By Specific Coating Patents (Class 361/705)
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Patent number: 8288655Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer.Type: GrantFiled: October 27, 2008Date of Patent: October 16, 2012Assignee: Industrial Technology Research InstituteInventors: Ra-Min Tain, Ming-Ji Dai
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Patent number: 8284556Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.Type: GrantFiled: April 28, 2011Date of Patent: October 9, 2012Assignee: Mitsubishi Electric CorporationInventors: Yoshitake Nishiuma, Koji Hashimoto
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Patent number: 8264841Abstract: The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.Type: GrantFiled: May 28, 2008Date of Patent: September 11, 2012Assignee: Sony CorporationInventors: Kenji Sasaki, Hidekazu Kawanishi, Yuichi Hamaguchi
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Patent number: 8259281Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.Type: GrantFiled: April 19, 2007Date of Patent: September 4, 2012Assignee: NLT Technologies, Ltd.Inventor: Kei Takahashi
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Publication number: 20120195004Abstract: Interconnected, open-celled porous or microporous polymeric foams are used for the preparation of heat transfer devices. The use of such porous polymeric foams can generate a turbulent flow within a heat exchanging liquid, thus enabling increased heat transfer to and from the fluid. The present disclosure provides devices having a heat transfer element containing a heat exchange region wherein a heat exchange fluid can be circulated through a porous polymeric foam; and method for making and using such devices.Type: ApplicationFiled: September 2, 2010Publication date: August 2, 2012Applicant: UNIVERSITY OF WASHINGTONInventor: Dustin M. Miller
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Patent number: 8194407Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.Type: GrantFiled: November 6, 2009Date of Patent: June 5, 2012Assignee: Fujitsu LimitedInventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
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Patent number: 8185166Abstract: Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.Type: GrantFiled: December 23, 2008Date of Patent: May 22, 2012Assignee: Apple Inc.Inventors: Douglas Weber, Naoto Matsuyuki, David A. Pakula, Evans Hankey
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Patent number: 8184438Abstract: A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.Type: GrantFiled: February 19, 2009Date of Patent: May 22, 2012Assignee: Hitachi, Ltd.Inventors: Yujiro Kaneko, Masahiko Asano, Hideto Yoshinari
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Publication number: 20120106085Abstract: A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate.Type: ApplicationFiled: January 27, 2010Publication date: May 3, 2012Inventors: Takao Yamazaki, Masahiko Sano, Seiji Kurashina
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Patent number: 8111516Abstract: A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.Type: GrantFiled: July 14, 2009Date of Patent: February 7, 2012Assignee: International Business Machines CorporationInventors: Gottfried A. Goldrian, Manfred Ries
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Patent number: 8076773Abstract: A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: GrantFiled: December 26, 2007Date of Patent: December 13, 2011Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Patent number: 8064203Abstract: A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer. A method for preparing the free standing film includes (a) providing an array of nanorods on a substrate, optionally (b) infiltrating the array with a sacrificial layer, (c) infiltrating the array with a matrix layer, thereby producing an infiltrated array, optionally (d) removing the sacrificial layer without removing the matrix layer, when step (b) is present, and (e) removing the infiltrated array from the substrate to form the free standing film. The free standing film is useful as an optical filter, ACF, or TIM, depending on the type and density of nanorods selected.Type: GrantFiled: January 25, 2008Date of Patent: November 22, 2011Assignee: Dow Corning CorporationInventors: Carl Fairbank, Mark Fisher
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Publication number: 20110242764Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.Type: ApplicationFiled: June 20, 2011Publication date: October 6, 2011Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Richard F. Hill, Shahi Riaz
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Publication number: 20110228481Abstract: A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together.Type: ApplicationFiled: March 19, 2010Publication date: September 22, 2011Applicant: DOMINTECH CO., LTD.Inventor: Jeff BIAR
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Publication number: 20110228482Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.Type: ApplicationFiled: June 1, 2011Publication date: September 22, 2011Applicant: APPLE INC.Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice
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Patent number: 8014152Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.Type: GrantFiled: June 8, 2009Date of Patent: September 6, 2011Assignee: Mitsubishi Electric CorporationInventors: Yoshitake Nishiuma, Koji Hashimoto
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Publication number: 20110194254Abstract: Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.Type: ApplicationFiled: April 20, 2011Publication date: August 11, 2011Inventors: Saikumar Jayaraman, Paul A. Koning, Ashay Dani
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Patent number: 7995351Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled.Type: GrantFiled: July 5, 2006Date of Patent: August 9, 2011Assignee: Gigaset Communications GmbHInventors: Georg Busch, Volker Detering, Ludger Hinken, Ralf Lorenz
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Patent number: 7995344Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.Type: GrantFiled: January 9, 2007Date of Patent: August 9, 2011Assignee: Lockheed Martin CorporationInventors: Charles H. Dando, III, Jon Larcheveque, David L. Vos
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Publication number: 20110188206Abstract: Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.Type: ApplicationFiled: February 18, 2011Publication date: August 4, 2011Inventors: Eric C. Hannah, Ralph M. Kling
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Publication number: 20110176276Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.Type: ApplicationFiled: March 29, 2011Publication date: July 21, 2011Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
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Patent number: 7980297Abstract: A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.Type: GrantFiled: September 6, 2007Date of Patent: July 19, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Dong-Yun Li, Jing Zhang, Jian Yang
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Patent number: 7978467Abstract: It is an object of the present invention to provide a key sheet and the like which can suppress local elevation of temperature, and effectively diffuse heat loss from electronic circuits. The key sheet includes: a viscoelastic sheet 16b having a viscoelastic property, and having a first surface and a second surface; a button section 16a located on the side of the first surface of the viscoelastic sheet 16b; a thermally-conductive sheet 14 located along the first surface or the second surface of the viscoelastic sheet 16b, the thermally-conductive sheet 14 having a thermal conductivity equal to a specific value; and a contact section 16d projected from the second surface of the viscoelastic sheet 16b, the contact section occupies a position corresponding to the button section 16a.Type: GrantFiled: February 5, 2007Date of Patent: July 12, 2011Assignee: Panasonic CorporationInventor: Yohei Ichikawa
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Patent number: 7969741Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.Type: GrantFiled: February 20, 2006Date of Patent: June 28, 2011Assignee: Panasonic CorporationInventors: Haruo Hayakawa, Masahiro Ono, Seiji Yamaguchi, Yoshihiro Uda, Kazuhiro Shinchi, Satoru Tomekawa, Kiyoshi Nakanishi, Kosuke Kubota, Atsushi Katagiri, Motohisa Kotani, Kazuhiro Konishi, Eiji Nishimura, Takeo Matsuki
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Patent number: 7961469Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.Type: GrantFiled: March 31, 2009Date of Patent: June 14, 2011Assignee: Apple Inc.Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
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Patent number: 7954236Abstract: A sealed thermal interface component minimizes or eliminates the exudation of fluids, such as silicone oils, while preserving the excellent thermal conductivity of silicon-based thermal pad materials and enhancing the conformability of the component. In preferred embodiments, a foam frame surrounds a plurality of thermal pad portions formed of conformable thermal management material that may exude fluid under elevated temperatures or over time. Film encapsulates the foam-framed thermal pad portions, forming a sealed and partially evacuated thermal interface component. In one embodiment of the invention, the thermal pads are formed of an elastomeric matrix material containing silicone, the foam frame is made of urethane, and the film is made of polyurethane.Type: GrantFiled: February 8, 2007Date of Patent: June 7, 2011Assignee: Lundell Manufacturing CorporationInventors: Timothy J. Lundell, Thomas L. Lundell
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Patent number: 7957137Abstract: A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.Type: GrantFiled: November 2, 2009Date of Patent: June 7, 2011Assignee: Intel CorporationInventor: Ravi Prasher
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Patent number: 7944697Abstract: Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening.Type: GrantFiled: October 8, 2009Date of Patent: May 17, 2011Assignee: Hitachi, Ltd.Inventors: Koji Hata, Hiroshi Kuwaki, Yasushi Kimura, Shinya Hamagishi, Seiji Asai
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Patent number: 7936569Abstract: In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.Type: GrantFiled: January 30, 2006Date of Patent: May 3, 2011Assignee: Sanyo Electric Co., Ltd.Inventors: Sadamichi Takakusaki, Noriaki Sakamoto, Motoichi Nezu, Yusuke Igarashi
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Patent number: 7918267Abstract: A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink.Type: GrantFiled: May 23, 2007Date of Patent: April 5, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hui Shen, Gen-Ping Deng, Yi-Qiang Wu
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Patent number: 7911795Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.Type: GrantFiled: April 8, 2008Date of Patent: March 22, 2011Assignee: Fujitsu LimitedInventor: Hideshi Tokuhira
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Publication number: 20110063801Abstract: An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for preventing heat generated by the heat source from directly transmitting toward the enclosure, and a space being formed between the heat insulating plate and the enclosure. The heat insulating structure further includes a thermal conductive layer disposed on a side of the heat insulating plate facing to the heat source. The heat insulating structure further includes the thermal conductive layer disposed on a side of the heat insulating plate facing to the enclosure. Therefore, the heat insulating plate can be for altering heat current generated by the heat source so as to dissipate the heat current via holes on the enclosure uniformly.Type: ApplicationFiled: September 14, 2009Publication date: March 17, 2011Inventors: Li-Tang Lin, Ming-Cheng Hsieh
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Patent number: 7907410Abstract: The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid.Type: GrantFiled: November 8, 2007Date of Patent: March 15, 2011Assignee: International Business Machines CorporationInventors: Yves C. Martin, Theodore G. Van Kessel
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Publication number: 20100320187Abstract: An apparatus for dissipating heat from and providing heat to electronic components includes a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module, and a heating member embedded in the thermally conductive member.Type: ApplicationFiled: June 17, 2009Publication date: December 23, 2010Applicant: DRS TEST & ENERGY MANAGEMENT, LLCInventors: David Griffin, Jeff Kusibab, Glen Dace
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Publication number: 20100309631Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.Type: ApplicationFiled: June 5, 2009Publication date: December 9, 2010Applicant: Laird Technologies, Inc.Inventors: Richard F. Hill, Shahi Riaz
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Publication number: 20100296253Abstract: A method of depositing a carbon particle-containing film that contains carbon particles includes: manufacturing film deposition slurry by mixing liquid into film deposition powder that contains carbon powder formed of the carbon particles; and depositing the carbon particle-containing film by spraying the film deposition slurry to a surface of a base material so that the liquid is vaporized.Type: ApplicationFiled: May 12, 2010Publication date: November 25, 2010Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Noritaka Miyamoto, Yoshihiko Tsuzuki, Tomoko Kozaki
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Patent number: 7838988Abstract: A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.Type: GrantFiled: August 19, 2009Date of Patent: November 23, 2010Assignee: Texas Instruments IncorporatedInventors: Siva Prakash Gurrum, Kapil Heramb Sahasrabudhe, Vikas Gupta
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Patent number: 7812487Abstract: Taught herein is a controller for a DC brushless motor comprising a control board (3) and a housing (4); wherein the control board (3) is disposed in the housing (4), and the housing (4) is made of metal materials with good thermal conductivity; a plurality of heat sinks (5) are disposed at the bottom of the housing (4), thereby heat generated by the control board (3) will be dissipated fast, and the operating temperature and failure rates are reduced; an integrated power module chip (7) disposed at the bottom of the control board (3) transfers heat to the housing (4) via an insulating heat sink (8), and in doing so prevents electric leakage; the purpose of a plurality of gaps (9) disposed at the top of the housing (4) is to provide ventilation, and to dissipate heat fast; all of these design characteristics make the invention simple in structure, and convenient for mass assembly.Type: GrantFiled: May 28, 2007Date of Patent: October 12, 2010Assignee: Zhongshan Broad-Ocean Motor Co., Ltd.Inventors: Ronghua Bi, Maosen Zeng, Jianwei Jin, Songfa Tang
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Patent number: 7813132Abstract: A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.Type: GrantFiled: October 10, 2008Date of Patent: October 12, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Zhi-Yong Zhou, Ji-Yun Qin, Xiao-Jian He
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Publication number: 20100254092Abstract: Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.Type: ApplicationFiled: April 1, 2009Publication date: October 7, 2010Inventors: Xiaopeng Dong, Mark MacDonald
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Patent number: 7808099Abstract: A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment of the method includes mixing a crosslinker with a linearly structured polymer to form a mixture, wherein the crosslinker includes a base agent including a vinyl-terminated or branched polydimethylsiloxane, and a curing agent including a hydrogen-terminated polydimethylsiloxane; and curing the mixture. The crosslinker functions as cages to block linear or branched linear macromolecules and prevents them from sliding into each other, thus increasing surface tension of the resulting LTI.Type: GrantFiled: May 6, 2008Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Randall J. Bertrand, Mark S. Chace, David L. Gardell, George J. Lawson, Yvonne Morris, Charles L. Reynolds, Jiali Wu
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Publication number: 20100246133Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.Type: ApplicationFiled: March 31, 2009Publication date: September 30, 2010Applicant: APPLE INC.Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice
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Patent number: 7781682Abstract: Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface material is placed on a top surface of a high power die disposed on the substrate, and then an integrated heat spreader lid is placed on top of the sealant and on top of the thermal interface material. A molding compound is flowed within an integrated heat spreader cavity through the opening directly on a top surface of a low power die disposed on the substrate.Type: GrantFiled: March 31, 2008Date of Patent: August 24, 2010Assignee: Intel CorporationInventors: Raj Bahadur, Marcos Valles, Matthew J. Graunke
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Patent number: 7782619Abstract: A heat sink protective cover includes a main body, on which at least one receiving space is defined for receiving a heat sink therein. The receiving space includes at least one positioning section and a dust-proof section. The positioning section is located at two opposite inner wall surfaces of the receiving space. The dust-proof section includes a raised portion and a recess portion, the raised portion is extended along a periphery of the dust-proof section to limit the recess portion on four sides thereof, and the dust-proof section is located on a bottom of the receiving space. The heat sink is stably hold in place in the receiving space by the positioning section and isolated from dust by the dust-proof section, and can therefore be effectively protected against collision, damage, and contamination while being transported.Type: GrantFiled: January 15, 2009Date of Patent: August 24, 2010Assignee: Asia Vital Components Co., Ltd.Inventor: Wen-Ji Lan
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Patent number: 7779529Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.Type: GrantFiled: November 20, 2008Date of Patent: August 24, 2010Assignee: Raytheon CompanyInventors: Alfred Sorvino, Hilario Tejeda, Randy Thompson
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Patent number: 7764494Abstract: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.Type: GrantFiled: November 20, 2007Date of Patent: July 27, 2010Assignee: Basic Electronics, Inc.Inventor: Alfiero Balzano
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Patent number: 7760504Abstract: An apparatus, system, and method are disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the system includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a system would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the system would be modular, reusable, and easy to install or replace without a significant mess.Type: GrantFiled: August 5, 2008Date of Patent: July 20, 2010Assignee: International Business Machines CorporationInventors: Timothy S. Farrow, Dean F. Herring
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Information handling systems having coatings with porous particles and processes of forming the same
Patent number: 7729108Abstract: Particles having a relatively high porosity can be used in an information handling system or other information handling system. In one aspect, a portable information handling system can include an electrical circuit that can generate thermal energy during normal operation of the electrical circuit. The portable information handling system can also include a housing that includes a first material and particles having a porosity of at least 80%. In another aspect, an information handling system can include a housing that includes a material and a coating, wherein the coating includes a polymeric material and particles having a porosity of at least 80%. In another aspect, a process of forming an information handling system can include coating a surface of a housing, wherein the coating includes particles having a porosity of at least 80%, and placing an electrical circuit within the housing after coating the surface.Type: GrantFiled: December 11, 2007Date of Patent: June 1, 2010Assignee: Dell Products, LPInventors: Mark L. Rehmann, Michael M. Heatly -
Patent number: 7728440Abstract: A semiconductor device includes: a semiconductor chip mounted on a mounting substrate; a first resin filling a gap between the chip and the substrate; a frame-shaped stiffener surrounding the chip; a first adhesive for bonding the stiffener to the substrate; a lid for covering the stiffener and an area surrounded by the stiffener; and a second resin filling a space between the stiffener and the chip. A thermal expansion coefficient of the second resin is smaller than that of the first resin. The first resin includes an underfill part filling a gap between the chip and the substrate and a fillet part extended from the chip region.Type: GrantFiled: January 23, 2004Date of Patent: June 1, 2010Assignee: NEC Electronics CorporationInventor: Hirokazu Honda
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Patent number: 7723845Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: GrantFiled: October 31, 2007Date of Patent: May 25, 2010Assignee: University of CincinnatiInventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis