Abstract: There is disclosed a method of manufacturing an electrical component, involving bonding a thin metal foil to an insulating substrate and thereby forming a component blank, and laser machining at least the metal foil of said component blank to produce at least one trench for defining one or more foil tracks, said trench being at least equal in depth to the thickness of the foil so as to prevent current flow across the trench.

Abstract: Automotive control unit having two connectors is provided in an uncomplicated configuration that allows holding durability to be ensured against high external force upon insertion of the connectors, watertightness in a severer environment, and high reliable connecting portions. The automotive control unit includes a board 100 on which an electronic device is mounted; a first connector directly inserted into and attached to a device to be controlled; a second connector 200 for connecting to another control unit; and a housing which holds the board and includes a cover 130 and a case 500 to which the first and second connectors 300 and 200, respectively, are attached. The first connector 300 is configured to be secured to the housing from the outside of the housing. The second connector 200 is held by and secured onto the board and then secured to the housing from the inside of the control unit.

Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).

Abstract: A printed circuit includes a number of conductive wires. Each of the conductive wires includes a first conductive wire section, a second conductive wire section, and a first connection section. The first connection section includes a first end and a second end opposite to the first end, the first end of the first connection section is connected to the first conductive wire section, and the second end of the first connection section is connected to the second conductive wire section. An angle between the first conductive wire section and the first connection section can be in a range from about 90 degrees to about 180 degrees.

Abstract: In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.

Abstract: A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a plurality of first signal lines. The terminals of the first set receive respective ones of a plurality of first signals supplied from a control device. Each of the second sets is provided for a corresponding one of the memory packages. The terminals of each of the second sets contact the corresponding one of the memory packages. The first signal lines extend from respective ones of the terminals of the first set while coupling respective ones of the terminals of each of the second sets. The first signal lines extend on the first surface without extending in the wiring board.

Abstract: A module includes an insulating substrate having an upper surface as a principal surface, a lid member having an internal space with the insulating substrate, and bonded to the upper surface in a first surface, a device element housed in the internal space, a semiconductor element connected to a top surface, which forms the both sides of the lid member together with the first surface, using a resin adhesive, electrodes electrically connected to the device element, and disposed on an upper surface of the insulating substrate in an area other than the connection area with the lid member, and a projection section formed of the same member as the lid member on the upper surface in an area between the electrodes and the lid member in a plan view.

Abstract: The electrical card has power modules constituted by power components and by control components that are carried by strips fastened on a support plate comprising an electrical ground plate. The power components are connected firstly to control buses, and secondly to power buses carried by the support plate and extending in a layer adjacent to the electrical ground plate.

Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract: Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.

Abstract: Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.

Abstract: A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.

Abstract: A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.

Abstract: A communication module including a circuit board having leading and trailing ends and a module axis extending therebetween. The communication module also includes a support wall that is coupled to the circuit board proximate to the leading end. The support wall extends transverse to the module axis and has a wall opening. The communication module also includes an electrical connector that is held by the support wall within the wall opening and has a mating face. The communication module also includes a board interconnect coupled to the circuit board. The communication module also includes a flex cable assembly that is coupled at one end to the array of electrical contacts and at an opposite end to the board interconnect. The electrical connector is permitted to float within the wall opening relative to the support wall.

Abstract: A connecting member for a portable electronic device includes a central cylinder, a first flange portion, a second flange portion, a plurality of first clasps and a number of second clasps. The first flange portion and the second flange portion surround on the central cylinder. The first clasps extend from the first flange portion, and the second clasps extend from the second flange portion.

Abstract: An interface card quick plug-and-unplug device for use with a PCIe interface card is disclosed to include a shell covering a part of the PCIe interface card, and a locating member disposed at one side of the shell and/or the PCIe interface card for engagement with the PCIe slot upon insertion of the PCIe interface card into the PCIe slot. Biasing the locating member allows quick removal of the PCIe interface card from the PCIe slot without any tool. The interface card quick plug-and-unplug device enhances the flexibility of the design of computer circuit layout.

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

Abstract: An embodiment of the present invention provides a wireless module comprising a circuit board module, a USB connector and a wave absorbing film. The USB connector is connected to the circuit board module. The wave absorbing film is disposed on the circuit board module and is extended to overlap at least a part of the USB connector. In addition, a wave-absorbing cavity is formed between the wave absorbing film and the USB connector.

Abstract: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

Abstract: A system includes a rack and one or more computer systems mounted in the rack. At least one of the computer systems includes a circuit board assembly, such as a motherboard, and a chassis coupled to the circuit board assembly. At least a portion of the chassis is made of a shock-absorbing polymeric material, such as an expanded foam material.

Abstract: There is provided a semiconductor module capable of being easily manufactured. The semiconductor module includes: a control part including at least one control device; and a power part including at least one power device, wherein any one of the control part and the power part includes contact pins having elasticity, and the control part and the power part are electrically connected to each other by the contact pins.

Abstract: The present invention provides a method for surface decoration of a three-dimensional object with ease. In one embodiment of the invention, a planar construction article that is foldable into the object is utilized. In another embodiment of the invention, multiple angle plates that are assembled into the object are utilized. The surface decoration process is carried out before the planar construction article is folded or before the angle panels are assembled together thereby to significantly simplify the decoration process of object faces in different orientations. The invention also provides a three-dimensional object obtained from the methods of the invention.

Abstract: The present invention relates to amounting structure for Mini PCI-E equipment is provided. The mounting structure comprises a Mini PCI-E slot and a fixing bracket, wherein the Mini PCI-E slot is welded on surface of a motherboard with an opening upward and perpendicular to the motherboard, the fixing bracket is close to the Mini PCI-E slot and fixed vertically on the motherboard. The fixing bracket includes a first fixing device which includes at least two mounting holes at the same height. The present invention also disclosed a computer using the above mounting structure. The mounting structure of the present invention could significantly reduce the area on the motherboard occupied by the Mini PCI-E equipment via setting the Mini PCI-E slots and the mounting bracket perpendicular to the motherboard. The above mounting structure could also improve the performance of heat dissipation of the Mini PCI-E equipment.

Abstract: A technique which in a portable or laptop ultrasonic diagnosis apparatus, optimizes the position of a hinge mechanism for connecting a display section having a touch panel and a main body and the strength of the main body and also reduce the influence of noise between mutual sections, such as an ultrasonic image processing circuit board, a power source, a CPU board and the like, which are arranged inside the main body is disclosed. According to this technique, on a bottom surface of a bottom case 11 in the main body, a supporting section 12 for supporting a display section 20 is formed to stand upright and extend in a width direction, at a position that is dislocated to a front end F side from a rear end R of a main body 10. Also, a region A in which the ultrasonic image processing circuit board is arranged and regions B, C in which a power source unit and the CPU board are arranged, respectively, are partitioned by means of the supporting section 12.

Abstract: A motherboard assembly includes a motherboard and an expansion apparatus. The motherboard includes a first expansion slot. An edge connector is set on a bottom side of the expansion apparatus to be detachably engaged in the first expansion slot. A number of SATA interfaces and a number of second expansion slots are arranged on the expansion apparatus, and are connected to signal pins and power pins of the edge connector.

Abstract: Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end.

Abstract: A semiconductor power module (10) includes a ceramic multilayer substrate (100), a bonding layer (110), a diffusion layer (120) and a semiconductor device (130). The bonding layer is placed on a first surface (105) of the ceramic multilayer substrate and is provided as a planar thin film layer including conductive bonding parts (111) configured to electrically connect the semiconductor device with the ceramic multilayer substrate and insulating bonding parts (112) configured to isolate the semiconductor device from the ceramic multilayer substrate. Also disclosed is a production method of the semiconductor power module.

Abstract: An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.

Abstract: A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad.

Abstract: An electronic device includes a chassis, a bracket received in the chassis and a cable. A storage device is received in the bracket, and a wire is connected to the storage device. A motherboard is attached to the chassis, and at least two inserting slots are located on the motherboard. A first circuit board is electronically connected to the wire. The cable is electronically connected to the first circuit board and includes a connecting component and at least two connectors. The connecting component is electronically connected to the first circuit board, and the at least two connectors are electronically connected to the at least two inserting slots.

Abstract: A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.

Abstract: A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component.

Abstract: According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract: A motor control device comprising a control board for controlling driving of an electric motor, the control board including a multilayer circuit board having inner layers and outer layers, a ground pattern disposed around an output shaft of the electric motor formed on one of the inner layers, and a severed portion formed on a part of the ground pattern, so as to sever through the ground pattern in a radial direction of the output shaft. The construction reduces noise from the motor control device.

Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

Abstract: A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver unit and the at least one antenna element are at least partially integrated into the printed-circuit board arrangement. In this context, the printed-circuit board arrangement includes different printed circuit boards, which are mechanically connected to one another in a rigid manner. A first part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a first material which is suitable for high-frequency, and a second part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a second material different from the first material, which is still sufficiently suitable for a low frequency and/or for a direct-voltage range.

Abstract: A portable external power-supplying device is disclosed. The portable external power-supplying device implements a unique mechanism to detachably assemble battery units whose number can be adjusted according to user needs, which means the overall aggregate capacity of the portable external power-supplying device is adjustable. The portable external power-supplying device is adaptive to connect and charge a portable electronic device.

Abstract: A modular controller for a lamp allows for the easy addition of remote control to multiple lamp fixture designs. The controller housing protects circuitry from shorts and has a window included for receiving remote control signals. The window is detachable and can be re-oriented relative to the controller housing to accommodate different lamp fixture designs. The position of the sensors within the controller housing can also be reconfigured, and it is also possible to connect external sensors to the controller for situations where sensors must be placed in a tight space. In some embodiments, the lamp power supply is incorporated within the modular controller, saving space and cost, and allowing for dimming of individual lamps.

Abstract: A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.

Abstract: A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n?2) and controls the at least one multi-channel package.

Abstract: The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer.

Abstract: A connection device is used to mount a computer mini-card. The connection device includes a board, an edge connector formed a bottom side of the board, a socket, and a pole. The socket is mounted on a first side surface of the board to connect to the computer mini-card, and is electrically connected to the edge connector. The pole extends from the first side surface of the board to fix an end of the computer mini-card opposite to the socket.

Abstract: An electronic card module which includes the function of storing information regarding the fabrication/maintenance/driving of a product. The electronic card module has a main function circuit unit configured by mounting various electronic components on a PCB substrate. The electronic card module is formed with the PCB module in one piece and includes an information provision unit which stores information including product fabrication information, maintenance information, and driving information, and which provides the information when a request is made from an external device.

Abstract: A portable device including: a housing including a bottom wall section and a frame-shaped peripheral wall section provided on the bottom wall section; a pressure-sensitive touch panel including a bonding section and a contact section, the bonding section being bonded to the peripheral wall section and the contact section being surrounded by the housing and positioned inside from the bonding section; and a control board that is electrically connected to the touch panel through the contact section.

Abstract: To provide a mobile terminal having a board support structure capable of reducing impact on built-in components of the mobile terminal when a housing thereof undergoes a primary mode of deformation. The upper end portion and the lower end portion of a main board 40 are supported by bosses 111a, 111b, 113a, and 113b. The upper end portion and the lower end portion of the main board 40 are fixed in a direction perpendicular to the surface of the main board 40. The upper end portion thereof slides with respect to the peripheries of small-diameter cylindrical portion insertion holes 211a and 211b of a module holding board 30 on the front side and a rear housing 20 on the rear side. Thus, the main board 40 can move in a plane direction (in a longitudinal direction).

Abstract: A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools.