Abstract: A substrate, an alignment plate, a heat sink, a back plate, a plurality of spacers, and a plurality of nuts are used to removably package one or more semiconductor package into a single module. The semiconductor dies are packaged with tape automated bonding (TAB) packages having land grid array (LGA) outer lead bumps. The substrate comprises a number of land patterns, a number of alignment cavities, and a number of join cavities. The alignment plate is fabricated with a number of alignment pins, a number of housing cavities, and a number of join cavities. The heat sink is fabricated with a number of stems and a number of join cavities. The back plate is fabricated with a number of extrusions having threaded ends. The spacers are fabricated with flanged openings at both ends, and each spacer is loaded with a number of spring washers. The nuts are fabricated with stepped heads.

Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling.

Abstract: An apparatus for containing and supporting electronic components includes a first housing portion having a first support, and a second housing portion having a second support. The apparatus further includes an elastomeric isolating member being secured between the first support and the second support so as to position the isolating member within the apparatus. Moreover, the apparatus further includes a base upon which electronic components are mounted, the base being attached to the elastomeric isolating member.

Abstract: A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

Abstract: The present invention provides an easily reworkable demountable means of electrically interconnecting an integrated circuit die to a substrate. The electrical assembly is comprised of an integrated circuit die having contact areas on a first surface, a substrate having contact areas aligned with the contact areas of the die for providing electrical connection to the integrated circuit die, and a compression means for maintaining the integrated circuit die contacts in electrical communication with the contacts of the substrate. The compression means typically includes a two-part spring system which provides superior electrical contact by causing the curvature of the integrated circuit die to be in the same direction as the curvature of the substrate.

Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips attached to the substrate. A plurality of head pads are located on the substrate to provide interconnection points between the lead wires and the substrate. Each intermediate strip is placed on the substrate such that each of a plurality of holes therein is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.

Abstract: A high impact high memory capacity flight data recorder, includes a plurality of planar parallel circuit cards and a plurality of planar parallel spacers stacked in alternating sequence to form a card stack. Each of the circuit cards includes a circuit board, plural integrated circuits mounted on the circuit board, plural connector pads on a periphery of the circuit board connected through the circuit board to output terminals of the integrated circuit memories, a foam layer covering the plural integrated circuit memories and an adjacent portion of the circuit board, the periphery of the circuit board being uncovered by the foam layer.

Abstract: A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Abstract: A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.

Abstract: A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

Abstract: A package for mounting I/C chips onto a circuit board is provided. The chip has a surface array of input/output pads on one side which forms a footprint. A carrier is formed of an organic dielectric material having opposite surfaces. A first set of bonding pads is formed on one surface of the chip carrier and arranged to correspond with the chip footprint. A first set of solder ball connections connects the input/output pads on the chip to the first set of bonding pads on the chip carrier. A second set of bonding pads is formed on the other surface of the chip carrier forming a second set of bonding pads. Electrically conducting vias extend through the chip carrier connecting the first set of bonding pads to the second set of bonding pads. An organic circuit board having a coefficient of thermal expansion similar to the chip carrier having electrical connector sites is provided, the sites are arranged in a pattern corresponding to the pattern of the second bonding pads on the chip carrier.

Abstract: A large-current circuit board having a plurality of fasteners positioned and secured beforehand to the circuit board, and a plurality of busbars for electrically connecting the plurality of fasteners. Each of the plurality of busbars has a strip-like planar plate shape. Various ones of the plurality of fasteners may have the same or different distances from the surface of the circuit board. Specifically, the portions of the fasteners that are connected with the busbars may be at different heights so that plural busbars connecting the fasteners can cross each other at plural levels. A variety of fasteners and busbar securing boards may be used for electrically connectibly holding and securing the plurality of busbars with the plurality of fasteners on the circuit board.

Abstract: An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon.

Abstract: A component is mounted to a circuit board using two spaced apart conductive pad portions that make electrical contact with a terminal of the component. The space between the conductive pad portions provides an additional path through which a cleaning solution and debris can flow.

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Abstract: An electronic part assembly composed of electronic parts wherein a projecting electrode formed on an electrode pad is pressed against a wiring pattern of a circuit board. A cover member a arranged so as to cover the electronic parts, and has a leg portion designed to be joined to the circuit board. A shape memory alloy member is arranged between the cover member and the electronic parts to press a reverse side surface so that electric connection between the projecting electrode and the wiring pattern can be maintained.

Abstract: An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.

Abstract: An electronic assembly that includes an electronic package which is coupled to a circuit board by a plurality of metal spheres that are captured by an interposer. The metal spheres electrically couple a plurality of first conductive pads on the electronic package with a plurality of second conductive pads on the circuit board. The spheres are pressed into operative contact with the conductive pads by a clamp adapted to apply a pressure to the electronic package. The metal spheres are captured by the interposer so that the spheres can rotate relative to the electronic package and the circuit board. The rotating spheres function as bearings which allow the interposer and package to be removed from the clamp and board without detaching the clamp. The electronic package can be coupled to the circuit board by merely pushing the package and interposer between the clamp and board until the metal spheres are properly aligned with the conductive pads.

Abstract: A solder spacer device and method for use in positioning a grid pin array having a plurality of pins over a circuit board having a plurality of pin holes respectively receiving the pins. The spacer is pulled through a central opening in the circuit board after the pins are soldered in the holes to the circuit board. The spacer has a cylindrical body which is positioned in the central opening and has a plurality of radial legs having respective flexure portions for separating the pin grid array from the circuit board during soldering and for folding into the central opening during extraction through the central opening after the soldering is finished.