With Housing Or Chassis Patents (Class 361/752)
  • Patent number: 9013886
    Abstract: Disclosed are a display device and a portable information apparatus including the same, which do not use a front set cover necessary for producing the display device and thus can minimize a thickness and enhance a sense of beauty with an innovative design. The display device includes a set cover, a guide frame, a display unit, a circuit disposing part, a plurality of circuit films, a PCB, and a deco cover. The circuit disposing part is prepared between one side of the guide frame and one side wall of a set side wall. The PCB is connected to the circuit films, and disposed at the circuit disposing part. The deco cover covers the circuit disposing part.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: April 21, 2015
    Assignee: LG Display Co., Ltd.
    Inventors: JaeWoo Park, NamDo Son, SungWoo Kim, DongYong Kim, GiNam Jean
  • Patent number: 9013888
    Abstract: Systems and methods for ejecting removable entities from electronic devices are provided. A removable entity ejection system may include a driver that may be controllable by software (e.g., via a control unit that may be configured to send electrical signals to the driver). The driver may include a driving component that may apply a force directly, or indirectly, to one or more removable entities to eject the one or more removable entities from an electronic device. When the force is applied indirectly, one or more interfacing components may receive the applied force and may transfer the received force to the one or more removable entities to cause ejection thereof.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 21, 2015
    Assignee: Apple Inc.
    Inventors: Piotr S. Trzaskos, Simon Kao
  • Patent number: 9014766
    Abstract: A protective clamp frame having a power and unclamp duplex button for mobile communication devices is disclosed, comprising a main frame, an auxiliary frame and a connection control element, wherein the main frame and the auxiliary frame are both configured in a closed frame structure, and the main frame is formed with a central recessed accommodating part for receiving a mobile communication device, further overlapped with the auxiliary frame, such that the lateral sides of the mobile communication device can be peripherally wrapped; in addition, the connection control element can release the connection between the main frame and the auxiliary frame and operate to engage in touch with the power switch on the mobile communication device in order to provide a duplex structure having power activation and unclamp frame features.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: April 21, 2015
    Assignee: Taer Innovation Co., Ltd.
    Inventors: Li-Ming Hu, Yu-Chun Lu, Chih-Sheng Wang
  • Patent number: 9013889
    Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to be joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masako Tamura, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Takaaki Tanaka, Hideki Umemoto
  • Patent number: 9013870
    Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming a first ground plane; a first dielectric substrate layer overlaying the chassis; a first signal trace overlaying the first dielectric substrate layer; and a second dielectric layer overlaying the first signal trace.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 21, 2015
    Assignee: BlackBerry Limited
    Inventors: Eric Gary Malo, Cameron Russell Steeves, Hassan Daniel Hosseinpor
  • Publication number: 20150103501
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board arranged in the housing, a screw-receiving member having a threaded hole and mounted on the circuit board, a mounted component mounted on the circuit board and screw-attached to the screw-receiving member, and a support rib provided on an inner surface of the housing, configured to contact with the circuit board near the threaded hole and to support the circuit board.
    Type: Application
    Filed: April 3, 2014
    Publication date: April 16, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Hirai, Katsuo Ozawa
  • Publication number: 20150103502
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, and a connector. The connector includes an opening into which a flexible cable is configured to be plugged. The connector is attached to the circuit board and faces an inner surface of the housing. The circuit board includes a cutout in a position corresponding to a center portion of the opening of the connector.
    Type: Application
    Filed: July 16, 2014
    Publication date: April 16, 2015
    Inventors: Shingo Koide, Daisuke Maehara
  • Patent number: 9007779
    Abstract: According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuhiro Yamamoto, Takahisa Funayama
  • Patent number: 9007780
    Abstract: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, the third housing being rotatably connected to the first housing and the second housing, and an antenna in the third housing.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Mitsuhiro Murakami
  • Patent number: 9007084
    Abstract: A support structure for installation of a component assembly housed in a rotating, translating carriage chassis, the support structure including: a stationary rail that includes a shaft extruding perpendicular to the stationary rail; a rotating rail adapted to receive a carriage chassis rail, the rotating rail parallel to the stationary rail when the rotating rail is in a non-rotated position, the rotating rail including a shaft receptacle that receives the shaft, the rotating rail configured to rotate about the shaft and relative to the stationary rail; and a translation mechanism attached to the rotating rail, the translation mechanism enabling the carriage chassis rail to translate parallel to and along the rotating rail.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: April 14, 2015
    Assignee: International Business Machines Corporation
    Inventors: Raymond F. Babcock, Michael A. Boraas, Matthew A. Butterbaugh, Jeffrey L. Justin
  • Publication number: 20150098198
    Abstract: A control apparatus has a housing and a first integral, multilayer printed circuit board with first, second and third parts. The first part carries electric and/or electronic components, the second part is electrically and mechanically connected to a contact pin of a first plug-in connector, and the third part connects the first and the second parts. A second integral, multilayer printed circuit board has first, second and third parts. The first part is equipped with electric and/or electronic components, the second part is electrically and mechanically connected to a contact pin of a second plug-in connector, and the third part connects the first and second parts. The two printed circuit boards in their third part are flexible or at least bendable. A connection element interconnects the first parts of the printed circuit boards.
    Type: Application
    Filed: May 7, 2013
    Publication date: April 9, 2015
    Applicant: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Gregory Drew, Thomas Riepl
  • Publication number: 20150098199
    Abstract: A fixing mechanism includes a casing and a positioning component. The casing includes a base and at least one wall whereon an opening is formed. A bottom of the positioning component is disposed on the base, and a top of the positioning component includes a level difference structure, which includes a first support surface and a second support surface. The first support surface is formed on an inner of the level difference structure, and the second support surface surrounds the first support surface to form on an outer of the level difference structure. The first support surface is higher than the second support surface relative to the base. The positioning component contacts the circuit board via the first support surface or the second support surface according to a hole on the circuit board, so as to align a connector of the circuit board with the opening on the casing.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 9, 2015
    Inventor: CHONG-XING ZHU
  • Publication number: 20150098200
    Abstract: An electronic enclosure device including an enclosure, an electric circuit device, and a sealing device is disclosed. The sealing device is provided as one, continuous gasket having a first gasket section configured to seal a first sealing area, a second gasket section configured to seal the second sealing area, and a third gasket section configured to seal the third sealing area.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Inventor: Erik Spangberg
  • Patent number: 9001517
    Abstract: A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: April 7, 2015
    Assignee: SNU R&DB Foundation
    Inventors: Yongtaek Hong, Sangwoo Kim
  • Publication number: 20150092437
    Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and a non-flat portion is provided to a region having a size greater than or equal to an outside diameter of a connector of an external connector line connected to the connector terminal in the casing portion.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventor: Kosaku ARITA
  • Publication number: 20150092367
    Abstract: A display device is disclosed. In one embodiment, the display device includes a display panel, a housing which houses the display panel and a frame which is disposed under the housing and comprises a first bottom portion. The first bottom portion includes a first bottom surface which is an upper surface thereof and a first base surface which is a lower surface thereof, and the frame includes a groove recessed from the first bottom surface.
    Type: Application
    Filed: December 11, 2014
    Publication date: April 2, 2015
    Inventor: Kyu-Hyeong Cheon
  • Publication number: 20150092365
    Abstract: The embodiments described herein relate to insert molding methods. The methods involve partially or fully encasing an insert within a thermoplastic material, forming a composite part that includes the insert and the molded thermoplastic material. Methods described provide a number of improvements over traditional insert molding techniques. In specific embodiments, a two-shot molding process is used whereby a first shot is formed on a first portion of the insert and a second shot is formed on a second portion of the insert. The insert molding processes can be performed using a single mold during the first and second injection molding processes.
    Type: Application
    Filed: December 16, 2013
    Publication date: April 2, 2015
    Applicant: Apple Inc.
    Inventor: Craig M. Stanley
  • Publication number: 20150092366
    Abstract: A protection case for protecting an electronic device includes a cover body shaped to receive and hold to the electronic device. A cable winding apparatus is arranged adjacent the cover body and includes a wheel rotatably arranged adjacent the cover body, and a pivot protruding from a center of the wheel and configured to wind a cable of an earphone. A through hole is arranged on a side wall of the pivot and configured to permit a first end of the earphone, which connects to a jack, to pass through.
    Type: Application
    Filed: September 12, 2014
    Publication date: April 2, 2015
    Inventors: CHEN-CHING CHU, CHENG-KUO LEE, YU-NING WANG
  • Publication number: 20150092432
    Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and the cover portion includes a storage portion bulging outward from the casing, the storage portion storing either one of an electronic component provided to a face of the circuit board which faces the cover portion and an electronic component provided across the circuit board.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventors: Kosaku ARITA, Masahiro NISHIKAWA
  • Patent number: 8994884
    Abstract: According to one embodiment, a broadcast receiver includes a housing, a circuit board, a module, a holder, and a buffer. The housing is provided with a wall. The circuit board is housed in the housing and includes a first connector. The module includes a second connector to be electrically connected to the first connector and fits to the first connector with a gap therebetween. The module is movable between a first position where the length of connected portions of the first connector and the second connector is short and a second position where the length of the connected portions is long. The holder holds the module. The buffer is provided to the holder and is bent along with the movement of the module from the first position to the second position.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: March 31, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seiji Hashimoto, Tetsuhiko Fukazawa, Tomohiro Hamada
  • Patent number: 8995140
    Abstract: An electronic device having a jack hole to expose a jack, includes a circumferential wall is formed in a case to surround the jack, wherein two gap portions of the circumferential wall are formed to pass from the jack hole to the inside of the case, and wherein one gap of the two gap portions is smaller than the other gap of two gap portions.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 31, 2015
    Assignee: KYOCERA Corporation
    Inventors: Katsushige Kohri, Kensaku Matsuda
  • Patent number: 8995142
    Abstract: Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: March 31, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masato Saito, Hiroyuki Abe
  • Patent number: 8995141
    Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 31, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Nidhi Rathi, Edward A. Lilgegren
  • Patent number: 8995139
    Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: March 31, 2015
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventor: Hideyuki Sakamoto
  • Patent number: 8995137
    Abstract: A modular mass storage system and method that enables cableless mounting of ATA and/or similar high speed interface-based mass storage devices in a computer system. The system includes a printed circuit board, a system expansion slot interface on the printed circuit board and comprising power and data pins, a host bus controller on the printed circuit board and electrically connected to the system expansion slot interface, docking connectors connected with the host bus controller to receive power and exchange data therewith and adapted to electrically couple with industry-standard non-volatile memory devices without cabling therebetween, and features on the printed circuit board for securing the memory devices thereto once coupled to the docking connectors.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: March 31, 2015
    Assignee: OCZ Storage Solutions Inc.
    Inventor: Franz Michael Schuette
  • Publication number: 20150085453
    Abstract: A compliant middle member to be used between encapsulated stacked circuit boards contained in an enclosure. The compliant middle member absorbing expansion forces from an encapsulant experiencing thermal expansion, thereby diverting and reducing the expansion forces exerted upon the electrical components.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Applicant: Trumpet Holdings, Inc.
    Inventors: JAMES LIBERTY, John W. RAMONAS, Dennis A. MALLER
  • Patent number: 8988867
    Abstract: A liquid crystal display device is provided with: a liquid crystal panel capable of displaying an image; a backlight unit including cold cathode tubes and a chassis housing the cold cathode tubes and supplying light to the liquid crystal panel; and a second exterior member housing the liquid crystal panel and the backlight unit and including a bottom portion facing the chassis. On a surface of the chassis facing the bottom portion, a plurality of fixing members capable of fixing the bottom portion is provided. The fixing members include inverter covers disposed with a gap from the bottom portion, and reinforcing members abutting on the bottom portion. Between the inverter covers and the bottom portion, spacers with the function of damping vibration are interposed.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: March 24, 2015
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Tatsuro Kuroda
  • Patent number: 8987054
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 24, 2015
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventor: Darrell Truhitte
  • Patent number: 8988884
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 24, 2015
    Assignee: Delphi Technologies, Inc
    Inventors: Chris R. Snider, Vineet Gupta, Michael G. Coady, Curtis Allen Stapert, Donald G. Moeschberger, Allen E. Oberlin
  • Patent number: 8988885
    Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: March 24, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Tatsuro Sawatari, Masashi Miyazaki, Yoshiki Hamada, Yuichi Sugiyama, Kazuaki Ida
  • Patent number: 8988888
    Abstract: A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the front surface side of the circuit board and on which the display plate is mounted, an upper case which is disposed on the front surface side of the middle case and through which the front surface can be seen, and a lower case which covers the middle case and the circuit board. A flange section which is sandwiched and held between the upper and lower cases is provided to the peripheral edge of the middle case. One of the upper case and the lower cases is provided with engagement sections, and engagement sections which engage with the engagement sections are provided to the other of cases so as to correspond to the engagement sections.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: March 24, 2015
    Assignee: Nippon Seiki Co., Ltd.
    Inventors: Satoshi Sano, Yuichiro Nakamura, Katsuhito Umezawa
  • Patent number: 8988886
    Abstract: An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 24, 2015
    Assignee: KYOCERA Corporation
    Inventors: Katsumi Arao, Ryosuke Iwaya
  • Publication number: 20150077955
    Abstract: A motor drive comprises a power sub-assembly and a control sub-assembly. The control sub-assembly includes components that may be accessed within the sub-assembly housing during installation and maintenance of the drive. A main circuit board is configured to define a high voltage region and a low voltage region. The high voltage region is isolated by an interior barrier of the housing so that the components can be conveniently accessed. An operator interface is provided in the control sub-assembly. An interface circuit board is also isolated by the barrier. Desired spacing between the interface circuit board and a surface of the interface is provided by integrally molded spring structures and plungers that interface with underlying switches.
    Type: Application
    Filed: October 14, 2013
    Publication date: March 19, 2015
    Applicant: Rockwell Automation Asia Pacific Business Center Pte. Ltd.
    Inventors: Donald Yuen Leong Tio, Yang Yueng Melvin Yap
  • Publication number: 20150077954
    Abstract: A rotary paddle level switch has a housing, a driving unit, two switches, a resilient member, a clutch, a transmission shaft, and a propeller. A resilient clip of the clutch holds a non-circular actuation section of the transmission shaft. When the driving unit drives the clutch to rotate, the transmission shaft and the propeller are driven by the clutch. When the propeller is rapidly rotated by suddenly exerting an excessively large external force thereon, as the resilient clip holds the transmission shaft by elastic force, the fast rotating transmission shaft removes itself from the holding of the resilient clip and is rotated without driving the resilient clip to rotate, thereby avoiding the transmission of the external force and damage to the driving unit. As the clutch just needs a clutch stand and a resilient clip to achieve the foregoing function, the level switch is structurally simple and relatively inexpensive.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 19, 2015
    Applicant: Finetek Co., Ltd.
    Inventors: Chih-Wen Wang, Ching-Jui Chen, Cheng-Tao Lee, Ting-Kuo Wu, Chao-Kai Cheng
  • Publication number: 20150077956
    Abstract: An electronic control unit for a vehicle includes a circuit board, a connector and a case. The circuit board has an electronic component disposed thereon. The connector is integrated to a surface of the circuit board to electrically connect the circuit board and an external device. The case accommodates the circuit board and the connector therein in a state where an end surface of the connector exposes from the case. The circuit board is disposed in the case such that the surface to which the connector is integrated faces down, and a clearance between the circuit board and the connector is located at a position lower than the circuit board. A droplet entering the case flows along an upper surface of the connector, which is located lower than the circuit board due to a force of gravity. The droplet is discharged from the case without affecting the circuit board.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 19, 2015
    Inventor: Yoshimasa SANO
  • Patent number: 8982541
    Abstract: The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: March 17, 2015
    Assignee: Traxxas LP
    Inventors: Timothy E. Roberts, Jon Kenneth Lampert, Otto Karl Allmendinger
  • Patent number: 8982571
    Abstract: Electronic equipment includes a first water cutoff member and a second water cutoff member on the periphery of a hole communicating from outside with a space in which an electric component such as an electric circuit board is provided. This can prevent liquid, dust, and the like, which enter a first housing from outside, from entering the space. Thus, the electric component, etc. placed in the space can be prevented from being damaged due to an electric short-circuit.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: March 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Reiji Matsumura, Takeshi Mori, Masato Murakata, Kenichi Shindo
  • Patent number: 8982580
    Abstract: In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and an auxiliary board is disposed at a surface of the shield case. The shield case is comprised of a metallic frame that is fixed at the surface of the main board and extends in such a manner as to surround at least the part of the region, and a metallic cover fitted into the metallic frame to cover at least the part of the region. A projecting piece is formed in the metallic frame of the shield case, and penetrates the metallic cover and projects toward the auxiliary board. An end face of the auxiliary board abuts against the projecting piece, so as to position the auxiliary board.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: March 17, 2015
    Assignee: KYOCERA Corporation
    Inventor: Akito Iwai
  • Patent number: 8981240
    Abstract: A case body portion accommodates an electronic circuit board. The case body portion has a rib projected from at least a part of a periphery of the opening. A lid has a flange, which is in contact with an outer periphery of the rib, when the lid is mounted on the case body portion to cover the opening. The rib has a raised portion raised outward from a part of an outer periphery of the rib.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: March 17, 2015
    Assignee: Denso Corporation
    Inventors: Hiroki Chitaka, Mitsuteru Suzaki
  • Publication number: 20150070857
    Abstract: A jack assembly includes a jack element, an elastic element, and at least one latching portion. The jack element defines a jack opening configured for receiving an electronic element therein. The elastic element is mounted in a side of the jack element. The at least one latching portion protrudes on the elastic element and extends towards the jack opening. The at least one latching portion detachably latches the electronic element to the jack opening so as to secure the electronic element within the jack opening.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 12, 2015
    Inventor: DING-YU LIN
  • Patent number: 8974235
    Abstract: A relay box is provided with: a main housing; and a mounting section, which is provided in the main housing, and has selectively mounted thereon a relay block having a plug-in relay mounted thereon and removable therefrom, and a relay module which houses, in a module case, a circuit configuring body having a switching element mounted thereon.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kenichi Washihira, Kenichi Nishikawa
  • Patent number: 8977798
    Abstract: The present invention provides an electronic system mounted on an aircraft which can effectively reduce electronic devices and wires by integration of control systems. Specifically, a fuselage (80) of an aircraft (100) is divided into a nose part (80a), a center part (80b), and an aft part (80c), and two IMAs (integrated modular avionics units) (50a to 50c) are provided in each of these parts. The IMA units (50a to 50c) are interconnected via an integrated data bus (53) to construct an integrated electronic system mounted on the aircraft. The system is suitably used for integrating utility systems except for avionics systems, among a plurality of control systems mounted on the aircraft, and is also applicable to integration of the avionics systems.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: March 10, 2015
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Yoichi Mitani, Masahiro Tamaru, Reiichi Ikarashi, Taisei Isobe
  • Patent number: 8976540
    Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: March 10, 2015
    Assignee: LG Electronics Inc.
    Inventor: Mansung Yoo
  • Publication number: 20150062844
    Abstract: An electronic device is provided, including a mounting plate, a first component and a second component disposed on the mounting plate, a substrate disposed on the mounting plate and having a portion disposed between the first component and the second component, and a third component disposed on the mounting plate and electrically coupled to the substrate.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 5, 2015
    Inventors: Seung-Jae BAE, Jae-Il SEO, Hong-Moon CHUN
  • Publication number: 20150062843
    Abstract: According to one embodiment, a semiconductor device includes a cell portion and a peripheral portion, including: a substrate, a first insulating layer disposed on the substrate, a first conductive layer disposed on the first insulating layer, a second insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the second insulating layer.
    Type: Application
    Filed: March 12, 2014
    Publication date: March 5, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Teppei HIGASHITSUJI, Toshifumi MINAMI, Hideyuki KAMATA, Atsuhiro SATO, Keisuke YONEHAMA
  • Patent number: 8971050
    Abstract: A circuit board assembly comprises a first circuit board and a second circuit board. A connector socket is mounted on the first circuit board, and a connector plug is mounted on the second circuit board. A handle assembly is attached to either the first circuit board or the second circuit board. The handle assembly comprises a base member attached to either the first circuit board or the second circuit board and first and second rotating members pivotably attached to opposite ends of the base member. When the first rotating member and the second rotating member are rotated away from the base member, the connector plug is disengaged from the connector socket. When the first rotating member and the second rotating member are rotated towards the base member, the connector plug is inserted into the connector socket.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 3, 2015
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventor: Wen-Hu Lu
  • Patent number: 8971049
    Abstract: A portable electronic device, a peripheral expansion module and methods for assembling a peripheral expansion module onto a portable electronic device are provided herein. The portable electronic device may comprise a main housing unit having a front cover and a back cover which, when coupled together, enclose internal components of the portable electronic device. The peripheral expansion module, comprising one or more peripheral devices coupled within or on a peripheral module housing, may be securely integrated with the portable electronic device. A majority of the peripheral expansion module may be positioned outside of the main housing unit along one side of the portable electronic device. In some embodiments, the peripheral expansion module includes a pair of rails, which extend out from within an interior of the module housing for attachment via one or more mechanical fasteners to an interior surface of the main housing unit of the portable electronic device.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: March 3, 2015
    Assignee: Motion Computing, Inc.
    Inventors: Bradford Edward Vier, Christopher Lorenzo Dunn
  • Patent number: 8969739
    Abstract: According to one embodiment, a semiconductor device includes a housing including a first wall and a second wall opposite to the first wall, a board in the housing, a first supporter provided on the first wall and configured to support an end of the board in a direction substantially parallel to the first wall, a stopper in the housing, the stopper configured to support the board, and a second supporter provided on the second wall and configured to support the stopper.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: March 3, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Toshiyuki Hayakawa
  • Patent number: 8966975
    Abstract: A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: March 3, 2015
    Assignee: TRW Automotive U.S. LLC
    Inventors: Curt Douglas Campbell, Neil Gordon Murray, Jr., Dion Parker
  • Patent number: 8964401
    Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: February 24, 2015
    Assignee: SunPower Corporation
    Inventors: Eduardo Escamilla, Marco Marroquin, William John Morris, John Trevor Morrison, Thomas Paul Parker, Stephen Wurmlinger