Abstract: A display assembly with divided interior space includes a first and second electronic display subassembly attached to a structural framework, where each of the subassemblies include an electronic display layer located behind a cover, an illumination device for providing illumination to the electronic display layer when powered, and a passageway for circulating gas. A common passageway for the circulating gas is located between the subassemblies and is in fluid communication with the passageways. A central septum extends within the common passageway between the subassemblies to divide the common passageway into a first portion and a second portion.

Abstract: A cooling system including a support structure and a cooling element is described. The cooling element has a central region and a perimeter. The cooling element is supported by the support structure at the central region. At least a portion of the perimeter is unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. Further, the cooling element has a first side distal from the heat-generating structure and a second side proximate to the heat-generating structure. The support structure supports the cooling element from one of the first side and the second side.

Abstract: A gas-liquid separator includes a chamber having an inlet for liquid to enter and at least one outlet for expulsion gas and/or vapour that has separated from the liquid within the chamber under gravity. For some applications the chamber will also have an outlet for the liquid. These systems can rely on the chamber remaining in a static orientation with the gas outlet arranged uppermost. Exemplary embodiments provide the chamber with multiple spaced apart outlets and an ability to sense orientation and/or acceleration of the chamber. A controller uses the output of the sensors to determine the spatial arrangement of the liquid phase and gas phase within the chamber relative to the outlets and selectively opens the multiple outlets to allow one of the liquid phase or gas phase to escape the chamber in preference to the other.

Abstract: A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Abstract: A big data cloud computing all-in-one machine apparatus, including an all-in-one machine main body, an integrated display screen and a back box support column is provided. A middle part of a top end of the all-in-one machine main body is fixedly connected with the integrated display screen, and a front surface of the integrated display screen is fixedly connected with the back box support column. Two sides of the top end of the all-in-one machine main body are fixedly connected with the top heat dissipation openings; the bottom end of the embedded support seat is fixedly connected with the base antiskid grounding mat; one end of the embedded support seat is fixedly connected with the embedded storage tab. The embedded support seat well improves the convenience of the device; the top heat dissipation openings well reflect the heat dissipation effectiveness of the device.

Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

Abstract: A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.

Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

Abstract: A cradle device for a computer according to an embodiment includes: a cradle part configured such that the inlet part is seated thereon and holes through which air flows are formed therein; a filter part configured to filter out foreign substances generated according to the flow of air; and a filter housing part configured such that the filter part is coupled to a top surface thereof, and fixedly coupled below the holes of the cradle part. The filter part includes a first filter part made of a mesh material, and filters out foreign substances through the first filter part before air is introduced into the inlet part.

Abstract: The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and optical module connectors to receive pluggable optics modules that provide connections to other network switches. The arrangement of the circuit board, switch chip(s) and optical module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the optical module connectors. In addition, the design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules. The vertical switch card assembly and its components can be made removable from the front panel for ease of servicing.

Abstract: A data center cabinet has a base frame with a pair of front vertical posts, first bottom and top side-to-side beams connected to the front vertical posts, a pair of back vertical posts, second bottom and top side-to-side beams connected to the back vertical posts, and front-to-back beams connecting the front vertical posts and back vertical posts. The first and second bottom side-to-side beams each comprise an opening configured to allow a removable transport caster to pass through the opening, a first set of keyholes configured to receive and retain a set of mounting buttons of a first removable transport caster, and a second set of keyholes configured to receive and retain a set of mounting buttons of a second removable transport caster.

Abstract: Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first opening. In an embodiment, the electronic package may further comprise a coolant plate covering the first opening. In an embodiment, the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface. In an embodiment, the first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.

Abstract: A portable electronic device is disclosed. The portable electronic device may include a laptop computing device that includes a base portion and a display housing rotationally coupled to the base portion. The base portion includes a fan designed to drive heated air out of the base portion, thus cooling the portable electronic device. A dynamic (movable) air diverter is integrated into the base portion near the fan's outlet. The air diverter is designed to direct airflow from the fan outlet. Moreover, the air diverter can be repositioned by, for example, rotating the display housing relative to the base portion. As a result of the repositioned air diverter, the airflow from the fan outlet is redirected out of the portable electronic device through a different location. The air diverter can be positioned in different discrete locations, or alternatively, can move continuously with the rotational movement of the display housing.

Abstract: An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (“EMI”) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.

Abstract: A computing unit configured to be mounted in a HPC cabinet comprising an external body and an internal body. The internal body includes a bottom tray, bottom secondary electronic components, at least a bottom connector connected to the bottom secondary electronic components and a top tray being releasably coupled with the bottom tray. The top tray includes top secondary electronic components and at least a top connector connected to the top secondary electronic components, wherein the top connector is configured to cooperate with the bottom connector when the top tray is coupled with the bottom tray.

Abstract: An electronic equipment enclosure which regulates incoming outside air to within the operational limits of the electronic equipment within is described. The enclosure recirculates the wasted heat from the equipment to regulate both the temperature and humidity within the enclosure to acceptable levels without relying on any heating or air conditioning component. Thus, the enclosure assembly relies entirely on air flow for regulating the temperature inside the enclosure. Additionally, the recirculation feature of the enclosure allows the electronic equipment to operate at outside temperatures much lower than the stated operational range by modifying the temperature of the intake air of the equipment. A method of controlling the temperature inside an enclosure is also described.

Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

Abstract: A heat dissipation control method is disclosed, wherein the heat generation speed of a heat dissipation channel may be calculated according to a power consumption value of each component in the heat dissipation channel, and a radiator is then controlled on the basis of the heat generation speed, whereby the heat dissipation speed of the heat dissipation channel is comparable to the heat generation speed. A heat dissipation control apparatus and device are further disclosed, which have the same beneficial effects as the heat dissipation control method.

Abstract: An information handling system may include a chassis configured to house components of the information handling system and a modular power supply module configured to be readily removable from the chassis. The modular power supply module may include an enclosure, power supply components housed within the enclosure, an air mover configured to drive airflow to cool one or more components of the information handling system, and a mechanical assembly configured to mechanically couple the air mover to the enclosure that enables a user to remove the air mover from the enclosure while still coupled to the enclosure via the mechanical assembly, rotate the air mover 180 degrees relative to the enclosure while still coupled to the enclosure via the mechanical assembly, and reinsert the air mover into the enclosure, in order to modify a direction of airflow driven by the air mover.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may determine that an inventory of components of an information handling system (IHS) includes a first fan and an IHS card, which include a second fan; receive user input indicating a maximum acoustic sound pressure level (SPL); determine a first maximum fan speed for the first fan based at least on the maximum acoustic SPL; determine a first maximum power consumption for the IHS card and a second maximum fan speed for the second fan based at least on the maximum acoustic SPL; provide first configuration information, indicating the first maximum fan speed for the first fan, to a fan controller of the IHS; and provide second configuration information, indicating the first maximum power consumption and the second maximum fan speed for the second fan, to the IHS card.

Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.

Abstract: An electronic apparatus includes an interface unit including a connection unit, a heat transfer unit, a heat dissipation unit, and a fixation member. The connection unit is attachable to an interface terminal of an external apparatus. The fixation member is couplable to a fixation unit of the external apparatus. When the electronic apparatus is attached to the external apparatus, the heat dissipation unit, the heat transfer unit, and the interface unit are arranged in a layered manner in this order and are thermally coupled, and, along therewith, the fixation member is thermally coupled to the heat dissipation unit and the fixation unit.

Abstract: A patient monitoring device can be configured to provide fast and reliable physiological measurements in a variety of care settings including at a patient's home. The device can include a compact, standalone monitor with telehealth capabilities as well as an intuitive interface for use at home. The device can include a blood pressure, capnography, or pulse oximetry module. A device can include a sleek and continuous outer surface that is easy to clean and generally free of crevices, holes, or surfaces that collect external contaminants. For example, portions of the housing can connect together using a limited number of screws, thereby limiting a number of holes. The device can include a vent cover that can be rotated to reconfigure the function of the vent cover. For example, the vent cover can function as a stabilization feature and/or a cover for a ventilation hole, while permitting exhaust through the ventilation hole.

Abstract: A heat exchanger for removing heat from a server cabinet, wherein the heat exchanger is disposed within the server cabinet and behind at least one server in the server cabinet, the heat exchanger including an upstream surface facing the at least one server, the upstream surface receiving air heated by the at least one server, wherein the air enters the heat exchanger in a generally horizontal direction, the heat exchanger having a fluid inlet for receiving a working fluid, and a fluid outlet for discharging the working fluid, wherein the working fluid cools the air entering the heat exchanger, and the heat exchanger having a downstream surface that discharges air cooled by the heat exchanger, wherein the air cooled by the heat exchanger exits the heat exchanger in a generally vertical direction.

Abstract: An apparatus comprises a body portion configured to be disposed above an electronic equipment rack. The apparatus further comprises one or more first openings in the body portion. The one or more first openings are configured for receiving a first plurality of cables routed through the one or more first openings. At least one bracket is attached to a side surface of the body portion and configured to be attached to a top surface of the electronic equipment rack. The at least one bracket comprises one or more second openings configured for receiving a second plurality of cables routed through the one or more second openings into the electronic equipment rack.

Abstract: A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.

Abstract: A fan handle is operable to be coupled to a fan. The fan handle includes a first sheet and a second sheet. The first sheet has first apertures operable to receive fasteners to couple a fan guard with a first side of the fan. The first sheet forms a slot. The second sheet has second apertures operable to receive fasteners to couple a fan guard with a second side of the fan. The second sheet forms shoulders from which an extension portion extends. The extension portion is received in the slot of the first sheet. In a retracted configuration, the first sheet and the second sheet are substantially flush such that the shoulders abut against the first sheet. In an extended configuration, the extension portion is partially withdrawn from the slot such that the first sheet and the second sheet are curved and coupled with one another.

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

Abstract: A thermal module for cooling a plurality of component and cooling a bottom cover of a sealed chassis. A pair of fans are positioned in the chassis, wherein each fan has a first fan outlet directing a first portion of the airflow toward a first fin stack near a vent in the back cover, a second fan outlet for directing a second portion of the airflow to a second fin stack near a vent in a side cover, and a third fan outlet for directing a third portion of the airflow to a set of components in the chassis or a surface of the chassis. The size of each fan outlet and the size and impedance of the first fin stack and the second fin stack are configured to ensure the airflow is distributed according to a ratio based on cooling a set of components in the chassis and a bottom cover of the chassis.

Abstract: A display apparatus includes a display panel module including a front surface displaying an image and a rear surface opposite the front surface, and a heat dissipation member disposed on the rear surface of the display panel module and including a first portion, that is in contact with the display panel module, and a second portion that is spaced farther apart from the display panel module than the first portion is. The heat dissipation member includes at least one portion that is bent between the first portion and the second portion with respect to a bending axis parallel to the rear surface.

Abstract: A riser bracket assembly for supporting at least one expansion card horizontally over a motherboard is disclosed. The riser bracket assembly may support different types of expansion cards. The assembly includes a first component half having a registration feature to mate with a first type of riser board. A second component half is attachable to the first component half. The second component half has a registration feature to mate with a second type of riser board. A riser board has an edge connector insertable into a socket on the motherboard. The riser board includes an expansion card connector connectable to the at least one expansion card. The riser board supports either the first component half or the second component half.

Abstract: A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.

Abstract: An oven comprises an interior electronics cavity defined within electronics cavity walls. The oven includes an air inlet for receiving ambient air from an ambient space outside the electronics cavity into the interior electronics cavity and a first air outlet for returning steam laden air from a cooking space to the ambient space outside the cooking space. The oven also includes a second air outlet positioned to separate flow going into the air inlet from flow from the first air outlet. An air plenum can be defined outside of the cooking space, and the air inlet can be defined in a first portion of an exterior interface of the air plenum. The second air outlet can be defined in a second portion of the exterior interface.

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

Abstract: A system including a cooling element and an egress passageway is described. The cooling element is configured to provide a stream of hot air having been heated by a heat from a heat-generating structure. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn to be mixed with the hot air.

Abstract: Systems, methods, and other embodiments associated with unified control of cooling in computers are described. In one embodiment, a method locks operation of first and second cooling mechanisms configured to cool one or more components in the computer. In response to a first condition, the method unlocks the operation of the first cooling mechanism to allow the first cooling mechanism to make cooling adjustments while the operation of the second cooling mechanism is locked. In response to a second condition, the method unlocks the operation of the second cooling mechanism to allow the second cooling mechanism to make cooling adjustments while the operation of the first cooling mechanism is locked. In the method, the first cooling mechanism and the second cooling mechanism are prevented from making the cooling adjustments simultaneously.

Abstract: A system is disclosed for managing a set of electrical/electronic devices for driving fans of a heat exchanger of a refrigeration plant, having a basic control unit adapted to act as interface between a remote control unit/Master unit and a plurality of electrical/electronic devices to be controlled. The basic control unit has a data input to receive inputs from the remote control unit/Master unit and a plurality of data outputs connectable with respective electrical/electronic devices of the electrical/electronic devices. The basic control unit is configured to address the electrical/electronic devices using management signals to program the operating parameters of the electrical/electronic devices, and to directly manage the operation. The management signals include addressing, programming and management commands previously programmed in the memory unit based on specific applications and communication protocols.

Abstract: A wearable device can include a wearable band configured to contact a user of the wearable device, an actuator, a sensor, and one or more processors in communication with the actuator and the sensor. The processors can be configured to measure a back electromotive force (“EMF”) of the actuator; determine, based on the measured back EMF, data that describes a contact force between the wearable band and the user; and determine, based on the data that describes the contact force, a quality metric describing a data quality of sensor data collected by the sensor. In some embodiments, the processor(s) can determine, generate sensor output data based on the sensor data and based at least in part on the data describing the contact force between the wearable band and the user. For example, one or more machine-learned models maybe leveraged to generate sensor output data that is compensated for the wearable band being too tight or too loose.

Abstract: An information handling system includes multiple hard disk drives, a central processing unit (CPU) and memory complex, a graphics processing unit (GPU) and input/output (I/O) complex, multiple cooling fans, and first and second airflow vanes. The cooling fans pull in airflow through the hard disk drives and push the airflow through both the CPU and memory complex and the GPU and I/O complex. The first and second airflow vanes are located between the hard disk drives and the cooling fans. The first and second vanes are in a first configuration when the information handling system is in a CPU and memory centric configuration, and in a second configuration when the information handling system is in a GPU and I/O centric configuration.

Abstract: A computing device of an information handling system includes a computing component and a chassis for housing the computing component. The computing components may be, for example, a portion of a circuit card, hardware device, or other physical structure. The chassis includes an air exchange for receiving gases for thermal management of the computing component and a corrosion management component, physically connected directly to the air exchange, that reduces a rate of corrosion of the air exchange due to the gases.

Abstract: A fan engagement structure for the fan to quickly and securely plug into or extract out of another structure. The fan engagement structure includes a frame main body. The frame main body has a first end and a second end. The frame main body has an internal hollow passage. The first end is mated with a fan. The frame main body has a first side and a second side. An engagement elastic plate extends from the first side. The surface of the engagement elastic plate has a latch section. The second side has a finger latch section, whereby the fan can be quickly and securely plugged into or extracted out of the other structure.

Abstract: A portable radio device incorporating active thermal mitigation systems, and methods of use thereof. An example radio device incorporating an active thermal mitigation system may comprise a portable radio device selectively connectable or otherwise interoperable with a power adapter or battery device, wherein the power adapter or battery device includes an active thermal mitigation system. The system may include a micro-fan, blower, or other similar device configured to generate airflow, and may be configured to direct a flow of air or other fluid towards the radio device. The system may further include one or more fins or other features for directing and/or enhancing fluid flow, as well as sensors and control features to vary flow depending on temperature of the radio device or other variables. Thus, the system allows for the continuous cooling the radio device via convection without requiring the incorporation of the active thermal mitigation system within the radio device.

Abstract: Disclosed is a combined core microchannel heat exchanger comprising a first plurality of microchannel tubes extended between, and in fluid communication with, a first inlet header and a first outlet header arranged in a first fluid circuit, a second plurality of microchannel tubes extended between, and in fluid communication with, a second inlet header and a second outlet header arranged in a second fluid circuit, wherein the first fluid circuit is fluidly isolated from the second fluid circuit and a microchannel tube of the second plurality of microchannel tubes is interleaved adjacent to microchannel tubes of the first plurality of microchannel tubes, and a plurality of fins disposed between the microchannel tube of the second plurality of microchannel tubes and the first plurality of microchannel tubes.

Abstract: A hospital human resource information management file cabinet is provided, including a support base plate, a lower surface of which is fixedly connected to upper surfaces of three fan assemblies; left ends of the three fan assemblies are respectively connected to outer surfaces of three first conduits, and front ends of the three first conduits are in communication with back ends of three second conduits. The file cabinet speeds up air flow rate on surfaces of the files therein, prevents moisture causing damage to the files, reduces information loss, and continuously treats the moisture inside, which in turn guarantees the service life of the file cabinet.

Abstract: A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Abstract: An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.

Abstract: A data center cabinet has a base frame with a pair of front vertical posts, first bottom and top side-to-side beams connected to the front vertical posts, a pair of back vertical posts, second bottom and top side-to-side beams connected to the back vertical posts, and front-to-back beams connecting the front vertical posts and back vertical posts. The first and second bottom side-to-side beams each comprise an opening configured to allow a removable transport caster to pass through the opening, a first set of keyholes configured to receive and retain a set of mounting buttons of a first removable transport caster, and a second set of keyholes configured to receive and retain a set of mounting buttons of a second removable transport caster.