Abstract: A wire harness includes a relay box having an external shape that is defined by a frame to which one of a mechanical relay cassette and a communication-function-provided relay cassette is replaceably attached, a junction connector having a space in which a communication module is installable, and a junction box having a microcomputer which works a communication function optionally.

Abstract: A conductor connection tool includes a terminal platform base, a conduction fitting accommodated in a fitting recessed part of the terminal platform base. The conduction fitting is formed in a substantially U shape and includes a bottom plate portion, a vertical portion bent vertically upward from one end of the bottom plate portion, and an attachment portion extending from an upper end of the vertical portion in parallel to the bottom plate portion, and having a terminal portion extending in the opposite direction to the attachment portion. A plate spring bent in a substantially V shape with one side serving as an attachment piece to be fixed to the attachment portion of the conduction fitting with the other side serving as a locking piece whose front end is to be brought into pressure contact with the bottom plate portion of the conduction fitting.

Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

Abstract: A sliding lid of an electronic device can move between an open state and a closed state, and in the open state, the external connecting terminals are exposed. The sliding lid includes a plurality of projecting shafts that project from the outer peripheral portion and a projecting portion that is formed on the surface of the device main body. A jack holder is provided with first guide rails and second guide rails that are rail members that guide the sliding lid, where first guide rails correspond to the projecting shafts of the sliding lid and second guide rails correspond to the projecting portion. In a closed state, the projecting shafts respectively abut the rails. While the sliding lid moves from the closed state to the open state, a projecting shaft separates from the first guide rails and the projecting portion slides to abut the second guide rails.

Abstract: A front plug for a PLC module, where the front plug includes a top and bottom contact strip that is connected to the top contact strip by a hinge for moving the top contact strip between an open and closed condition, the contacts of the top and bottom contact strip are in the closed condition arranged electrically insulated laterally mutually offset and enable contact with mating contacts of the PLC module requiring to be connected via the front plug, and contact with the mating contacts is enabled at least partially on a side of the bottom contact strip that side faces away from the top side.

Abstract: There is provided a technology for realizing a low-cost electric power converter operating at low noise under a high-temperature environment. The electric power converter is provided with an enclosure, a power module including a switching element, a driver circuit for generating a signal for driving the switching element, a control circuit board for generating an actuating signal to be sent out to the driver circuit, a base plate with the control circuit board mounted thereon, and a connection part for connecting between the enclosure and the control circuit board. The enclosure is provided with two openings adjacent to each other, and the base plate or the opening of the enclosure is provided with the connection part.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module.

Abstract: Disclosed herein are a package substrate, a method of manufacturing the same, and a power module package using the package substrate.

Abstract: A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.

Abstract: A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package.

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract: A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.

Abstract: This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Abstract: Systems, methods, and devices are provided for coupling a direct current (DC) pre-charging circuit to a motor drive. In one embodiment, an industrial automation device may include an enclosed module that may include a pre-charge circuit. The pre-charge circuit may pre-charge a direct current (DC) bus. Further, the DC bus may couple to an inverter. The enclosed module may also include a power input that may couple the pre-charge circuit to a DC power source and an electrical output structure that may couple the pre-charge circuit to the inverter. Additionally, the pre-charge circuit may be removeably coupled to the inverter and the DC power source via a sliding action of the enclosed module.

Abstract: Techniques disclosed herein include systems and methods for assembly of electric motor starter connecting packages that enable increased automation and reduced assembly via top-down assembly of circuit components, thereby allowing robotic placement, connection, and securing of circuit components. The connecting package can include an electric motor starter, with optional overload protector, packaged as one unit. The motor starter can include an electrical circuit containing a triac, current transformer, Positive Temperature Coefficient (PTC) element, resistor, and a capacitor. A cover and base of the connecting package enclose and firmly secure connected circuit elements without needing a circuit board or filler material. The device design enables quick testing of the motor starter circuit and circuit elements after being enclosed by the housing.

Abstract: An apparatus including a sliding mechanism configured to enable a card holder to be moved between a first position and a second position; a resilient member configured to bias the card holder towards the first position; and an adjustment mechanism configured to enable tension in the resilient member to be adjusted when the card holder is in the second position.

Abstract: An embodiment includes a system, comprising: a circuit; an energy harvesting device configured to convert energy from the circuit to electrical energy; an energy storage device configured to store the electrical energy; and a power supply configured to supply power from the energy storage device, and multi-sensor module including such a system.

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract: A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.

Abstract: The electric component includes first and second members 30 and 40, at least one of which being used as an electric conductor. The first member includes a bus bar 31 and a resin member 32 for covering the bar and has a predetermined area where they expose to the exterior. The second member has an exposing portion where the surface of the aluminum wire 44 exposes and the exposing portion faces portions (H1, H3) where the bar 31 exposes to the exterior at the predetermined area. The first and second members are supported by a housing 10 including a resin at least having a part exposing to the exterior. In this electric component, the first member is configured such that the contact angle of the water droplet relative to the surface of the resin member 32 within the predetermined area is smaller than or equal to 70 degrees.

Abstract: Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.

Abstract: Serializer-deserializer (SERDES) and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate. The first and second SERDES dies positioned adjacent, in a plane, and disposed on the package substrate. The logic circuit communicatively connected to the SERDES circuit and to the package substrate. The logic die stacked vertically and disposed on the first and second SERDES dies. A method of assembling a SERDES and integrated circuit package including providing a SERDES structure selected from a menu of SERDES die and SERDES circuit combinations. A design structure of a SERDES and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: A frame module is adapted to be disposed in a housing of a computer for fixing first and second electronic devices. The computer includes a motherboard unit with a socket connector. The frame module includes a frame body having top and bottom surfaces adapted to be connected respectively to the first and electronic devices. An adaptor board includes a board body connected transversely to a rear edge of the frame body and having an edge connector adapted to be inserted into the socket connector, and first and second electrical connectors for electrical connection with the first and second electronic devices, respectively.

Abstract: Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

Abstract: Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.

Abstract: A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Abstract: According to one embodiment, an apparatus includes a board, a module, cables, and an insulator. The module includes a module body having a first end portion protruding to form a step and module terminals attached to the first end portion. The first end portion is thinner than a main portion of the module body. The protrusion height of the module terminal is less than that of the step. The cables have cable terminals fixed to the module terminals. The insulator has a first adhesive portion adhered to an adhesive point arranged on the back side to the first surface opposite to the board, a second adhesive portion adhered to the first surface, and a cover portion continued to the second adhesive portion and covering the cable terminal between both adhesive portions.

Abstract: An electronic apparatus 1 includes a flat cable 70, an end 70a of which is bonded to the front surface of a sub-board 30 through an anisotropic conductive film 79, engaged portions 74A and 74B formed in the flat cable 70, and an intermediate frame 40 that engages with the engaged portions 74A and 74B to restrain the movement of the engaged portions 74A and 74B in a direction away from the electrode on the sub-board 30. Consequently, it is possible to realize a reduction in costs while maintaining connection stability between a flat cable and a circuit board.

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

Abstract: A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.

Abstract: An electronic device includes a first body, a second body and a hinge structure. The hinge structure includes a first pivot component, a second pivot component, a first connecting component and a torsion adjusting assembly. The first pivot component is fixed on the first body. The second pivot component is fixed on the second body and pivoted to the first pivot component. The first connecting component is fixed on the first pivot component. The torsion adjusting assembly is movably disposed at the second body. When the torsion adjusting assembly is moved to a first position, the first connecting component and the torsion adjusting assembly are separated and the hinge structure has a first torsion. When the torsion adjusting assembly is moved to a second position, the first connecting component is connected to the torsion adjusting assembly and the hinge structure has a second torsion larger than the first torsion.

Abstract: A pluggable module for releasable engagement with a computing device includes a first end portion, a second end portion and a release tab structure. The release tab structure connects with the first end portion to facilitate removal of the module from the port of the computing device and has a generally U-shaped profile including two elongated arms spatially distanced from each other and extending transversely from the first end portion and terminating at a crossbar that connects between the elongated arms. Portions of the elongated arms and the crossbar extend within a plane that is separated a sufficient distance from the cable connector so as to facilitate 360° of access around the cable connector during connection and removal of the cable connector with the cable connection port.

Abstract: Base modules are provided over a backplane network for high availability control of industrial processes or machines. The base modules may include, for example, an I/O base module, which may control the industrial processes or machines and which may releasably receive an I/O function card, an adapter base module, which may communicate with an industrial controller over a separate control network, and a bus expansion base module, which may provide coupling to another bank of base modules. The base modules may be arranged side-by-side via electrical and mechanical connections. Logic of the I/O base module may detect the presence or absence of the I/O function card to allow coupling or bypassing of the I/O function card with respect to the backplane network.

Abstract: A remote controller is arranged for selecting a light source among a plurality of light sources. The remote controller has an omnidirectional transmitter and is arranged to instruct, by means of the omnidirectional transmitter, the light sources to transmit a directional signal comprising a code, which is unique for each light source. Further, the remote controller has a directional signal receiver, and is arranged to receive the directional signals from the light sources, and signal comparison circuitry connected with the directional signal receiver. The remote controller is arranged to select one of the light sources on basis of the received directional signals. Furthermore, the remote controller comprises a transmission indicator, which is arranged to generate an indication signal, indicative of a successful omnidirectional transmission, and it is arranged to initiate the selection of one of the light sources by means of the indication signal.

Abstract: A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.

Abstract: Provided are a conductive structure including a) a base, b) a conductive pattern provided on at least one side of the base, and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof.

Abstract: A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the front surface side of the circuit board and on which the display plate is mounted, an upper case which is disposed on the front surface side of the middle case and through which the front surface can be seen, and a lower case which covers the middle case and the circuit board. A flange section which is sandwiched and held between the upper and lower cases is provided to the peripheral edge of the middle case. One of the upper case and the lower cases is provided with engagement sections, and engagement sections which engage with the engagement sections are provided to the other of cases so as to correspond to the engagement sections.

Abstract: In one embodiment, methods for making semiconductor devices are disclosed.

Abstract: An electro-optic device includes an electro-optic panel, a first holding member that holds the electro-optic panel, and a second holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered. In the electro-optic device, a predetermined gap is provided between the first holding member and the second holding member.

Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.

Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

Abstract: A method of selecting a light source among a plurality of light sources by means of a remote controller includes the remote controller: instructing, by omnidirectional transmission, the light sources to each transmit a directional signal comprising a code, which is unique for each light source; —receiving the directional signals from the light sources; and selecting one of the light sources on basis of the received directional signals. Furthermore, the method includes: generating, remotely of the light sources, codes to be transmitted by the light sources; and—the remote controller instructing each one of the light sources which one of the remotely determined codes to transmit.

Abstract: A touch cover including a substrate, a sensing circuit and a grounding circuit is provided. The substrate has an inner plane and an inner side surface extending from the inner plane. The inner plane and the inner side surface are not coplanar. The sensing circuit is disposed on the inner plane. At least a portion of the grounding circuit is disposed on the inner side surface. An electronic apparatus with the touch cover and a fabricating method of the touch cover are also provided.

Abstract: Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.

Abstract: The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.

Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.