Plural Patents (Class 361/729)
  • Patent number: 7911799
    Abstract: The present invention provides an electronic control unit which is capable of suppressing harmful effects caused by liquid while suppressing increase in the size thereof. The electronic control unit includes an electronic component in which a circuit element coated with an anti-splash agent is implemented, a casing, and a liquid discharge portion. The casing includes a base on which the electronic component is mounted, a cover which is connected to the base in the state where the electronic component is covered with the cover, and a connector which electrically connects the electronic component to the outside. The liquid discharge portion includes a flow passage in which liquid which has intruded into an internal space in the casing formed by the base, the cover and the connector for housing the electronic component flows, and an opening portion which discharges the liquid to the outside of the internal space via the flow passage.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: March 22, 2011
    Assignee: Denso Corporation
    Inventor: Koichi Kato
  • Publication number: 20110063804
    Abstract: A portable electronic device includes a main body and a power converter. The main body includes a first housing and a main circuit disposed within the first housing. The main circuit includes a power input end located on a side surface of the first housing. The power converter includes a second housing and a power modulating circuit. A side surface of the second housing is detachably assembled to the side surface of the first housing. The modulating circuit is disposed in the second housing, and includes a power output end and a utility power input end. The power output end is located on the side surface of the second housing, and the utility power input end is located on another side surface of the second housing. The power modulating circuit is capable of modulating utility power from the utility power input end to modulated power suitable for the main circuit, and the modulated power s outputted from the power output end.
    Type: Application
    Filed: September 12, 2009
    Publication date: March 17, 2011
    Inventors: Hou-Yuan Lin, Yi-Yuan Liu, Chien-Chih Kao
  • Patent number: 7907420
    Abstract: A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: March 15, 2011
    Assignee: PANASONIC Corporation
    Inventors: Koichi Nagai, Minoru Yamamoto, Ken Takano, Tatsuo Sasaoka, Kazumichi Shimizu
  • Patent number: 7896531
    Abstract: Providing an electrical assembly, which can protect electric components provided at the electrical assembly from damage, and minimize output amount of recycle material and waste material, a functional module as the electric assembly includes a lamp and a switch as the electric components. The lamp extends from a center area of a bottom wall of a housing so as to slant toward an outside of the housing according to going apart from the bottom wall. The switch extends vertically from one end of the bottom wall. Ends of the lamp and the switch far from the bottom wall project out of the housing. When the functional modules are transported to an assembling line, the pair of functional modules is stacked on each other so as to arrange the lamp face to each other in parallel, and fixed to each other.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: March 1, 2011
    Assignee: Yazaki Corporation
    Inventors: Kentaro Nagai, Yoshinori Hirayama, Shinji Yamada
  • Patent number: 7894192
    Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: February 22, 2011
    Assignee: Round Rock Research, LLC
    Inventors: David J. Corisis, Walter L. Moden, Terry R. Lee
  • Publication number: 20110038126
    Abstract: An improved smoke detector device comprising a base for mounting to a place on a ceiling or a wall via a mounting means; and a ring for removably attaching to the base, the ring comprising at least two modules that removably connect together via a connecting means to form the ring, wherein each module comprises an inner chamber and a door, the inner chamber of each module can hold an item, the door of each module can move between an open position and a closed position for respectively allowing and preventing access to the inner chamber of the module.
    Type: Application
    Filed: October 23, 2009
    Publication date: February 17, 2011
    Inventor: Daniel P. Casey
  • Publication number: 20110026211
    Abstract: An all-in-one electrical device includes a front enclosure module, a rear enclosure module, a touch screen, and a middle module. The front enclosure module includes a frame. An opening is defined in the frame. A number of restricting members extend backwards from the frame. The rear enclosure module includes a cover detachably fixed to the frame. The touch screen is received in the frame and exposed through the opening. A forward freedom of motion (FOM) of the touch screen is restricted by the frame. Leftward, rightward, upward and downward FOMs of the touch screen are restricted by the number of restricting members. The middle module is detachably fixed to the frame and received between the frame and the cover. The middle module restricts a backward FOM of the touch screen.
    Type: Application
    Filed: December 20, 2009
    Publication date: February 3, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YI-LAN LIAO, TSUNG-HSI LI, SHU-YUN HUANG
  • Patent number: 7865648
    Abstract: The invention pertains to a modular data transmission system with several modules or bus nodes that can be arranged adjacent to one another in a row. The data transmission system comprises a first bus node that features a first transmitter for the wireless transmission of data and an electrical connector, as well as a second bus node that features a first receiver for the wireless reception of data and an electrical connector. Both bus nodes are detachably fixed on a mounting rail such that they are arranged adjacent to one another in a row. The first and second bus nodes are respectively detachably connected to a bus receptacle, wherein each bus receptacle features an electrical mating connector that is coupled to the electrical connector of the respective bus node in the connected state in order to transmit energy, as well as a positioning device for positioning the respective bus node.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: January 4, 2011
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventors: Detlev Kuschke, Johann Derksen, Michael Hoffmann, Stephan Grewe, Dominik Weiss
  • Patent number: 7857267
    Abstract: A mounting assembly is provided for mounting equipment on a frame including a front pair of vertical rails and a back pair of vertical rails. The mounting assembly includes a bracket for attaching a front side of the equipment to one of the front rails and a hinge for attaching a back side of the equipment to one of the back rails.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: December 28, 2010
    Assignee: Alcatel Lucent
    Inventor: Ronald Franklin Watts
  • Patent number: 7859856
    Abstract: A protocol analyzer for analyzing traffic on a bus. A tap card is used to tap into a bidirectional bus. The tap provides a pass through connection from the card to the host and taps off of the bus. While tapping off the bus, stubs lengths are minimized and input capacitance is minimized. A repeater that preferably has no internal termination provides a differential input and a differential output or a single ended output. The bus lines are input to one of the inputs in the differential inputs and a reference voltage is provided to the other differential input. The reference voltage enables the tap to determine if the data is high or low. A jumper is also included in the tap such that the reference voltage can be selected from the host or from the pod.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: December 28, 2010
    Inventor: Eric J. Lanning
  • Publication number: 20100321900
    Abstract: A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector.
    Type: Application
    Filed: August 30, 2010
    Publication date: December 23, 2010
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Bok Kyu CHOI, Sang Joon LIM, Eul Chul JANG
  • Publication number: 20100315789
    Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.
    Type: Application
    Filed: October 5, 2007
    Publication date: December 16, 2010
    Inventor: Junya Sato
  • Publication number: 20100302729
    Abstract: A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.
    Type: Application
    Filed: May 27, 2009
    Publication date: December 2, 2010
    Inventors: DON TEGART, ZHENNING LIU
  • Publication number: 20100296256
    Abstract: A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair.
    Type: Application
    Filed: April 29, 2010
    Publication date: November 25, 2010
    Applicant: MOSAID TECHNOLOGIES INCORPORATED
    Inventors: Peter Gillingham, Roland Schuetz
  • Publication number: 20100290197
    Abstract: A number of structural modules are configured to be secured together and to be secured to a foundation. Each of the structural modules is without one or more sidewalls, such that when the structural modules are secured together they form a building structure that encloses an open region which continuously extends through interiors of the structural modules. Each of the number of structural modules is structurally formed to be independently transported. A power module is configured to be secured to one of the structural modules and to the foundation. The power module is defined as an enclosed structure and is structurally formed to be independently transported. The power module is equipped with electrical components for supplying and distributing electrical power to a pre-defined layout of data equipment to be deployed within the open region of the building structure formed by the number of structural modules.
    Type: Application
    Filed: March 19, 2010
    Publication date: November 18, 2010
    Applicant: NxGen Modular, LLC
    Inventors: Rudy Bergthold, David Ibarra
  • Publication number: 20100271787
    Abstract: A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
    Type: Application
    Filed: March 23, 2010
    Publication date: October 28, 2010
    Inventors: Martin Holzmann, Christian Ohl, Harald Emmerich
  • Patent number: 7821792
    Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: October 26, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Eric Peterson
  • Patent number: 7813143
    Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: October 12, 2010
    Assignee: ADC Telecommunications, Inc.
    Inventors: James Dorenkamp, Vern Loch, Jeffrey Peters, Wayne Nelson
  • Patent number: 7813118
    Abstract: An device bracket for mounting devices to a flat panel display incorporates a device hub able to form a network with devices coupled to it where the device hub associates one or more physical characteristics to devices coupled to it, including locality, orientation and position relative to the device hub. The device hub is conveys data indicating these physical characteristics associated with these devices to one or more of the devices coupled to it, thereby either enabling the devices with those physical characteristics to modify the manner in which they perform their own functions in response to those physical characteristics, or enabling other devices to modify data that they exchange with the devices having those physical characteristics in response to those physical characteristics.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: October 12, 2010
    Assignee: Bose Corporation
    Inventor: Benjamin Douglass Burge
  • Patent number: 7800911
    Abstract: A fastening element for connecting a housing to a printed circuit board comprises a first surface having a through hole for receiving a connecting element for connecting the fastening element to the housing, at least one first mounting pin extending from the first surface for mounting the fastening element to the printed circuit board, a second surface from which a second mounting pin extends for mounting a fastening element to the printed circuit board and a third surface connecting the first surface and the second surface.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: September 21, 2010
    Assignee: Harman Becker Automotive Systems GmbH
    Inventor: Robby Rieger
  • Patent number: 7795728
    Abstract: An electronic component includes a multi-layer substrate having an upper side and under side, and at least one integrated impedance converter. The electronic component also includes at least one chip component having external contacts. The at least one chip component is disposed on the upper side of the multi-layer substrate, and is electrically connected to the at least one integrated impedance converter.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: September 14, 2010
    Assignee: Epcos AG
    Inventor: Andreas Przadka
  • Patent number: 7793026
    Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.
    Type: Grant
    Filed: October 13, 2008
    Date of Patent: September 7, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Benjamin Abraham, Yancy Chen
  • Publication number: 20100214747
    Abstract: The present invention relates to a modular electric system with a base module (2, 11) comprising a substrate (3, 12), a power supply (40), power/data transmission means (4, 16) and holding means; at least one load module (7, 20, 30) comprising an cc electric load, a power/data receiving means (8, 26) and a holding means, said load module (7, 20, 30) being adapted to be placeable on said substrate (3, 12) in first and second positions, wherein in said first position (connecting position) the transmission means (4, 16) of said base module interact with said receiving means (8, 26) of said load module (7, 20, 30) and in said second position (repelling position) interaction of said transmission means (4, 16) and said receiving means (26) is not allowed or possible.
    Type: Application
    Filed: February 7, 2008
    Publication date: August 26, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Joseph H.A.M. Jacobs, Dirk Hente, Eberhardt Waffenschmidt
  • Publication number: 20100208434
    Abstract: A mobile terminal having a detachable sub-module is disclosed. The mobile terminal includes a sub-module having a sub-function configuration unit formed with parts for performing a function and a main terminal having a display unit at a front surface and a connection unit at a rear surface for coupling the sub-module to the main terminal. A magnet is installed at a side surface of the connection unit or the sub-module, and the sub-module is coupled to the main terminal or is detached from the main terminal through the magnet. Enhancement of the portability and function quality of mobile terminals that support various functions is achieved by coupling a sub-module for performing a function to the main terminal having a display unit that allows user interactivity with the mobile terminal.
    Type: Application
    Filed: February 12, 2010
    Publication date: August 19, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu Guen Kim, Sang Min Hyun, Seog Guen Kim, Yun Su Kim
  • Patent number: 7768799
    Abstract: The invention is directed to an apparatus (1) for accommodating a plurality of individual inverters (2), comprising a rack, the individual inverters (2) being removably mountable to the side elements of said rack, said rack having at least one terminal block (10) for receiving cables for current supply and evacuation.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: August 3, 2010
    Assignee: SMA Solar Technology AG
    Inventors: Gunther Cramer, Bernd Engel
  • Publication number: 20100182753
    Abstract: A system for mounting a device to a host, such as an appliance, includes elongated, substantially parallel device interfaces for removably mounting the device to the host. The device interfaces can include rails, slots and/or electrical conductors.
    Type: Application
    Filed: March 29, 2010
    Publication date: July 22, 2010
    Applicant: WHIRLPOOL CORPORATION
    Inventors: JAMES W. KENDALL, RICHARD A. MCCOY, AMERESH VISWANATHAN, JOHN M. KNIGHT, CHRISTOPHER S. MOES, DAVID A. WEINKAUF
  • Publication number: 20100157546
    Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate.
    Type: Application
    Filed: December 22, 2008
    Publication date: June 24, 2010
    Inventor: James A. Reimund
  • Patent number: 7738255
    Abstract: An electronic module includes a board unit having a handle and a module housing. The handle includes a grip portion and a pair of leg portions. The leg portions have engagement convex portions extending from portions serving as rotary pivots, of the leg portions. The module housing includes an engagement concave portion provided to correspond to the engagement convex portions. When the board unit is inserted into the module housing, by rotating the handle around the rotary pivots in a direction along which the grip portion approaches the panel portion, the engagement convex portions are brought into contact with a part of the engagement concave portion to produce a force in a direction, along which the board unit is pressed into the module housing.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: June 15, 2010
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Masahiko Nishimoto, Masato Kobayashi
  • Publication number: 20100128446
    Abstract: A modular building system arrangement includes a plurality of electrical building systems. Each electrical building system has a housing with a mechanical connector that is connectable with a like connector of each other building system housing. Members of any subset of the building system housings are connectable with each other to form a building system assembly. The building systems of the building system assembly conjointly define an electrically conductive pathway interconnecting each of the building systems of the building system assembly. The pathway carries power and/or data.
    Type: Application
    Filed: November 21, 2008
    Publication date: May 27, 2010
    Applicants: Bosch Security Systems, Inc., Robert Bosch GmbH
    Inventor: William DiPoala
  • Patent number: 7724543
    Abstract: A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: May 25, 2010
    Assignee: Fujitsu Limited
    Inventors: Fujio Ozawa, Tetsuya Murayama, Junichi Hayama, Hiroyuki Abe, Hisato Sato
  • Publication number: 20100103629
    Abstract: A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.
    Type: Application
    Filed: October 29, 2008
    Publication date: April 29, 2010
    Inventors: Brian P. Carlson, William M. Christensen, Chris J. Steep, Ryan J. Urban
  • Publication number: 20100033936
    Abstract: A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 11, 2010
    Inventors: Jenny Jiayan Shen, Yong Su, Zhunming Du, Ying Shen
  • Patent number: 7656669
    Abstract: A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: February 2, 2010
    Assignee: Mitac International Corp.
    Inventors: Mario J. D. Lee, Tomonori Hirai, Jyh Ming Jong
  • Publication number: 20100020480
    Abstract: An electronic device is provided, including a first module, a second module, a control module, and a torsion hinge. The second module is rotatably disposed on the first module between a first position and a second position. The control module is slidably disposed on the first module between a third position and a fourth position. When the control module is in the third position, the second module is restricted to rotate with respect to the first module. When the control module is in the fourth position, the second module is released by the control module and rotatable with respect to the first module.
    Type: Application
    Filed: July 17, 2009
    Publication date: January 28, 2010
    Inventors: Hsiao-Chuan HUANG, Yi-Bin HO
  • Publication number: 20090290312
    Abstract: A structural configuration and methods. A structural configuration includes a support structure having at least one module supporting a computer server disposed therein. Each module includes at least one support member separating the module from each adjacent module. The support member is configured to transmit simultaneously both power and data. A method for connecting servers includes placing a first server inside a first module which includes a first structural member configured to conduct both electrical power and data to the first server. A second server is placed inside a second module which includes a second structural member. The second module is placed on top of the first module. The first member supports the second module and separates the second module from the first module, resulting in the first member connecting to the second member. A method for using a computer support structure is also included.
    Type: Application
    Filed: June 17, 2008
    Publication date: November 26, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sebastien Bousseton, Arnaud Lund
  • Publication number: 20090279268
    Abstract: A module is provided. The module includes a first module unit provided at a top surface with a cavity and a second module unit on which one or more electronic devices are mounted. The second module unit is at least partly received in the cavity of the first module unit.
    Type: Application
    Filed: April 6, 2007
    Publication date: November 12, 2009
    Inventor: Kyung Joo Son
  • Patent number: 7609529
    Abstract: A panel assembly structure including a first connecting portion, a first screw, a second connecting portion and a second screw for fixing a display panel on a panel cover is provided. The first connecting portion having a first connecting through hole is formed on the cover and extends toward a first side of the panel. The first screw is screwed into the first connecting through hole and a first panel threaded hole on the first side for fastening the first connecting portion and the first side. The second connecting portion having a second connecting through hole is formed on the inner surface of the cover and extends toward a second side of the panel. The second screw is screwed into the second connecting through hole and a second panel threaded hole on the second side of the panel for fastening the second connecting portion and the second side.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: October 27, 2009
    Assignee: Compal Electronics, Inc.
    Inventors: Jung-Sheng Chiang, Po-An Lin, Wen-Yi Huang
  • Publication number: 20090257200
    Abstract: A device, a module being insertible into a housing-forming recess of the device, energy and/or data being transmittable in a contactless manner.
    Type: Application
    Filed: October 13, 2006
    Publication date: October 15, 2009
    Inventor: Josef Schmidt
  • Publication number: 20090257202
    Abstract: An expendable electrical connector uses a plurality of modular housings sequentially assembled for receiving receptacle assemblies. The expendable electrical connector does not use dedicated moulds for different numbers of the receptacle assemblies and cost is decreased. Two neighboring modular housings share a side plate so that total length of the expendable electrical connector will be shortened and cost will also be decreased. Each of the modular housings may be made from a metallic sheet by punching process, and used to cover each of the receptacle assemblies and the modular housings can be connected with each other. The modular housings provide a good performance of grounding and shielding electromagnetic interference without dedicated grounding steps for individual receptacle assemblies.
    Type: Application
    Filed: May 29, 2008
    Publication date: October 15, 2009
    Applicant: DRAGONSTATE TECHNOLOGY CO., LTD.
    Inventors: KUO-CHI LEE, CHIN-HUANG LIN
  • Publication number: 20090257201
    Abstract: An device bracket for mounting devices to a flat panel display incorporates a device hub able to form a network with devices coupled to it where the device hub associates one or more physical characteristics to devices coupled to it, including locality, orientation and position relative to the device hub. The device hub is conveys data indicating these physical characteristics associated with these devices to one or more of the devices coupled to it, thereby either enabling the devices with those physical characteristics to modify the manner in which they perform their own functions in response to those physical characteristics, or enabling other devices to modify data that they exchange with the devices having those physical characteristics in response to those physical characteristics.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Inventor: Benjamin D. Burge
  • Publication number: 20090257203
    Abstract: A mobile communication device with replaceable function modules includes a main body and an externally connected device. The main body serves as a central member, and has a main hybrid joint including an electrical contact and a magnetic joint. The main hybrid joint of the main body is joined to a device hybrid joint of the externally connected device, so as to realize the function thereof. When joined together, the main body activates a functional module of the externally connected device functional module. In addition, the main body and the externally connected device are further joined through the magnetic joints. Therefore, when separated by accidentally falling onto the ground, the mobile communication device can be rejoined through the magnetic joints, and thus it is unnecessary to worry about the unavailability due to the break-down of the joint portion.
    Type: Application
    Filed: April 13, 2009
    Publication date: October 15, 2009
    Inventors: Sea-Weng YOUNG, Po-Cheng Chen, Kung-Ming Kao
  • Patent number: 7599183
    Abstract: An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: October 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Karl Klaus Dittus, Michael Sven Miller, Whitcomb Randolph Scott, III, Joel Edwin Walker
  • Patent number: 7599188
    Abstract: An electronic apparatus including a first body, a second body, and a pivot mechanism is provided. The pivot mechanism includes a base, a pivot, a sleeve, and a holder. The base is fastened with the first body, and the pivot is fastened with the base. The sleeve has a hole closely fitting a section of the pivot, and the sleeve applies an elastic force on the pivot, so as to form a frictional force between the hole and the pivot. The holder having a first opening is fastened with the second body. A first section of the sleeve closely fits the opening, so as to be fastened with the first opening. The frictional force between the hole and the pivot holds the second body, such that the second body may pivot relative to the first body manually.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: October 6, 2009
    Assignee: Compal Electronics, Inc.
    Inventor: Kuan-Hsun Chen
  • Patent number: 7591067
    Abstract: A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring layer, is disclosed. The chip is attached to a heat sink portion of the patterned carrier metal layer. The dielectric layer is formed over the patterned carrier metal layer and covers the chip. The wiring layer is formed on the dielectric layer for electrically connecting the patterned carrier metal layer and the chip. In the process of manufacturing the thermally enhanced coreless thin substrate with embedded chips, the heat sink portion is formed by patterning the patterned carrier metal layer after finishing the formation of the wiring layer. Thus, a thin board type electronic device that combines a heat sink, a carrier substrate and embedded chips together to form an integral unit is fabricated.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: September 22, 2009
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Chien-Hao Wang
  • Patent number: 7589974
    Abstract: A modular computer system is provided. In one embodiment, the system includes a computer server having a first printed circuit assembly disposed within a first housing and an expansion connector. The computer server is configured to be coupled to a modular expansion unit via the expansion connector to convert the computer server from a base configuration to an expanded configuration. In various embodiments, the expanded configuration may provide additional processing power, additional memory, or the like. A method of assembling a modular computer system is also provided.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: September 15, 2009
    Assignee: Helwett-Packard Development Company, L.P.
    Inventors: John R. Grady, Jeffery M. Giardina, Aaron M. Albaugh
  • Publication number: 20090180259
    Abstract: The invention discloses a portable media player for playing DVD and IPOD including a base (1) defining a first docking bay (3) for a DVD host and a second docking bay (4) for a IPOD, a cover (2) with a display attached to the base, and a locking device (5) attached at the base for obstructing the detachment of the IPOD. The locking device includes a through hole (7), a resilient piece (8), and a protruding member (9). The base has a rotating shaft (6) and a groove (10). When the resilient piece is engaged into the groove, the protruding member is adjacent to the IPOD and obstructs the detachment of the IPOD.
    Type: Application
    Filed: January 14, 2008
    Publication date: July 16, 2009
    Applicant: ACTION TECHNOLOGY (SZ) CO., LTD.
    Inventor: Juen Tien Peng
  • Publication number: 20090168370
    Abstract: An improved power supply and platform for a military radio has been developed. The apparatus includes a base that is adapted and arranged for supporting a HARRIS 117 radio and a power amplifier adapted to amplify radio frequency output of the radio. The connectors include an electrical connector for the radio and a connector for the amplifier. A power supply is housed within the assembly. A power supply for the connector to the amplifier is also housed within the assembly, Also included is a wiring harness for a SINCGARS LS/671 device and a LED indicator to identify which radio is in operation for multiple radio configurations.
    Type: Application
    Filed: January 26, 2009
    Publication date: July 2, 2009
    Applicant: Perkins Technical Services, Inc.
    Inventors: Frank N. Perkins, III, Jeffrey K. Taylor, Bruce Weddendorf, Lloyd W. Childs
  • Patent number: 7542296
    Abstract: A system of keying implementation for swapping paired devices is provided. The system includes a controller module having a first keying member, a power supply unit having a second keying member, and a chassis having a plurality of receiving slots for receiving the controller module and the power supply unit. When the controller module and the power supply unit are a matched pair and when the controller module and the power supply unit are fully inserted, next to each other, into the plurality of receiving slots, the first keying member and the second keying member do not interfere with each other so that the power supply unit may supply power to the controller module.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: June 2, 2009
    Assignee: Network Appliance, Inc.
    Inventors: David J. Baik, George Feltovich, Brad Reger, David Willheim, Harold Miyamura
  • Publication number: 20090129031
    Abstract: A flat pressure sensor of the invention is prepared by processing a thin film of a polymer material to have plurality of substantially square openings 24. A planar member 22 of the flat pressure sensor thus obtained has a net-like structure including multiple element formation areas 26 and multiple bridging areas 28 that respectively bridge the multiple element formation areas 26. Pressure sensor elements 30 are provided in the multiple element formation areas 26 of the planar member 22. A wiring to the pressure sensor elements 30 is formed on the multiple bridging areas 28. The net-like structure enables the flat pressure sensor to be stretched in diagonal directions without arrangement of the bridging areas 28 and to be deformed to a curved surface. The flat pressure sensor of the invention is thus attached to a curved surface, for example, a spherical surface.
    Type: Application
    Filed: September 27, 2005
    Publication date: May 21, 2009
    Applicant: THE UNIVERSITY OF TOKYO
    Inventors: Takao Someya, Takayasu Sakurai, Hiroshi Kawaguchi, Tsuyoshi Sekitani
  • Publication number: 20090086442
    Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 2, 2009
    Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.
    Inventors: Hideyuki SAKAMOTO, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa