Abstract: A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a peltier device and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, an upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipes connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module.

Abstract: An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

Abstract: According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section.

Abstract: A thermal module includes a base including a first plate having a first side for connecting with a first heat source so as to conduct heat generated by the first heat source, and a second plate connected to the first plate. A height difference is formed between the first plate and the second plate. The second plate includes a second side opposite to the first side of the first plate for connecting with the second heat source so as to conduct heat generated by the second heat source. The thermal module includes a heat-dissipating device connected to the base for dissipating the heat transmitted to the first plate and for dissipating the heat transmitted to the second plate. A height difference is formed between the first heat source and the second heat source, and the base is positioned between the first heat source and the second heat source.

Abstract: According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe which thermally connects the first heat emitter with the heat sink, a second heat pipe, and a fan unit which cools the heat sink and the second heat pipe. The second heat pipe has a first end portion which is thermally connected to the second heat emitter, and a second end portion which is located near the heat sink.

Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.

Abstract: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: A portable electronic device includes a housing receiving a heat generating electrical component therein, a display unit and a heat dissipating hinge pivotably interconnecting the housing and the display unit. The heat dissipating hinge includes a body, a cover, a first heat pipe and a second heat pipe. A body defines a first receiving groove receiving a condenser section of the second heat pipe therein. The cover and the body cooperatively define a receiving channel receiving the evaporator section of the first heat pipe therein. Heat generated by the electric device is transferred from the heat generating electronic component to the display unit through the heat dissipating hinge. First and second supporting members are secured to two ends of the evaporator section of the first heat pipe to prevent leakage of thermal grease from a middle portion of the receiving channel.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: A portable electronic device includes a casing, an electronic component disposed in the casing, and a thermal module for dissipating heat of the electronic component. The thermal module includes a heat pipe, a fin unit, and a transverse fan. The heat pipe includes an evaporating section thermally attached to the electronic component, and a condensing section thermally attached to the fin unit. The transverse fan is arranged in the casing for generating an airflow through the electronic component and the fin unit. The transverse fan includes a rotor, and a sidewall on a floor of the casing and surrounding the rotor. The sidewall defines an air inlet and an air outlet therein. The air outlet faces to the fin unit. The air inlet faces to the electronic component.

Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Abstract: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Abstract: A cover structure comprises: a substrate defined a sliding slot and an opening adjacent to the sliding slot; a covering board defined a receiving portion; an alignment plate defined a salient point, and an aperture aligned with the opening; the alignment plate is fixed on the substrate, the covering board is slidably positioned in the sliding slot and between the substrate and the alignment plate, and the salient point is received in the receiving portion to lock the covering board.

Abstract: According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the heat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.

Abstract: A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins.

Abstract: An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the adapting block.

Abstract: An electronic device includes a housing that has a bottom surface and a side surface and includes an opening for air cooling formed therein; and a substrate that has a heat generating component mounted on a surface thereof facing the bottom surface of the housing and is fixed in the housing such that there is space between the substrate and the opening. The electronic device further includes a heat radiation component that contacts the heat generating component on the substrate and that spreads, between the bottom surface of the housing and the substrate, through the space, and to a position near and inside the opening; and a fan that is disposed in the space and fixed in the housing independently of the substrate so as to perform air cooling using the opening.

Abstract: According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.

Abstract: An electronic device is provided with an enclosure having a side wall in which vent holes are formed, a heat generator stored in the enclosure, a radiator disposed adjacent to the vent holes, a heat receiver thermally connected to the heat generator, a heat transmission member having one end thermally connected to the heat receiver and the other end thermally connected to the radiator, a fan disposed adjacent to the radiator to generate cooling air toward the radiator, and a seal member that seals a gap formed between the radiator and the side wall having the vent holes formed therein.

Abstract: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Abstract: The present invention provides a portable computer in which an increase in temperature of a housing is suppressed. In the present invention, a guide plate is provided to suppress an increase in temperature of a bottom surface. When a cooling fan device operates, outside air taken in from inlet openings flows as an air current through a narrow flow path formed between the guide plate and the bottom surface. A flow velocity of the air current can be increased by narrowing the flow path, and heat exchange with the guide plate can be effectively performed, thereby sufficiently cooling a cooling surface. The cooled guide plate cools an air layer between the guide plate and the heat sink and thermally insulates between the air layer and the bottom surface.

Abstract: Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed.

Abstract: An electrical connector assembly for electrically connecting a printed circuit board and an electronic package, comprises an electrical connector on which the electronic package is mounted, a heat sink module mounted upon the electronic package and a clip positioned upon the heat sink module. The printed circuit board defines a connector mounting area surrounded by a plurality of through holes thereof. The clip has a base portion downwardly pressing against the heat sink module, a pair of mounting portions mounted to the corresponding holes, and a pair of pressing portions extending from the mounting portions and disposed on opposite sides of the clip for pressing against the heat sink module.

Abstract: The present invention represents a significant advancement in the field of cooling systems for computer hardware. One embodiment of a system for cooling a heat-generating device includes a housing sized to fit within a drive bay of a computing device, a heat exchanger disposed within the housing and configured to transfer heat from liquid to air, a fan disposed within the housing and configured to force air through the heat exchanger, and a pump disposed within the housing and configured to circulate a liquid through a cold plate sub-assembly and back to the heat exchanger. The cold plate sub-assembly is configured to be thermally coupled to the heat-generating device. The disclosed system may be advantageously disposed in any computing device whose chassis has a standard-sized drive bay, thereby enabling the system to be easily implemented across a wide variety of computing devices.

Abstract: A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

Abstract: A portable electronic device includes a casing, an electronic component disposed in the casing, and a thermal module for dissipating heat of the electronic component. The thermal module includes a heat pipe, a fin unit, and a transverse fan. The heat pipe includes an evaporating section thermally attached to the electronic component, and a condensing section thermally attached to the fin unit. The transverse fan is arranged in the casing for generating an airflow through the electronic component and the fin unit. The transverse fan includes a rotor, and a sidewall on a floor of the casing and surrounding the rotor. The sidewall defines an air inlet and an air outlet therein. The air outlet faces to the fin unit. The air inlet faces to the electronic component.

Abstract: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Abstract: A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.

Abstract: According to one embodiment, a substrate unit of the present invention comprises a first substrate, a second substrate and a coupling member. The first substrate has a first substrate main body and a circuit component. The second substrate has a second substrate main body, an opening portion provided at the second substrate main body, and a cooling module which cools the circuit component. The circuit component is mounted on a face of the first substrate main body which is opposite to the second substrate. The cooling module has a main body and a projecting portion. The coupling member fixes the main body to a second face of the second substrate main body, and couples the first substrate and the second substrate so as to fit the projecting portion in the opening portion and press the projecting portion against the circuit component.

Abstract: An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes a heat generating component, a heat receiving region thermally connected to the heat generating component and a heat radiating region having a lower temperature than the heat receiving region while the apparatus is operating. The heat transfer member includes a first end portion attached in the heat receiving region and a second end portion attached in the heat radiating region.

Abstract: A housing for a computer or multi-media equipment or the like includes at least one heat-generating component. The housing may have a respective cooling body on opposing walls and a heat conduction conduit that is thermally coupled to the heat-generating component. The heat conduction conduit can run along both opposing walls and is thermally coupled to the cooling bodies, whereby heat from the heat-generating component can be dissipated from the housing via the heat conduction conduit and the cooling bodies. By running the heat conduction conduit along opposing walls, heat may be transferred in a rapid, uniform manner to the entire surface of the cooling bodies that are contained in the walls.

Abstract: A thermal resistance measuring apparatus for a heat sink includes a heat source, a temperature sensor, a micro control unit (MCU), a display, and a power apparatus. The heat source heats the heat sink. The temperature sensor senses temperature signals of the heat source. The MCU receives the temperature signals from the temperature sensor and processes them to calculate thermal resistance of the heat sink. The display is electrically connected to the MCU for showing the thermal resistance of the heat sink. The power apparatus supplies power to the heat source, the temperature sensor, and the MCU.

Abstract: Provided is a display module having an improved heatsink. The display module includes a display panel adapted to display an image, a chassis adapted to support the display panel, a driver circuit unit arranged on the chassis and adapted to generate an electrical signal that drives the display panel, an integrated circuit arranged on a signal transmitting unit, the integrated circuit being adapted to control signal transmission between the driver circuit unit and the display panel and at least one heatpipe arranged on a side of the chassis opposite the display panel, the heatpipe being adapted to transfer heat generated by the IC chip to the chassis.

Abstract: A thermal module includes a centrifugal fan (10), a fin assembly (20) disposed at an air outlet of the centrifugal fan and two heat pipes (30, 40). The fin assembly includes a plurality of fins (21) connected together. Each fin has a front surface (212) and a rear surface (213) opposite the front surface. An elongated protruding member (218) is formed on the fin and protrudes from the rear surface towards the front surface. A recessed concave (219) corresponding to the protruding member is defined in the rear surface of the fin. At least one slit is defined along the protruding member and communicates with the concave. The protruding member divides the fin into first and second fin portions (20a, 20b). The two heat pipes thermally interconnect the first and second fin portions with two heat generating electronic components, respectively.

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?umd)/??2,500; with ? being the fluid density, um being the free-stream fluid velocity, d being the pipe distance or diameter, ? being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.

Abstract: A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics memory chips mounted on a top thereof, and a plurality of second graphics memory chips mounted on a bottom thereof. The heat sink for cooling the GPU and the first graphics memory chips, includes a base attached to the top of the graphics card, a finned part fixed to a top of the base, and a heat pipe sandwiched between the base and the finned part. A pathway of the heat pipe passes over the GPU and at least part of the first graphics memory chips of the graphics card. The thermal board is mounted to the bottom of the graphics card for cooling the second graphics memory chips.

Abstract: A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.