Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Abstract: A connection device is provided connecting an electronic component that is arranged on a carrier to a housing part. The connection device has a first bush for receiving a first fastening unit which is used to fasten the connection device to the carrier and a second bush for receiving a second fastening unit for fastening the connection device to the housing part. The first bush is thermally insulated from the second bush. A controller has an electronic component which is arranged on the carrier and which is connected or can be connected to the housing part by use of such a connection device.

Abstract: A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

Abstract: Aspects of state estimation for cooperative electrical grids are disclosed. State estimation of a local electrical grid can be based on a local grid model and local electrical grid information. The local state estimation can reflect interactions and interconnections with other electrical grids by determining state estimation solution information based on the local grid model, local electrical grid information, and remote state estimator solution information associated with the other electrical grid. As such, a local state estimator can be configured to receive and employ remote state estimator solution information. This can be in addition to the more conventional technique or receiving a remote grid model and remote electrical grid information to estimate the conditions of the remote electrical grid. Further, state estimation solution information can be incremental to further reduce the amount of information to be transferred and the time needed to accomplish transmission of the information.

Abstract: Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.

Abstract: A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.

Abstract: An electronic assembly can include a support structure, a circuit substrate coupled to a first portion of the support structure, and a composite material panel coupled to a second portion of the support structure. An electronic device can be coupled to a mounting surface of the circuit substrate and disposed within a space enclosed by walls of the support structure. The panel can include contiguous sections inner surfaces of which can be oriented within twenty-five degrees of parallel to said mounting surface. Each section can be significantly more thermally conductive generally parallel to the inner surface of the section than generally perpendicular to the inner surface.

Abstract: The present invention provides a curvature adjustment structure of a curved liquid crystal display device, which includes: a backplane (1) and at least one bracing assembly (3) fixedly mounted to the backplane (1). Each bracing assembly (3) includes a first bracing member (31) in contact engagement with the backplane (1), a second bracing member (33) opposite to the first bracing member (31) and distant from the backplane (1), and a cooling chip array (35) arranged between the first and second bracing members (31, 33). The cooling chip array (35) includes a plurality of cooling chips (2). Each of the cooling chips (2) includes a heat absorption surface (22) and an opposite heat dissipation surface (24).

Abstract: A portable terminal is provided. The portable terminal includes a mounting member configured to be capable of being attached to/detached from a housing of the portable terminal, a connection member configured to extend from the mounting member and to selectively enclose at least a part of the housing, and a cover element connected to an end of the connection member to open/close a display device installed on the front surface of the housing. The portable terminal provided with the protection cover has an advantage in that the increase of the thickness of the terminal can be minimized because the protection cover may be disposed on a side surface or an edge of the rear surface of the housing by the mounting member.

Abstract: A bus bar includes a bus bar body and a spacer provided on the bus bar body, the spacer being an insulator. The bus bar body includes a through hole portion that allows a part of a fixing member for fixing the bus bar body to be inserted therethrough. The spacer includes a head portion and a body portion extending therefrom. When the spacer is provided on the bus bar body, the head portion covers at least part of a peripheral edge region of an end opening of the through hole and the body portion covers an inner peripheral surface of the through hole portion. An outer peripheral surface of the body portion of the spacer is fixedly adhered to the inner peripheral surface of the through hole portion so that resistance occurs when the spacer moves toward the head portion side relative to the bus bar body.

Abstract: A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.

Abstract: A cooling structure for light emitting elements for a liquid crystal panel according to the present invention includes: a long-shaped substrate that is disposed so as to extend along an edge of a light guide plate provided on a rear surface of a liquid crystal panel, and in which a plurality of through-holes are formed; a plurality of light emitting elements that are disposed on a front surface of the substrate so as to face the light guide plate; and a chassis that is provided at a rear surface side of the substrate, and the through-holes are arranged at a higher density at a center portion of the substrate in a long direction than at end portions of the substrate in the long direction.

Abstract: A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.

Abstract: A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Abstract: A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.

Abstract: An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating component is disposed on the circuit board. The electromagnetic wave shielding module includes a plurality of conductive components and a heat dissipating component. The conductive components are disposed on the circuit and electrically connected to the ground plane, wherein the conductive components are arranged with intervals and surround the heat generating component. The heat dissipation component is disposed on the heat generating component and connected to the conductive components, wherein the heat dissipating component covers and contacts with the heat generating component to dissipate heat from the heat generating component and shield an electromagnetic wave generated by the heat generating component, and the electromagnetic wave is transmitted to the ground plane and drained through the conductive components.

Abstract: A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

Abstract: A chip heat dissipation structure and a liquid crystal display having thereof are provided. The chip heat dissipation structure includes a metal heat dissipation member contacted with a chip. The metal heat dissipation member is connected to a metal protection cover of a printed circuit board. The metal heat dissipation member is perpendicular to the metal protection cover. The present invention also relates to a liquid crystal display. The chip heat dissipation structure and a liquid crystal display having thereof of the present invention have a good heat dissipation effect.

Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.

Abstract: In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features.

Abstract: Disclosed is a display device having reduced noise during curvature varying. The display device includes a display module configured to display an image and a curvature varier configured to change a shape of the display module to a plane shape or a curvature shape with respect to a front surface of the display module. The curvature varier changes the shape of the display module to the plane shape or the curvature shape according to a shape change caused by a temperature.

Abstract: An article of manufacture comprises a composite, layered, and compressible TIM differentially adhered to a heat-spreader surface and a heat-source surface, such as a circuit card, where at least one of the surfaces comprises an uneven surface, and the TIM is compressively bonded to the uneven surface. The adhesive strength of the TIM to the heat-spreader surface is unequal to the adhesive strength of the TIM to the heat-source surface, and is adjusted so that the heat-spreader surface and the heat-source surface can be separated without damaging the heat-source surface. A process comprises manufacturing the article of manufacture.

Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

Abstract: A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.

Abstract: An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.

Abstract: A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.

Abstract: A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber.

Abstract: An electronic device includes a housing defining an opening, a circuit board mounted in the housing, and a cover capable of conducting heat and covering the opening. An element and a hollow partition portion receiving the element are mounted on the circuit board. The cover includes a block formed on an inner surface of the cover. The block enters the partition portion and contacts the element.

Abstract: A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically conductive material. The printed circuit board has at least one layer composed of electrically conductive material. The heat sink and the printed circuit board serve as screening elements.

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.

Abstract: An electronic device includes a circuit board, a connector and an electronic module. The connector includes an insulating body and a first terminal set. The insulating body includes a concave. The first terminal set is fastened on the insulating body and is electrically connected to the circuit board. The electronic module is detachably disposed in the concave and includes a second terminal set. The second terminal set contacts the first terminal set to be electrically connected to the circuit board.

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: A device includes a printed circuit assembly (PCA) including a printed circuit board and at least one electronic component integrated with the printed circuit board, and a support to which the PCA is securable. At least one of the PCA and the support includes engaging structure elements, and some engaging structure elements are configured to secure the PCA to the support while other engaging structure elements are configured to secure the support to a securing structure within a housing of an electronic device.

Abstract: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.

Abstract: A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one heat dissipating hole, and at least one thermally conductive material. The electronic elements are disposed on the top surface of the PCB. Each of the at least one heat dissipating hole is formed through the top and bottom surfaces of the PCB and aligns with one of the electronic elements. Each of the at least one thermally conductive material is disposed in the corresponding heat dissipating hole and in contact with the corresponding electronic element. The heat dissipating device is attached to the bottom surface of the PCB and in contact with the at least one thermally conductive material. With a high thermal conductivity, the at least one thermally conductive material rapidly transfers the waste heat produced by the PCB in operation to the heat dissipating device for heat dissipation.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.

Abstract: An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.

Abstract: A motor controller comprising multiple types of interfaces assigned automatically, including a mother circuit board and a daughter circuit board. The daughter circuit board is plugged into the mother circuit board to form electric connection. The mother circuit board has a power circuit, a microprocessor unit of the mother circuit board, a rotor position sensing unit, a power inverter unit, and an analog sensing unit. The daughter circuit board includes a signal interface circuit. The mother circuit board further has a serial digital communication unit. The signal interface circuit includes a microprocessor of the daughter circuit board, and a serial digital communication unit of the daughter circuit board. The microprocessor unit of the mother circuit board communicates with the microprocessor of the daughter circuit board via the serial digital communication unit of the mother circuit board and the serial digital communication unit of the daughter circuit board.

Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.

Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).

Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.