Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.

Abstract: An electronic apparatus including a housing; a plurality of accommodating portions, formed in the housing, each having an opening portion that opens towards an outside of the housing; an electronic component unit having a unit body accommodated in at least one first accommodating portion among the plurality of accommodating portions, and a unit cover that is installed on the opening portion of the first accommodating portion and that has a first connection opening connecting an inside and an outside of the first accommodating portion; and a dummy cover that is installed on the opening portion of a second accommodating portion different from the first accommodating portion among the plurality of accommodating portions, and that has a second connection opening connecting an inside and an outside of the second accommodating portion.

Abstract: A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Abstract: An electronic system includes an electronic device and a cooling device. The electronic device includes a housing, a heat source, a heat-conducting seat, and a heat-conducting block. The housing includes a space and at least one opening in communication with each other. The heat source and the heat-conducting seat are disposed in the space and contact with each. The heat-conducting seat faces the opening. The heat-conducting block is located at the opening and is connected to the housing. The cooling device includes a pressing portion and a cooling portion. The pressing portion presses the heat-conducting block, to cause the heat-conducting block to move into the space and abut against the heat-conducting seat, so that heat of the heat source is transferred to the pressing portion. The cooling portion is connected to the pressing portion, and dissipates the heat transferred to the pressing portion.

Abstract: A power system includes a base module including a system management controller (SMC) and a power distribution unit (PDU), an uninterruptible power supply (UPS) module including a UPS, and a battery module including a battery. The base module includes a first edge, and the battery module is detachable from UPS module in a direction perpendicular to the first edge.

Abstract: An air blow guide member 100 for cooling an electrical component accommodated in an electrical component socket 10 is configured to guide flowing air K supplied from a ventilation unit 3 toward the electrical component socket 10. Further, a test device unit 2 including the air blow guide member 100 and the electrical component socket 10 is configured so that the flowing air K supplied from the air ventilation unit 3 is guided toward the electrical component socket 10 by the air blow guide member 100. Further, a test device includes a plurality of the test units 2 arranged from an upstream side toward a downstream side of the flowing air K supplied from the ventilation unit 3.

Abstract: A device is provided that includes a heat conductive structure; a heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the heat transfer structure to rotate above the heat transfer structure without making contact with the heat transfer structure so as to define a boundary layer between the heat conductive structure and heat transfer structure, wherein the heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the heat conductive structure includes small geometric turbulators.

Abstract: A cooling system for cooling chips in a server rack uses a heat pipe, providing a cooled connection to the chips in a server rack. A coolant for the heat pipe is located outside the rack, so that water never needs to be brought into the rack.

Abstract: An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.

Abstract: A slot cover and an integrated circuit access device having the slot cover are provided. The slot is used to be removably inserted into a slot of an electronic device and includes a frame, a positioning portion, an engaging portion, and at least one conductive elastic plate. The frame includes a center sheet, a first-side sheet configured to connect to an integrated circuit access module, and a second-side sheet. The first-side sheet and the second-side sheet are respectively located at a first side and a second side of the center sheet. The positioning portion and the engaging portion are respectively located above and below the center sheet. The at least one conductive elastic plate is disposed at the second-side sheet. When the slot cover is inserted in the slot of the electronic device, the center sheet blocks an opening of the slot.

Abstract: An AC/DC power supply for providing power to a processing device includes a power-supply housing and power-handling units connected to the power-supply housing to permit flow of heat to the power-supply housing by conduction. The power-supply housing comprises an intake port and an exhaust port that have been configured to use moving coolant fluid that made to move by a fan on the processing device to cause convective cooling of the power-handling units.

Abstract: A boat protection system comprises a hub system and at least one auxiliary module. The hub system comprises a hub housing defining at least one hub guide portion, at least one hub electrical connector supported by the hub housing, and a DC bus operatively connected to the at least one hub electrical connector. The at least one auxiliary module comprises an auxiliary housing defining at least one auxiliary guide portion, at least one auxiliary electrical connector supported by the auxiliary housing, and at least one functional component. At least one hub guide portion engages at least one auxiliary guide portion to support at least auxiliary housing relative to the hub housing such that at least one hub electrical connector engages at least one auxiliary electrical connector. The at least one functional component of the at least one auxiliary module is operatively connected to the DC bus.

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

Abstract: Adaptive cooling system and methods, docking stations for electronic devices, and systems using the same are described. In embodiments the active cooling systems include a controller that compares a detected temperature of at least a component of a first electronic device to a first temperature threshold (T1D1) for the first electronic device. When the first temperature is ?T1D1, the controller may issue a control signal that causes a cooling system for a second electronic device to operate at a defined duty level. In embodiments the adaptive cooling systems are incorporated into equipment for a vehicle, such as a vehicle center console. The docking stations may function as a battery eliminator and/or an uninterruptible power supply, and may include a mount, a power connector, and optionally a data connection, which may couple to corresponding device power and device data connections of an electronic device that is coupled to the mount.

Abstract: A wearable electronic device according to various embodiments of the disclosure includes: a housing including a first housing part in which a processor is received and a second housing part in which a display is received, and a hinge connecting the first housing part and the second housing part and having a hole provided in an area in communication with an outside of the wearable electronic device. At least part of heat generated from the processor is radiated to the outside through the hinge having the hole formed therein.

Abstract: A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.

Abstract: Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

Abstract: A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

Abstract: An electronic device includes an interface unit including a connection portion attachable to an external device by being connected with an interface terminal disposed in the external device, a heat transfer unit, and a heat dissipation unit, wherein the heat transfer unit and the heat dissipation unit are connected with the interface unit, and are in a direction opposite the external device when the interface unit is connected with the external device.

Abstract: A cooling system for an information handling system in a portable chassis comprises a vapor chamber for transferring heat away from components, a porous heat exchanger for receiving heat from the vapor chamber, an air pump of receiving airflow at a first air pressure and generating a second airflow at a second air pressure greater than the first airflow. The porous heat exchanger may comprise one of a plurality of sides of an internal air chamber configured to allow the air pump to generate the second air pressure two to three orders of magnitude greater than the first air pressure. An air pump such as a piezoelectric air pump can generate airflow at a pressure that is two to three orders of magnitude greater than possible using a traditional blower.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: A display assembly with loopback cooling includes a housing for an electronic display where a first airflow pathway extends within the housing. An equipment storage device for electronic equipment located at a storage area within the housing. A second airflow pathway fluidly connects the storage area with the first airflow pathway. One or more fans, when activated, cause a flow of air to travel through a portion of the first airflow pathway extending rearward of the electronic display in a first direction and a portion of the flow to leave the portion of the first airflow pathway and travel through the second airflow pathway, at least initially, in a second direction.

Abstract: The disclosure provides an electronic device and a control method and control apparatus therefor, a storage medium, and a processor. The electronic device includes: a body; a display screen, located on a surface of the body, wherein the display screen includes a plurality of sub-screens; an actuating structure, connected with the display screen and configured to deform at different temperatures to change an included angle between at least two adjacent sub-screens; and at least one current drive structure, electrically connected with the actuating structure and configured to input current to the actuating structure to deform the actuating structure. The electronic device can control the included angle between the two adjacent sub-screens to reach a predetermined included angle by merely controlling the current of the current drive structure, and a user does not need to fold or unfold the display screen by hand, such that user experience is good.

Abstract: Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.

Abstract: In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.

Abstract: In a method of operating a storage device, temperature information is received from a temperature sensor. At least one power control signal and at least one performance control signal are alternately output based on the temperature information. A first temperature control operation and a second temperature control operation are alternately performed based on the at least one power control signal and the at least one performance control signal. The first temperature control operation is performed to control cooling performance of a thermoelectric element included in the storage device based on the at least one power control signal. The second temperature control operation is performed to control a throttling of operating performance of the storage device based on the at least one performance control signal.

Abstract: A data handling device includes a plurality of data storage units that are adapted for long term redundant storage of data, generate heat during operation, and are mounted in a manner allowing cooling, and data accessing circuitry adapted determine information chunks relating to data to be stored such that a subset of the information chunks suffice for reproduction of the data, select several of the plurality of data storage units, write the information chunks onto the selected data storage units, determine from which of the selected data storage units to retrieve information chunks based on temperatures of the data storage units to reproduce the data, where at least some of the subset of data storage units are mounted to be cooled by a common vertical air.

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: A display assembly with divided interior space includes a first and second electronic display subassembly attached to a structural framework, where each of the subassemblies include an electronic display layer located behind a cover, an illumination device for providing illumination to the electronic display layer when powered, and a passageway for circulating gas. A common passageway for the circulating gas is located between the subassemblies and is in fluid communication with the passageways. A central septum extends within the common passageway between the subassemblies to divide the common passageway into a first portion and a second portion.

Abstract: A gas-liquid separator includes a chamber having an inlet for liquid to enter and at least one outlet for expulsion gas and/or vapour that has separated from the liquid within the chamber under gravity. For some applications the chamber will also have an outlet for the liquid. These systems can rely on the chamber remaining in a static orientation with the gas outlet arranged uppermost. Exemplary embodiments provide the chamber with multiple spaced apart outlets and an ability to sense orientation and/or acceleration of the chamber. A controller uses the output of the sensors to determine the spatial arrangement of the liquid phase and gas phase within the chamber relative to the outlets and selectively opens the multiple outlets to allow one of the liquid phase or gas phase to escape the chamber in preference to the other.

Abstract: A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Abstract: A cooling system including a support structure and a cooling element is described. The cooling element has a central region and a perimeter. The cooling element is supported by the support structure at the central region. At least a portion of the perimeter is unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. Further, the cooling element has a first side distal from the heat-generating structure and a second side proximate to the heat-generating structure. The support structure supports the cooling element from one of the first side and the second side.

Abstract: A big data cloud computing all-in-one machine apparatus, including an all-in-one machine main body, an integrated display screen and a back box support column is provided. A middle part of a top end of the all-in-one machine main body is fixedly connected with the integrated display screen, and a front surface of the integrated display screen is fixedly connected with the back box support column. Two sides of the top end of the all-in-one machine main body are fixedly connected with the top heat dissipation openings; the bottom end of the embedded support seat is fixedly connected with the base antiskid grounding mat; one end of the embedded support seat is fixedly connected with the embedded storage tab. The embedded support seat well improves the convenience of the device; the top heat dissipation openings well reflect the heat dissipation effectiveness of the device.

Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

Abstract: A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.

Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

Abstract: A cradle device for a computer according to an embodiment includes: a cradle part configured such that the inlet part is seated thereon and holes through which air flows are formed therein; a filter part configured to filter out foreign substances generated according to the flow of air; and a filter housing part configured such that the filter part is coupled to a top surface thereof, and fixedly coupled below the holes of the cradle part. The filter part includes a first filter part made of a mesh material, and filters out foreign substances through the first filter part before air is introduced into the inlet part.

Abstract: The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and optical module connectors to receive pluggable optics modules that provide connections to other network switches. The arrangement of the circuit board, switch chip(s) and optical module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the optical module connectors. In addition, the design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules. The vertical switch card assembly and its components can be made removable from the front panel for ease of servicing.

Abstract: A data center cabinet has a base frame with a pair of front vertical posts, first bottom and top side-to-side beams connected to the front vertical posts, a pair of back vertical posts, second bottom and top side-to-side beams connected to the back vertical posts, and front-to-back beams connecting the front vertical posts and back vertical posts. The first and second bottom side-to-side beams each comprise an opening configured to allow a removable transport caster to pass through the opening, a first set of keyholes configured to receive and retain a set of mounting buttons of a first removable transport caster, and a second set of keyholes configured to receive and retain a set of mounting buttons of a second removable transport caster.

Abstract: Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first opening. In an embodiment, the electronic package may further comprise a coolant plate covering the first opening. In an embodiment, the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface. In an embodiment, the first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.

Abstract: A portable electronic device is disclosed. The portable electronic device may include a laptop computing device that includes a base portion and a display housing rotationally coupled to the base portion. The base portion includes a fan designed to drive heated air out of the base portion, thus cooling the portable electronic device. A dynamic (movable) air diverter is integrated into the base portion near the fan's outlet. The air diverter is designed to direct airflow from the fan outlet. Moreover, the air diverter can be repositioned by, for example, rotating the display housing relative to the base portion. As a result of the repositioned air diverter, the airflow from the fan outlet is redirected out of the portable electronic device through a different location. The air diverter can be positioned in different discrete locations, or alternatively, can move continuously with the rotational movement of the display housing.

Abstract: An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (“EMI”) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.

Abstract: A computing unit configured to be mounted in a HPC cabinet comprising an external body and an internal body. The internal body includes a bottom tray, bottom secondary electronic components, at least a bottom connector connected to the bottom secondary electronic components and a top tray being releasably coupled with the bottom tray. The top tray includes top secondary electronic components and at least a top connector connected to the top secondary electronic components, wherein the top connector is configured to cooperate with the bottom connector when the top tray is coupled with the bottom tray.

Abstract: An electronic equipment enclosure which regulates incoming outside air to within the operational limits of the electronic equipment within is described. The enclosure recirculates the wasted heat from the equipment to regulate both the temperature and humidity within the enclosure to acceptable levels without relying on any heating or air conditioning component. Thus, the enclosure assembly relies entirely on air flow for regulating the temperature inside the enclosure. Additionally, the recirculation feature of the enclosure allows the electronic equipment to operate at outside temperatures much lower than the stated operational range by modifying the temperature of the intake air of the equipment. A method of controlling the temperature inside an enclosure is also described.

Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

Abstract: A heat dissipation control method is disclosed, wherein the heat generation speed of a heat dissipation channel may be calculated according to a power consumption value of each component in the heat dissipation channel, and a radiator is then controlled on the basis of the heat generation speed, whereby the heat dissipation speed of the heat dissipation channel is comparable to the heat generation speed. A heat dissipation control apparatus and device are further disclosed, which have the same beneficial effects as the heat dissipation control method.

Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.