For Computer Memory Unit Patents (Class 361/679.31)
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Publication number: 20140293529Abstract: A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.Type: ApplicationFiled: March 29, 2013Publication date: October 2, 2014Inventors: Vijay K. Nair, Chuan Hu, Shawna M. Liff, Larry E. Mosley
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Patent number: 8848358Abstract: A server includes a main board, a side panel having an attached female connector, an expansion card, and a lever. The expansion card includes a latching member having a pivot and a male connector. The lever includes an engaging portion defining a slot, and a main body connected to the engaging portion and pivotally connected to the main board. When the lever is rotated in a first direction, the pivot is slid into the slot, causing the engaging portion to engage with the latching member. Further rotating the lever in the first direction, the expansion card is urged to move toward the side panel until the male connector mate with the female connector. When the lever is rotated in a second direction opposite to the first direction, the expansion card is urged to move away from the side panel, causing the male connector to disengage from the female connector.Type: GrantFiled: August 2, 2012Date of Patent: September 30, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wen-Tang Peng, Hai-Chen Zhou
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Patent number: 8848359Abstract: A fixing structure for an interface card connector is provided and includes a bottom housing, a board body, an interface card connector, a fixing plate, a torsion spring, and a spring. The bottom housing has an opening and a stop wall. The interface card connector is rotatably located on the board body by a fixing axis and includes a slot. The fixing plate includes a main body, a second spring fixing portion, an interface card connector fixing portion, and a protruding portion. When the board body is moved out the opening and the protruding portion contacts the stop wall, the fixing plate is stopped, and the interface card connector is separated from the interface card connector fixing portion. As a result, the interface card connector is rotated on the board body by the torsion spring, such that the slot is directed upwardly on the board body.Type: GrantFiled: July 9, 2014Date of Patent: September 30, 2014Assignee: Wistron Corp.Inventor: Tung-Hsien Lin
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Patent number: 8848356Abstract: A memory card reader assembly for a device having a GPS component includes a housing having an exterior wall and defining two interior compartments. A jack for a memory card is secured within one compartment, and the housing includes a slot for enabling insertion of a memory card through the housing wall and into the jack. That compartment, including the slot, is sealed to prevent fluid entry into the compartment.Type: GrantFiled: October 12, 2011Date of Patent: September 30, 2014Assignee: Trail Tech, Inc.Inventor: Geoffrey Wotton
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Publication number: 20140268534Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.Type: ApplicationFiled: March 12, 2013Publication date: September 18, 2014Inventors: Rajen S. Sidhu, Mukul P. Renavikar, Sandeep B. Sane
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Publication number: 20140268535Abstract: A portable computing device includes a processor, a memory, and a portable computing device case that encloses one or more integrated circuits, including at least the processor and the memory. The case includes a molded fiber-reinforced polymer (FRP) material that includes a polymer material and elongated fibers that adhere to the polymer material and that have a property that varies over a length of the fibers along an elongation axis of the fibers, wherein an adhesion strength between the fibers and the polymer is determined at least in part by a property of the fibers that varies over a length of the fibers along the elongation axis.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: Google Inc.Inventors: William Hamburgen, Felix Jose Alvarez Rivera
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Publication number: 20140268536Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Applicant: Skyera, Inc.Inventors: Pinchas Herman, William Radke, Radoslav Danilak
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Patent number: 8837117Abstract: The electrical card has power modules constituted by power components and by control components that are carried by strips fastened on a support plate comprising an electrical ground plate. The power components are connected firstly to control buses, and secondly to power buses carried by the support plate and extending in a layer adjacent to the electrical ground plate.Type: GrantFiled: December 21, 2009Date of Patent: September 16, 2014Assignee: Sagem Defense SecuriteInventors: Etienne Merlet, Marie-Noëlle Besold-Etchechoury
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Patent number: 8837135Abstract: An expansion module for an interface card includes a transfer circuit-board, an expansion slot, a bottom-plate, a lateral-frame, and a latch. The transfer circuit-board has an electrical connector to be inserted into a card slot of a main circuit-board. The expansion slot is disposed on the transfer circuit-board and used for the interface card to be inserted into it, so as to connect the interface card to the main circuit-board. The transfer circuit-board is mounted onto the bottom-plate. The lateral-frame extends from the bottom-plate to define an accommodating space between the bottom-plate and the lateral-frame, and the transfer circuit-board is located in the accommodating space. The latch is pivoted to the lateral-frame and moves between a releasing position and a latching position. The latch has a first clamping element, and at the latching position the latch clamps and fixes the interface card with the first clamping element.Type: GrantFiled: December 23, 2011Date of Patent: September 16, 2014Assignee: Wistron CorporationInventors: Yong-Liang Zheng, Hung-Chun Liu
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Patent number: 8837141Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.Type: GrantFiled: October 17, 2012Date of Patent: September 16, 2014Assignee: Microelectronics Assembly TechnologiesInventors: James E. Clayton, Zakaryae Fathi
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Patent number: 8837134Abstract: A side-push retractable USB memory stick includes a PC board providing a data storage function, an insulative PC board holder accommodating the PC board and having a springy plate located on one lateral side thereof and a press portion outwardly protruded from the springy plate, a housing surrounding the insulative PC board holder and having a sliding slot located on one lateral side thereof for receiving the press portion and enabling the press portion to be operated by an external force to move a metal shield and a USB interface circuit of the PC board in and out of a front opening of the housing. A rear end block closed on a rear open side of the housing, and a front end block press-fitted into the front opening and defining a through hole for passing the metal shield and the USB interface circuit in and out of the housing.Type: GrantFiled: November 4, 2011Date of Patent: September 16, 2014Assignee: Ho E Screw & Hardware Co., Ltd.Inventor: Joseph Huang
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Publication number: 20140253093Abstract: Methods and systems for data center management include collecting sensor data from one or more sensors in a rack; determining a location and identifying information for each asset in the rack using a set of asset tags associated with respective assets; communicating the sensor and asset location to a communication module; receiving an instruction from the communication module; and executing the received instruction to change a property of the rack.Type: ApplicationFiled: March 8, 2013Publication date: September 11, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: INTERNATIONAL BUSINESS MACHINES CORPORATION
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Publication number: 20140254083Abstract: A protection and data transmission device suitable for use on a portable electronic device includes an inner cover, a transmission member, an outer cover assembly and a plurality of bolts. The transmission member is directly formed in the inner cover and have a USB connector and an electronic-device connector formed at two ends thereof, the user can insert the electronic device in the receiving chamber of the inner cover and connect the electronic-device connector to the connection port of the electronic device, which not only provides protection for the electronic device, preventing the electronic device from collision, but also prevents the connection port from being exposed to air and consequently preventing oxidization. Further, the electronic device can still perform data transmission and charging, without extra data transmission cable.Type: ApplicationFiled: March 9, 2013Publication date: September 11, 2014Inventor: Hsin-Fu WANG
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Publication number: 20140254085Abstract: Described are methods, systems, and apparatus relating to a modular data center. In some embodiments, a modular data center includes one or more data modules. The modular data center includes a network module connected to the one or more data modules, the network module containing equipment for facilitating data communications by the one or more data modules. The modular data center includes a power module connected to the one or more data modules and the network module, the power module containing electronics equipment for conditioning and distributing power to the one or more data modules and the network module.Type: ApplicationFiled: March 27, 2014Publication date: September 11, 2014Applicant: IO DATA CENTERS, LLCInventor: George Slessman
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Multiprocessor Computing Apparatus with Wireless Interconnect for Communication among its Components
Publication number: 20140254084Abstract: A fan less Multiprocessor Computing Apparatus (MCA) is housed in a metallic Enclosure (ME) that acts as an heat sink and provides extended surface area for heat dissipation. The ME also acts as an electro-magnetic-Shield that provides immunity from Electro-Magnetic-Interference (EMI) from external stray magnetic fields to wireless communications among components of MCA. The Wireless Interconnect (WLI) can use whole range of radio, microwave, and optical frequencies involving transceivers and antennas. Printed Circuit Boards of MCA are mounted on inside of metallic surfaces of ME of any required size and shape. MEs are filled with vacuum or clean air without any suspended particles for efficient and reliable communications. Electro-magnetically shielded and sealed MEs housing MCAs are made dust and water proof so that they can be placed under water in a sea or a river, particularly MCAs constituting large data/cloud centres.Type: ApplicationFiled: March 10, 2014Publication date: September 11, 2014Inventor: Sureshchandra B. Patel -
Patent number: 8824130Abstract: A chip card holder includes a base, a first retaining board attached to the base, a second retaining board attached to the base spaced apart from the first retaining board, and a receptacle is defined between the first retaining board and the second retaining board. The first retaining board has a first electrical connector. The second retaining board has a second electrical connector. A drawer is movably received in the receptacle. When the drawer received in the receptacle, the chip cards are retained between the first electrical connector and the second electrical connector.Type: GrantFiled: June 15, 2012Date of Patent: September 2, 2014Assignee: Chi Mei Communication Systems, Inc.Inventor: Chia-Hsin Chang
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Publication number: 20140240914Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.Type: ApplicationFiled: February 28, 2013Publication date: August 28, 2014Applicant: ORACLE INTERNATIONAL CORPORATIONInventor: Carl L. Meert
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Publication number: 20140240913Abstract: A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature. The temperature regulating system tightly regulates the temperature of solid state memory chips to within a nominal operating temperature range selected to extend the lifetime and/or improve the endurance and reliability of the solid state memory. The temperature regulating system may regulate different memory chips to different nominal temperatures based on the operations being performed and lifetime factors for the memory chips including current health and prior use.Type: ApplicationFiled: February 22, 2013Publication date: August 28, 2014Applicant: Skyera, Inc.Inventor: Dmitry Vyshetsky
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Publication number: 20140240915Abstract: A drive carrier includes a bezel and opposing sidewalls connected to the bezel. At least one of the opposing sidewalls includes a plurality of slots that form at least part of a keying solution, and a dimension of at least two of the plurality of slots is not the same.Type: ApplicationFiled: November 1, 2011Publication date: August 28, 2014Inventors: Andrew James Phelan, John P. Franz, James Jeffery Schulze, Kelly K. Smith, Everett R. Salinas
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Patent number: 8817459Abstract: A fixing structure for an interface card connector is provided and includes a bottom housing, a board body, an interface card connector, a fixing plate, a torsion spring, and a spring. The bottom housing has an opening and a stop wall. The interface card connector is rotatably located on the board body by a fixing axis and includes a slot. The fixing plate includes a main body, a second spring fixing portion, an interface card connector fixing portion, and a protruding portion. When the board body is moved out the opening and the protruding portion contacts the stop wall, the fixing plate is stopped, and the interface card connector is separated from the interface card connector fixing portion. As a result, the interface card connector is rotated on the board body by the torsion spring, such that the slot is directed upwardly on the board body.Type: GrantFiled: May 18, 2012Date of Patent: August 26, 2014Assignee: Wistron Corp.Inventor: Tung-Hsien Lin
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Patent number: 8817458Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.Type: GrantFiled: October 17, 2012Date of Patent: August 26, 2014Assignee: Microelectronics Assembly Technologies, Inc.Inventors: James E. Clayton, Zakaryae Fathi
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Patent number: 8807500Abstract: A fixing apparatus for fixing a hard disk drive includes a bracket receiving the hard disk drive with a locating pin extending from each of opposite sidewalls, and a rotating member. The bracket includes two opposite supporting walls and an end wall. Each supporting wall defines a latching slot. The locating pins are slidably inserted into the corresponding latching slots. The rotating member includes a fixing pole slidably abutting against the hard disk drive toward the end wall, two rotating poles respectively extending from two opposite ends of the fixing pole and rotatably connected to the corresponding supporting walls, and a latching pole extending from a distal end of one of the rotating poles to be detachably latched to one of the supporting walls.Type: GrantFiled: December 8, 2011Date of Patent: August 19, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: He-Tao Han, Song Deng, Jun-Hua Tan, Wen-Kang Lo, Guang-Yao Lee
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Patent number: 8811006Abstract: A USB memory stick includes comprises a casing comprising opposing top and bottom sides and a bottom opening in said bottom side, a PC board comprising a USB interface circuit and a memory chip package, a tray holding the PC board in the casing, a safety hook for fastening to a belt or strip-like object, and a hinge coupled between the casing and the safety hook for allowing a limited angle of rotation between the casing and the safety hook.Type: GrantFiled: April 6, 2012Date of Patent: August 19, 2014Assignee: Ho E Screw & Hardware Co., Ltd.Inventor: Joseph Huang
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Publication number: 20140226318Abstract: A night-light comprising an elastic cover for mounting on a door handle and circuitry for activation and deactivation of a light source.Type: ApplicationFiled: February 12, 2014Publication date: August 14, 2014Applicant: 3D Lighting Innovations Inc.Inventor: Erick Brennan
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Publication number: 20140226279Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.Type: ApplicationFiled: April 19, 2014Publication date: August 14, 2014Inventors: JinTae KANG, Kisun KIM, Dongyang LEE, Doil KONG, Sunghoon LEE
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Publication number: 20140226278Abstract: A memory system is provided with a motherboard, and a memory controller and a plurality memory devices mounted on the motherboard. The motherboard comprises a unicursal-shape main wiring, and branch wirings branched from the main wiring to the respective memory devices. Further, the motherboard comprises an open stub wiring branched from a connecting point between a start end and a branch point of the main wiring. Thus, a ringing of a waveform of a signal received by a receiving circuit can be suppressed irrespective of a wiring length of the branch wiring.Type: ApplicationFiled: February 6, 2014Publication date: August 14, 2014Applicant: CANON KABUSHIKI KAISHAInventor: Masanori Kikuchi
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Patent number: 8804369Abstract: A PCI card fastening device for fastening a PCI card to a chassis includes a latching plate fixed to the PCI card, a latching element slidably fixed to the chassis and a locking element. The latching element includes a latching hole and a latching portion. The locking element is rotatably fixed to the latching element, the locking element includes a pressing board and a hook, the hook includes a securing block. The latching plate is latched to the latching portion, the securing block is latched in the latching hole to latch the locking element to the latching element. After the securing block is released from the latching hole, the pressing board moves away from the latching element to release the latching plate between the pressing arm and the latching element.Type: GrantFiled: February 8, 2012Date of Patent: August 12, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Hai-Qing Zhou
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Publication number: 20140218858Abstract: A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.Type: ApplicationFiled: February 1, 2013Publication date: August 7, 2014Applicant: DELL PRODUCTS L.P.Inventors: Austin Michael Shelnutt, James D. Curlee, Jimmy Pike
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Patent number: 8797733Abstract: A fastening module for fastening a data storage device is provided. The data storage device includes first and second positioning apertures. A frame of the fastening module includes a retaining hole, and first and second positioning holes. The data storage device is slidably received in the frame. A securing member of the fastening module includes a main body, a pivot member, and a pin. The main body includes a pivot hole pivotally connected by the pivot member. A securing piece of the pivot member passes through the retaining hole and rotates relative to the main body to fasten the securing member to the frame. When the securing piece passes through the retaining hole, the pin passes through either the first or second positioning hole and inserts into either the first or second positioning aperture to fasten the data storage device at different positions.Type: GrantFiled: May 3, 2012Date of Patent: August 5, 2014Assignee: Pegatron CorporationInventors: Wei-Chih Lai, Hsin-Hung Hsiao
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FIXING MECHANISM FOR FIXING A STORAGE MODULE OF AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH
Publication number: 20140211401Abstract: A fixing mechanism for fixing a storage module of an electronic device includes a tray, two fixing components, two engaging structures and two fixing structures. The tray is for supporting the storage module. The two fixing components are detachably installed on two sides of the tray respectively. The two engaging structures are disposed on the two fixing components respectively, and the two engaging structures are for engaging the two fixing components with the tray. The two fixing structures are disposed on the two fixing components respectively, and two fixing structures are for fixing the storage module on the tray after the two fixing components are engaged with the tray.Type: ApplicationFiled: April 15, 2013Publication date: July 31, 2014Applicant: Synology IncorporatedInventors: Guo-Shiang Lee, Ming-Hung Tsai -
Patent number: 8793413Abstract: A data storage system and method comprises a storage device located inside a cartridge housing and an adapter module removable from the storage device. A first interface directly connects the storage device to the adapter module through an opening in the cartridge housing and a second interface different than the first interface connects the adapter module to a host device.Type: GrantFiled: November 9, 2010Date of Patent: July 29, 2014Assignee: Seagate Technology LLCInventors: Michael G Morgan, Bill Dublin, Max Tsai, Homer Pitner
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Publication number: 20140204523Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.Type: ApplicationFiled: February 28, 2013Publication date: July 24, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHENG-HSIU YANG, CHIH-TA HUANG
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Publication number: 20140204522Abstract: A storage device carrier includes a first member and a second member. The first member includes a side portion and a front portion, perpendicularly coupled to an inside surface of a front end of the first member side portion. The first member includes a first portion of a finger grab. The second member includes a side portion and a latching feature. The latching feature is on an outside surface of a second member side portion. The second member also includes a front portion, perpendicularly coupled to an inside surface of a front end of the second member side portion. The second member includes a second portion of the finger grab.Type: ApplicationFiled: January 23, 2013Publication date: July 24, 2014Inventor: David Michael Keffeler
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Patent number: 8783797Abstract: An electronic device includes a housing, a card holder, and a card holder control mechanism. The housing defines a first slot. The card holder defining a receiving recess. A resisting block protrudes from the card holder. The resisting block includes an inclined surface facing the receiving recess. The inclined surface includes a first end and a second end. The card holder control mechanism includes a pushing post, a slidable button, and an elastic element. An upper end of the pushing post is connected to the slidable button, and a lower end of the pushing post is disposed on the card holder and resists the second end of the inclined surface. The slidable button includes an operation portion extending through the housing through the second slot. One end of the elastic element is connected to the slidable button, and an opposite end is connected to the housing.Type: GrantFiled: December 18, 2012Date of Patent: July 22, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Li-Jun Yang
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Patent number: 8780536Abstract: A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.Type: GrantFiled: October 18, 2011Date of Patent: July 15, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shin-Ting Yen, Yung-Chieh Chen, Duen-Yi Ho
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Patent number: 8779578Abstract: A multi-chip socket includes multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be based on a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.Type: GrantFiled: June 29, 2012Date of Patent: July 15, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kevin B. Leigh, George D. Megason
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Publication number: 20140192476Abstract: A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: INTERNATIONAL BUSINESS MACHINES CORPORATION
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Publication number: 20140192473Abstract: An information handling system (IHS) chassis includes a chassis base. A center portion of the chassis base comprises at least ninety-five weight percent of a first metal element that is one of Aluminum or Magnesium. An edge section of the chassis base extends around the circumference of the chassis base adjacent the center portion. The edge section is comprised of an alloyed material that includes the first metal element and at least five weight percent of at least one second metal element that is selected from the group including Lithium, Titanium, Tungsten, Chromium, Hafnium, Lanthanum, and Ytterbium. The center portion and the edge section may comprise a first layer of the chassis base, and a second layer may be bonded to the first layer. In one example including the second layer, the first metal element is Magnesium and the second layer is at least ninety-five weight percent of Aluminum.Type: ApplicationFiled: January 4, 2013Publication date: July 10, 2014Applicant: Dell Products L.P.Inventor: Deeder M. Aurongzeb
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Publication number: 20140192477Abstract: In the present invention, generation of occurrence of a wiring area is prevented, and a reflection by an inconsistency of a characteristic impedance of a high-speed signal line and a through hole connecting portion. By doing so, a conductor pattern of a raised shape is formed on each of front and back of a through hole, on a GND layer closest to the high-speed signal line in the vicinity of the connecting portion of the high-speed signal line and the through hole. Further, the conductor pattern is a trapezoidal shape, and is a shape which becomes wider as it becomes closer to the through hole.Type: ApplicationFiled: January 9, 2013Publication date: July 10, 2014Inventor: Masatoshi Yoshihara
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Publication number: 20140192474Abstract: An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Applicant: Dell Products L.P.Inventors: Travis C. North, Deeder M. Aurongzeb
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Publication number: 20140192475Abstract: A system and method of controlling a cooling fan in an information handling system is disclosed. A fan request signal is received from a component of an information handling system and a determination is made regarding whether the component is configured to operate with a cooling fan. If the component is configured to operate with the cooling fan, the fan request signal is transmitted to the cooling fan. If, on the other hand, the component is not configured to operate with the cooling fan, a revised fan request signal is generated and transmitted to the cooling fan.Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Inventors: Eric M. Tunks, William K. Coxe
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Publication number: 20140185226Abstract: Embodiments of the invention describe a motherboard PCB having a memory bus to receive signal data from a channel of memory chips/devices of a memory module. Electrical contacts, communicatively coupled to the memory bus, securely couple the PCB to the memory chips/devices of the memory module. Embodiments of the invention further include a receiving housing that includes said electrical contacts and has a height less or equal to the height of the memory module. Embodiments of the invention further describe a memory module having a memory card housing, first and second pluralities of memory chips/devices included in the housing, and first and second pluralities of memory module electrical I/O terminals for coupling the first and second pluralities of memory chips/devices to PCB, respectively. In embodiments of the invention, the above described first and second pluralities electrical I/O connectors are disposed on different sides of the housing.Type: ApplicationFiled: December 28, 2012Publication date: July 3, 2014Inventors: Hue V. Lam, Loc V. Doan
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Publication number: 20140185225Abstract: In an embodiment, a datacenter includes a silo-shaped enclosure defining a shelter from an environment and a plurality of racks having datacenter equipment and configured within the silo-shaped enclosure. The racks are configured in a substantially cylindrical arrangement that defines an interior channel to receive and expel an exhaust airflow communicated from a first side of the plurality of racks to a second side of the plurality of racks abutting the interior channel.Type: ApplicationFiled: December 28, 2012Publication date: July 3, 2014Inventor: Joel Wineland
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Patent number: 8767397Abstract: A computer system that has an outer shape that is round in outer cross-section. The computer housing can be formed of first and second housing parts that are each round in outer cross-section where one unscrews relative to another like taking the lid off a jar. The inside of the housing can store various kinds of nonvolatile memory and a processor. The user's entire processing environment may be stored within the memory and processor, and part of that environment may include stylesheet that represents specific styles of the user.Type: GrantFiled: July 5, 2011Date of Patent: July 1, 2014Assignee: Harris Technology, LLCInventor: Scott C. Harris
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Publication number: 20140177158Abstract: A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Aleksandar Aleksov, Shawna M. Liff
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Patent number: 8760858Abstract: An information processing apparatus may include a housing, a board accommodated inside the housing, a plurality of memories mounted on the board, a temperature sensor mounted on the board to be adjacent to one of the memories, and a memory controller mounted on the board to be adjacent to the temperature sensor and configured to acquire temperature information detected by the temperature sensor. The temperature sensor may be mounted on a central portion of the board so as to be positioned between one side of the memory controller and one side of the one of the memories. Other embodiments are also described.Type: GrantFiled: January 17, 2012Date of Patent: June 24, 2014Assignee: Kabushiki Kaisha ToshibaInventor: Hisao Tsukazawa
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Patent number: 8760857Abstract: An exemplary USB device includes a base including a body and a pair of arms extending from the body, a head rotatably positioned between the pair of arms, and a pair of wheels fixed to the head. When the base is gripped by a user and oriented at an oblique angle relative to an external surface, with the at least one wheel contacting the surface, and the base is moved by the user in a direction generally parallel to the surface, the head is capable of rotating relative to the base by reason of friction between the wheels and the surface, and the head is opened out from the base and is secured in position at a desired angle with respect to the base when the user ceases moving the base.Type: GrantFiled: December 9, 2011Date of Patent: June 24, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shih-Wei Lin, Tzu-Hsiu Hung
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Publication number: 20140168881Abstract: Described is an apparatus which comprises: a first node to provide an un-gated power supply; a second node to provide a threshold dependent supply; an inverter with an input and an output, the inverter coupled to the first and second nodes, the inverter to receive the un-gated power supply at its power supply node, and to receive the threshold dependent supply for supplying ground supply at its ground node; and a transistor with its gate terminal coupled to the output of the inverter, the transistor to provide gated power supply to one or more logic units.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Inventors: Hong Yun Tan, Anant S. Deval, R. Kenneth Hose, JR.
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Publication number: 20140168880Abstract: An apparatus including a glass window, a front cover, a back cover, and an elastic frame. The elastic frame is configured to form at least a first neutral plane and a second neutral plane.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Applicant: Nokia CorporationInventors: Sami SAILA, Antti Salo
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Publication number: 20140168879Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.Type: ApplicationFiled: December 13, 2012Publication date: June 19, 2014Inventors: Mayue Xie, Zhiyong Wang, Yuan-Chuan Steven Chen