Selective Connections Patents (Class 361/733)
  • Patent number: 5822190
    Abstract: A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: October 13, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Iwasaki
  • Patent number: 5808876
    Abstract: A power distribution system utilizing a power distribution circuit board having a front and back side with at least one connector on each side. The connector on the front side is disposed to mate with a selected power supply and the connector on the back side is disposed to mate with a substantially identical power supply. The connector on the back side is rotated 180.degree. so that substantially identical power supplies can be located in close proximity to each other while maintaining required conductor spacing in order to provide an improved power distribution system.
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: September 15, 1998
    Assignee: International Business Machines Corporation
    Inventors: Brian Scott Mullenbach, Jan Douglas Smid
  • Patent number: 5798907
    Abstract: A wearable computing device includes at least one computing-device component module and flexible circuitry operably connected to the module. The module includes a top module portion, a bottom module portion, and at least one protrusion for holding the top module portion in substantially fixed relationship with the bottom module portion. The protrusion passes into and/or through the flexible circuitry. A plurality of such modules are also contemplated.
    Type: Grant
    Filed: December 2, 1996
    Date of Patent: August 25, 1998
    Assignee: ViA, Inc.
    Inventor: Craig M. Janik
  • Patent number: 5793615
    Abstract: This invention relates to a multiplex control of components and subsystems in motor vehicles having: a central electronic control unit and multiplex bus electronic units (3) associated with each component and each subsystem. The multiplex bus electronic units (3) are incorporated in the casings (2) of the connectors, the same having on the component side (2b) the requisite number of contacts and on the back a four-pole multiplex connector (1, 2a) for two signal lines and two power lines.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: August 11, 1998
    Assignee: Framatome Connectors International
    Inventors: Friedrich Bach, Jurgen Hitz, Helmut Steinhardt
  • Patent number: 5790380
    Abstract: A multiple chip module architecture capable of forming structures having selectable aspect ratios which themselves form the basis for higher levels of integration in analogous manner. The modular architecture uses a flexible interconnect of patterned copper on polymer to successively reorient the connection plane between successive levels, permitting the selective stacking of module levels to create the desired aspect ratio of the multiple chip module. Interconnection between levels may be accomplished by solder reflow, direct dendritic bonding, or connection through a dendritic interposer.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: August 4, 1998
    Assignee: International Business Machines Corporation
    Inventor: Richard Francis Frankeny
  • Patent number: 5783870
    Abstract: Stackable ball grid array packages are disclosed, wherein a plurality of separate ball grid array packages may be stacked, one on top of another, and interconnected by conductive terminals located on opposite surfaces of each of the ball grid array packages. Thus, the mounting of ball grid array packages on a printed circuit board may be conducted in three dimensions rather than two dimensions, requiring considerably less printed circuit board surface area and reducing parasitic inductances and capacitances between the terminals of the stacked ball grid array packages. An air gap is formed between adjacent, stacked packages for cooling. Connections between adjacent packages are made by conductive epoxy and noble metal balls.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: July 21, 1998
    Assignee: National Semiconductor Corporation
    Inventors: Shahram Mostafazadeh, Joseph O. Smith
  • Patent number: 5774338
    Abstract: A body integral electronics package housing is formed of cloth material that simulates a person's garment, such as a poncho or vest. The housing contains various pockets to confine various electronic modules, including a front pocket of such size as to overlie the breast and midriff portions of the person's torso. The front pocket confines a plurality of rigid electronic modules that are supported within the pocket in a row and column array. The user may twist or turn his torso and bend forward or back and the foregoing array, and the modules do not restrict that movement. Instead, the position of the individual modules independently adjusts to the torso's position.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: June 30, 1998
    Assignee: McDonnell Douglas Corporation
    Inventor: Francis Christopher Wessling, III
  • Patent number: 5764497
    Abstract: The circuit board connecting method and a connection structure. A first flexible board is adhered to a first surface of the circuit board at a first temperature, and then a second flexible board is adhered to a second flexible board at a second temperature lower than the first temperature.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: June 9, 1998
    Assignee: Minolta Co, Ltd.
    Inventor: Yoshiyuki Mizumo
  • Patent number: 5752838
    Abstract: A control unit including an inverter (1) and a terminal block (2) connectable to wires (8) in which an external signal for the inverter (1) is directly delivered to the inside of the inverter (1) when a first additional device (3a) is not connected to the inverter (1), and an external signal for the inverter (1) is delivered via an internal circuit in a first additional device (3a) to the inside of the inverter (1) when the first additional device (3a) is connected to the inverter (1). The terminal block (5) includes screws (14) for connection to external signal wires (8) and upper and lower sets of contact pieces (15, 16) that can be pressed together or shorted when the inverter (1) is not connected to the first additional device (3a).
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: May 19, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yuji Nishizawa
  • Patent number: 5731956
    Abstract: An electronic assembly of two planar electronic devices for insertion into a shelf for back plane connection. Each device may be a printed circuit board or a circuit pack incorporating such a board. A flexible flat cable extends between front ends of the devices to interconnect their circuitry. This cable is torsionally flexible to allow relative pivoting movement of the electronic devices in their respective planes. The cable is also bendably flexible to allow movement towards each other or apart of the rears of the electronic devices. A movement limiting device restricts the degree of relative movement of the electronic devices. The relative movement overcomes tolerance issues between terminal positions of one device relative to the other during connection into the back plane and damage to terminals and connectors is avoided.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: March 24, 1998
    Assignee: Northern Telecom Limited
    Inventor: Radu-Marko Nicolici
  • Patent number: 5721672
    Abstract: A panel sub-system for a life safety system having a plurality of inter-connected panels, each panel including a local rail, and a plurality of modules, each comprising a module circuit board, inter-connected by the local rail. The first of the modules have a central processing unit, and the remainder I/O modules having a variety of functions, as well as at least two channel members containing respective rail circuit boards defining each local rail. Moreover, each board has spaced electrical connectors for connecting to the respective module circuit boards.
    Type: Grant
    Filed: May 10, 1996
    Date of Patent: February 24, 1998
    Assignee: General Signal Corporation
    Inventors: Hilario S. Costa, Kenneth W. Patterson
  • Patent number: 5701233
    Abstract: Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or "tub" of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: December 23, 1997
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Robert E. DeCaro, Ying Hsu, Michael K. Miyake
  • Patent number: 5691885
    Abstract: Circuit supporting modules form a three-dimensional communication interconnect mesh. A first embodiment three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure. In a second embodiment the interconnect is hexahedral. A characteristic of both is embodiments is that, although connections are made to plural other modules, the physical connections are made along the same direction.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: November 25, 1997
    Assignee: Massachusetts Institute of Technology
    Inventors: Stephen A. Ward, Gill A. Pratt, John N. Nguyen, John S. Pezaris, Norman Margolus
  • Patent number: 5689402
    Abstract: A docking adapter includes a male HDI 30 type connector (for connecting to a "POWERBOOK" portable computer) and a female DB 25 type connector (for connecting via a SCSI bus cable to either a "MACINTOSH" personal computer or a SCSI external hard drive). The pins of the HDI type connector are electrically connected to the corresponding pins of the DB type connector. The adapter includes a switch having an actuated position for grounding pin 1 of the HDI type connector to "dock" the portable computer in a disk operating mode facilitating data transfer with the "MACINTOSH" over the SCSI bus. When not in the actuated position, the portable computer may be connected to and access the external hard drive over the SCSI bus. The adapter also includes a light emitting diode (LED) connected between the termination power pins of the DB and HDI connectors and ground to monitor for the presence of termination power on the SCSI bus.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: November 18, 1997
    Assignee: APS Technologies
    Inventor: Richard Anthony Ralston, Jr.
  • Patent number: 5677830
    Abstract: An electronic circuit board enclosure comprised of a planar member having dimensions at least equal to dimensions of the circuit board, first pillars fixed to at least one side of the planar member and extending orthogonally to the planar member above the planar member, apparatus for aligning and fixing bottoms of second pillars of another circuit board enclosure to tops of the first pillars, apparatus for fastening a first circuit board to and above the planar member, and locating apparatus for precisely locating the fastening position of the circuit board to the planar member relative to the first pillars, whereby the position of the first circuit board can be located precisely relative to another circuit board fastened to another circuit board enclosure.
    Type: Grant
    Filed: March 2, 1995
    Date of Patent: October 14, 1997
    Assignee: Mitel Corporation
    Inventors: David A. Nogas, Willi Lotz, Michael G. Emler
  • Patent number: 5666272
    Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: September 9, 1997
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Dale Thomas Moore, Frank Sigmund, Fred Chevreton
  • Patent number: 5627413
    Abstract: A circuit disables an on-board voltage regulator when an upgrade voltage regulator is installed. The system including the voltage regulator disable circuit of the preferred embodiment comprises an on-board voltage regulator circuit, a receptacle, coupled to the on-board voltage regulator circuit, for receiving an upgrade voltage regulator module, and a disable circuit coupled to the on-board voltage regulator circuit and the receptacle, the disable circuit being activated upon insertion of the upgrade voltage regulator module to disable an output of the on-board voltage regulator circuit.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: May 6, 1997
    Assignee: Intel Corporation
    Inventors: Taha Mughir, Tom Rampone, Dave Landolf, Hal Massie
  • Patent number: 5604666
    Abstract: The structure of an outdoor communication device includes a device body and a mounting base. The device body includes a device body, a disk-like mounting portion, a plurality of units, and a cylindrical cover. The units are enclosed in rectangular parallelepiped cases and are stacked and mounted on the mounting portion and serve to separately store electrical circuits for driving the device. The cylindrical cover has an opening portion on one end face side and serves to store the stacked units. The opening portion is fixed to the mounting portion. The mounting portion is detachably mounted on the mounting base such that the device body is suspended from and fixed to the mounting base with the mounting base being located above the device body. Fixing members are used to fix the units while the units are stacked on the mounting portion, such that the units are stacked substantially in a form of a cross.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: February 18, 1997
    Assignee: NEC Corporation
    Inventor: Kazuhisa Yoshizawa
  • Patent number: 5603044
    Abstract: An interconnection network comprises a pair of backplanes for receiving X pluggable node cards. The pair of backplanes include X backplane connector groups, each backplane connector group adapted to receive mating connectors from a pluggable node card. Each backplane connector group includes X/2 connectors. A first backplane includes first permanent wiring which interconnects a first subset of pairs of connectors between backplane connector groups. A second backplane includes second permanent wiring which interconnects a second subset of pairs of connectors between backplane connector groups. The first permanent wiring and second permanent wiring connect complementary subsets' of pairs of the connectors. A plurality of node cards, each including a card connector group, pluggably mate with the backplane connector groups. Each node card further includes a frontal connector that is adapted to receive a cable interconnection.
    Type: Grant
    Filed: February 8, 1995
    Date of Patent: February 11, 1997
    Assignee: International Business Machines Corporation
    Inventors: Narasimhareddy L. Annapareddy, Damon W. Finney, Michael O. Jenkins, Larry B. Kessler, Donald J. Lang, Song C. Liang, David N. Mora, David A. Plomgren, Peter P. Urbisci, Andrew D. Walls
  • Patent number: 5583749
    Abstract: A reconfigurable apparatus for computing systems including a set of baseboards and a family of daughtercards, together with a programmable interface to an external bus for a host system. Daughtercards attach to the baseboard through complementary connectors mounted on the baseboard and the daughtercards. In addition, daughtercards are constructed to allow stacking of daughtercards vertically. The baseboard and daughtercard approach of the present invention allows simple, incremental upgrade of installed boards by adding or replacing the daughtercards and allows simple migration to new systems by changing baseboards.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: December 10, 1996
    Assignee: Altera Corporation
    Inventors: Harry L. Tredennick, David E. Van den Bout
  • Patent number: 5552962
    Abstract: Disclosed are interconnect and cross-connect equipment which permit easy cutover and restoration of telecommunications services. Coupled to plug-receiving jacks is a series of relays which are not activated until a button is depressed after the plugs are inserted to effect the cutover.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: September 3, 1996
    Assignee: AT&T Corp
    Inventors: Clay A. Feustel, John M. Scaglione
  • Patent number: 5541810
    Abstract: An expandable automation system includes both a programmable controller that is capable of stand-alone operation, and a modular programmable controller. The programmable controller that is capable of standalone operation has an interface, such as a multipole plug connector, for connecting expansion units. The modular programmable controller consists of a central processing unit and expansion modules. The expansion modules of the modular programmable controller can be used as expansion units for the programmable controller that is capable of standalone operation.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: July 30, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventors: Peter Donhauser, Richard Gmeiner
  • Patent number: 5526230
    Abstract: A device and method for interconnection packages in a stack. Each package encapsulates, for example a semiconductor chip containing an integrated circuit, which for example may be a memory. The packages (2) which have connecting pins (21) are mounted on support grid (4) which preferably act as a heat shunt, and are stacked and linked to each other with a resin coating (5). A stack (3) is cut out so that the pins on the packages and one edge of the grids are flush with faces (31, 32) of the stack (3). Connections between the packages themselves, and between the packages and stack connecting pads, are made on the faces of the stack. The connecting pads are where necessary fitted with connecting pins.
    Type: Grant
    Filed: September 21, 1993
    Date of Patent: June 11, 1996
    Assignee: Thomson-CSF
    Inventor: Christian Val
  • Patent number: 5509066
    Abstract: A telephone distribution frame element, of the type including firstly a plurality of input connectors (14E) and output connectors (14S) disposed in rows, and secondly at least one filtering and/or protection module (17) to be inserted between the input connectors (14E) and the output connectors (14S), with channels (16) suitable for guiding the corresponding link wires being associated with the output connectors (14S). According to the invention, the channels (16) associated with the output connectors (14S) in the same row (20) are grouped together inside a guide plate (21) which extends on edge and in alignment with the row (20), and each of the rows (20) of input connectors (14E) and output connectors (14S) aligned in this way with the guide plates (21) is flanked on one side by a passage (22) in which a filtering and/or protection module (17) can extend. Application, in particular, to connection strips.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: April 16, 1996
    Inventor: Yves Saligny
  • Patent number: 5508886
    Abstract: In an electrical system consisting of individual subassemblies, particularly in a control system composed of modules, the individual subassemblies (1, 2) comprise housings, which are adapted to be arranged in a row and for making electric line connections are provided with plug terminals for counterplug terminals on a subassembly carrier. The housings (1, 2) are secured to the subassembly carrier (4) by detachable retaining elements (27, 30, 34), particularly by swivel holders Which permit the housings to be swung up, and by snap holders (27, 28) for locking the housings when they have been swung into the row.
    Type: Grant
    Filed: April 21, 1994
    Date of Patent: April 16, 1996
    Inventors: Erwin Bernecker, Josef Rainer
  • Patent number: 5497471
    Abstract: A new machine design minimizes latency between many high performance processors and a large amount of shared memory. Wire length, latency and skew are minimized by stacking edge connected modules (ECMs). The ECMs are characterized by signal input/output (I/O) pads on three edges, the two opposing inside connector edges and the third global connector edge. The ECMs support multiple processors per module, a plurality of basic storage modules (BSMs) per module, and portions of request and response switches per module. A plurality of processor ECMs and request switch ECMs are stacked in a first stacks and a plurality of BSM ECMs and response switch ECMs are stacked in a second stack. The two stacks are arranged adjacent one another with the request switch ECMs above or below the processor ECMs and the response switch ECMs below or above the BSM ECMs so that the response switch ECMs are adjacent the processor ECMs and the request ECMs are adjacent the BSM ECMs.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: March 5, 1996
    Assignee: International Business Machines Corporation
    Inventor: John B. Gillett
  • Patent number: 5493194
    Abstract: A motor control system and the electrical bus for interconnecting the components of the control system are disclosed herein. The system includes a main motor control unit connected to four motor axis control modules. The control algorithms and commands for the system are stored and executed by the control unit which communicates control commands to the individual motor axis control modules. Each motor control module processes the control commands to control a motor connected to the module, and also communicates feedback signals produced at the associated axis to the control unit. The interconnection between the control unit and the modules is positioned at the face of the components to facilitate removal and insertion of the modules. The electrical bus includes both communications conductors and power conductors, and is included in the interconnection of the components.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: February 20, 1996
    Assignee: Allen-Bradley Company, Inc.
    Inventors: Michael Damiano, John Brubaker, Enoch Smith
  • Patent number: 5459474
    Abstract: An active array antenna, which may be used for radar, includes antenna elements (antelements) supported in a two-dimensional array. The fronts of the elements are protected by a cover. In order to allow easy repair, each column of antelements is associated with a slide-in carrier which simultaneously mates with all antelements of a column. Each carrier has a transmit-receive (TR) module for each antelement with which it mates, and a column beamformer. Each carrier also has logic modules and power supplies for the TR modules. The total width of each slide-in carrier with its TR modules, beamformer, logic and power supplies, is less than or equal to the column-to-column spacing. Each carrier can be slid out from the rear to expose all the active components for each column of antelements, so maintenance can be performed without environmental exposure.
    Type: Grant
    Filed: March 22, 1994
    Date of Patent: October 17, 1995
    Assignee: Martin Marietta Corporation
    Inventors: Joseph A. Mattioli, Ashok K. Agrawal, Norman R. Landry
  • Patent number: 5436799
    Abstract: A modular switching-element block which comprises at least one base body having plug-in locations for switching elements, such as electrical switches, and is fitted with a base body which is split into a plurality of base-body modules which can be plugged into one another. In comparison with a common base body, this arrangement makes possible greater variability of the number of plug-in locations, with respect to freely selectable special fits with switching elements, and reduces the advance-provision cost for a standard fit.
    Type: Grant
    Filed: December 16, 1994
    Date of Patent: July 25, 1995
    Assignee: Mercedes-Benz AG
    Inventors: Karl-Heinz Krieg, Siegfried Klink, Uwe Manzke, Michael Schulcz
  • Patent number: 5434752
    Abstract: A system for controlling staggered connection timing of an adapter module so that live insertion, or "hot swapping", may be performed with the adapter module, has a connector with staggered pins, i.e., some pins being longer than others for initial contact with mating pins of a mating connector. The system further has a latch for controlling the timing of the connection of the staggered pins. As an adapter module is inserted into a housing, the latch allows the adapter module to be in one of three positions: (1) an entirely disconnected position where none of the pins of the adapter module are connected to the pins of the housing connector; (2) a "stopped", or partially connected, position where the longer of the staggered pins are connected between the housing and adapter modules connectors; and (3) a "fully-engaged" position wherein all pins of the connectors are engaged.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: July 18, 1995
    Assignee: International Business Machines Corporation
    Inventors: Joseph D. Huth, Robert F. Pan, Frank J. Pita, Bart P. Reier, Victor E. Valle
  • Patent number: 5418686
    Abstract: Apparatus and electrical circuitry are provided for electrical devices in order to provide electrical isolation of exposed electrical contacts on at least one of multiple modules of the electrical device. The apparatus includes at least one actuating component in one module and at least one sensor component within a second module in electrical communication with electrical circuitry, whereby electrical isolation of the exposed electrical contacts ceases when the sensor apparatus senses a desired location of the module. Placement of the apparatus and electrical circuitry to reside within the modules promotes electrical safety while minimizing tampering with safety aspects of the device. The apparatus and circuitry are useful for medical devices such as handheld diagnostic devices and consumer devices such as telephones.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: May 23, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Alan P. Dieken, David J. Fischer, Jonathan C. Platt, William L. Sondermann
  • Patent number: 5406453
    Abstract: To improve the serviceability, manufacturability and uptime for a computer file server a specially designed planar/riser card assembly is mounted on the computer chassis and includes a card cage structure in which a riser card is secured. Carried on the riser card are I/O card edge connector sockets into which all of the system I/O cards may be plugged. The riser card is hard connected into the system and itself has an edge connector portion. The system planar board is carried on a mounting plate which is screwed to an outer side of the cage structure. A socket connector carried on the planar board receives the edge connector portion of the riser card, thereby electrically coupling the planar board to the riser card. The riser serves as a wiring plane containing only the signals which the planar board would normally provide to the I/O cards through "on planar" connectors.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: April 11, 1995
    Assignee: Dell USA, L.P.
    Inventors: Richard L. Cusato, James D. Curlee
  • Patent number: 5349497
    Abstract: A terminal for receiving and storing information and a reader for reading information and communicating the information to the terminal. A housing is provided which has the terminal and reader integrated therein and also a battery for providing necessary power thereto. A detachable handle can be attached to the housing and includes sides which extend around the sides of the housing as well as partially extending over the top of the housing. An improved mechanism is shown for selectively locking a handle to a terminal. A holster for holding the terminal and handle is also shown. A handle with a scanner integrated therein is attachable to a terminal for receiving and storing information read by the scanner.
    Type: Grant
    Filed: October 5, 1992
    Date of Patent: September 20, 1994
    Assignee: Norand Corporation
    Inventors: George E. Hanson, Steven R. Kunert, Darald R. Schultz, William T. Gibbs, Jon Rasmussen, Robert J. Traeger
  • Patent number: 5233501
    Abstract: A digital communication network having a digital cross-connect system is described for facilitating the insulation, testing, monitoring, restoration and repair of digital telecommunication apparatus. The system includes a plurality of digital cross-connect modules 10. Each module 10 has an input jack 32, and output jack 34, cross-connect input jack 36 and cross-connect output jack 38 mounted on the front panel for providing front panel access. Each of the jacks is mounted to a printed circuit board having printed circuit board terminals. BNC or TNC coaxial connectors are mounted on the rear panel. The jacks and the connectors are interconnected via printed circuit board traces. Each of the modules has a switch structure for interconnecting jacks and for providing termination before break capability. Each of the jacks automatically interrupts the circuit when a coaxial plug is inserted into a respective jack to isolate the conductor.
    Type: Grant
    Filed: February 27, 1992
    Date of Patent: August 3, 1993
    Assignee: Telect, Inc.
    Inventors: Brian J. Allen, Duane B. Kutsch, Donald R. Skinfill