Abstract: A fastener includes a main body, a washer, and a spring. The main body includes a pole, two spaced latches extending from a top end of the pole, and two spaced legs extending down from a bottom end of the pole opposite to the latches. An annular blocking portion protrudes out from a circumference of the pole adjacent to the legs. A tapered first projection protrudes from an outer side of a distal end of each latch opposite to the other latch. A tapered second projection protrudes from an outer side of a distal end of each leg opposite to the other leg. The washer and the spring are fitted around the pole, and the spring is sandwiched between the washer and the blocking piece.

Abstract: Systems and methods providing for packaging of scalable machines are discussed herein. Some embodiments may include a stackable cooling rail based system with a plurality of stackable frames. A stackable frame may contain one or more modules that may contain functional components; one or more cooling elements to remove heat from the one or more modules (e.g., on a first side); and one or more cooling rails coupled thermally with the one or more cooling elements. The stackable frame may move (e.g., together) with at least one of its cooling rails, such that the stackable frames and cooling rails may be adjustable between an opened configuration and a stacked configuration. In the opened configuration, an access gap may be present between a pair of consecutively stacked stackable frames and their cooling rails, to provide physical access to modules and other features.

Abstract: A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides.

Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: Methods, apparatuses, and computer program products for modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack are provided. Embodiments include receiving, by a configuration controller, a configuration preference from a user; identifying, by the configuration controller, a spatial orientation configuration corresponding to the configuration preference received from the user; and coordinating, by the configuration controller, movement of the thermal acoustic panel relative to a body of the computing enclosure rack in accordance with the identified spatial orientation configuration.

Abstract: A wireless power transfer system and power transmitting/receiving device according to the present invention include an antenna (resonator) 109 and a heat dissipation structure 111 with an electrically conductive thermal conductor 11, a portion of which makes thermal contact with the inductor 13 of the antenna 109 with an electrical insulator 12 interposed between them. The thermal conductor 11 is arranged to form no electrically closed loop.

Abstract: A package 10 includes a housing 1 in which an electronic component 5 is mounted in a recess 1a having an opening on an upper surface and a screwing section 31 that is fixed on a side face of the housing 1 and extends in a lateral direction. The screwing section 31 includes a thin section 34 which is located on a distal end and is provided with a through hole 36 through which a screw is inserted, a thick section 35 which is located between the thin section 34 and the side face of the housing 1 and has a thickness less than that of the side face of the housing 1 and thicker than that of the thin section 34, and a screw fastening hole 37 which extends in the vertical direction in the thick section 35. Even if the housing 1 has warpage when the package 10 is fixed on the external substrate, heat dissipation from the package to the external substrate can be improved.

Abstract: Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

Abstract: A junction box includes a cable connecting box and a cover covering the cable connecting box. The cable connecting box includes an insulative block, a plurality of contacting foils retained in the insulative block and a plurality of diodes. Each diode connects with two neighborly contacting foils. The contacting foils are insert-molded with the insulative block. Based on thermal radiation properties of the plastic material is superior to that of the metal material, as the contacting foils transfer the heat to the insulative block, the insulative block would deliver the heat to the cable connecting box, then the heat would be delivered to the cover. Such that, the heat dissipates outside quickly from the junction box.

Abstract: Improving the operating efficiency of a rear door heat exchanger, including: determining, by a ventilation management module, a temperature differential between two temperature sensors in the rear door heat exchanger, the temperature differential indicative of cooling efficiency in the rear door heat exchanger; determining, by the ventilation management module, whether the temperature differential is greater than a predetermined threshold; and responsive to determining that the temperature differential is greater than the predetermined threshold, taking corrective action by the ventilation management module.

Abstract: A display device, comprising a display panel, a back surface enclosure disposed on a back surface side of the display panel and comprising a concave portion formed in a concave shape on a display panel side, and a heat generating component disposed between the display panel and the back surface enclosure, wherein the concave portion comprises a plurality of holes that release heat from the heat generating component to an outside of the display device.

Abstract: A connection arm couples to a cooling fan main body to enclose wires extending from the main body to an end of the connection arm that holds a plug of the wires in a position aligned with a circuit board cooling fan socket. Wires enclosed in the connection arm slip through a slot along the side of the connection arm and are protected from view by a cable cover disposed along the top surface of the cooling fan and connection arm.

Abstract: An assembly method suitable for assembling a portable electronic device having a housing with an undercut portion is disclosed. The method includes aligning a non-display portion of a display assembly with the undercut portion of the housing, the display assembly comprising a display, a protective top layer covering a top side of the display portion and the non-display portion and a battery module attached to an underside of the display assembly, electrically connecting the battery to a circuit previously installed in the housing, angling the display assembly in relation to a front opening of the housing in a tilted configuration such that the non-display portion is partially inserted into the undercut portion of the housing, and in the tilted configuration, performing a pre-install functional test on the display and fully inserting the display assembly into the housing only when the pre-install functional test is successfully completed.

Abstract: Disclosed is a mechanical layout for a half-bride power module that is optimized for low inductance. In one embodiment, a first power module and a second power module are mounted on each side of a heat sink. An inductance cancelling bus bar is wrapped around the heat sink, the first power module and the second power module in a loop.

Abstract: Prior to loading into a vehicle, a duct is attached to a battery such that the duct is moveable between a loading position and a post-loading position. Before the battery and duct are loaded into the vehicle, the duct is positioned in the loading position. After the battery and duct are loaded into the vehicle, the duct is positioned in the post-loading position and secured.

Abstract: There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat sink block 3, and a semiconductor chip 2, wherein a first insulating resin sheet 41, which forms a lower layer of the insulating resin sheet 4, is first bonded to the cooler 5 by thermal compression. Next, with a second insulating resin sheet 42, which forms an upper layer of the insulating resin sheet 4, interposed between the first insulating resin sheet 41 and the heat sink block 3, the second insulating resin sheet 42 is bonded to the first insulating resin sheet 41 by thermal compression, and the heat sink block 3 is bonded to the second insulating resin sheet 42 by thermal compression. The semiconductor chip 2 is then soldered onto the heat sink block 3.

Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.

Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.

Abstract: In one implementation, an environmental controller operates a cooling system in an electronic device. The environmental controller includes a closed loop control system for operating a cooling fan at a target speed. The environmental controller may select the target speed based on one or more temperature sensors. The environmental controller may select the target speed based on the speeds of additional fans or the fans may be controlled in unison. The closed loop control system includes a proportional weight. When a measured cooling fan speed deviates from the target speed by more than a threshold error value, the proportional weight is constant. As the measured cooling fan speed approaches the target speed, and the threshold error value is crossed, the proportional weight is variable. The variance may be a function of time such as a periodic stair step function.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Abstract: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.

Abstract: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

Abstract: A system includes a digital subscriber line access multiplexer (DSLAM) enclosure having a power area for housing power components and a component area for housing components configured to receive power from the power components. The system further includes at least one DSLAM positioned in the component area of the DSLAM enclosure and an AC power supply for providing AC power to the at least one DSLAM. The AC power supply is positioned in the power area of the DSLAM enclosure.

Abstract: The invention relates to a power switch cabinet of a device for producing electric energy. The technical object of obtaining optimum scalability and cooling of a power switch cabinet despite little space being required is achieved according to the invention in that the power switch cabinet has a machine connection, a power module and a mains connection, wherein the power module has a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and the arrangement of the components substantially corresponds to the direction of the power flow.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

Abstract: The present invention relates to a battery management system for a battery module comprising a plurality of cells connected to one another which each have a positive and a negative terminal. The invention is in particular concerned with a battery management system which is used with accumulators especially lithium ion cells for forming a traction battery or a traction battery module for vehicles with an electrical drive drain. Such battery modules can for example be used in electrical vehicles, hybrid vehicles with combustion engines or hybrid vehicles with fuel cells, can however also be used for other purposes, for example for stationary applications or for small traction applications, such as for example in a wheelchair.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: An enclosure that includes a box structure that includes a plurality of sides defining a sealed chamber for containing a heat producing component. At least one of the sides of the box structure includes a panel. The panel includes two outer sheets and an inner layer of material sandwiched between the two outer sheets. The two outer sheets and the inner layer of material collectively define a plurality of fluid flow channels extending from a first end of the two outer sheets to a second end of the two outer sheets. Heat generated by the heat producing component is transferred to at least one of the outer sheets which transfers the heat to fluid flowing through the fluid flow channels. The panel can be the main load bearing path of the box structure.

Abstract: In one embodiment, a printed circuit board assembly comprises a printed circuit board including a processor, a heat sink mountable to the printed circuit board proximate the processor, and a memory module comprising logic instructions which, when executed by the processor, configure the processor to initiate a processor load routine, collect temperature gradient data during the processor load routine, and verify operation of the heat sink using the temperature gradient data.

Abstract: An electrical junction box includes a casing configured to be mounted in a vehicle, a start relay (a start electrical component) A housed in the casing and to which a current is supplied at least at a start of the vehicle, an operational electrical component (an operational relay, a connector, and a fuse connector) housed in the casing and to which a current is supplied at least during an operation of the vehicle, and a surrounding heat shield wall (a heat shield wall) disposed between the start relay and at least one of the operational relay, the connector, and the fuse connector that are the operational electrical components. The start relay includes a relay case (an electrical component case) and a terminal portion. The terminal portion is housed in the relay case and has a fixed contact and a movable contact.

Abstract: An electronic device thermal management system comprising a thermal management controller configured to maintain a temperature level within a housing of an electronic device based on a signal indicative of a temperature of at least a portion of a wall of the housing of the electronic device.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: A laptop computer support platform for resting a portable personal computer on. The computer support platform having a non-rigid base structure having one or several risers to establish an air gap between the non-rigid base and the laptop computer. The air gap acts as an insulating medium and contributes to a thermal cooling effect of the laptop computer.

Abstract: An apparatus for controlling grille aperture ratios of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining target grille air volumes of air blowing to the racks, for determining simulation air volumes of air blowing from the air transfer grilles on the basis of the target grille air volumes so that each of air of the target grille air volumes are blown to the racks, and for determining grille aperture ratios for each of the air transfer grilles on the basis of the plurality of simulation air volumes so that each of the amounts of air blowing from the air transfer grilles is replaced by each of the simulation air volumes, and a controller for controlling each of the grille aperture ratios of the air transfer grilles on the basis of each of the determined grille aperture ratios.

Abstract: A computer and a control method for smart fan thereof are provided, wherein the computer includes a processor configured to control a smart fan under an UETFI bios mode. A sensed temperature value from a temperature sensor, and a current speed value of the smart fan are acquired. A real-time temperature curve and a real-time speed curve are traced in a dynamic updating zone of a graphical interface respectively according to the current temperature and the current speed value. A first control point and a second control point, which correspond to the smart fan, are obtained via a control zone of the graphical interface. A control curve is traced in the graphical interface according to the first and second control points. The speed of the smart fan is controlled according to the control curve.

Abstract: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular housing. The customized storage container also encloses a second row of interconnector modules positioned adjacent to the first, open end of the rectangular housing. At least one air vent is positioned along a side of the rectangular housing and adjacent to a second, closed end of the rectangular housing. According to one exemplary embodiment, the storage container can comprise a single printed circuit board for supporting the first and second row of interconnector modules. In another exemplary embodiment, the storage container can comprise two printed circuit boards for supporting the first and second rows interconnector modules.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: An electric power converter has a stacked body formed by stacking a plurality of semiconductor modules and coolers, a capacitor, and positive and negative bus bars. Each of the bus bars is formed by two sheets of plate members, respectively. Each of the plate members has a body portion, a plurality of extended portions, and a plurality of terminal connecting portions. The terminal connecting portions are connected to power terminals of the semiconductor modules. The main body portion of each plate member are joined to each other so that the terminal connecting portion of the one of the plate members and the terminal connecting portion 44 of the other one of the plate member are disposed alternately in a stacking direction of the stacked body.

Abstract: A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: Magnetic fluid cooling devices and power electronic devices are disclosed. In one embodiment, a magnetic fluid cooling device includes a magnetic field generating device, a magnetic fluid chamber assembly, and a heat sink device. The magnetic field generating device includes a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device. The magnetic fluid chamber assembly defines a magnetic fluid chamber configured to receive magnetic fluid. The heat sink device includes a plurality of extending fins, and is thermally coupled to the magnetic fluid chamber assembly. Power electronic devices are also disclosed, wherein the magnetic fluid chamber may be configured as opened or closed.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: A transformable enclosure enabling increased functionality, such as storage capacity, is provided. The apparatus enables modular units to be attached to increase capacity without compromising the integrity of the overall structure. The apparatus includes a housing that contains a signal processing circuit, the housing including interfaces for coupling a plurality of removable modules to the circuit, a base coupled to the housing that supports the housing in at least two orientations. The apparatus operates in a first mechanical orientation without the plurality of removable modules coupled to the interfaces and operates in a second mechanical orientation with the plurality of removable modules coupled to the interfaces. A cooling device provides cooling for the circuit in the first mechanical orientation and the plurality of removable modules in the second mechanical orientation.

Abstract: A method for controlling a motor comprises steps of: first, determining whether a switch of a motor control circuit in an electronic system is in a first state; then, operating the motor at a fanless operation mode when a temperature inside an enclosure of the electronic system is higher than zero and lower than a first threshold temperature, wherein the rotation speed of the motor is zero rpm; operating the motor at a silent operation mode when the temperature is higher than the first threshold temperature and lower than a second threshold temperature, wherein the rotation speed of the motor is a constant rotation speed; and operating the motor at a cooling operation mode when the temperature is higher than the second threshold temperature, wherein the rotation speed of the motor is a function of the temperature and varies between the constant rotation speed and a maximum rotation speed.

Abstract: According to one embodiment, an electronic device includes: a casing comprising a display thereto, the casing being configured to house therein an electric component configured to generate heat; a wearing member configured to be wrapped around an arm of a human body to cause the casing to be worn on the arm; a plurality of electrodes configured to face, in a state that the casing is worn on an arm, a side of the arm; an impedance measurement module configured to measure impedance between two of the electrodes; and a controller configured to control the electric component so that when the impedance obtained in the impedance measurement module is lower than a threshold, an amount of the heat generated by the electric component becomes small compared with a case that the impedance is higher than the threshold.

Abstract: A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.