With Cooling Means Patents (Class 361/676)
  • Patent number: 7092253
    Abstract: Back plane and mid-plane assemblies and related systems and methods are described. In one embodiment, a system comprises an enclosure and a plane assembly mounted within the enclosure and configured to connect with multiple pluggable devices. The plane assembly comprises a first plane portion having multiple connectors; and at least a second plane portion having multiple connectors, with the second plane portion being offset from the first plane portion.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: August 15, 2006
    Assignee: Hewlett-Packard Development Company, LP.
    Inventor: An Hien Lam
  • Patent number: 7079379
    Abstract: A cooling device for a high voltage electrical unit for a motor of a vehicle, includes: an inverter for controlling the motor that drives the vehicle; an electrical energy storing device for supplying electrical energy to the motor via the inverter; a downverter for decreasing source voltage of the electrical energy storing device, the downverter, the inverter, and the electrical energy storing device disposed under a seat of the vehicle in a concentrated manner; a fan, disposed under the seat, for moving cooling air to the electrical energy storing device and the inverter; an air inlet disposed under the seat and at an end of the seat as viewed in a width direction of the vehicle; and an air outlet disposed under the seat and at the other end of the seat as viewed in a width direction of the vehicle.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: July 18, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hiroo Yamaguchi, Hiroshi Ohtsuka, Osamu Hasegawa, Toshiyuki Matsuoka, Koshiro Fuchibe, Kunio Hasegawa, Hiromitsu Sato
  • Patent number: 7069737
    Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: July 4, 2006
    Assignees: Waffer Technology Corp.
    Inventors: Jack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
  • Patent number: 7041900
    Abstract: An AC inlet with heat-insulation function disposed in an opening of an electronic apparatus is disclosed. The inlet comprises a main body having an indentation portion disposed on a first side thereof, and the indentation portion having at least a conducting terminal and at least a hole, at least a connecting piece disposed on a second side opposite to the first side, and having one end connected with the conducting terminal, at least a conducting element having one end connected with the connecting piece and the other end connected with the circuit system in the electronic apparatus, a heat-insulation element covering the connecting piece and forming a space between the main body and the heat-insulation element, wherein the heat-insulation element has at least an opening for passing the conducting element therethrough. Thereby the air in the space circulates with the external air through the hole in the indentation portion of the main body.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: May 9, 2006
    Assignee: Delta Electronics, Inc.
    Inventor: Chun-Chen Chen
  • Patent number: 7038912
    Abstract: The high-power switch (1) according to the invention, with at least one switch pole (2) for guiding and switching an electric current which flows in one current flow direction when the switch is in the closed state, with the at least one switch pole (2) containing an inner conductor (3) which carries the current and containing an outer conductor (4) which is connected to ground potential (G) and carries a return current in the opposite direction to the current, with the outer conductor (4) being in the form of a housing (4) which surrounds the inner conductor (3), is characterized in that a cooling rib arrangement (5) which contains cooling ribs (9) is arranged on the outer conductor (4). At least some of the cooling ribs are advantageously arranged on a separate part of the housing (4), which is not the same as the part (15) of the housing (4) which is at a minimum distance from the inner conductor (3).
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: May 2, 2006
    Assignee: ABB Research LTD
    Inventors: Marianne Pleines, Jean-Claude Mauroux, Martin Lakner, Thomas Schoenemann
  • Patent number: 7018701
    Abstract: A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 ?g/cm2 per unit surface area. The amount of volatile corrosive gas generated from the sheet is not more than 10 ?g/cm2 per unit surface area. The sheet has a thermal conductivity of 0.5 to 20 W/m·K. This thermally conductive sheet generates fewer volatile substances and can be used even in a closed place.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: March 28, 2006
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Shunsuke Yamada, Hajime Funahashi, Junzo Shiomi
  • Patent number: 6992382
    Abstract: A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more economical than forming the microchannels directly into the back of the chip being cooled. In some embodiments, the microchannels are high-aspect-ratio grooves formed (e.g., by etching) into a polycrystalline silicon cooling base, which is then attached to a cover (to contain the cooling fluid in the grooves) and to the back of the chip.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: January 31, 2006
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, Ravi Prasher
  • Patent number: 6979772
    Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: December 27, 2005
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Huang Meng-Cheng, Lin Ming-Yang
  • Patent number: 6975027
    Abstract: A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: December 13, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Paul A. Farrar, Jerome M. Eldridge
  • Patent number: 6950310
    Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 27, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Darvin R. Edwards
  • Patent number: 6898072
    Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: May 24, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
  • Patent number: 6856503
    Abstract: A control device is for a commercially available switchgear and an electronic power module. Compactness of the device is improved so that it can be used in a switchgear cabinet. To this end, the power module is placed onto the switchgear on the side facing away from its bottom wall and the dimensions of the power module are adapted to the base contour of the switchgear so that the peripheral contour of the power module extends beyond the base contour only slightly, if at all, wherein at least the width of the contactor does not extend beyond it.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: February 15, 2005
    Assignee: Siemens Aktiengesellschaft
    Inventors: Walter Apfelbacher, Norbert Reichenbach
  • Publication number: 20040264114
    Abstract: An electronic apparatus includes a housing and a printed wiring board contained in the housing. The printed wiring board includes a first surface, a second surface and a conductive layer. The first surface has a mounting area, the second surface is located opposite to the first surface in a position corresponding to the mounting area, between the first surface and the second surface. A heat generating component is mounted on the mounting area of the printed wiring board. A reinforcing member is provided on the second surface of the printed wiring board, and is in thermal contact therewith. The heat of the heat generating component is conducted to the reinforcing member through the printed wiring board, and is radiated from the reinforcing member.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 30, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Shogo Hachiya
  • Publication number: 20040240160
    Abstract: The aim of the invention is to prevent an unwanted conduction of a flow of gas inside a channel that connects an inner space of an enclosed switchgear (1) to another space. To this end, the channel is closed by means of a closing mechanism according to an increase in pressure in the inner space.
    Type: Application
    Filed: February 26, 2004
    Publication date: December 2, 2004
    Inventors: Gildo Mahn, Achim Milbich, Brunhilde Wenge
  • Publication number: 20040125547
    Abstract: A multi-mode modulation and display device of heat dissipating fans of a computer power supply is disclosed. A modulation and display device is installed within a computer power supply. The modes of the modulation and display device are changeable. Thereby, in standby, the noise of the power supply is reduced and as operation in higher temperature, the heat dissipating fan can be driven to be operated with a higher speed. The modulation and display device includes a switching and display module having lamps for displaying the operation condition of fans. Thereby, the condition of the fans can be viewed by and alerted to the uses. Speeds of the fans are adjustable by using a sensor to sense the temperature variation of the environment and using a control unit to actuate the switching and display module so as to change the rotation speed of the heat dissipating fans.
    Type: Application
    Filed: December 2, 2003
    Publication date: July 1, 2004
    Inventor: Yen Tsai Tsung
  • Patent number: 6671175
    Abstract: An assembly of computer peripherals, which has the functions of (temperature control and fan rotation speed regulation, includes a host casing, a temperature sensing circuit, a fan driver circuit, a liquid crystal display (LCD) driver circuit, an alarm circuit, a fan rotation regulating device for regulating the fan rotation speed within a safe range, a control device for selectively showing the location of the host casing, the hard disk and the microprocessor on the LCD, and a control circuit, all of which are connected to one another. The user controls the fan rotation speed regulating device according to the fan rotation speed value shown on the LCD to optimize the rotation speed of the fan used for the microprocessor and then minimize the noise. Furthermore, the location of the heat source to be sensed can be changed.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: December 30, 2003
    Inventor: Jung I Chen
  • Patent number: 6633480
    Abstract: An induction foil cap sealing system includes a ferrite core having a plurality of openings therethrough and a mounting plate with a plurality of openings therethrough which are aligned with the plurality of openings in the ferrite core. Air is directed to flow through the openings to draw heat away. A litz wire coil is disposed proximate to the ferrite core which produces an electromagnetic field within the ferrite core. The ferrite core and litz wire coil are adapted to direct the electromagnetic field toward abject to heat it.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: October 14, 2003
    Inventor: Kenneth J. Herzog
  • Patent number: 6620515
    Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: September 16, 2003
    Assignee: Dow Corning Corporation
    Inventors: Qian Jane Feng, Lenin James Petroff, Diane Elizabeth Swarthout, Shizhong Zhang
  • Publication number: 20030133258
    Abstract: In an alternator, a voltage control device includes a control circuit IC chip, a radiating fin and a case. The radiating fin 253 has a base 256 that is fixed to the IC chip and radiating portions. The radiating portions protrudes from the base 256 and have substantially U-shaped cross sections, so that tubular air passages are formed between the radiating portions and a fixed surface of the IC chip. Each radiating portion has a central trunk and alternating branches, thereby rows of air passages are formed by the central trunk and rows of branches.
    Type: Application
    Filed: December 10, 2002
    Publication date: July 17, 2003
    Applicant: DENSO CORPORATION
    Inventors: Naoki Yamamoto, Tooru Ooiwa
  • Patent number: 6586835
    Abstract: An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: July 1, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Kie Y. Ahn, Leonard Forbes, Eugene H. Cloud
  • Patent number: 6578491
    Abstract: A tactical missile includes a heat pipe connecting heat sources with heat sinks within the missile. The system includes a removable external heat dissipation device that connects to the heat pipe while the missile is being tested or reprogrammed. The external heat dissipation device draws heat out of the heat pipe and so maintains the electronic components acceptably cool during extended testing or reprogramming. During the relatively short tactical flight, the heat pipe transfers heat from the electronic components to the heat sinks within the missile. The high heat transfer rate of the heat pipe enables elements such as structural members and propellant to be used as heat sinks, elements not heretofore incorporated into thermal management of the heat generating electronic components.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: June 17, 2003
    Assignee: Raytheon Company
    Inventor: Bruce R. Babin
  • Patent number: 6574094
    Abstract: A method for cooling bus bars 12,14 in order to increase their current-carrying capacity while saving space and weight. The method comprises the steps of providing a housing having an interior wall; locating a distribution manifold 20 within the housing, the distribution manifold comprising a hollow bus bar 12,14; communicating to the manifold a supply of an evaporative coolant 18, 18′; and delivering the coolant 18, 18′ outwardly under pressure so that upon exiting the manifold 20, the coolant 18, 18′ undergoes a phase change from the liquid to the vapor state. Heat is extracted from the manifold 20 at least as quickly as heat is generated by the flow of current. The extraction of heat by the flow of coolant 18, 18′ and evaporation maintains or lowers the temperature of the bus bar and enables a given size of bus bar to carry more current without a significant rise in temperature. The invention also includes an apparatus 10 for cooling bus bars 12,14 in an electrical circuit.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: June 3, 2003
    Assignee: General Dynamics Land Systems Inc.
    Inventors: Ernest J. Morrow, Sally M. Sellers, Gary D. Knudsen
  • Patent number: 6570762
    Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: May 27, 2003
    Assignee: Nortel Networks Limited
    Inventors: Douglas B. Cross, John C. Atkinson, Marko Nicolici, Kalvin W. Korpela, Roger D. Carroll
  • Patent number: 6567262
    Abstract: A cooling system and method for cooling a heat sensitive element in an enclosure, such as a CPU, the cooling system including a high power active cooling unit having at least one Thermo Electric Cooler (TEC) component having a cooling liquid circuit passing through a cold side heat sink therein, the cooling liquid circuit being coupled to a heat sink coupled to the heat sensitive element and having a cooling liquid circuit therethrough; a dedicated power supply; and a controller for controlling the TEC components and the cooling liquid pump.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: May 20, 2003
    Assignee: Active Cool Ltd.
    Inventor: Ronen Meir
  • Patent number: 6545866
    Abstract: To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: April 8, 2003
    Assignee: Fujitsu Limited
    Inventors: Tadashi Katsui, Haruhiko Yamamoto
  • Patent number: 6522528
    Abstract: An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: February 18, 2003
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Shigeki Yamane
  • Patent number: 6510047
    Abstract: A conductive heat sink is electrically interposed between a fuse and a switching apparatus within a watertight case of a network protector. The heat sink is advantageously configured to conduct current between the switching apparatus and the fuse. During operation, the skin effect causes the electricity conducted by the heat sink to flow primarily through the outer regions of the heat sink, thereby resulting in the generation of heat at the outer regions of the heat sink due to electrical resistance. The heat sink includes a core from which a plurality of fins extend. The fins conduct and convect heat away from the outer regions of the heat sink, which reduces the temperature thereof and correspondingly increases the conductivity of the outer regions of the heat sink.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: January 21, 2003
    Assignee: Eaton Corporation
    Inventors: Steven E. Meiners, Douglas M. Brandt
  • Publication number: 20020122289
    Abstract: A conductive heat sink is electrically interposed between a fuse and a switching apparatus within a watertight case of a network protector. The heat sink is advantageously configured to conduct current between the switching apparatus and the fuse. During operation, the skin effect causes the electricity conducted by the heat sink to flow primarily through the outer regions of the heat sink, thereby resulting in the generation of heat at the outer regions of the heat sink due to electrical resistance. The heat sink includes a core from which a plurality of fins extend. The fins conduct and convect heat away from the outer regions of the heat sink, which reduces the temperature thereof and correspondingly increases the conductivity of the outer regions of the heat sink.
    Type: Application
    Filed: March 5, 2001
    Publication date: September 5, 2002
    Inventors: Steven E. Meiners, Douglas M. Brandt
  • Patent number: 6417443
    Abstract: An exhaust chamber for an arc resistant cabinet directs high temperature, expanding gases away from locations where personnel are likely to be present. The exhaust chamber may have an open top, directing gases outward through the center of the exhaust chamber's top. Alternatively, the exhaust chamber may be completely enclosed, directing expanding gases through a duct.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: July 9, 2002
    Assignee: Eaton Corporation
    Inventor: James E. Smith
  • Publication number: 20020080563
    Abstract: Thermal management devices and methods include branching networks comprising flow channels of varying cross-sectional area. The branching networks can be fractal-like in nature with an increase in the total flow area following a flow channel bifurcation. In representative embodiments, the branching networks are defined in a channel pattern that is laminated between cover plates to form a thermal management device. The channel pattern includes bridging portions so that the branching network is defined with a single pattern piece. The branching networks can exhibit radial symmetry or be aligned with respect to one or more axes. Heat exchangers and diffusive mixers that include such networks are also provided.
    Type: Application
    Filed: June 5, 2001
    Publication date: June 27, 2002
    Inventors: Deborah V. Pence, Jose N. Reyes, Nathan Phillips, Qiao Wu, John T. Groome
  • Patent number: 6407331
    Abstract: A panel, preferably a ceiling panel, for an arc resistant cabinet defines at least one flap dimensioned and configured to bend outward in response to excessive pressure within the cabinet. The flap is bent into a position wherein it will direct high temperature, expanding gases exiting the cabinet away from areas where personnel are likely to be located. The panel also includes a frame below the flap, thereby permitting the entire panel, including the flap, to support the weight of people working on top of the cabinet.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: June 18, 2002
    Assignee: Eaton Corporation
    Inventors: James E. Smith, Brad R. Leccia
  • Publication number: 20020064020
    Abstract: A circuit panel chassis having a plurality of angled slots in a top surface thereof. The angled slots improving flame containment inside the circuit panel chassis while providing for cooling the circuit components of the circuit panel.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 30, 2002
    Inventors: Luis Armando Yanes, David E. Schomaker, Ronald Robert Kurth
  • Publication number: 20020041481
    Abstract: This invention is directed to the prevention of the deterioration of the accuracy in component mounting by suppressing the temperature rise of the moving member as much as possible by cooling the moving member, which is the heat source of a linear motor. The moving member 48 of the linear motor 14 is configured in the following manner for achieving the objective of this invention. That is, the heat dissipation portion, the axis 17 made of the material with efficient thermal conduction such as aluminum, pierces through the iron core 18 around which coils 20 are wound. The moving member except a part of the axis 17 is molded with synthetic resin, and at one end of the axis 17, the heat dissipation fin 19 which makes heat dissipation area larger is formed. And this heat dissipation fin 19 is placed to face the air exhaust port 67.
    Type: Application
    Filed: September 27, 2001
    Publication date: April 11, 2002
    Inventors: Yoshinori Kano, Osamu Inaoka, Haruhiko Yamaguchi, Shigeru Kageyama
  • Patent number: 6236562
    Abstract: The section of an electrical high-voltage system has a gas-filled housing of predominantly symmetrical design. Provided in the housing are a conductor extending along a plane of symmetry of the housing, and cooling means for producing a circulation flow which dissipates heat loss from the conductor. The cooling means contains two blowers. The blowers are arranged in the interior of the housing and designed in such a way that, during the operation of the system, two mirror-symmetrical circulation part flows are formed which are bounded by the plane of symmetry. These circulation part flows are in each case guided without recirculation along a housing side wall from the top of the housing or the bottom of the housing. By this means, the heat loss is given up particularly effectively to the housing side walls, and the conductor can be loaded with very high operating currents.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: May 22, 2001
    Assignee: Asea Brown Boveri AG
    Inventors: Günter Wilfert, Günter Kübler, Sacha Parneix, Enrico Malfa
  • Patent number: 6229690
    Abstract: The invention concerns a horizontally divided switchgear, including compartments for high voltage and for cable connection. The cable connection compartment is common to one or more switchgear cubicles and is a compartment separated from the high voltage compartment(s) of the cubicle(s). In the switchgear is included one or more switchgear cubicles defined by vertical (12, 13, 14) and horizontal (15, 16) walls. The cubicle is arranged with only high voltage equipment, while connection means (18) for incoming and outgoing current cables are arranged exteriorly underneath the lower horizontal wall (16) of the cubicle. Bushing means (17) for cable conections are arranged in the lower horizontal wall (16).
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: May 8, 2001
    Assignee: ABB AB
    Inventors: Jan Fivelstad, Christer Arnborg
  • Patent number: 6219254
    Abstract: The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51).
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: April 17, 2001
    Assignee: TRW Inc.
    Inventors: Gershon Akerling, James M. Anderson, John W. Spargo, Benjamin Tang
  • Patent number: 6215658
    Abstract: Structure for housing and heat sinking active equipment pieces (3; 2) in a space vehicle, comprising a constraining external container (1; 46) containing a cooling gas or a mixture of gases, means for mechanically holding said boxes (3; 2) into the container (1; 46) and a plurality of channels (32) or empty volumes (18), provided between the external surfaces of the active equipment boxes (3; 2) and the means for mechanically holding said boxes, for the circulation of the cooling gas or mixture of gases. (FIG.
    Type: Grant
    Filed: October 7, 1999
    Date of Patent: April 10, 2001
    Assignee: Negesat di Boer Fabrizio & C.S.N.C.
    Inventor: Amedeo Bodini
  • Patent number: 6188574
    Abstract: A cooling structure for an electric vehicle includes a battery box provided with at least one battery, a blower fan supplying air to cool the batteries, a wind box disposed on the battery box and provided with at least one electric component to be cooled. The wind box is formed with an air passage having a substantially U-shape when viewed from the top, on which the electric component is disposed. The wind box includes an air inlet connected to the blower fan and an air outlet communicating with one end of the battery box, so that the air from the blower fan is supplied to the battery box via the wind box.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: February 13, 2001
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Makoto Anazawa
  • Patent number: 6185116
    Abstract: A device for supervising the cooling of a cooling system of a valve of a high voltage converter station located on high voltage potential level comprises members (31) located on high voltage potential level and adapted to detect the temperature at cooling blocks (32) of the valve on high voltage potential level and send values so detected to first control units (3) for controlling semiconductor components (4) of the valve. The first control units have means (20) for treating said values detected and the first control units are adapted to send data resulting from said treatment to an arrangement (16) for supervising said valve located on low potential level.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: February 6, 2001
    Assignee: ABB AB
    Inventors: Urban Åström, Krister Nyberg, Roland Siljeström, Gunnar Asplund, Hans Björklund
  • Patent number: 6169247
    Abstract: An enclosure for electronic devices has a wall of a rigid plastic material, with elongated chambers defined therein. The chambers are filled with a material having a high thermal conductivity, or materials having high heat capacity, such as phase change material. Each chamber is located so that the material in the chamber is in thermal contact with the wall at a first location that tends to be at a relatively high temperature, and at a second location that tends to be at a lower temperature. The enclosure may alternatively have heat pipes of metal rather than chambers.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: January 2, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Thomas F. Craft, Jr., Jason A. Kay, Ivan Pawlenko, Alfonso J. D'Alessio, Anthony R. Tancreto, George Shevchuk
  • Patent number: 6117194
    Abstract: An electrolytic capacitor with several conductive layer portions, including some anode layers and some cathode layers in alternating arrangement. A set of insulator layers is interleaved with the conductive layers, and the conductive and insulator layers are laminarly stacked with an anode layer being outermost on one surface. The stack is positioned adjacent a metal heat sink, with an outer insulator layer positioned between and closely contacting the stack and the heat sink. The cathode layers may be connected to the heat sink.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: September 12, 2000
    Assignee: Pacesetter, Inc.
    Inventors: Thomas F. Strange, Paul Lunsmann
  • Patent number: 6097610
    Abstract: The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: August 1, 2000
    Assignee: Seiko Epson Corporation
    Inventor: Nobuaki Hashimoto
  • Patent number: 6067223
    Abstract: A cooler which can be fitted on a rear wall or a side wall or a door of a switching cabinet and can be connected thereto via an intake and an inlet aperture of an internal circuit. According to the invention, rain and dustproofing is improved because alongside a central ventilation shaft open at the top, the cooler housing has vertical ventilation chambers open at the top as part of an external circuit hermetically separated from the internal circuit, the top of the switching cabinet and cooler housing is covered by a roofing component spaced therefrom which projects on all sides beyond the control box and the cooler housing and leaves a peripheral ventilation slot opening downwards. The roofing component is divided by two partitions into three chambers which communicate with the ventilation shaft and both ventilation chambers in the cooler housing.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: May 23, 2000
    Assignee: Rittal-Werk Rudolf Loh GmbH & Co. KG
    Inventors: Michael Diebel, Achim Edelmann, Walter Nicolai, Heinrich Strackbein
  • Patent number: 6043978
    Abstract: An alternating current circuit breaker having an extended fin cantilevered from its housing. A portion of the fin along its extended length is magnetized so that the fin flutters in the magnetic field generated by the alternating current conducted through the breaker. The resulting magnetic resonance vibration establishes forced, convective heat transfer which assists cooling of the breaker.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: March 28, 2000
    Assignee: Eaton Corporation
    Inventors: Hemant K. Mody, Xin Zhou, Peter J. Theisen
  • Patent number: 6018455
    Abstract: Heat sinks extending rearward from and connected to the risers of a switchgear assembly by the same fasteners which secure the stabs to the risers dissipate the joule heat generated by current flow through the risers and stabs and accommodate for the higher temperature rise permitted in the power circuit breakers engaged by the stabs. The heat sinks are formed by a pair of heat sink members straddling the risers, each of which has an elongated flat body with an extended flat mounting surface on a first face which provides extended surface engagement with a stab. The elongated body projects rearward beyond the stab and a first set of transverse fins project from the first face rearward of the stab toward the first set of fins on the other heat sink member of the pair.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: January 25, 2000
    Assignee: Eaton Corporation
    Inventors: William E. Wilkie, II, Rodney William Bruner
  • Patent number: 5982611
    Abstract: Angle members forming the vertically extending supply buses in a meter center have arcuate offsets so that flanges on the ends of horizontally extending tenant buses form tenant stab contacts which are vertically aligned with supply stab contacts on straight sections of the outwardly projecting flanges of the supply bus angle members. Meter socket assemblies have double ended fastenerless meter jaws one pair of which plug onto the supply bus stab contacts and another pair of which plug onto the tenant bus stab contacts, and into which the meters are plugged. The double ended fastenerless meter jaws are fabricated from a pair of elongated flat members having end sections bent back on and diverging from straight center sections, and terminal sections which extend toward each other from the end sections and converge slightly toward the center sections. Spring clips clamp the terminal sections of the pair of elongated members in compliant confronting relationship to form the double ended fastenerless meter jaws.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: November 9, 1999
    Assignee: Eaton Corporation
    Inventors: James Monroe Campbell, Scot Eugene Remmert, Larry Joe Simpkins, Edward Hugh Lechleiter, Glen Clark Naugle
  • Patent number: 5929410
    Abstract: A terminal structure of a vacuum circuit breaker is capable of effectively radiating heat when conducting electricity.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: July 27, 1999
    Assignee: LG Industrial Systems Co., Ltd.
    Inventor: Ki Rim Mun
  • Patent number: 5892195
    Abstract: An improved arc-resistant switchgear enclosure is disclosed. The disclosed arc-resistant switchgear enclosure provides a cost effective structure to collect and channel the pressure and hot exhaust gases from lower compartments and safely vent these gases through the switchgear enclosure. In preferred embodiments, an internal arc chamber is formed by assembling modules and creating a void within the center of the switchgear enclosure. As multiple compartments or modules for a switchgear enclosure are connected, an arc chamber is created within the enclosure. Upon initiation of an arc fault within a particular compartment, a relief flap or cover for that particular compartment opens to channel the pressure and the gases into the internal arc chamber or directly through the top of the enclosure. Pressure and gases are vented into the internal arc chamber and flow horizontally through the arc chamber until a path to the top of the switchgear enclosure is reached.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: April 6, 1999
    Assignee: ABB Power T&D Company, Inc.
    Inventors: Albert H. Aufermann, Robert S. Karnbach
  • Patent number: 5864176
    Abstract: A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: January 26, 1999
    Assignee: Unisys Corporation
    Inventors: James Wittman Babock, Jerry Ihor Tustaniwskyi
  • Patent number: 5831812
    Abstract: A three-phase electrical distribution system includes an elongate housing of substantially square cross-section and a plurality of frames connected between the top and rear walls of the housing. Each frame includes three sections arranged in a stepped manner to locate and mount one power phase busbar by a standoff insulator near the rear wall, a second power phase busbar forwardly and vertically above the first busbar, and a third power phase busbar located vertically above and forwardly of the other busbars to minimize the cross-sectional housing space while spacing such busbars to prevent arcing therebetween or arcing to the housing or to the frames. The ground and neutral busbars are mounted via insulating standoffs to the bottom wall of the housing forwardly of the power busbars. An access opening is located in the bottom wall at various intervals to provide for hookup of power cables to the busbars via an openable front wall spanning between a pair of adjacent frames.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: November 3, 1998
    Inventor: Rodney W. Livingston