Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract: A portable electronic device including a first body, a second body, and an assembling structure is provided. The assembling structure includes a first assembling unit and a second assembling unit. The first assembling unit is adapted to hidden in one of the first and the second bodies, and the second assembling unit is disposed and hidden in another one of the first and the second bodies. When the first body is close to the second body, the first assembling unit is protruded out of the first body or the second body, and assembled to the second assembling unit, such that the first and the second bodies are fixed to each other.

Abstract: A guiding mechanism includes a first guiding component, a second guiding component, a push rod, a push rod sheath and a driving component. A distance is between the second guiding component and the first guiding component and increases in a first direction. The push rod includes a rod base slidably connected to the first guiding component. The push rod sheath includes an engaging portion movably engaged with the rod base, and a guiding portion slidably connected to the second guiding component and used for pushing a flexible printed circuit board. The driving component drives the rod base to move relative to the engaging portion, so as to drive the push rod and the push rod sheath to slide relative to the first guiding component and the second guiding component.

Abstract: A module arrangement including a plurality of functional modules lined up in a stacking direction, which are connected to one another for fluidic and electric communication, wherein a functional module includes a plate-shaped base body having two parallel, opposite joining surfaces which are designed to contact joining surfaces of adjacent base bodies, wherein the base body includes a connecting device designed for transferring electric signals and/or electric supply voltages and/or fluid flows between adjacent functional modules along the stacking direction, and wherein several signal lines selectable by the control module extend along the stacking direction of the functional modules for transmitting control signals provided for the direct selection of individual functional modules wherein at least one storage device for detecting, buffering and transferring at least one electric signal of an external component is electrically looped into at least one signal line.

Abstract: The present invention provides a server architecture, which comprises a plurality of first middle planes disposed horizontally in the server chassis, and each of the first middle plane electrically coupled to a server board such that the server board is also horizontally disposed in the server chassis. By means of the server architecture in the present invention, in addition to providing a hot-swappable function to the server board, for the whole server system, horizontally arranged first middle plane and server board will not block the route for heat dissipating flow so that the heat dissipating efficiency with respect to the server will not be reduced.

Abstract: A power supply apparatus includes a first electronic device, a second electronic device, and plural power modules. The first electronic device includes a first compartment. The first compartment has a first width. The second electronic device includes a second compartment. The second compartment has a second width. Each of the power modules has a third width. The third width is determined according to the first width and the second width, so that a specified number of power modules are selectively accommodated within the first compartment or the second compartment.

Abstract: A power semiconductor module is provided in which power semiconductor chips with an aluminum-based chip metallization and power semiconductor chips with a copper-based chip metallization are included in the same module, and operated at different barrier-layer temperatures during use.

Abstract: A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.

Abstract: A cable management apparatus includes two mounting brackets respectively fixed to opposite sides of an electronic device. A cable management arm connected between the two mounting brackets, two latch members slidably connected to the cable management arm, two resilient members connected between the cable management arm and the corresponding latch members. In addition, two releasing members rotatably mounted to the cable management arm and engaging with the corresponding latch members. Each of the mounting brackets defines two locking holes respectively adjacent to top and bottom. Each of the latch members includes a positioning pin selectively engaging in one of the locking holes of the corresponding mounting bracket to respectively lock the cable management arm is at upper or lower position. The releasing members can be rotated to drive the latch members to slide away from the corresponding mounting brackets to unlock the cable management arm relative to the mounting brackets.

Abstract: The invention relates to an accommodating device having a one-piece support that prevents damage to a circuit board and its contacts even with frequent installation and dismantling of mounting rail module cases. This is achieved in particular by the fact that the module case can be detached from an integral mounting rail of the support by pivoting it in the direction of the circuit board. This special pivoting is made possible by the fact that the integral mounting rail and the holding area of the circuit board are separated from one another spatially so that even in the installed state, the mounting rail module case and the circuit board are mechanically decoupled.

Abstract: The power supply and cooling provided by existing aircraft system line replaceable units (LRUs) or other devices supports new cards that are installed in previously empty slots or which replace existing original cards and which are not limited in functionality and do not require licensing of any proprietary technology included in the LRU. These new cards can include components such as processors, memory, and/or storage that significantly improve the performance of the LRU, and/or add new functionality—all without exceeding the power supply and cooling capability of the LRU. A network and avionics bus interface can be added to a portion of the new card and electrically coupled to the circuitry and electronic components on the new card, so that one or more cables connected to the interface can be connected to externally accessible standard avionics buses and network connectors added to a chassis of the LRU.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: In a power conversion apparatus including a rectifying module mounted with a power conversion device, an inverter module, and a direct-current reactor, a rectifying module and an inverter module 5B are mounted on a base section of a cooling fin, a direct-current reactor (DCL) is arranged in a lower layer of a vane section attached to the lower surface of the base section of the cooling fin 3A, an air gap section is provided in the cooling fin 3A, and a terminal block for obtaining electrical connection between the rectifying module and the inverter module and the direct-current reactor (DCL) is arranged making use of a space of the air gap section.

Abstract: Scalable up and down nesting integrated electronic enclosures with form factors including asteroids and/or dumbbells and/or approximated tessellation(s)/tiling(s) or combinations thereof with thermal management, wiring, sliding fit, manual and/or automated full range vertical to horizontal positioning, access and structural systems for individual modules and intra- and inter-planar stacks, columns, rows, arrays and associated infrastructures.

Abstract: A plurality of custom thermometer models are manufactured from a universal clinical thermometer core. The thermometer core includes a housing, a controller storing a software program, a power source, a probe, a probe cord, and a display. A plurality of model selection devices are produced, each corresponding to a different thermometer model. One of the model selection devices is selected and connected to the controller. The controller operates the thermometer as a function of the connected model selection device such that the thermometer is configured with the features and default settings of the thermometer model corresponding to the connected model selection device.

Abstract: An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power supply and at least one DC power supply. The AC supply and DC power supply are configured to switch automatically to the DC power supply should the AC power supply fail.

Abstract: A fire resistant enclosure comprising an enclosure base including a base cap and a bucket-style base body is provided. The base body includes a bottom wall with a side wall extending upwardly therefrom defining a base cavity. The side wall includes an upper peripheral edge that defines an opening in the base cavity. A data storage device positioned within the base cavity. Fire resistant insulation material is positioned within the base cavity to encapsulate the data storage device, wherein the insulation material fills the base cavity to a level below the upper peripheral edge, wherein the base cap is configured to be coupled with the base body to enclose the data storage device within the enclosure base. In another aspect, an enclosure base and an enclosure lid may be provided, wherein each include bucket-style bodies. The enclosure base and lid define a storage compartment for the data storage device.

Abstract: A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire.

Abstract: An electronic device includes a chassis including a bottom wall, a bracket fixed to the bottom wall, a data storage assembly received in the bracket, and a connector module. The connector module includes a main body and two mounting members. The mounting members are fixed to the chassis and the bracket. The main body is slidably arranged between the mounting members. The main body includes a first side surface and a second side surface, a first signal connector and a power connector are set on the first side surface, the first signal connector is to electrically connect with a motherboard of the electronic device, the power connector is to connect with a power supply, a plurality of second signal connectors are set on the second side surface, to electrically connect with the data storage assembly.

Abstract: According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening.

Abstract: An automatic door sensor includes: at least one sensor module unit (sensor module 11) configured to detect optically an object or a human body and to output, according to the detection results, a signal to a door controller for controlling an automatic door to open/close; an accommodation unit (profile 12) capable of accommodating the at least one sensor module unit; a cover member (front cover 13) that is transmissive to light for use for the detection performed by the sensor module unit and configured to cover the accommodation unit in which the sensor module unit is accommodated; and a functionality expansion module (LED module 14) either side of which can be joined to the cover member and that is configured to expand functionalities of the automatic door sensor by performing communication with the sensor module unit.

Abstract: An electronic device includes: a substrate having multiple terminal lands and multiple through holes; an electric element including multiple terminals coupled with respective terminal lands and a body on the substrate; and an auxiliary member for assisting fixation between the electric element and the substrate. The auxiliary member includes a base fixed to the body and multiple leg portions extending from the base and inserted into respective corresponding through holes. The leg portions include a pair of locking parts, each having a latch and a spring. The latch is disposed on an insertion end of the leg portion, and is latched around the through hole on the substrate. The spring is deformable when the latch is inserted into the through hole. The pair of locking parts are inserted into two different through holes, respectively.

Abstract: The present invention, relating to the battery field, discloses a positive pole material of a lithium ion battery and method for preparing the same, a positive pole of a lithium ion battery, and a lithium ion battery, which are capable of effectively preventing precipitation of metal impurity ions on a negative pole, and improving the cycle performance and high-temperature storage performance of the lithium ion battery. The positive pole material of the lithium ion battery includes: a conductive additive; nano phosphate, where the formula of the nano phosphate is LiMPO4, M being one or multiple of Co, Ni, Mn, Fe, and V; and a functional polymer material, where the functional polymer material contains a transition metal ion chelating function group. The present invention also provides a method for preparing a lithium ion battery and a communication device. The present invention is applicable to the battery field.

Abstract: A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting dual AN/VRC-110 radio systems. The platform has a first power supply that includes a DC power converter for converting 110/220 alternating current into +28 Volt direct current and a second power supply that converts +28 Volt direct current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said dual AN/VRC-110 radio systems.

Abstract: An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within the sets of terminals, a set of terminals corresponding to a specific sub-module of the sub-modules include a power-input terminal arranged to input power from outside the control module. For example, on a printed circuit board (PCB) of the apparatus, arrangement of some modules is similar to that of some contact pads associated to the sets of terminals. In another example, the control module includes a power distribution system including at least one power distribution wire. In another example, a PCB within the apparatus includes at least one signal transmission wire and at least one set of co-plane ground wires.

Abstract: A printed circuit assembly, along with a server and method incorporating such printed circuit assembly, are disclosed for determining a storage configuration for use in a computer system via a simple hardware change. The printed circuit assembly may comprise a paddle board slot for connection to a paddle board for determining a storage configuration; a bus coupled to the paddle board; and a southbridge coupled to the bus, the southbridge comprising signal lines coupled to the paddle board slot through the bus. The storage configuration of the printed circuit assembly may be determined via the paddle board when the paddle board is connected to the paddle board slot.

Abstract: An interconnect structure includes an insulative web having a first surface and a second surface; a logic device secured to the second surface of the insulative web; a frame panel assembly including a frame base having a first surface and a second surface, a first frame insulative layer disposed between the frame base first surface and the insulative web second surface, an aperture extending through the frame base and first frame insulative layer, wherein at least a portion of the logic device is disposed within the aperture, and a first frame connector disposed between a first electrically conductive layer located on the frame base first surface, and a second electrically conductive layer located on a surface of the first frame insulative layer; a device connector disposed between an I/O contact on a surface of the logic device and a third electrical conductor located on a surface of the insulative web; and an insulative layer connector that is disposed between the third electrical conductor located on a sur

Abstract: A connecting mechanism of adjusting an angle of a first module relative to a second module of an electronic device is disclosed in the present invention. The connecting mechanism includes a hinge assembly disposed on the second module, a rod disposed on the hinge assembly and pivoting to the first module, a torsional spring disposed between the rod and the hinge assembly, and a damper assembly disposed on the rod and sheathed by the torsional spring. The hinge assembly includes a first hinge installed inside the second module, and a second hinge slidably disposed on the first hinge. The torsional spring drives the rod to rotate relative to the second hinge from a first position to a second position, so that the first module can stand on the second module. The damper assembly can be for absorbing a vibration generated from the rod.

Abstract: A data center includes a housing and a number of server units arranged in the housing. Each server unit includes a server module and a cable management member. The first ends of a number of cables are connected to the back panel of the server module. The cable management member includes a bottom plate, a front plate, and two side plates. A number of connectors are set on the front plate. The second ends of the cables are connected to the connectors. The cable management member is fixed to one side of the server module. The cables are received in a space formed between the bottom plate and the server module. The cable management member includes a first clipping portion and a second clipping portion formed at opposite sides. The housing includes a number of rails, which can slide between the first and second clipping portions.

Abstract: The invention discloses a double-layer PCB of a low power wireless sensing system and a manufacturing method thereof. The low power wireless sensing system includes a first layer and a second layer. The first layer comprises a wireless communication module, a power amplifying module, a USB module, a balun module, an antenna module, a low-frequency oscillator and a high-frequency oscillator. According to the double-layer PCB of the low power wireless sensing system and the manufacturing method thereof, a circuit layout can be performed on the double-layer PCB to reduce volume of the PCB.

Abstract: The present invention discloses a sliding mechanism for sliding a display module relative to a host module. The sliding mechanism includes a host module fixing component installed inside the host module, a display module fixing component connected to the host module fixing component, a sliding component disposed on a lateral side of the display module and installed on the display module fixing component in a slidable manner, and a roller set installed on the display module fixing component for guiding the sliding component to slide in a first direction relative to the display module fixing component, such that the display module can slide relative to the host module in the first direction.

Abstract: A power module includes a power source comprising an end defining a socket, an external power line comprising a plug inserted into the socket, a fixing piece fixed at the end of the power source, and a clamping piece. The clamping piece includes a base mounted on the fixing piece, two parallel fixing portions extending from the base and defining a slot therebetween, a hook positioned on one of the fixing portions and extending in the slot, and a clamping band. The clamping band includes a fixed end fixed on the base and a slide end. The slide end includes spaced fixing teeth, a fixing groove is defined between each two of the fixing teeth, the clamping band winds around the external power line, the hook is engaged with one fixing groove to lock the slide end, and the clamping band and the base cooperatively hold the external power line.

Abstract: A line-management device for use in applications involving hoisting a load, the device having two or more parts, each part being releasably securable to at least one other part and comprising a body portion (1) and engaging means (6) and (7) for securably engaging with at least one other part and being shaped such that, in combination with the other part, a cavity is defined for receiving a load-bearing line, the device comprising attachment means (10) for attachment of a secondary line to be managed and, in use, the device being moveable longitudinally about the load-bearing line.

Abstract: A wall mounted modular workstation system utilizes individually mountable modules, such as a keyboard/monitor module, a CPU module, and a medical supply module, that may be each be selectively positioned, mounted, rearranged, used or not used, and/or added or removed at a later time. The individually mountable modules are formed with mountings and vertically located openings for electrical lines and module to module ventilation, which reduce/prevent creation of dust during mounting or later modification of the system.

Abstract: An output termination board for a safety system is disclosed herein. The termination board provides simplified wiring between the output modules and the remote devices operated by the controller in the system. Redundant output signals are generated within each pair of output modules and combined such that one control signal is sent to each remote device. In addition, a program executing on the controller of the safety system performs a test to determine if each output module is operating normally. If the program detects a fault in either output module, the safety system may alternately shut down according to a fail-safe procedure or continue operating under a fault-tolerant mode of operation.

Abstract: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method.

Abstract: An expansion apparatus includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a first circuit board, an expansion card with a second circuit board, and a cable member. A first edge connector is set on a bottom edge of the first circuit board and includes a number of first power pins connected to a control chip, a number of first storage chips, and a first connector, and a number of first ground pins. A second edge connector is set on a bottom edge of the second circuit board and includes a number of second power pins connected to a number of second storage chips and a second connector, and a number of second ground pins. The cable member includes a cable, a third connector connected to the first connector, and a fourth connector connected to the second connector.

Abstract: The present invention provides a tape substrate with COF structures for a liquid crystal display panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. Each of the package units includes input leads and output leads. In each of the package units, along the longitudinal direction of the tape substrate, the input leads and the output leads are disposed at both sides of the tape substrate, respectively. The present invention further provides the liquid crystal display panel using the tape substrate.

Abstract: An electrical connector assembly includes several casings juxtaposed to and connected to one another along an assembling direction, and a positioning bottom plate disposed at a level below the casings. Each casing includes a top plate, a side wall extending downwardly from a lateral side along a mounting direction transverse to the assembling direction, and one fixing pin projecting downward from a bottom end of the side wall. The positioning bottom plate is formed with several rows of fixing channel. Each row of the fixing channels is aligned with the fixing pins of a respective casing. When the juxtaposed casings are brought to fix securely on a printed circuit board supporting the positioning bottom plate, the fixing pins of the casings respectively extend through the fixing channels in the positioning bottom plate such that the positioning bottom plate absorbs an accumulated tolerance caused due to a juxtaposed connection among the casings along the assembling direction.

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein. Each complex shape is either a power hub including rechargeable batteries or a processor hub including processors. A sensor module is latched in a sensor docking bay and an actuator module is latched in an actuator docking bay of each complex shape in one or more tiers of the multiple tiers.

Abstract: The present invention provides a combinative power device. In one aspect, the combinative power device of the present invention includes an AC-to-DC module including a first joint portion; and a DC-to-DC module having a second joint portion and coupled to the AC-to-DC module by the second joint portion with the first joint portion electrically, wherein the DC-to-DC module acts as a removable module which can be removable from the AC-to-DC module to enable the AC-to-DC module to cooperate with different types of the DC-to-DC module.

Abstract: A touch panel comprises a substrate having a forward major surface and formed of a plurality of assembled substrate segments. Cover material overlies the forward major surface to reduce the visibility of seams between adjacent substrate segments.

Abstract: A support element arrangement for an electronic component includes a first support element and a second support element, the first support element being configured perpendicularly to the second support element and having a first main extension plane, and, in addition, the first support element having a first recess, the first recess at least partially surrounding the second support element in the first main extension plane.

Abstract: Vertically-stacked electronic devices having conductive carbon films are disclosed. The vertically-stacked devices exhibit non-linear current-versus-voltage response over a voltage sweep range in various embodiments. The vertically-stacked devices may be assembled into arrays where the vertically-stacked devices may be electrically addressed independently of one another. Uses of the vertically-stacked electronic devices and arrays as two-terminal memory devices, logic units, and sensors are disclosed. Crossbar arrays of vertically-stacked electronic devices having conductive carbon films and nanowire electrodes are disclosed.

Abstract: A power routing device includes one or more mounting portions and one or more power routing portions. At least one of the mounting portions can be mounted in an expansion slot of a circuit board assembly. The power routing portion can route electrical power to the circuit board assembly. In one embodiment, the expansion slot is a slot for a PCI expansion card.

Abstract: Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

Abstract: An universal network interface device base module including an access module, a modem module electrically connected to the access module, a dividing structure placed between the access module and modem module, and a base plate, wherein the access module, modem module and dividing structure are mounted on the base plate.

Abstract: A motherboard assembly includes a motherboard with a memory slot, an adapter board, and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board and a connector. An edge connector is set on a bottom edge of the circuit board. The adapter board includes a SATA interface, a hard disk drive (HDD) signal multiplier, a power interface, and an expansion SATA interface. The edge connector is connected to the memory slot and the connector is connected to the expansion SATA interface, to enable the motherboard communication with SATA DIMM modules, which are connected to the memory slots.

Abstract: A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n?2) and controls the at least one multi-channel package.

Abstract: A security system includes a central control and a number of security controllers, each of which includes a removable and replaceable security control module. Each module is interchangeable with other modules. Each controller includes a housing within which the module is contained. Cables from security-controlled components extend into the interior of the housing and are removably connected to the module. Each module includes a first connector for connection in a communication system and a second connector for receiving inputs from and providing outputs to a security component controlled by the controller. Each module further includes a third connector for receiving inputs from or providing outputs to an auxiliary device other than the security component. The auxiliary device provides an input to the controller or receives an output from a controller independent of the security component. Each controller also includes an accelerometer for providing a tamper evident feature.