Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

Abstract: A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.

Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.

Abstract: A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.

Abstract: A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

Abstract: The present disclosure relates, in some embodiments, to modular information handling systems configured to automatically adjust coolant flow upon insertion and/or removal of heat-releasing elements (e.g., blades). A system may comprise, for example, a chassis at least partially defining a cavity, at least one fan in fluid communication with the cavity and operable to move coolant through at least a portion of the cavity, and one or more bays. Each of the one or more bays (a) may be at least partially defined by a bay wall, (b) may be configured to receive a heat-releasing element, and/or (c) may comprise an obturator configured to conditionally block fluid communication between the bay and the chassis cavity, the fan, and/or a coolant, wherein the obturator allows fluid communication when a blade is present in the bay and blocks fluid communication when a blade is absent from the bay. A system may further comprise at least one heat-releasing element positioned in at least one of the one or more bays.

Abstract: The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A mounting apparatus for mounting an expansion card to a printed circuit board (PCB), includes a connector on the PCB, and a latch member pivotably connected to the connector. The connector defines a slot to receive the expansion card. The latch member is a rectangular wire frame comprising a lock portion, two connection arms extending down from the lock portion, and two pivot portions extending from distal ends of the connection arms toward each other. The pivot portions are pivotably attached to two sidewalls of the connector. After the expansion card is plugged into the slot of the connector, the latch member is pivoted to make the lock portion press against a portion of the expansion card, thereby locking the expansion card to the connector.

Abstract: A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. At least one of the fins to which the computer systems are coupled extends from the base module such that the fin has a primarily vertical orientation. An electrical power bus in the base module supplies power to computer systems of the fin modules. The site of operation may be indoors, out of doors, or in a limited shelter.

Abstract: A computer system is disclosed having an enclosure having a plurality of components. The computer system further includes a first chamber including a first set of cooling devices; and a second chamber including solely a set of components and a second set of cooling devices. The second chamber is located adjacent to the first chamber, and the set of components includes components not included in the first chamber. The set of components includes solely a plurality of storage components selected from the group consisting of a CD-ROM and a hard drive. Air flow is unidirectional from a front side of the enclosure to a rear side of the enclosure. Further, air flow is prevented from flowing between the first chamber and the second chamber by a solid separation mechanism there between. The first chamber has an air flow path independent of the air flow path of the second chamber.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.

Abstract: Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

Abstract: A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Abstract: The present invention relates to an electric vehicle and a method of cooling a vehicular DC/DC converter. A fuel cell vehicle, as one example of an electric vehicle, includes a DC/DC converter connected between an electricity storage device and a fuel cell for converting a voltage generated by the electricity storage device and applying the converted voltage to a motor, and converting a regenerated voltage produced by the motor in a regenerative mode or a voltage generated by the fuel cell and applying the converted voltage to the electricity storage device, and a cooling apparatus for cooling the DC/DC converter. The cooling apparatus includes a cooling fluid passage therein for a cooling fluid that flows therethrough, the cooling fluid passage including a bend. The cooling apparatus is constructed such that the cooling fluid flowing upstream of the bend cools upper arm devices, while the cooling fluid flowing downstream of the bend cools lower arm devices.

Abstract: An electric unit, having at least one cooler structure and at least one electric module with at least one electric element on a metal-ceramic substrate.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.

Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Abstract: A server of a computer server system includes an enclosure and a fan module located outside the enclosure. The enclosure includes a sidewall defining a plurality of ventilating holes therein. The fan module includes a tray and a fan mounted on the tray. The fan module is pivotally mounted relative to the sidewall of the enclosure, and the fan module is capable of being pivoted from a horizontal state to a vertical state relative to the server.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.

Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Abstract: Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.

Abstract: A system including plural storage devices provides a technique for controlling storage devices in which files are located by a file system, and turning on or off the storage devices based on prediction of the start or end of access to the files. A program that manages power to the storage devices and data access to the storage devices via the files includes means or functions for allocating a storage device as an area in which a file is located, for selecting a storage device in which a file is located, for predicting that access to a file is started for commanding turning on power to a storage device based on the prediction that access to a file is started, for predicting that access to a file terminates, and for commanding turning off power to a storage device based on the prediction that access to a file terminates.

Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.

Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.

Abstract: A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a local area of the interior space. The plurality of power taps, the plurality of supply taps, and the plurality of return taps can be divided into a plurality of zones, with taps of each zone are configured to be controllably coupled to a power source or a coolant source independently of the taps of other zones. The taps can be positioned along paths, and paths of the power taps can be spaced from associated proximate paths of supply and return taps by a substantially uniform distance along a substantial length of the first path.

Abstract: Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner.

Abstract: A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.

Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.

Abstract: A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.