Abstract: An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Abstract: According to one embodiment of the present invention, there is provided an apparatus for cooling a data center. The apparatus comprises an air conditioning unit for supplying cooled air to a cold portion of a data center, an airflow measurement device for measuring a rate of bypass airflow through a segregation between the cold portion and hot portion of the data center, and outputting a bypass airflow signal indicative of the rate of bypass airflow between the cold portion and the hot portion, and a control unit arranged to receive the bypass airflow signal from the airflow measurement device and to output a control signal to a means for controlling a rate of the bypass airflow to maintain a predetermined rate of bypass airflow.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.

Abstract: An electronic device has a board, a heat producing component mounted on the board, a connector mounted on the board and allowing a module component to be fitted thereto, a chassis housing the board, and an air blower configured to cause air to flow through the chassis. Additionally, an airflow adjustment member including a guide portion is placed upstream, in a flow direction of the air, of the heat producing component and the connector, the guide portion being configured to guide part of air flowing toward a region where the connector is placed to a region where the heat producing component is placed.

Abstract: Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.

Abstract: There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, a third dual IGBT coupled to the heatsink and common to the field exciter and the battery. The electronic device also includes a temperature sensor disposed in the heatsink, a cooling unit comprising a plenum and a variable source of air flow, and a controller. The controller is configured to receive a temperature reading from the temperature sensor and, based on the temperature reading, determine a desired level of cooling for at least one of the dual IGBTs, wherein an air flow rate provided by the cooling unit is determined based on the desired level of cooling.

Abstract: An electronic device includes an enclosure, and an airflow guiding duct. The enclosure includes a bottom panel. The airflow guiding duct is pivotably mounted to the enclosure. The airflow guiding duct includes a positioning portion. The bottom panel defines a sliding slot. A positioning opening is defined in the bottom panel communicating with the sliding slot. The positioning portion is used for being driven to slide along the sliding slot to move into the positioning opening when the airflow guiding duct is rotated.

Abstract: A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Abstract: A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.

Abstract: A thermal management system for electronic devices is provided. The thermal management system includes one or more synthetic jets. The synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation. In one implementation, the synthetic jets are operated at an ultrasonic frequency.

Abstract: Disclosed is a fan module used in electronic equipment and the like. The fan module of the present invention includes a dust-collecting part which has an air’-suction port and an air-discharge port, and which has a rotational region forming a passage linking the air-suction port to the air-discharge port and has a dust-collection box for collecting dust and detritus rotating in the rotational region; and a fan which is joined to one side of the dust-collecting part and makes air flow into the rotational region. The present invention can use centrifugal force to effectively remove various forms of dust and detritus contained in the air which flows into the casings of electronic equipment, household appliances and the like due to the action of a fan. Further, since a filter is not used, there is the advantage that the cooling efficiency is not reduced by the dust collection as the smooth flow of the air being sucked in is not disturbed.

Abstract: A power converting apparatus includes a housing, a self-standing cable, and a grommet securing member. The housing includes a housing base, a main body, and an air duct. The housing base includes a through hole. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The self-standing cable is disposed through the through hole so as to be wired between the main body and the air duct. The self-standing cable stands on itself in a direction approximately orthogonal to the housing base. The grommet securing member is disposed in the air duct or the main body so as to secure a grommet to the through hole. The grommet securing member is not integral with the housing base.

Abstract: An information processing apparatus allows an operator to extract temperature adjustment electrical components accommodated in two holders through a single extraction port when changing the temperature adjustment electrical components. A second holder shares a transfer pathway between an accommodation position of a first holder and an opening portion of a chassis. When the second holder moves in the direction of the opening portion, the first holder is accordingly pushed and moved. Next, the first holder is fixed to a rotating member and is moved to a position above the chassis. After the second holder is discharged to the outside of the chassis, the first holder is returned to the original position.

Abstract: An electronic device includes a chassis, a number of electronic components, and at least one block. The at least one block is fitted between two of the electronic components. At least one air flow passage is defined under the at least one block to direct air flow to enter between the two electronic components.

Abstract: An electronic apparatus for a vehicle, includes an electronic device, a waterproof housing that receives the electronic device, and a filter. The housing has a ventilation hole that penetrates through a housing wall of the housing. The filter is attached to a filter attachment portion of the housing wall to cover the ventilation hole. A wall surface of the ventilation hole includes a slope surface section that has an increasing cross-sectional area, which progressively increases from an inner end to an outer end of the slope surface section toward an outer surface of the housing wall in a penetrating direction of the ventilation hole. Furthermore, a distance between the filter attachment portion and the outer surface is larger than that between the inner end of the slope surface section and the outer surface in the penetrating direction.

Abstract: Provided herein is an electronic display assembly for use with a housing as well as a method for assembling an electronic display assembly within a housing. The assembly preferably contains an electronic display module having an electronic display secured within a mounting frame having a top and bottom surface. Top brackets and bottom brackets may be secured to the mounting frame and then secured to the interior of the housing. A front glass assembly can also be secured to the brackets. In some embodiments the housing may contain interior hangers which correspond to hangers that are fastened to the mounting frame of the electronic display module.

Abstract: A robot control device that controls operation of a robot having an actuator includes a casing, an actuator driver, a drive-control board, a main control board, a main power supply board, a vent passage, a cooling fan, and a holding member.

Abstract: A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the rear side of which a first connector is provided, is inserted into the corresponding spatial area so as to move over a shelf from an open end [of the unit cover]; and a backboard which is disposed inside the unit cover and on which a second connector is provided in a position where the first package box, inserted in the corresponding spatial area, mates with the first connector, wherein the shelf is provided with a protrusion which rotatably supports the first package box in a fan direction.

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: An avionics module including an electronic circuit board, a case in which the circuit board is positioned and including at least one inlet orifice and at least one outlet orifice for cooling air, a first corridor for the circulation of the cooling air formed between a first face of the circuit board and a first facing wall of the case, and a second corridor for the circulation of the cooling air formed between a second face of the circuit board and a second facing wall of the case. The module includes at least one baffle for controlling the distribution of the cooling air between the first and second corridors. Preferably, the baffle is fixed to the electronic circuit board.

Abstract: A cooling structure (10A) for an electronic device includes: a housing provided with an air inlet and an air outlet; a fan; and a circuit board (2) disposed in the housing. A heat generating component (3) is mounted on one surface of the circuit board (2). A heat release member (4) having fins (45) and a heat transfer plate (41) is disposed between the one surface of the circuit board (2) and an opposite wall (12) of the housing. The heat release member (4) extends, in an arrangement direction of the fins (45), beyond both sides of the heat generating component (3). For example, in an intermediate zone, a resistant layer (8) for suppressing heat transfer from the fins (45) to the opposite wall (12) is formed between the opposite wall (12) and the fins (45).

Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.

Abstract: Provided is a storage apparatus that uses a generally-used housing and allows storage devices mounted from two sides of the housing, in which a cooling device is provided in front of the storage devices and the cooling device is configured to be movable so as to open the front side of the storage devices so that maintenance and replacement of a storage device(s) can be performed from the two sides of the housing.

Abstract: A power supply includes a main body, a fan, and a mounting bracket. The main body defines an opening therein. The mounting bracket for mounting the fan is detachably mounted to the main body to cover the opening. The fan is mounted on the mounting bracket and received in the main body through the opening.

Abstract: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot.

Abstract: A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the transport unit with air of the cooling unit to cool one or more generating devices; and a heat pipe for heat dissipation of the power electronics. At a first portion of the heat pipe, at least some of a working agent is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent is in the gas phase. In the first portion of the heat pipe, heat from the power electronics is absorbed by evaporating the working agent in the liquid phase. In the second portion of the heat pipe, heat is released to the cooling agent by condensing the working agent in the gas phase.

Abstract: Certain embodiments of the present invention provide a system for managing heat generated by electronic equipment in an electronic equipment enclosure. The electronic equipment enclosure includes a first pair of equipment rails and a second pair of equipment rails spaced apart from the first pair of equipment rails. The system includes a duct connected to the first pair of equipment rails and a bracket connected to the second pair of equipment rails and spaced apart from the duct. The duct is adapted to receive a first portion of the electronic equipment and the bracket is adapted to receive a second portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening and the second portion of the electronic equipment includes an air exhaust opening. The duct forms a barrier between the air intake opening and the air exhaust opening for separating cooled air entering the electronic equipment and heated air exiting the electronic equipment.

Abstract: An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: A printing device having ultrafine particle (UFP) emissions is disclosed which includes an UFP particle removal assembly comprising a fluid conduit having a printing device emission input and output and an other fluid input and output wherein an emission portion of the conduit is affected by the other fluid portion and communication of the other fluid through the removal assembly effects a condensation/coalescence of the UFP emissions between the emission input and output for a reduction in UFP content of printing device emissions at the printing device emission output.

Abstract: A heat-dissipating module is disposed within an electronic device. The heat-dissipating module includes at least one vibration element, a bracket, and a driving unit. The vibration element includes a working part and a free end. The bracket is connected with the working part of the at least one vibration element. The driving unit is connected with the bracket. When the driving unit drives the bracket to vibrate at a vibration frequency, the vibration element is moved with the bracket, and a resonant vibration causes the free end of the vibration element to generate a displacement, so that an airflow is generated at the free end of the vibration element to cool the electronic device.

Abstract: A display apparatus includes a driving circuit portion driving a display panel portion, in which the driving circuit portion and a power unit which supplies electric power to the driving circuit portion are arranged on the back surface side, a case housing both the driving circuit portion and the power unit with the display panel portion, a partitioning wall portion which divides a housing space of the case, a gap which is formed between the display panel portion and the partitioning wall portion, and a cooling fan which leads outside air into the gap and which is arranged on the partitioning wall portion. The driving circuit portion and the power unit are arranged on an opposite side of the partitioning wall portion against the gap. The gap is shrunk along a direction from downside to upside of the display panel portion.

Abstract: An air cooled motor controller includes a substrate and at least one inductor assembly arranged on the substrate. The at least one inductor assembly includes a outer cylindrical housing, a wound inductor core arranged within the outer cylindrical housing, and a inner cylindrical housing arranged within the wound inductor core, wherein the inner cylindrical housing defines an inner cylindrical cavity configured to transmit air, and wherein the outer cylindrical housing and the inner cylindrical housing define at least one cylindrical gap in fluid communication with the inner cylindrical cavity and configured to transmit air. The motor controller also includes at least one air source in fluid communication with the at least one cylindrical gap.

Abstract: A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.

Abstract: Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Abstract: In an electronic device, when a 48 V feed system is shifted to a 12 V feed system, in order to supply the same electric power, a current of fourth times needs to flow into a backplane. Also, in an anteroposterior intake and exhaust system, there is a need to form a ventilator through which a cooling air passes in the backplane. Further, there arises a problem that a mechanical strength is deteriorated by provision of the ventilator in the backplane. There is provided a structure in which a pinnate projection is provided on a feed bus bar, and a cooling air is applied to the feed bus bar. Also, the feed bus bar is brought into close contact with an overall surface of the backplane, and electrically and mechanically connected thereto at multiple points, to thereby perform both of cooling and the suppression of stiffness deterioration.

Abstract: An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: A fan includes, an impeller having propeller-shaped blades, a motor disposed inside of a hub to rotationally drive the impeller centered on the rotation axis, a tubular air duct forming an air passage on a periphery of the blades of the impeller and the rotation axis, wherein the rotation axis penetrates the inside of the air duct, and an exhaust outlet larger than an outer diameter of a rotation trajectory of the blades is formed on one end of the air duct, and an air flow guiding plate blocking an opening on an other end of the air duct in the rotation axis direction, a suction inlet through which the rotation axis passes being formed in approximately the center of the air flow guiding plate, wherein the blades are closer to the air flow guiding plate than the air duct.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: A switching module is for connecting a Pulse Width Modulation (PWM) device to a plurality of fans under test. The switching module includes a print circuit board (PCB), and a plurality of groups of signal connectors arranged on the PCB. Each group of signal connectors includes a first port, a second port, and a third port interconnected with each other. The first port is for connecting to a testing port of an external PWM device. The second port is for connecting one corresponding fan of the plurality of fans. The third port is for connecting an interface of a server motherboard.

Abstract: A detachable USB fan module mounting structure includes a machine case having a top opening and two guide rails at two opposite lateral sides of the top opening, a circuit board with one a USB connector accommodated in the machine case, a cover member detachably covered on the top opening of the machine case and having a coupling structure detachably coupled to the guide rails of the machine case and a bottom bracket with a fan module positioning structure to hold a USB fan module that has a power cord with a USB plug connected to the USB connector of the circuit board.

Abstract: A display apparatus including a glass plate detachably mounted to facilitate after-sales service (A/S) for repair or replacement of the glass plate and reduce A/S time is provided. The display apparatus includes a display which displays an image; a glass detachably mounted on the front surface of the display; and a pivotable holder provided at the glass to detachably mount the glass to the display.

Abstract: The invention relates to a monitoring device for sliding closures, casting tube changers or the like on a foundry ladle or a similar metallurgical vessel, wherein the device has an electronics system (4) for detecting the parameters of the monitored device that are functionally important during casting. In order to ensure trouble-free functioning of the electronics system (4), according to the invention said system is housed in a unit (3) fastened to the foundry ladle. Said unit has thermal insulation (8) and is provided with an air cooling system (10) which is operated with purified cooling air and can be electrically driven both by an energy source (15) supplied by the waste heat of the foundry ladle and by an external energy source (16).