Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.
Type:
Grant
Filed:
October 26, 2016
Date of Patent:
November 6, 2018
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Han Hong Lee, Jae Hong Park, Jung Hyun Woo, Sung Woo Joo, Chang Hoon Han
Abstract: According to an embodiment, an implantable medical device is disclosed. The device includes a sealed housing enclosing an electronic circuitry, a plurality of feedthrough conductors, each conductor of the plurality of feedthrough conductors includes a proximal end part connected to the enclosed electronic circuitry and a distal end part available external to the housing. The device further includes a plurality of spatially separated feedthrough connectors configured to provide terminal connections, away from the plurality of feedthrough conductors, for a plurality of electrical wires. Each connector of the plurality of spatially separated feedthrough connectors includes a first end section adapted to be connected with the distal end part of a feedthrough conductor of the plurality of feedthrough conductors and a second end section adapted to be connected with one of the plurality of electrical wires.
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dicing channels used in the singulatation process of interposers and methods of manufacture. The structure includes: one or more redistribution layers; a glass interposer connected to the one or more redistribution layers; a channel formed through the one or more redistribution layers and the glass interposer core, forming a dicing channel; and polymer material conformally filling the channel.
Type:
Grant
Filed:
January 29, 2016
Date of Patent:
October 2, 2018
Assignee:
GLOBALFOUNDRIES INC.
Inventors:
Brittany L. Hedrick, Vijay Sukumaran, Christopher L. Tessler, Richard F. Indyk, Sarah H. Knickerbocker
Abstract: A bottom package includes a molding compound, a buffer layer over and contacting the molding compound, and a through-via penetrating through the molding compound. A device die is molded in the molding compound. A guiding trench extends from a top surface of the buffer layer into the buffer layer, wherein the guiding trench is misaligned with the device die.
Abstract: One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.
Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.
Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.
Abstract: A die device includes a die including an active layer; and an interconnect feature configured for electrical connection of the active layer, wherein the interconnect feature is in contact with a substrate in the die; and a bump, independent of the die, configured for electrical connection of the active layer.
Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
Abstract: A device with waterproof structure includes a case, a waterproof cover, and a fixed element. The case has an opening and a waterproof wall surrounding the opening. The waterproof cover is screwed to the case and is selectively covered or moved away from the opening. The fixed element includes a fixed portion and a waterproof plate. The waterproof plate covers the outer edge and one side surface of the fixed portion. The fixed element is detachably disposed to the waterproof cover through the fixed portion. When the waterproof cover covers on the opening, the outer edge of the waterproof plate is close contacted to the waterproof wall. Therefore, using the waterproof plate which could close contact to the waterproof wall to replace the O-ring also could achieve the purpose of waterproofing.
Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
Type:
Grant
Filed:
March 2, 2017
Date of Patent:
July 31, 2018
Assignee:
Amkor Technology, Inc.
Inventors:
Hee Sung Kim, Yeoung Beom Ko, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim
Abstract: A printed circuit board (PCB) module that includes a processor package, an upper PCB and a lower PCB. The processor package includes a processor substrate and a processor. An upper socket is disposed on a lower surface of the upper PCB, and the upper socket electrically connects to a top electrical interface on the upper surface of the processor substrate. The lower PCB electrically interfaces with a bottom electrical interface on a lower surface of the processor substrate.
Abstract: A module retracting type installing and uninstalling device, including a base, a slide block, a pressing cover and a bail. The slide block includes a long-strip-shaped slide block base body, and U-shaped grooves are respectively formed in the middle part of two side walls of the slide block base body. A square hole is formed at the rear end of the slide block base body, and is sheathed onto a triangular lock catch of the base. First and second rotating shafts of the bail are respectively located in two snapping grooves at the front end of the base, and third and fourth rotating shafts are respectively located in the U-shaped grooves. The pressing cover includes a square pressing cover base body, and a pressure resilient sheet attached to the upper surface of the slide block and being pressed to the base.
Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
Type:
Grant
Filed:
April 19, 2016
Date of Patent:
February 27, 2018
Assignee:
Virident Systems, LLC
Inventors:
Ruban Kanapathippillai, Kenneth Alan Okin
Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.
Abstract: A memory system includes a memory controller and a memory module. The memory controller is arranged for selectively generating at least a clock signal and an inverted clock signal. The memory module includes a first termination resistor, a second termination resistor and a switch module, where a first node of the first termination resistor is to receive the clock signal, a second termination resistor, wherein a first node of the second termination resistor is to receive the inverted clock signal, and the switch module is arranged for selectively connecting or disconnecting a second node of the second termination resistor to a second node of the first termination resistor.
Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).
Abstract: A method for preparing an alloy encapsulation mobile phone protective case is provided, which includes steps of: selecting an alloy material as an edging material; CNC machining; making a surface treatment; drying; spraying and molding for shaping. The alloy encapsulated mobile phone protective case is formed after shaping the alloy outer frame and the soft rubber inner molding layer, which not only simplifies the assembly, but also strengthens the strength and hardness of the structure, thus effectively avoiding the splitting phenomenon caused by strong impact. Due to the combination of the alloy material with the soft rubber inner molding layer, the protective case has a certain flexibility, abrasion resistance, high strength and high formability. The rigidity of the protective case is in a range from 50° to 90°and has strong resilient force and curvature, which not only can effectively protect the mobile phone, but also has long service life.
Abstract: An optical fiber connector includes a cartridge, a latch and a pair of elastic members. The cartridge has two opposite sidewalls and a wire terminal, and each sidewall has a runner and a containing slot disposed on a side of the wire terminal. The latch includes a pull handle, a sliding member having two opposite extending arms, and a stop portion disposed at each extending arm. The pull handle is capable of rotatably connecting the sliding member, and each extending arm is slidably combined with the cartridge through each runner. Each elastic member has an end abutting each containing slot and the other end abutting each stop portion. Therefore, the space of the cartridge is increased, and the total volume of the optical fiber connector is reduced.
Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
Abstract: An electronic device including a first body, a first connecting assembly, a second body, and a second connecting assembly is provided. The first body has a recess, and the first connecting assembly is disposed at the first body and hidden in the recess. The second connecting assembly is disposed on the second body in protruding manner. The second connecting assembly is fit to be assembled in the recess and electrically connected to the first connecting assembly, such that the first and the second bodies are detachably assembled to each other.
Abstract: An exemplary system includes a plurality of connector assemblies. Each of the connector assemblies includes a plurality of ports. Each of the connector assemblies is configured to read information stored on or in physical communication media that is connected to the ports of the respective connector assembly. An aggregation point is communicatively coupled to the plurality of connector assemblies. The aggregation point is configured to automatically discover the connector assemblies and cause each of the connector assemblies to send to the aggregation point at least some of the information read from the physical communication media that is connected to its ports. The aggregation point is configured to store at least some of the information sent by the connector assemblies to the aggregation point. The aggregation point can also be configured to provide at least some of the information it stores to at least one other device via the network.
Type:
Grant
Filed:
February 12, 2010
Date of Patent:
June 6, 2017
Assignee:
CommScope Technologies LLC
Inventors:
Mohammad H. Raza, Kamlesh G. Patel, John P. Anderson, Joseph C. Coffey
Abstract: A pluggable optical transceiver module for being plugged in a housing is provided. The housing has a cover and an elastic piece, and the cover has an accommodating space. One end of the elastic piece is connected to the cover while the other end has a first fastening portion. The first fastening portion is located on one side of the accommodating space. The pluggable optical transceiver module comprises a base and a sliding member. The base comprises a base body and a second fastening portion. The base body has a guide surface, and the second fastening portion is next to the guide surface. The base is for being plugged in the accommodating space, and the second fastening portion is fastened with the first fastening portion. The sliding member comprises a body section and a push section connected to each other. The body section is slidably disposed on the base.
Type:
Grant
Filed:
April 28, 2014
Date of Patent:
June 6, 2017
Assignee:
Applied Optoelectronics, Inc.
Inventors:
Che-Shou Yeh, Chao-Hung Tsai, Chien-Te Lin
Abstract: A protected memory source device including removable non-volatile memory durably stores a signature such as a serial number or identifier, which is used to mark protected multimedia content legally stored on the protected memory device. The protected multimedia content is moved from the source device to another device, such as a target device used to aggregated protected content in a library. Moving the protected multimedia content involves replacing a source-specific header, comprising digital rights management metadata and/or other security metadata allowing only a device having the source device signature access to the content, with a target-specific header comprising digital rights management metadata and/or other security metadata allowing only a device having the target device signature access to the content. The transfer is done using one of a variety of transfer methods with either a trusted or un-trusted host system connecting the source device to the target device.
Type:
Grant
Filed:
June 4, 2014
Date of Patent:
May 9, 2017
Assignee:
MO-DV, INC.
Inventors:
Robert D. Widergren, Martin Paul Boliek
Abstract: A modular Radio Frequency transceiver includes a frequency synthesizer module arranged to generate a local oscillator signal. At least one transmitter module and/or at least one receiver module are arranged adjacent to the frequency synthesizer module. Each transmitter module and receiver module is arranged to mix at least one respective input signal with the local oscillator signal. Adjacently arranged modules are electrically connected to each other with respect to at least data signals, the local oscillator signal and a power supply.
Type:
Grant
Filed:
September 26, 2014
Date of Patent:
April 11, 2017
Assignee:
Imagination Technologies Limited
Inventors:
Martin Lantz, Pontus Andren, Joakim Landmark
Abstract: An electronic apparatus includes a replaceable device, an apparatus casing, a supporting structure, an abutting structure, and a removable carrier. The supporting structure, the abutting structure, and the removable carrier function as an installation mechanism for installing the replaceable device into the apparatus casing. The supporting structure and the abutting structure are disposed in the apparatus casing. The abutting structure has two side walls oppositely disposed. The removable carrier includes a fixing frame and an actuation part pivotally connected to the fixing frame. The replaceable device is fixed on the fixing frame. When the removable carrier is disposed on the supporting structure, the actuation part can be rotated relative to the fixing frame and alternatively abut against one side wall so that the fixing frame moves on the supporting structure and a connector of the replaceable device is engaged with or disengaged from a connector of the electronic apparatus respectively.
Abstract: A display device includes a display panel, a bottom case, and a curvature maintaining bar. The display panel has a first curvature. The display panel is disposed in the bottom case. The bottom case has a locking projection and a second curvature substantially a same shape or radius as that of the first curvature. The curvature maintaining bar is coupled to the locking projection. The curvature maintaining bar includes a first protrusion. The bottom case has a coupling hole into which the first protrusion is inserted.
Abstract: The invention relates to a connector which includes basic parts that can be assembled and nested together, forming a high-density connector technology for hermaphroditic contacts.
Abstract: A semiconductor device includes a semiconductor element having a semiconductor chip and connection terminals, a cooling fin to which the semiconductor element is fixed, and an external cooling body having a passage for cooling medium, the cooling fin being fixed to the external cooling body. The semiconductor element has a protruding cooling block that is inserted and fixed to the cooling fin, which in turn is fixed to the external cooling body such that the cooling fin is in contact with the cooling medium.
Abstract: A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.
Abstract: A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface.
Abstract: A single integrated circuit comprises one or more functional modules; a bus port; a bus in communication with the one or more functional modules and the bus port; and a bus tracer disposed within the integrated circuit and configured to capture activity on the bus. A method for a single integrated circuit comprising a bus comprises capturing, in a bus tracer disposed within the single integrated circuit, activity on the bus; and providing, through a bus port of the single integrated circuit, the activity captured by the bus tracer.
Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface. The clamping assembly includes a base with a central strut and a plurality of peripheral struts projecting perpendicularly therefrom, and the clamping assembly also includes a central conductive path.
Abstract: The invention relates to a communication cartridge (1) characterized in that—it is adapted to be integrated in a removable manner into a recess (25) of a host equipment (2), during normal operation, an external front part (13) of the cartridge being intended to be external to the recess (25) of the host equipment (2), and in that—it comprises at least one front port, placed in an internal space of the cartridge (1) and intended to cooperate with a wireless communication module also placed in the internal space of the cartridge (1), during normal operation, the front port being moreover adapted to have an adjustable position in the internal space, so that the module is at least partially positioned in the external front part (13) of the cartridge (1), during normal operation. The invention also relates to an equipment, an assembly and a system corresponding thereto.
Type:
Grant
Filed:
July 12, 2012
Date of Patent:
April 26, 2016
Assignee:
SAGEM DEFENSE SECURITE
Inventors:
Jean-Marie Courteille, Pierre Guivarch, Francois Guillot, Bruno Larois
Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.
Abstract: An electronic component built-in multi-layer wiring board that comprises collectively stacked therein a plurality of first printed wiring boards by thermal compression bonding, and that comprises an electronic component package built in thereto, wherein the electronic component package comprises a first electronic component built in thereto and a plurality of second printed wiring boards stacked to have electrodes on an outermost surface of the package at a pitch that is wider than the electrode pitch of the first electronic component and that is matched to the wiring pitch of the first printed wiring boards, the electronic component built-in multi-layer wiring board includes a second electronic component having a thickness which is greater than that of the first electronic component, and the electronic component package having a thickness which is 80% to 125% of the thickness of the second electronic component.
Abstract: A connector system includes a plurality of housing mounted on a circuit board and a plurality of cages are provided, each cage enclosing one of the housings, each of the cages including a front face that defines a first port, the cages being spaced apart a predetermined distance. A thermal washer is positioned around the cages, the thermal washer including a front portion and a main portion with air apertures that allow air to flow through the thermal washer and along a gap between the cages.
Type:
Grant
Filed:
May 6, 2013
Date of Patent:
January 26, 2016
Assignee:
Molex, LLC
Inventors:
Jerry D. Kachlic, Philip J. Dambach, Emanuel G. Banakis
Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
Abstract: In a modular structure of independent output/input socket for UPS, when UPS needs to be repaired, the bypass switch of the detachable socket is turned on, so that the input power is directly connected with power output sockets through the power input wire. The detachable socket is then removed from the UPS host, and the UPS host is sent to be repaired. Load equipment plugs do not need to be unplugged from the power output jacks one by one, and moved to the power socket on the wall. If there are not enough power sockets on the wall, then additional extension wire sockets having multi-jacks need to be utilized for electrical connection. The action of unplugging and plugging in load plugs into the different power sources can be tedious and even dangerous. The detachable output/input sockets are also replaceable with different plug adapters for use with the different power plug standards around the world.
Abstract: Voltage regulator, in particular for an alternator, comprising a connector designed to perform the function of a communication interface between the alternator and a control unit of an engine to which the alternator is connected; a capacitor designed to be connected to the alternator, for performing the function of an anti-noise filter at radio frequencies; a processing module designed to be connected to the alternator, for managing operation thereof; a heat sink designed to dissipate the heat of the regulator; the regulator wherein it comprises a casing which is designed to be connected to the alternator and defines a main cavity designed to house the connector and a secondary cavity which is adjacent to the main cavity and designed to house the capacitor; the casing is able to be fixed to the alternator by means of four mechanical connection elements, two of said connection elements being connected to the capacitor, a third one being connected and screwed to a brush holder of the alternator and a fourth one
Type:
Grant
Filed:
April 5, 2012
Date of Patent:
November 24, 2015
Assignee:
Denso Manufacturing Italia S.P.A.
Inventors:
Giammarco Di Risio, Mario Piluso, Rocco Miccoli, Nicola Fizzano
Abstract: A configurable connector system may include a connector assembly including a housing, and at least one wafer retained within the housing. The wafer(s) may include at least one active device in communication with at least one programmable memory component. The active device(s) may be configured to operate based on programming instructions or settings stored within the programmable memory component. The housing of the connector assembly may include an open programmer-receiving channel configured to receive at least a portion of an external programmer that is configured to send the programming instructions or settings to the at least one programmable memory component.
Abstract: The present invention provides a curvature adjustment structure of a curved liquid crystal display device, which includes: a backplane (1), at least one threaded rod (3) fixedly mounted to the backplane (1), a rack (5) arranged to correspond to the threaded rod (3) and having two ends positioned against the backplane (1), and an adjustment nut (7) in threading engagement with the threaded rod (3). The threaded rod (3) extends through the rack (5) and then mates the adjustment nut (7), whereby by rotating the adjustment nut (7) to compress or release the rack (5), the rack (5) is caused to compress or release the backplane (1) so as to achieve the adjustment of the curvature of the backplane (1). The adjustment of the curvature of the curved liquid crystal display device is made easy, improving the product appeal to the market and simplifying the structure to make it easy to make.
Type:
Grant
Filed:
May 28, 2014
Date of Patent:
November 10, 2015
Assignee:
Shenzhen China Star Optoelectronics Technology Co., Ltd
Abstract: A circuit board for electric components has at least one current conductor, which is configured as a molded part, and at least one unhoused electric component affixed to the current conductor. The circuit board exhibits improved operating reliability.
Abstract: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.
Abstract: A wire harness includes a relay box having an external shape that is defined by a frame to which one of a mechanical relay cassette and a communication-function-provided relay cassette is replaceably attached, a junction connector having a space in which a communication module is installable, and a junction box having a microcomputer which works a communication function optionally.
Abstract: A conductor connection tool includes a terminal platform base, a conduction fitting accommodated in a fitting recessed part of the terminal platform base. The conduction fitting is formed in a substantially U shape and includes a bottom plate portion, a vertical portion bent vertically upward from one end of the bottom plate portion, and an attachment portion extending from an upper end of the vertical portion in parallel to the bottom plate portion, and having a terminal portion extending in the opposite direction to the attachment portion. A plate spring bent in a substantially V shape with one side serving as an attachment piece to be fixed to the attachment portion of the conduction fitting with the other side serving as a locking piece whose front end is to be brought into pressure contact with the bottom plate portion of the conduction fitting.
Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.
Type:
Grant
Filed:
March 1, 2013
Date of Patent:
September 1, 2015
Assignee:
Samsung Electro-Mechanics Co., Ltd.
Inventors:
Tae Hyun Kim, Bum Seok Suh, Do Jae Yoo, Kwang Soo Kim
Abstract: A sliding lid of an electronic device can move between an open state and a closed state, and in the open state, the external connecting terminals are exposed. The sliding lid includes a plurality of projecting shafts that project from the outer peripheral portion and a projecting portion that is formed on the surface of the device main body. A jack holder is provided with first guide rails and second guide rails that are rail members that guide the sliding lid, where first guide rails correspond to the projecting shafts of the sliding lid and second guide rails correspond to the projecting portion. In a closed state, the projecting shafts respectively abut the rails. While the sliding lid moves from the closed state to the open state, a projecting shaft separates from the first guide rails and the projecting portion slides to abut the second guide rails.
Abstract: A front plug for a PLC module, where the front plug includes a top and bottom contact strip that is connected to the top contact strip by a hinge for moving the top contact strip between an open and closed condition, the contacts of the top and bottom contact strip are in the closed condition arranged electrically insulated laterally mutually offset and enable contact with mating contacts of the PLC module requiring to be connected via the front plug, and contact with the mating contacts is enabled at least partially on a side of the bottom contact strip that side faces away from the top side.
Abstract: There is provided a technology for realizing a low-cost electric power converter operating at low noise under a high-temperature environment. The electric power converter is provided with an enclosure, a power module including a switching element, a driver circuit for generating a signal for driving the switching element, a control circuit board for generating an actuating signal to be sent out to the driver circuit, a base plate with the control circuit board mounted thereon, and a connection part for connecting between the enclosure and the control circuit board. The enclosure is provided with two openings adjacent to each other, and the base plate or the opening of the enclosure is provided with the connection part.