For Computer Memory Unit Patents (Class 361/679.31)
  • Patent number: 9665135
    Abstract: In one example, a cabinet is described for storing at least one electronic device. The cabinet includes a frame, a power supply system for charging the at least one device, and a shelving assembly. The shelving assembly can include a stationary member engaged to the frame, and a pivoting member engaged to the stationary member. The pivoting member can be adapted to hold the at least one device.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 30, 2017
    Assignee: Ergotron, Inc.
    Inventors: Thiem Wong, David J. Prince, Saeb Asamarai, Mustafa A. Ergun, Robert W. Fluhrer
  • Patent number: 9625959
    Abstract: The present disclosure provides a top-load HDD server including: a partition plate arranged in a containing space of a case to divide the containing space into a plurality of hard disk chambers and a system chamber; a mother board arranged at a bottom of the system chamber; a power supply frame including a power control board and a power carrier; the power carrier includes a movable frame and a fixed frame, the movable frame is arranged on the power control board and removable, and thereby improves cable management and maintenance.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: April 18, 2017
    Assignee: SUPER MICRO COMPUTER INC.
    Inventors: Richard S. Chen, Chaoching Wu
  • Patent number: 9612630
    Abstract: A flash drive including a housing, a carrier, and a storage module is provided. The carrier is movably disposed inside the housing along a first axis. The carrier has an elastic arm being deformable along a second axis. The storage module is assembled to the carrier to move together with the carrier in relative to the housing, so that a connector of the storage module is moved outside the housing or hidden inside the housing. The elastic arm has a contour protruded along a direction away from the storage module when not receiving force.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: April 4, 2017
    Assignee: PHISON ELECTRONICS CORP.
    Inventor: Wei-Hung Lin
  • Patent number: 9563583
    Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: February 7, 2017
    Assignee: Rambus Inc.
    Inventors: Ian Shaeffer, Ely Tsern, Craig Hampel
  • Patent number: 9521782
    Abstract: A system includes an electrical enclosure, a first electrical unit, a first electrical module, a first heat spreader, and a heat sink. The first electrical unit is removably disposed within the electrical enclosure, and the first electrical unit includes a first surface opposite to a second surface. The first electrical module is removably disposed within the first electrical unit, and the first electrical module is inserted into the first electrical unit in a first direction from the first surface to the second surface. The first heat spreader is coupled to the first electrical module, and the first heat spreader comprises a first tapered coupling. The heat sink includes a second tapered coupling. The second tapered coupling is couples with the first tapered coupling of the first heat spreader to form a physical thermal connection that facilitates heat transfer between the first electrical module and the heat sink.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: December 13, 2016
    Assignee: General Electric Company
    Inventors: Anthony Dominic Tatta, Jonathan Vilagy, Craig Andrew Peterson
  • Patent number: 9513677
    Abstract: A backplane configured to receive electrical components is provided. The backplane in one example includes a substantially planar substrate comprising an at least partially flexible material and formed in a non-rectangular shape, a series of alternating connector islands formed along two substantially parallel axes, wherein each connector island is able to move independently of other connector islands, a plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region, and one or more spring elements bridging between a particular connector island and the substrate, with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: December 6, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Lidu Huang, Toshiki Hirano, Jeffrey Wilke, Jin Hui Ou-Yang
  • Patent number: 9513675
    Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: December 6, 2016
    Assignee: CareFusion 303, Inc.
    Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
  • Patent number: 9504160
    Abstract: A semiconductor memory device is included. The semiconductor device includes a semiconductor memory device, comprising: a first substrate including a first semiconductor device mounted on the first substrate and a first connection terminal disposed at an edge of the first substrate; a second substrate including a second semiconductor device mounted on the second substrate and a second connection terminal at an edge of the second substrate; and an interface connector including a first socket portion configured to receive the first connection terminal and a second socket portion configured to receive the second connection terminal. The interface connector further includes: first socket terminals of the first socket portion are connected with the first connection terminals; second socket terminals of the second socket portion are connected with the second connection terminals; and an internal wiring for electrically connecting the first socket terminals with the second socket terminals.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: November 22, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Teck-su Oh, Sung-ki Lee
  • Patent number: 9491887
    Abstract: A server structure includes a transfer board, a connecting backplane, a first bridge circuit board and a second bridge circuit board. The transfer board has oppositely at least one first connector and at least one second connector. The connecting backplane has at least one third connector located correspondingly to the at least one first connector and at least one fourth connector located in correspondingly to the at least one second connector. To electrically couple the transfer board and the connecting backplane, the first bridge circuit board is inserted between the first connector and the third connector, while the second bridge circuit board is inserted between the second connector and the fourth connector. The communication bandwidth between the transfer board and the connecting backplane can be extended by the combination of the first bridge circuit board and the second bridge circuit board.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: November 8, 2016
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Jia-Bin Wang, Hui Zhu
  • Patent number: 9462719
    Abstract: A plug-in mechanism, a subrack and a finished board are provided. The plug-in mechanism implements fast and reliable plug-in and plug-out by using a lever assistance effect and a gearing effect of a gear. The plug-in mechanism is configured to be disposed between a sub-carrier frame and a parent carrier frame to implement plug-in and plug-out of the sub-carrier frame in the parent carrier frame, and the plug-in mechanism includes a driving part and a gearing part, where the driving part includes an ejector lever, the gearing part includes at least one gear that is engaged successively, a gear at one end is connected to the ejector lever, each of the at least one gear is fastened onto the sub-carrier frame by using a rotating shaft, and the at least one gear is connected to the parent carrier frame by using a linkage structure.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: October 4, 2016
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Dingqiang Wu, Dongli Wang, Yao Li
  • Patent number: 9444162
    Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 13, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wiren D. Becker, William L. Brodsky, Matteo Cocchini, Michael A. Cracraft
  • Patent number: 9436640
    Abstract: A rack server system for a map/reduce data processing is disclosed. The method can include a plurality of servers arranged in a rack, and a plurality of offload processor modules supported on at least two of the servers, each offload processor module having an input-output (IO) port and multiple offload processors, a first offload processor module configured to execute map steps of the map/reduce data processing, and being connected directly to a second offload processor through their respective IO ports to define a midplane switch, wherein the second offload processor module is configured to execute reduce steps of on data provided from the first offload processor module.
    Type: Grant
    Filed: June 29, 2013
    Date of Patent: September 6, 2016
    Assignee: Xockets, Inc.
    Inventors: Parin Bhadrik Dalal, Stephen Paul Belair
  • Patent number: 9434127
    Abstract: A protective sheet, including a base substrate; and a plurality of protective units on a first surface of the base substrate and spaced apart from each other, each of the plurality of protective units including a pillar protruding from the first surface of the base substrate perpendicularly to the first surface, and a hard coating layer on lateral surfaces of the pillar, the plurality of protective units being elastically bendable and hard coating layers of neighboring protective units overlapping each other when the plurality of protective units are bent.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: September 6, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyunjoon Oh, Sangil Park, Hyejin Oh, Jeoungsub Lee, Minhoon Choi, Insun Hwang
  • Patent number: 9431781
    Abstract: Provided is a signal connector including a plug insulator, a first terminal insulator, a second terminal insulator, and a first terminal group and a second terminal group. The first terminal insulator and the second terminal insulator are connected to the plug insulator. The front end and the rear end of the first terminal group extend beyond the first terminal insulator. The front end and the rear end of the second terminal group extend beyond the second terminal insulator. The middle portion of the first terminal group is embedded in the first terminal insulator. The middle portion of the second terminal group is embedded in the second terminal insulator. The first terminal group and the second terminal group each include a plurality of high frequency terminals. The width of the middle portion of each high frequency terminal is smaller than that of the front end of each high frequency terminal.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: August 30, 2016
    Assignee: BizConn International Corp.
    Inventors: Hong-Guang Kuang, Jia-Mao Zheng
  • Patent number: 9417401
    Abstract: An adapter structure for use with a telecommunications module that is configured to be slidably inserted into a first type of telecommunications chassis comprises a body configured to be mounted to the telecommunications module. The body of the adapter structure is configured for mounting the telecommunications module to a second type of telecommunications chassis that is different than the first type of telecommunications chassis, wherein the telecommunications module is not configured to be mounted to the second type of telecommunications chassis without the adapter structure. The adapter structure includes at least one fiber optic connector protruding outwardly from the body for receiving a fiber optic signal to be relayed to fiber optic equipment of the telecommunications module.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: August 16, 2016
    Assignee: CommScope Technologies LLC
    Inventor: Yuanzhe Zhang
  • Patent number: 9342116
    Abstract: A stacked expansion card assembly is positioned on a mainboard. The mainboard includes a mainboard connector. The stacked expansion card assembly includes a first expansion card, at least one first supporting member, and a first connector. The first card includes a contact card end and electrically connected with the mainboard connector by inserting the contact end of the first expansion card to the mainboard connector. The first supporting member is positioned on the mainboard and supports the first expansion card. The first connector is positioned on the first expansion card and electrically connected or disconnected with a second expansion card by removable insertion of the second expansion card to the first connector. Thereby, the expansion cards can be installed onto the mainboard without increasing the surface area of the mainboard and limited by the layout of the electronic components on the mainboard.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: May 17, 2016
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih Ming Lai, Yung Shun Kao, Hui Ling Chung, Tzu-Hsiang Huang, Ji Chen Su
  • Patent number: 9256248
    Abstract: Protecting device includes a main body and a removable cover. The main body receives an electronic device and includes a first holding member and a second holding member. The removable cover includes a first attaching portion, a first supporting portion, a second attaching portion and a second supporting portion. When the removable cover is located on a closed position, the first holding member holds the first attaching portion, or the second holding member holds the second attaching portion. When the removable cover is located on a first open position, the first holding member holds the first attaching portion, and the first supporting portion is configured to support the electronic device. When the removable cover is located on a second open position, the second holding member holds the second attaching portion, and the second supporting portion is configured to support the electronic device.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: February 9, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Fu-Kuo Huang
  • Patent number: 9237670
    Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: January 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Zhan Ping
  • Patent number: 9229882
    Abstract: A system for backing up and restoring the functionalities of an information technology system which comprises an electronic computer, the electronic computer comprising elements for accessing the data communications network, a first hard disk, a removable slider which is adapted to contain the first hard disk, a first data bank; an operations center being adapted to retrieve instructions from the data bank which are adapted to be processed by the computer on the basis of a unique identifier associated with the electronic computer, the computer being further adapted to perform operations for backing up a restore point on elements for backing up data which are present on the first hard disk, on the basis of the instructions, and operations for restoring the data on the first hard disk on the basis of a choice made by a user.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: January 5, 2016
    Inventor: Alberto Renzi
  • Patent number: 9202159
    Abstract: A USB flash drive, comprising a housing comprising internal walls defining a receiving space, at least one of the internal walls having an engagement component, a memory main body disposed in the receiving space and comprising a hook slot component, and a fastener disposed in the receiving space comprising a protrusion component and a hook component, the hook component engaged with the hook slot component of the memory main body, and the protrusion component engaged with the engagement component of the housing, thereby fastening the memory main body to the housing.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: December 1, 2015
    Assignee: PNY Technologies, Inc.
    Inventors: Tai-Kao Hsieh, Hen-An Chen, Ching-Ting Chang
  • Patent number: 9195280
    Abstract: The present invention discloses a case fastening device, which is applied to a case. The handle and the plate member are respectively pivotally coupled to two ends of the base by a first pivotal element and a second pivotal element, and rotatable above the base. Two ends of the metallic buckle are respectively snap-fitted to the handle and the plate member. The bayonet bolts are fixed on the plate member. While the user presses down the handle, the metallic buckle actuates the plate member to rotate above the base, and let the-bolts be inserted into the second through-hole of the base and the first through-hole of the case, whereby the bayonet bolts are mounted to the case. While the user lifts up the handle, the bolts are withdrawn from the first through-hole and the second through-hole, whereby the bolts are dismounted from the case.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: November 24, 2015
    Assignee: NZXT Corporation
    Inventor: Johnny Hou
  • Patent number: 9134772
    Abstract: A mounting apparatus includes a bracket receiving a hard disk drive (HDD), a transmission mechanism mounted on a side of the bracket, and an operation member. The transmission mechanism includes an installing frame, a first rack, and a second rack. The gear is engaged with the first and second racks. A first end of the operation member is detachably latched to the bracket, while a second end of the operation member is movably connected to the bracket. An abutting piece protrudes out from a rear end of the second rack and abuts against a rear end of the hard disk drive. The operation member is slid rearward, to push the first rack to slide rearward. The first rack drives the gear to rotate, the gear drives the second rack to slide forward, and the abutting piece abuts against the HDD to move the HDD out of the bracket.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: September 15, 2015
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Guang-Yi Zhang, Xiao-Zheng Li
  • Patent number: 9128680
    Abstract: A casing structure including a frame having a capacity space and a fastener at a side of the capacity space that an electronic unit assembled therein, a first linking member slidably coupled to the frame, and a second linking member pivoted to the frame having a first and a second end is provided. The first end is linked to the first linking member and the second end faces to the electronic unit in the space. The electronic unit is locked by the fastener in assembling mode and the first linking member is located at a first position to block the fastener from releasing the electronic unit. The first linking member is forced to move out of the first position and drive the second linking member to rotate relative to the frame, such that the second end pushes the electronic unit to be released from the fastener in disassembling mode.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: September 8, 2015
    Assignee: Cal-Comp Electronics & Communications Company Limited
    Inventors: Min-Chang Chi, Tung-Kai Tsai
  • Patent number: 9122458
    Abstract: An electronic apparatus includes an apparatus casing and a removable cage. The removable cage includes a cage body, a carry handle, and a locking mechanism disposed on the cage body. The carry handle includes a pivotally-connecting part, pivotally connected to the cage body, a handle body, and a pushing part. The handle body and the pushing part are oppositely connected to the pivotally-connecting part. The locking mechanism includes a latching part and an unlocking part. The latching part can be engaged into a lock slot of the pivotally-connecting part so that the carry handle is fixed relative to the cage body for carrying the cage body. The unlocking part can be driven to disengage the latching part from the lock slot. By the lever rule, the carry handle can move the cage body into the apparatus casing further or move the cage body reversely to depart from the apparatus casing.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: September 1, 2015
    Assignee: Wistron Corporation
    Inventor: Ching-Jen Yu
  • Patent number: 9122970
    Abstract: An electronic card connector comprises a base, a cover and a limiting element. The base has an electronic card holder for holding an electronic card. The cover is pivoted on the base so that the cover is able to be operated in an open state and a close state relative to the base. When in the close state, the cover is configured for sliding relative to the base and therefore has a fastening position and a release position. The limiting element is connected to the cover and has an unstressed state and a stressed state relative to the cover. The limiting element comprises an elastic arm and at least one limiting block. The elastic arm is connected to the cover via a connecting end while the at least one limiting block is connected to an end other than the connecting end of the elastic arm.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: September 1, 2015
    Assignee: Wistron Corporation
    Inventor: Kuo-Che Huang
  • Patent number: 9122459
    Abstract: A detachable fixing mechanism includes a supporter, a contacting component, a fixing component, a track component and an ejecting component. An electronic component is hold be the supporter. The supporter includes a base, a rear wall and two lateral walls. The rear wall and the lateral walls are disposed on three sides of the base. The contacting is connected to an upper edge of the lateral wall, so as to buckle the electronic component with the base. The fixing component is movably disposed on the lateral wall. The fixing component includes a constraint portion to resiliently pass through a hole on the lateral wall. The track component is disposed on the lateral wall of the supporter. The ejecting component is slidably disposed between the track component and the supporter. A second part of the ejecting component inserts into the supporter to contact against the rear end of the electronic component.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: September 1, 2015
    Assignee: Wistron Corporation
    Inventor: Hsing-Wei Peng
  • Patent number: 9069522
    Abstract: A fixing mechanism includes a first positioning component, a bridging component, a movable component, a base, a second positioning component, a latch and a driving component. The first positioning component and the bridging component are disposed on a backboard, and the movable component is slidably disposed on the bridging component. The second positioning component and the latch are disposed on the base. The latch includes a guiding pin slidably disposed on the movable component. The driving component is rotatably disposed on the latch. The driving component includes an actuating portion slidably disposed on the movable component. The actuating portion slides relative to a first slot on the movable component, so that the guiding pin slides at a second slot on the movable component and the base moves close to the backboard, so as to combine a first connector disposed on the base with a second connector disposed on the backboard.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: June 30, 2015
    Assignee: Wistron Corporation
    Inventor: Fong-Chi Ho
  • Publication number: 20150146363
    Abstract: A server includes a chassis including a first sidewall, a second sidewall, a rear wall, a front wall, and a partition wall. A receiving space to receive a power module is bound by the front wall, the partition wall, and front portions of the first and second sidewalls. A number of through holes is defined in each of the rear wall, the front wall, and the front portions of the first and second sidewalls. An outlet and an inlet of the power module face the first sidewall and the second sidewall, respectively. A part of the partition wall between the inlet and the first sidewall does not define through holes. Another part of the partition wall defines a number of through holes. A number of data storage devices is located between the partition wall and the rear wall. A number of fans is located outside the rear wall.
    Type: Application
    Filed: December 26, 2013
    Publication date: May 28, 2015
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: CHAO-KE WEI, LI-FANG FAN
  • Patent number: 9042104
    Abstract: A portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 26, 2015
    Assignee: Wistron Corporation
    Inventors: Yu-Han Tsai, Chun-Wang Lin, Ching-Wei Ku, Chia-Hsing Yu, Yao-Te Tsai, Chia-Hung Tsai
  • Publication number: 20150138715
    Abstract: Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
    Type: Application
    Filed: December 9, 2014
    Publication date: May 21, 2015
    Inventors: Timothy J. CHAINER, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark E. STEINKE
  • Patent number: 9036342
    Abstract: Storage apparatus configured to provide an external apparatus with logical storage area as data storage area, the storage apparatus having a physical storage medium configured to generate the logical storage area, and storage controller communicatively coupled to physical storage medium to control data input/output processing between the external apparatus and the logical storage area, wherein the storage controller includes circuit package including circuit board which implements predetermined function of storage controller and a circuit board case to accommodate the circuit board, plurality of cooling fan units that generate cooling air for cooling circuit component mounted on the circuit board of the circuit package, and a chassis having a structure for accommodating the circuit package and the cooling fan units, some of circuit packages are inserted to be accommodated in chassis from opening thereof and are arranged side by side across width direction of chassis.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: May 19, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Tomohiro Fukuda, Kenichi Miyamoto, Tadaharu Maeda
  • Patent number: 9030814
    Abstract: A screwless carrying frame for data access devices is fixed to a bottom board and includes a first frame body having an upper structure with an upper vertical plate and an upper transverse plate connected into a step shape. The upper vertical plate has elastic packing elements, and the upper transverse plate has elastic support elements. A second frame body is installed at the bottom board and connected to the first frame body and includes an upper structure with an upper riser plate and an upper horizontal plate connected into a step shape. An upper carrying space is formed between two upper structures of the first and second frame bodies for accommodating the data access device. The elastic packing element is elastically packed at a lateral side of the data access device and the elastic support element is elastically supported at a bottom side of the data access device.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: May 12, 2015
    Assignee: AIC Inc.
    Inventor: Lin-Kuei Tsai
  • Patent number: 9030819
    Abstract: A mounting apparatus includes a mounting piece and a drive bracket. A first restricting piece is formed on a top side of the mounting piece. A first sliding member is formed on the first restricting piece. The drive bracket includes a side piece which defines a sliding groove. The sliding groove includes a guiding portion and a restricting portion. The drive bracket includes a handle pivotally mounted thereon. The handle includes a locking portion. The locking portion defines a cutout. The handle is rotated between a first position and a second position. In the first position, the cutout is aligned to the guiding portion to receive the first sliding member in the cutout and the guiding portion. In the second position, the sliding member is restricted in the restricting portion by the locking portion to mount the drive bracket on the top side of the mounting piece.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: May 12, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Yu-Wei He, Xiu-Quan Hu
  • Publication number: 20150124360
    Abstract: Described is a low power clamp or driver comprising: an inverter; and a silicon controlled rectifier (SCR) embedded in the inverter such that the SCR is part of the inverter. The clamp offers improved conductance per area and lower leakage current compared to the traditional PMOS-based active rail clamps. The clamp or driver combines a trigger circuit with the inverter-embedded SCR for maximum area efficiency. The clamp or driver also results in less stringent requirements for power ramp rates.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 7, 2015
    Inventors: Nathan D. Jack, Steven S. Poon
  • Publication number: 20150124391
    Abstract: A memory device comprising a temperature sensor mounted on a surface of a substrate, the temperature sensor in electrical communication with a heating element and configured to activate the heating element in response to detecting a temperature below a predetermined temperature threshold. The heating element is in thermal communication with a solid state memory configured to store computer readable data. A universal serial bus (USB) driver is also mounted to the substrate, in electrical communication with the memory, and configured to communicate with another USB device via a USB channel in order to transfer data to and from the memory. The memory device can be enclosed in a protective backshell canister connected to the MIL-DTL-38999 type connector to provide a fully ruggedized, fully sealed device to withstand and operate effectively in extreme environmental conditions.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: Northrop Grumman Systems Corporation
    Inventors: RENAE MARTINEZ, Anthony J. Zychal, Meredith L. Chow
  • Publication number: 20150116922
    Abstract: The present invention relates to a structure of a screw-free adaptation rack, which includes a main casing including a carrying section to define an upper portion of the main casing as a primary accommodation space and a lower potion as a secondary accommodation space. A partition plate is arranged in the primary accommodation space for division into a first receiving space and a second receiving space. A retention mechanism retains at least one 2.5-inch hard drive in the primary accommodation space. The secondary accommodation space has two sidewalls with a pair of bumps and a pair of through apertures formed therein so that with position adjustment of a retained object, the bumps are fit into and thus retain the retained object, allowing the present invention to readily receive and retain a hard drive and a 3.5-inch floppy disk drive in a screw-free manner for extensive applications to various specifications.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: CREMAX TECH CO., LTD.
    Inventor: Chien-Chung LIN
  • Publication number: 20150116923
    Abstract: An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable cassettes include floating connectors. The cable cassettes are modular assemblies that contain all the wiring and connectors. As the connectors float in the cable cassettes, the cable cassettes are blind mated to the bulkhead as standalone units.
    Type: Application
    Filed: July 15, 2014
    Publication date: April 30, 2015
    Inventors: David Skirmont, Dan Kilkenny, Anthony Vanderveen, Peter Doyle
  • Publication number: 20150109725
    Abstract: A flash drive including a storage element, a housing, and an integrating member is provided. The storage element has a first connector and a second connector. The integrating member is pivoted to the storage member and coupled to the housing, wherein the integrating member and the housing move relatively in a first path or a second path. The integrating member and the housing move relatively along the first path, such that the first connector is extended outside or hidden inside the housing. The integrating member and the housing move relatively along the second path and drive the storage element to move relative to the integrating member, such that the second connector is extended outside or hidden in the integrating member. An operating method of flash drive is also provided.
    Type: Application
    Filed: December 2, 2013
    Publication date: April 23, 2015
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Wei-Hung Lin, Yu-Ting Tseng
  • Publication number: 20150103479
    Abstract: The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 16, 2015
    Inventors: Frederick A. Ware, Suresh Rajan
  • Publication number: 20150098176
    Abstract: The various implementations described herein include systems, methods and/or devices used to manage heat flow for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one embodiment, heat sinks are disposed on front sides of a first module and a second module in the electronic system, and at least one heat sink in the second module is disposed between at least two heat sinks in the first module. In some embodiments, the number of heat sinks and/or a subset of geometric parameters for the locations, sizes and shapes of the heat sinks are configured for the purpose of disturbing and mixing air flow that passes an air gap between the front sides of the first and second modules.
    Type: Application
    Filed: December 19, 2013
    Publication date: April 9, 2015
    Applicant: SanDisk Enterprise IP LLC
    Inventors: David Dean, Robert Ellis
  • Publication number: 20150098177
    Abstract: A modular data center is disclosed. The modular data center may have a plurality of unit structures arranged generally parallel to one another. A plurality of supports may be used for supporting the unit structures elevationally above a floor, and wherein adjacent ones of the unit structures form hot aisles therebetween through which hot air generated from data center components may be channeled. Each unit structure may form an elongated structure having a frame structure, a roof panel supported by the frame structure, and a ceiling panel. The unit structures may be used to channel cold air to the data center components and hot air from the hot aisles out from the unit structures.
    Type: Application
    Filed: October 1, 2014
    Publication date: April 9, 2015
    Inventors: Eric WILCOX, John HOEFFNER, Stjepan SINKOVIC, Denis RANCIC, Zeljko GJURANI
  • Publication number: 20150092337
    Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.
    Type: Application
    Filed: September 4, 2014
    Publication date: April 2, 2015
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Minshong TAN, Syuzo AOKI, Takuya ODA
  • Publication number: 20150092336
    Abstract: An apparatus or method for providing thermal energy transfer comprising; a circuit board, a housing connected to the circuit board, at least one electronic component contained within said housing, said housing comprising a aperture, wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: Nokia Corporation
    Inventors: Mezhgan SAMADY, Mikko Juhani TIMPERI, Romeo DUMPIT, Vincent PHAN, Cachaulo VAN LAANEN
  • Patent number: 8995118
    Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: March 31, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JinTae Kang, Kisun Kim, Dongyang Lee, Doil Kong, Sunghoon Lee
  • Publication number: 20150085440
    Abstract: A screw device, for mounting within a housing, configured to fixedly connect a first portion and a second portion of the housing, includes: a driving part fixedly connected within the first portion of the housing; a screw connected with the driving part; a nut fixedly connected within the second portion of the housing and matching the screw; and a chip configured to control the driving part to drive the screw to move relative to the nut, so as to achieve engagement or separation between the screw and the nut.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 26, 2015
    Inventors: Yuan Gao, Fenghui Wu, Jianyu Wang
  • Patent number: 8988870
    Abstract: There is disclosed an electronics module (101) for a data storage device enclosure (100) and data storage device enclosures (100). The module comprises an enclosure connector (104) for connecting to the enclosure, at least one bay constructed and arranged to receive a data storage device (200), and a controller (102) arranged to selectively provide access to storage devices to which it is connected. The module (101) has a communications path (107) between the controller and the enclosure connector (104) by which the controller can communicate with storage devices in the enclosure. The module (101) also has a first communications path to the data storage device (200) when received in the bay by which the controller can communicate with that data storage device. The module (101) also has a second communications path to the data storage device (200) when received in the bay by which that data storage device can be accessed from outside the module.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: March 24, 2015
    Assignee: Seagate Technology LLC
    Inventors: Andrew Goodwin, Christopher Girard
  • Publication number: 20150077920
    Abstract: An assembled module and an electronic apparatus having the same are disclosed. The assembled module is disposed in a case of the electronic apparatus. The assembled module includes a backplane and an actuating unit. The backplane is disposed on the case and used to be moved between a first position and a second position. The actuating unit is disposed on the backplane and used to be operated so as to drive the backplane moving relative to the first position and the second position. The actuating unit includes a first rack, a complex gear, and a second rack; wherein when the first rack is operated to move along a first direction, the complex gear is carried by the first rack to allow the second rack to move along a second direction, such that the assembled module is able to move between the first position and the second position.
    Type: Application
    Filed: January 9, 2014
    Publication date: March 19, 2015
    Applicant: Wistron Corporation
    Inventor: Chong-Xing ZHU
  • Publication number: 20150077918
    Abstract: Stiffening is provided for an electronic package assembly having a substrate. A first electronic package, having a first function, is electromechanically fastened to a first surface of the substrate with a first array of electrically conductive interconnects, which is disposed over a central area of the substrate first surface. A second electronic package, having a second function, is fastened to the first substrate surface with a second conductive interconnect array. At least a pair of the first array conductors is electrically coupled to at least a pair of the second array conductors for data/signal exchange and at least a component of the first electronic package interacts with at least a component of the second package. A metallic stiffener ring is disposed about an outer periphery of at least the central area of the substrate.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 19, 2015
    Applicant: Nvidia Corporation
    Inventors: Leilei Zhang, Ron Boja, Abraham Yee, Zuhair Bokharey
  • Publication number: 20150077919
    Abstract: A transmission line with both data storage function portable structure thereof includes a cable, a memory module, a Micro USB connector, a cover, a housing and a shell. The memory module and the Micro USB connector are connected to two opposite ends of the cable. The cover covers over the memory module. The housing has a front wall, a rear wall and two side walls which corporately define a receiving chamber. A partition is defined at the center of the receiving chamber and divides the receiving chamber into a first receiving cavity and a second receiving cavity. The memory module and the Micro USB connector are respectively located in the first and second receiving cavities of the housing. The shell encloses the housing.
    Type: Application
    Filed: November 4, 2013
    Publication date: March 19, 2015
    Applicant: Power Quotient International Co., Ltd.
    Inventors: Chung Ying Chang, Hung Chi Tung, Hsuan Chi Huang, Shu Chin Liang, Tzu Ju Huang, Chia Hsin Tsai, Tung Ming Chang
  • Patent number: 8982580
    Abstract: In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and an auxiliary board is disposed at a surface of the shield case. The shield case is comprised of a metallic frame that is fixed at the surface of the main board and extends in such a manner as to surround at least the part of the region, and a metallic cover fitted into the metallic frame to cover at least the part of the region. A projecting piece is formed in the metallic frame of the shield case, and penetrates the metallic cover and projects toward the auxiliary board. An end face of the auxiliary board abuts against the projecting piece, so as to position the auxiliary board.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: March 17, 2015
    Assignee: KYOCERA Corporation
    Inventor: Akito Iwai