

Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

Abstract: There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a capacitor part including first and second internal electrodes formed in the ceramic body; a resistor part including a first internal connection conductor, a third internal connection conductor formed on one dielectric layer in the ceramic body and a second internal connection conductor, a fourth internal connection conductor formed on another dielectric layer in the ceramic body; first to fourth external electrodes formed on first and second main surfaces of the ceramic body; and a first connection terminal formed on first end surface of the ceramic body and a second connection terminal formed on second end surface of the ceramic body, wherein the capacitor part and the resistor part are connected to each other in series.

Abstract: One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.

Abstract: A cochlear implant includes a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device and a magnet configured to hold the external device in proximity to the sealed housing. The sealed housing includes an upper cover being closest to the skin when the device is implanted, and a lower cover that is hermetically connected to the upper cover. The lower cover includes an elevated region, a recessed region, and at least one feedthrough element formed in the recessed region of the lower cover. The recessed region provides space for a lead to connect to the feedthrough element and protects it from shock and other environmental risks.

Abstract: The present invention relates in particular to a conductive electrode for an electrical energy storage system (1) having an aqueous electrolyte solution, said electrode comprising a metallic current collector (3) and an active material (7), said metallic current collector (3) comprising a protective conductive layer (5) placed between said metallic current collector (3) and said active material (7), characterized in that said protective conductive layer (5) comprises: —between 30% and 85% as a proportion by weight of dry matter of a copolymer matrix, —between 70% and 15% as a proportion by weight of dry matter of conductive fillers, in addition to the proportion by weight of dry matter of copolymer in order to achieve a total of 100%.

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract: Embodiments of MIM capacitors may be embedded into a thick IMD layer with enough thickness (e.g., 10 K?˜30 K?) to get high capacitance, which may be on top of a thinner IMD layer. MIM capacitors may be formed among three adjacent metal layers which have two thick IMD layers separating the three adjacent metal layers. Materials such as TaN or TiN are used as bottom/top electrodes & Cu barrier. The metal layer above the thick IMD layer may act as the top electrode connection. The metal layer under the thick IMD layer may act as the bottom electrode connection. The capacitor may be of different shapes such as cylindrical shape, or a concave shape. Many kinds of materials (Si3N4, ZrO2, HfO2, BST . . . etc.) can be used as the dielectric material. The MIM capacitors are formed by one or two extra masks while forming other non-capacitor logic of the circuit.

Abstract: A multipolar feedthrough filter capacitor assembly for an active implantable medical device includes a feedthrough filter capacitor including a first active electrode plate, a second active electrode plate and a plurality of ground electrode plates. The plates are in spaced parallel relation disposed within a monolithic dielectric substrate where the first and second active electrode plates are disposed between the plurality of ground electrode plates. A first conductive terminal pin is disposed through the feedthrough filter capacitor electrically coupled to the first active electrode plate and in non-conductive relation to both the second active electrode plate and ground electrode plate. A second conductive terminal pin may be disposed through the feedthrough filter capacitor electrically coupled to the second active electrode plate and in non-conductive relation to both the first active electrode plate and ground electrode plate.

Abstract: Disclosed are a Ti alloy having an excellent hydrogen absorption inhibition effect, a Ti alloy member using the Ti alloy, and a manufacturing thereof. A Ti alloy is characterized in that it contains 0.1 to 5.0% by mass in total of at least one of Zr and Hf, and a residue comprising Ti and impurities.

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

Abstract: A capacitor for an implantable medical device is presented. The capacitor includes an anode, a cathode, a separator therebetween, and an electrolyte over the anode, cathode, and separator. The electrolyte includes ingredients comprising acetic acid, ammonium acetate, phosphoric acid, and tetraethylene glycol dimethyl ether. The capacitor has an operating voltage ninety percent or greater of its formation voltage.

Abstract: A method for making an hermetic and electrically insulating feedthrough in the metal wall of a housing of a device, preferably of an active medical device, is disclosed. The method includes: a) forming electrically insulating layers (24, 26) on each of the internal and external sides of the wall (10), b) on the internal side of the wall, forming a non-through groove with a closed contour (30) defining in the wall a metal islet (28) that is physically and electrically isolated from the rest of the wall, by removing the entire thickness of the electrically insulating internal layer (26) and the wall (10), leaving intact a sufficient thickness of the electrically insulating external layer (24) so that the external layer mechanically supports the metal islet, and c) on the external and internal sides respectively, exposing pads (34, 36) for making an electrical contact to the metallic islet, by a localized removal of material of the electrically insulating external and internal layers (24, 26), respectively.

Abstract: Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations. In one embodiment, an apparatus includes a circuit board having a first surface and a second surface opposite to the first surface and a passive device integral to the circuit board, the passive device having an input terminal configured to couple with electrical power of a die, an output terminal electrically coupled with the input terminal, and electrical routing features disposed between the first surface and the second surface of the circuit board and coupled with the input terminal and the output terminal to route the electrical power between the input terminal and the output terminal, wherein the input terminal includes a surface configured to receive a solder ball connection of a package assembly including the die. Other embodiments may be described and/or claimed.

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: Shielding performance and protection from radiated RF energy at a cable's point of entry to an enclosure are improved when a shield of the cable is AC coupled around an entire opening of the enclosure using a discoidal capacitor. The capacitor may be electrically coupled to the shield and the enclosure around the entire inner and outer circumferences of the discoidal capacitor. Compared to traditional DC coupling or the use of a drain wire and traditional capacitor, using the discoidal capacitor lowers inductance and improves shielding of the opening itself while improving AC filtering characteristics and preventing ground loops.

Abstract: A feed through assembly has a metal component passed through a ceramic insulator, and a multi-layered joint brazed to the ceramic insulator and the metal component to form the assembly. The multi-layered joint includes a first portion of braze filler material placed around the metal component and a hollow member of predetermined shape placed around the metal component. A flange is provided at a first end of the hollow member, wherein the flange rests on the first portion of braze filler material. The multi-layered joint has a second portion of braze filler material placed around the hollow member and seated onto the flange. A ceramic member of predetermined shape is placed around the hollow member which rests on the second portion of braze filler material. A third portion of braze filler material is placed around the metal component and seated onto a second end of the hollow member.

Abstract: A lead feedthrough of an electrical functional unit, in particular a capacitor or medical electronic implant, which comprises a hollow conductive flange and a contact piece disposed in the cavity thereof and which is electrically insulated and sealed with respect to the flange, wherein the flange can be connected to a lead of a first type, and the contact piece can be connected to a lead of a second type in the functional unit, wherein, in a circumferential section of the flange, a tangentially extending gap is provided, which is delimited on one side by a flange body and on the other side by a tab integrally formed on the body, or by a separate pressure piece, for the tangential insertion and affixation of the lead of the first type.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: A hermetic feed-through includes a housing body defining a hollow space, a plurality of conductive pins and a seal structure. The plurality of conductive pins extend through the hollow space. The seal structure is provided in the hollow space and includes a single-piece glass component. The single-piece glass component hermetically seals at least two conductive pins to the housing body and electrically insulates the at least two conductive pins from the housing body.

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract: Methods for making feedthrough assemblies including a capacitive filter array are disclosed. Methods disclosed include attaching a perimeter wall of the capacitor filter array to an interior wall of a ferrule, depositing a thick film conductive paste within at least one passageway to form a conductive pathway, and heating the ferrule, capacitor filter array and the thick film conductive paste to convert the paste to a relatively solid material.

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract: A measurement system for measuring a parameter of the muscular-skeletal system is disclosed. The measurement system comprises a capacitor, a signal generator, a digital counter, counter register, a digital clock, a digital timer, and a data register. The sensor of the measurement system is the capacitor. The measurement system generates a repeating signal having a measurement cycle that corresponds to the capacitance of the capacitor. The capacitor comprises more than one capacitor mechanically in series. Electrically, the capacitor comprises more than one capacitor in parallel. In one embodiment, the capacitor includes a dielectric layer comprising polyimide. A force, pressure, or load is applied to the capacitor that elastically compresses the device. The capacitor is shielded from parasitic coupling and parasitic capacitance.

Abstract: In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor.

Abstract: A measurement system for measuring a parameter of the muscular-skeletal system is disclosed. The measurement system comprises a capacitor, a signal generator, a digital counter, counter register, a digital clock, a digital timer, and a data register. The sensor of the measurement system is the capacitor. The measurement system generates a repeating signal having a measurement cycle that corresponds to the capacitance of the capacitor. The capacitor comprises more than one capacitor mechanically in series. Electrically, the capacitor comprises more than one capacitor in parallel. In one embodiment, the capacitor includes a dielectric layer comprising polyimide. A force, pressure, or load is applied to the capacitor that elastically compresses the device.

Abstract: The present invention consists of an implantable structural element for in vivo delivery of bioactive active agents to a situs in a body. The implantable structural element may be configured as an implantable prosthesis, such as an endoluminal stent, cardiac valve, osteal implant or the like, which serves a dual function of being prosthetic and a carrier for a bioactive agent. Alternatively, the implantable structural element may simply be an implantable article that serves the single function of acting as a time-release carrier for the bioactive agent.

Abstract: Multiple wound film capacitors include a hollow core formed by a first non-conducting tubular section, and a first capacitor winding wrapped around the first non-conducting tubular section. Also included are a second non-conducting tubular section wrapped around the first capacitor winding, and a second capacitor winding wrapped around the second non-conducting tubular section. The multiple wound film capacitors may also include a third non-conducting tubular section wrapped around the second capacitor winding, and a third capacitor winding wrapped around the third non-conducting tubular section. In addition, ends of the first and second non-conducting tubular sections extend beyond ends of the first and second capacitor windings.

Abstract: A feedthrough of an electrolyte or other capacitor, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the electrolyte capacitor, an aluminum flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the aluminum flange.

Abstract: The present disclosure relates to feedthrough contacts for electronic components of the type used in implantable stimulators such as, for example, cardiac pacemakers, ICDs, CRT-Ds, and/or neurostimulators. A feedthrough conductor includes a metallic electrode, wherein a part of the metallic electrode (2) has a locally enlarged diameter in the region of the passage through an opening (3) in the component housing (4). The ridge (5) formed as a result exerts pressure onto the elastic sealing material (6) disposed around the electrode (2) in a tubular shape, thereby producing a hermetic seal between the electrode surface and the sealing material (6), and between the sealing material (6) and the wall (4) of the housing opening (3). The feedthrough conductor is sealed using an adhesive material (7) on the outer side of the electronic component.

Abstract: A feedthrough capacitor includes an inner electrode that extends coaxially within a grounded outer electrode. A non-conductive, epoxy-based potting material insulates and adhesively joins opposing roughened portions of the inner and outer electrodes. A capacitor assembly extends between the inner and outer electrode and serves to bypass relatively high frequency signals carried by the inner electrode to the grounded outer electrode. The capacitor assembly includes a plurality of monolithic multilayer ceramic capacitors, each capacitor having first and second terminals that are respectively surface mounted onto inner and outer concentric conductive rings. A plurality of deflectable tines project radially inward from the inner ring and resiliently circumferentially contact the exterior of the inner electrode. Similarly, a plurality of deflectable tines project radially outward from the outer ring and resiliently circumferentially contact the interior of the outer electrode.

Abstract: A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup.

Abstract: An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip.

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract: Described are devices and methods for detecting binding on an electrode surface. In addition, devices and methods for electrochemically synthesizing polymers and devices and methods for synthesizing and detecting binding to the polymer on a common integrated device surface are described.

Abstract: Terminal pins that include a refractory metal forming a full perimeter weld connected to a terminal block including a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: Terminal pins that include a refractory metal partially welded to a terminal block of a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract: A metallization that includes a composite of alternating metal and metal oxide layers for incorporation into feedthrough filter capacitor assemblies is described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.