Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.

Abstract: A high-voltage switching device (1) is described with a charge storage arrangement (3) with a multiplicity of charge storage modules (M1, M2, M3, M4, . . . , MN) connected in series, wherein in each case a certain number of the charge storage modules (M1, M2, M3, M4, . . . , MN) are arranged in a common assembly housing (21, 30, 50) so as to form a charge storage module assembly (B), and wherein the assembly housings (21, 30, 50) are mounted in a supporting frame in an insulated manner.

Abstract: A Universal Serial Bus device includes a PCB module, a plastic package shell and a power module. The PCB module includes a PCB, and a storage chip and a control chip both arranged on the PCB module. The PCB includes opposite front end and rear end, and opposite upper surface and lower surface. The upper surface has a number of contacting portions, and the storage chip and the control chip being arranged on the lower surface. The plastic package shell at least encapsulates the lower surface of the PCB to encapsulate the storage chip and the control chip. The power module is electrically connected to the part of the PCB module where is not encapsulated by the plastic package shell.

Abstract: An electronic control unit, has a casing accommodating a printed circuit board. The casing has a molded plastic intermediate structure having a frame. Two electrically conductive members are partially embedded in the intermediate structure during the course of molding and are connected to the printed circuit board forming output terminals of the control unit. Two flexible conductors, provided with corresponding electrically insulating coverings, connect the control unit to an apparatus to be controlled. Each conductor has an end permanently connected to a respective one of the conductive members and the connection between the conductors and the conductive members are covered and sealed in a fluid-tight way by an electrically insulating material.

Abstract: An electronic device includes a chassis, a first printed circuit board (PCB), a second PCB, a third PCB, and a number of memory modules. Each memory module includes two edge connectors respectively formed on two opposite sides of the memory module. A plurality of parallel sockets is formed on each of the first and second PCBs. The edge connectors are respectively inserted into the sockets of the first PCB and the sockets of the second PCB. The third PCB is electrically connected between the first PCB and the second PCB.

Abstract: A digital electrical power and energy meter integrates a primary processing module and a user interface module onto a single printed circuit board to reduce overall meter size, assembly time, and cost.

Abstract: A circuit board includes a pair of differential signal lines and a pair of test point pads, one test point pad coupled to one of the signal lines and another of the test point pads coupled to another of the signal lines. The two test point pads are staggered relative to each other and the two signal lines. The circuit board includes a plurality of conductive layers and a plurality of insulating layers. The conductive layers can be etched into conductive patterns, or traces, for connecting the electronic components, which are soldered to the circuit board. The conductive layers may be selectively connected together by vias. One or more of the conductive layers may be a metal plane for providing a ground plane and/or a power plane. To minimize or eliminate the capacitance generated between the test point pad and an underlying ground plane and/or power plane, portions of the ground plane and/or the portion of the power plane directly aligned with each test point pad are removed.

Abstract: There is provided a high frequency module including a part mounted on one surface of a board; an electrode for connecting the part formed on the one surface and an apparatus for mounting the high frequency module; and a first insulating layer, which is formed on the one surface and is configured to cover the part, wherein the electrode is formed on a surface of the first insulating layer such that at least a part of the electrode and the first insulating layer are successively formed.

Abstract: An electronic device with a detachable communication module is provided. The electronic device includes an electronic device casing and the communication module. The electronic device casing includes a receiving space and an opening. The communication module includes a covering plate, a fixing plate, a first circuit board, and a first connector. The covering plate has an aperture. The first connector has a connecting port. Moreover, the first circuit board is connected with a supporting member. The first connector is connected with the first circuit board. The connecting port is exposed to the aperture of the covering plate. After the first circuit board and the first connector are accommodated within the receiving space, the opening of the electronic device casing is covered by the covering plate. Moreover, by the fixing plate, the communication module is fixed on the electronic device casing.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.

Abstract: A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.

Abstract: A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Abstract: The adaptive computing system described herein may generally include a modular control, switching, and power supply architecture. In particular, the adaptive computing system may provide a platform supporting multiple independent desktop computer modules that occupy less physical space than a standalone commercial computer, provide performance density comparable to current server solutions, and address concerns relating to stability, safety, productivity, performance, assembly, service, and other factors important to diverse desktop computer user communities. Moreover, mechanical, electrical, and functional components associated with the adaptive computing system may have various certifications or otherwise be relied upon to demonstrate compliance with criteria in regulatory, environmental, consumer safety, and other contexts.

Abstract: A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module.

Abstract: A device has been designed that allows for modular rearrangement of groups of controls such that a user can shift control “pods” from left to right on the face of the device without changing the functionality of the device in any manner. The pods are electrically and mechanically movable from one port to another and thus pods can be designed having different control types for controlling the same function. Thus, an operator can select the operator's preferred control types for a particular set of functions and can then adapt the control panel with the operator's preference of both control type and control function location. This then allows the same device to be used by different operators one after the other with each operator being able to customize the control panel according to that operator's preferences. In one embodiment operators can rearrange the control panel in the hot mode so that the device need not be turned off.

Abstract: A shell for fixing main board of an electronic device including a base wall, and sidewalls around the base wall, is provided. The base wall includes supporting projections. The internal surface of sidewalls includes restriction elements. The main board is laid on the supporting projections and abuts against the restriction elements. The base wall includes positioning pins and the main board defines positioning holes into which the positioning pins can be engaged.

Abstract: A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.

Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.

Abstract: The power supply and cooling provided by existing aircraft system line replaceable units (LRUs) or other devices supports new cards that are installed in previously empty slots or which replace existing original cards and which are not limited in functionality and do not require licensing of any proprietary technology included in the LRU. These new cards can include components such as processors, memory, and/or storage that significantly improve the performance of the LRU, and/or add new functionality—all without exceeding the power supply and cooling capability of the LRU. A network and avionics bus interface can be added to a portion of the new card and electrically coupled to the circuitry and electronic components on the new card, so that one or more cables connected to the interface can be connected to externally accessible standard avionics buses and network connectors added to a chassis of the LRU.

Abstract: There is provided a device module. The device module includes: a key input portion; a display portion; a power supply portion; a circuit board, wherein the key input portion, the display portion and the power supply portion are mounted on and electrically connected to the circuit board; and a sheet member, wherein the key input portion, the display portion, the power supply portion and the circuit board are enveloped in and sealed with the sheet member.

Abstract: Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: An interface module is provided. The interface module includes a substrate and a flexible print circuit board. The substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side. The flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.

Abstract: A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.

Abstract: The invention provides a device module including a device, a connecting part, and a plastic part. The device is a sensor, an electronic component, or a circuit board. The connecting part is connected to the device and includes an external connecting portion. The device and the connecting part are embedded in the plastic part. The plastic part is provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside.

Abstract: A portable electronic device with a USB connector comprising a card body complying with chip card layout standards, with at least one elastic hinge going from one edge to another of the card body allowing a 180° folding, and a contour of the card body such that, in the closed folded state, a zone supporting a USB contact has the thickness and width of a standard male USB connector. Preferably the card body is an ISO 7816 standard card body, incorporating a corresponding connection contact, and it comprises two elastic hinges dividing the card body into a central portion and two lateral portions. The hinges may advantageously be positioned so as to incorporate an antenna and/or a magnetic strip.

Abstract: A portable external power-supplying device is disclosed. The portable external power-supplying device implements a unique mechanism to detachably assemble battery units whose number can be adjusted according to user needs, which means the overall aggregate capacity of the portable external power-supplying device is adjustable.

Abstract: A backplane electronic circuit board of an electronic apparatus (10) comprises an interface connector with an external system and two interface boards (22, 23) connected to one another, a first interface board (22) being connected to the said interface connector and a second interface board (23) being intended for the connection of a set of electronic circuit boards of the said electronic apparatus (10). The backplane electronic circuit board (20) comprises reinforcement means (30, 40) installed between the said two interface boards (22, 23). Use in particular in an electronic apparatus on board an aircraft.

Abstract: Small form-factor pluggable (SFP) ports are often employed in telecommunications hardware to take advantage of their lower profile and to provide connections to other network elements. The use of SFP ports has increased the density of ports possible for a given circuit board size, but this increase has previously meant that individual ports are difficult to access. Also, identification of those ports is frustrated by a lack of free space to place labeling. Example embodiments of the present invention address these issues by placing a divider plate between columns of SFP ports that provides surface area adjacent to the SFP ports for affixing labeling. The divider plate is offset from the SFP ports to allow access when the plate is installed. As a result, hardware employing embodiments of the present invention can achieve a higher density of SFP ports with ease of access by personnel assembling or servicing the hardware.

Abstract: An adaptive printed circuit board (PCB) connector consists of an adapter. The adapter comprises a printed circuit board having connectors connectable to battery terminals of a battery terminal structure of a populated circuit board (POP) of a mobile device. The adapter can have an opening shaped or adapted to receive the battery terminal structure of the POP. Battery terminals can be spring loaded. Spring loaded battery terminals can provide connective stability between POP and adapter by pushing against edge inside of opening of the adapter.

Abstract: A solid state drive is disclosed. The solid state drive includes a circuit board having opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the circuit board of the solid state drive, and the plurality of semiconductor chips of the solid state drive include at least one memory chip that is at least substantially encapsulated in a resin. An in-line memory module-type form factor circuit board is also disclosed. The in-line memory module-type form factor circuit board has opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the in-line memory module-type form factor circuit board, and these semiconductor chips include at least one memory chip that is at least substantially encapsulated in a resin.

Abstract: A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card.

Abstract: A motor starter module is provided, the module according to the present disclosure including a PCB (Printed Circuit Board) substrate configured to communicate with and control the magnetic contactor, a mechanism part operating in association with an operation of the magnetic contactor, and an upper case covering the PCB substrate and an outer case of the mechanism part, whereby the magnetic contactor can be locally and directly driven, and controlled via communication to reduce a line cost, to shorten an operation time and to promote maximization of spatial utilization.

Abstract: A photoelectric conversion module includes a transmission side photoelectric conversion part for converting an electrical signal into an optical signal, a transmission side circuit board on which the transmission side photoelectric conversion part is mounted off-center to one side of the transmission side circuit board at one end of the transmission side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, and a reception side circuit board on which the reception side photoelectric conversion part is mounted off-center to one side of the reception side circuit board at one end of the reception side circuit board. A surface of the transmission side circuit board on which the transmission side photoelectric conversion part is mounted is opposite to a surface of the reception side circuit board on which the reception side photoelectric conversion part is mounted.

Abstract: A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.

Abstract: A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.

Abstract: A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.

Abstract: According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module.

Abstract: A control system for achieving high-speed torque for a joint of a robot includes a printed circuit board assembly (PCBA) having a collocated joint processor and high-speed communication bus. The PCBA may also include a power inverter module (PIM) and local sensor conditioning electronics (SCE) for processing sensor data from one or more motor position sensors. Torque control of a motor of the joint is provided via the PCBA as a high-speed torque loop. Each joint processor may be embedded within or collocated with the robotic joint being controlled. Collocation of the joint processor, PIM, and high-speed bus may increase noise immunity of the control system, and the localized processing of sensor data from the joint motor at the joint level may minimize bus cabling to and from each control node. The joint processor may include a field programmable gate array (FPGA).

Abstract: An expansion apparatus includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a first circuit board, an expansion card with a second circuit board, and a cable member. A first edge connector is set on a bottom edge of the first circuit board and includes a number of first power pins connected to a control chip, a number of first storage chips, and a first connector, and a number of first ground pins. A second edge connector is set on a bottom edge of the second circuit board and includes a number of second power pins connected to a number of second storage chips and a second connector, and a number of second ground pins. The cable member includes a cable, a third connector connected to the first connector, and a fourth connector connected to the second connector.

Abstract: In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage.

Abstract: A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board.

Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.

Abstract: There is provided a tuner module used for a television (TV) or a set top box, and more particularly, to a tuner module having a significantly reduce size. The tuner module includes: a tuner including a circuit board having at least one electronic component mounted thereon, and a cover coupled to the circuit board and having an opened bottom portion so as to allow the circuit board to be received therein; and a main board having the tuner mounted on one surface thereof, wherein the main board includes a ground pad formed thereon to correspond to a position in which the tuner is mounted.

Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.

Abstract: A double circuit board module includes a bracket, a pivot rack pivotably mounted to the bracket, a first circuit board fixed to the bracket, and a second circuit board fixed to the pivot rack. After the pivot rack is pivoted away from the bracket, the first circuit board is exposed.

Abstract: A pre molded can package includes a circuit board, a MEMS die, a pre mold cavity and a can. The MEMS dies are connected to the circuit board by conductive wires and the MEMS dies are separated by the pre mold cavities. A cap is connected to the top of each pre mold cavity to form MEMS die units. The MEMS die units are packed to as to reduce their volume. The manufacturing cost is reduced and the processes are simplified. The MEMS die units are able to be applied to the smaller and fine electronic devices.

Abstract: A touch panel includes first and second substrates, and first insulating layer disposed therebetween. The first substrate has, on its bottom surface, a first conductive layer having opposing first and second sides; a first electrode along the first side; and a second electrode along the second side. The second substrate has, on its top surface, a second conductive layer facing the first conductive layer with a predetermined space and having third and fourth sides orthogonal to the first and second sides: a third electrode along the third side; and a fourth electrode along the fourth side. The first insulating layer is frame-like and coats at least part of the first and second electrodes. The first and second electrodes and the first insulating layer together form a decoration part having a color tone to prevent the third and fourth electrodes from being visible when viewed from the first substrate side.

Abstract: A wireless module with an external antenna and a connector with the wireless module are disclosed. The wireless module includes a printed circuit board, a plurality of conductive terminals, a wireless transmission chip, an antenna connector and an external antenna. The plurality of conductive terminals, the wireless transmission chip, and the antenna connector are electrically coupled to a printed circuit board, and the external antenna is coupled to the antenna connector through a connected circuit. The wireless module further includes a casing for covering the printed circuit board, the conductive terminals, the wireless transmission chip, and the antenna connector. A pivot hinge is installed at an end of the casing, and the external antenna is pivotally coupled to the pivot hinge of the casing, so that users can change the angle of the external antenna to adjust the intensity and range of receiving/transmitting signals of the wireless module freely.