Abstract: A support system for an electrical device arranges the plurality of heat-sink assemblies in an orientation that allows the forces associated with an electrical fault that are transferred to the support structure to be reduced. The arrangement allows the electrical fault forces to cancel one another out such that the resulting net force applied to the support structure is significantly reduced. The size, strength and/or robustness of the support system can be reduced as the forces transmitted thereto are greatly reduced. The heat-sink assemblies can be arranged to facilitate ease of maintenance by allowing the heat-sink assemblies to be removed from a front access panel of the electrical device.

Abstract: An exemplary thermal protection system includes a body having a first surface, at least one stationary thermal member disposed at least partially proximate the first surface and at least one heat producing device. An aperture, defined by at least one exterior edge can penetrate both the body and the stationary thermal member. At least a portion of the heat producing device can be disposed proximate the aperture. A moveable thermal member translatable between a first position and a second position, can be disposed proximate the stationary thermal member, the aperture, and the heat producing device when in the first position. When in the first position, a first portion of the moveable thermal member can overlap at least a portion of the stationary thermal member. When in the second position, the moveable thermal member can be disposed distal to the aperture and the at least one heat producing device.

Abstract: A novel personal electronic device includes a first (embedded) and second (non-embedded) processors including associated operating systems and functions. In one aspect, the first processor performs relatively limited functions, while the second processor performs relatively broader functions under control of the first processor. Often the second processor requires more power than the first processor and is selectively operated by the first processor to minimize overall power consumption. Protocols for functions to be performed by the second processor may be provided directly to the second processor and processed by the second processor. In another aspect, a display controller is designed to interface with both processors. In another aspect, the operating systems work with one another. In another aspect, the first processor employs a thermal control program. Advantages of the invention include a broad array of functions performed by a relatively small personal electronics device.

Abstract: An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.

Abstract: Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.

Abstract: An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks.

Abstract: A flange (3) for sealing an opening (1) of a fuel container (2) of a motor vehicle maintains an electronic component (9) which is arranged on the external side (5) on a carrier (12). The carrier (12) is embodied as a single piece and has a heat-conducting element (13) which can penetrate the wall (4) of a flange (3). The heat-conducting element (13) dissipates the heat which is produced by the electronic component (9) to the inside (7) of the fuel container (2).

Abstract: An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.

Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.

Abstract: Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.

Abstract: A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A transit container, such as a rack-mount style container, includes a temperature control system for maintaining a desired temperature within the container such that any cargo within the container remains operational at selected times and possibly in selected locations. The temperature control system includes support or mounting brackets, a temperature control assembly, shock isolation devices for shock attenuation of the temperature control assembly, exhaust assemblies that include exhaust fans and exhaust/intake louvers, and a mounting plate attachable to a lid of the transit container. The temperature control assembly and the aforementioned components may be arranged to have a low-height profile or envelope, which in turn permits the temperature control system to be located in a cavity or chamber of the lid.

Abstract: A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.

Abstract: The present invention relates to a package comprising a plate formed from a diamond-composite material and a frame and its use as a lid or cavity lid in electronic packaging applications.

Abstract: An integrated driving recorder (1) in which trouble due to a temperature rise in a vehicle interior can be avoided. The driving recorder (1) has one or more detection means for sensing conditions of the behavior of the vehicle, surrounding conditions, etc. and outputting data indicating the conditions, and also has a condition data storage section for storing the condition data outputted from the detection means. Both means are held in a single casing (2). A heat radiation region (2a) is formed on the casing (2), and a heat conduction member (9) is provided on the casing. The heat conduction member (9) is connected at one surface to the heat radiation region (2a) and exhibits predetermined thermal conductivity. The other surface can be bonded to the window glass (W) of the vehicle.

Abstract: A thermally dissipative housing (200) includes a rigid housing (203) and a compliant heat spreader (215). The compliant heat spreader (215) is thermally coupled to a heat-generating component (201) disposed within the thermally dissipative housing (200). The compliant heat spreader (215) removes heat from the heat-generating component (201) and transfers it along an interior surface of the rigid housing (203) by passing along an interior (209) of the rigid housing (203) across at least a portion of the interior surface area (211) of the rigid housing (203). The compliant heat spreader (215) transfers heat to the surface of the rigid housing (203) without substantially interfering with the shock absorbing properties of the rigid housing (203).

Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.

Abstract: Particles having a relatively high porosity can be used in an information handling system or other information handling system. In one aspect, a portable information handling system can include an electrical circuit that can generate thermal energy during normal operation of the electrical circuit. The portable information handling system can also include a housing that includes a first material and particles having a porosity of at least 80%. In another aspect, an information handling system can include a housing that includes a material and a coating, wherein the coating includes a polymeric material and particles having a porosity of at least 80%. In another aspect, a process of forming an information handling system can include coating a surface of a housing, wherein the coating includes particles having a porosity of at least 80%, and placing an electrical circuit within the housing after coating the surface.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: An upper lid forming an upper portion of a casing is formed by a metal (an aluminum alloy or the like) having a high heat radiation performance. The upper lid serves as a heat sink (a heat radiation member) radiating heat generated from electronic components within the casing to an external portion. A plurality of flat plate-shaped heat radiation fins are provided in an upper surface of the heat sink. A groove forming each of the heat radiation fins is open in a side surface of the heat sink without forming a step.

Abstract: The invention relates to an inverter casing, said inverter casing comprising in the bottom at least one depression for receiving heat dissipating electric components, coils in particular.

Abstract: A heat dissipating device for an electronic apparatus includes an enclosure that houses a component of the electronic apparatus which becomes hot when the electronic apparatus is in use, the enclosure being made of a heat conductive material capable of dissipating heat in the enclosure to the outside, a heat receiving member provided between the component and the enclosure and capable of receiving heat from the component and transferring the received heat, a heat insulating member provided in contact with a side of the heat receiving member opposite from the component and configured to prevent transmission of the heat received by the heat receiving member, and a heat diffusing member provided between the heat insulating member and the enclosure in contact with both the heat insulating member and the enclosure and capable of receiving heat from the heat insulating member and diffusing the received heat into the enclosure.

Abstract: An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.

Abstract: An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.

Abstract: A liquid crystal display module for preventing noise caused by friction between a support main and a light guide plate is provided. In the module, a hole is defined at a support main having at least one of a polygonal shape or a circular shape. A light guide plate is disposed on the support main. A protrusion which protrudes from a side surface of the light guide plate is inserted into the hole. The protrusion has at least one of said polygonal shapes and said circular shape.

Abstract: An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided.

Abstract: An electronic apparatus of the present invention includes a radiation rubber. The radiation rubber is brought into firm contact with both a frame of an air-cooling fan unit and a housing of the electronic apparatus such as a notebook personal computer. The heat of a fan unit is transferred to the housing through the radiation rubber, and the housing is utilized as a radiator.

Abstract: a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.

Abstract: An electric power storage unit includes plural storage element blocks, an external bus bar for electrically connecting the storage element blocks, a base made of metal for fixing the storage element blocks, and a cover fixed to the base for accommodating the storage element blocks. Each of the storage element blocks includes plural electric power storage elements connected electrically to each other, and a case made of heat-conductive insulating resin for holding the electric power storage elements. This electric power storage unit reduces variation of cooling of the electric power storage elements, hence having high reliability.

Abstract: The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: Featured is a controller for a motor that is ultra-compact, with a power density of at least about 20 watts per cubic cm (W/cm3). The controller utilizes a common ground for power circuitry, which energizes the windings of the motor, and the signal circuitry, which controls this energization responsive to signals from one or more sensors. Also, the ground is held at a stable potential without galvanic isolation. The circuits, their components and connectors are sized and located to minimize their inductance and heat is dissipated by conduction to the controller's exterior such as by a thermally conductive and electrically insulating material (e.g., potable epoxy). The controller uses a single current sensor for plural windings and preferably a single heat sensor within the controller. The body of the controller can also function as the sole plug connector.

Abstract: To provide an electric power steering apparatus in which it is possible to minimize a connection distance between a control unit and an electric motor and surely prevent electric noise from mixing between the control unit and the electric motor as well as to minimize electric resistance and minimize an electric loss by directly connecting the control unit and connection terminals of the electric motor and a torque sensor. A motor control apparatus includes a steering column 3 having inserted therein a steering shaft 2 to which steering torque is transmitted, a reduction gear box 4 coupled to the steering shaft 2, and an electric motor 5 that transmits a steering assisting force to the steering shaft 2 via a reduction mechanism in the reduction gear box 4.

Abstract: Featured is a controller for a motor that is ultra-compact, with a power density of at least about 20 watts per cubic cm (W/cm3). The controller utilizes a common ground for power circuitry, which energizes the windings of the motor, and the signal circuitry, which controls this energization responsive to signals from one or more sensors. Also, the ground is held at a stable potential without galvanic isolation. The circuits, their components and connectors are sized and located to minimize their inductance and heat is dissipated by conduction to the controller's exterior such as by a thermally conductive and electrically insulating material (e.g., potable epoxy). The controller uses a single current sensor for plural windings and preferably a single heat sensor within the controller. The body of the controller can also function as the sole plug connector.

Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.

Abstract: A portable electronic device includes a cover (10), a container (20) and a heater (40). The container is provided on the cover. The heater includes some exothermic materials. The heater is received in the container.

Abstract: A light source module includes at least a light source and a housing. The housing includes a base having a slanted reflective surface, a plurality of sidewalls extending out of a peripheral of the base cooperatively defining an opening with the base, the sidewall aligned with a trough of the slanted reflective surface having an inner surface and an outer surface opposite to the inner surface, and a plurality of fin structures formed on the outer surface of the sidewall. The light source is fixed on the inner surface of the sidewall. Light rays emitted from the light source being reflected at the slanted reflective surface toward the opening. A backlight system using the light source module is also provided. The present backlight system has a good heat dissipation capability due to an employment of the present light source module, and can be configured to be a thin body.

Abstract: A scanning apparatus with heat dissipating ability includes a housing having an opening formed thereon. A cover having a slit, a heating dissipating portion, and supporting portion connected to the heat dissipating portion covers the opening, wherein the supporting portion extends from an edge of the slit into the housing. A light emitting elements is fixed on the supporting portion, for emitting a scanning light through the slit, and the scanning light is reflected as an image light by a document. The image light is converted to image data by an image scanning module. The heat dissipating portion is made of a thermal conductive material to exchange heat with the air, so that heat generated by the light emitting elements is transferred to the heat dissipating portion and the heat is dissipated to the air, the work temperature of the light emitting elements is controlled at an optimal temperature.

Abstract: A driving circuit module assembly includes a driving circuit module and a heat sink assembly to receive and cool the driving circuit module. The heat sink assembly includes a hollow heat sink, a cover abutting against a top portion of heat sink, and a base abutting against a bottom portion of the heat sink. The driving circuit module is mounted on the base and thermally connects therewith, whereby heat generated by the driving circuit module is transferred to the heat sink via the base. A plurality of screws extends through the cover, grooves in an outer surface of the heat sink and the base to threadedly engage with nuts thereby assembling the driving circuit module assembly together.

Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.

Abstract: An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting feature. At least one electrical component is in thermal contact with a portion of the at least one heat sink.

Abstract: A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.

Abstract: A disclosed information processing apparatus includes a central processing unit; a substrate on which the central processing unit is mounted; a housing configured to form a space for accommodating the substrate; and a dividing member configured to divide the space into a first space for accommodating the substrate and a second space other than the first space.

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.