With Housing Or Chassis Patents (Class 361/796)
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Patent number: 8493739Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.Type: GrantFiled: August 12, 2011Date of Patent: July 23, 2013Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Allen E. Oberlin
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Patent number: 8472189Abstract: An enclosure comprises a thermal barrier (42) for protecting a heat sensitive component (40). The thermal barrier includes at least one endothermic layer (48, 54, 58) that includes water gelled with a thickening agent, absorbed onto a cellulose-comprising fabric or paper. The endothermic layer is sandwiched between layers comprising metal foil or sheet (49, 52, 56).Type: GrantFiled: April 11, 2007Date of Patent: June 25, 2013Assignee: Penny & Giles Aerospace Ltd.Inventor: David Charles Aslin
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Patent number: 8456859Abstract: It is an object of the present invention to provide switching equipment for communications networks, which switching equipment supports high-speed signalling between switch cards and line cards. Hence, the invention relates to a switching device for communications networks comprising a plurality of line cards and at least one switch card. The line cards comprise connection means arranged on or close to one edge of each line card, and the at least one switch card comprises matching connection means arranged on one flat side of said switch card. In this way, when said switch card is arranged substantially perpendicular to said line cards with said flat side of the switch card facing and at least partially overlapping said edges of the line cards, interconnection is achieved between the connection means of the line cards and the matching connection means of the at least one switch card.Type: GrantFiled: February 27, 2008Date of Patent: June 4, 2013Assignee: Telefonaktiebolaget LM Ericsson (Publ)Inventors: Stefan Dahlfort, Einar Jan Vilhelm In De Betou
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Patent number: 8453985Abstract: A mounting device includes a clamping device, a spacing device, and a receiving device. The clamping device includes an upper clamping element and a lower clamping element. The upper clamping element includes a first side plate and an upper clamping plate, the first side plate defines a guiding element and a number of position holes thereon thereon. The lower clamping element includes a second side plate received in the guiding element and a lower clamping plate opposite to the upper clamping plate. The second side plate defines a spacing hole therethrough. The spacing device is positioned on the first side plate and extends outward a position pole, the poison pole penetrates the position hole and receives in the spacing hole for fixing the lower clamping element. The receiving device is rotatably connected with the first side plate and defines a receiving room.Type: GrantFiled: May 10, 2011Date of Patent: June 4, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wen-Tang Peng, Xin-Hu Gong, Ju-Wen Dai
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Patent number: 8451623Abstract: A mounting apparatus includes a chassis, an expansion piece secured to a first end of an expansion card, a carrier and a supporting device configured to support a second end of the expansion card. The chassis includes a bottom plate, and the carrier is mounted on the bottom plate. The supporting device includes a first supporting member secured to the carrier, and a second supporting member secured to the first supporting member. The first supporting member and the second supporting member sandwich the expansion card when the second supporting member is attached on the first supporting member.Type: GrantFiled: November 3, 2010Date of Patent: May 28, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Po-Wen Chiu, Zhan-Yang Li
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Patent number: 8446737Abstract: An in-wall mounted housing or enclosure for an electronic apparatus, such as used as part of a wireless sound system, is configured with a relatively large volume chamber which requires a limited size cut-out for installation. With such a configuration, the enclosure can be mounted within a wall, ceiling, or floor structure while having a sufficient volume to contain all of the required electrical components for a particular application, such as in a wireless sound system. In one arrangement, the housing is configured with two or more chambers where each chamber contains a distinct electrical component. Separation of certain electrical components into distinct chambers can minimize electrical interference between the components during operation. In one arrangement, the housing is further configured to carry both low voltage and high voltage components within the separate chambers while minimizing electrical interference among the components.Type: GrantFiled: September 17, 2010Date of Patent: May 21, 2013Inventor: David Tschirpke
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Patent number: 8437140Abstract: An FPC board (1) is mounted on a front bezel (BZ1) and a rear bezel (BZ2). The outer claw (CW1) of the front bezel (BZ1) and the inner claw (CW2) of the rear bezel (BZ2) are engaged with each other while holding the ground portion (12) of the FPC board (1) therebetween.Type: GrantFiled: March 2, 2009Date of Patent: May 7, 2013Assignee: Sharp Kabushiki KaishaInventors: Kohei Kitagawa, Nobuaki Takahashi, Masahiro Imai, Koichi Yoshioka
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Publication number: 20130107489Abstract: A backplane includes multiple vertical insertion plates separately arranged from each other, and connectors connecting circuit boards and a circuit serving as signal wiring are disposed on the vertical insertion plates. Each connector is electronically connected to the circuit of the vertical insertion plate on which the connector is disposed, so that when the connector on the vertical insertion plate connects a switch board with a service board, the switch board and the service board can implement signal interconnection through the signal wiring of the vertical insertion plate. Due to the backplane of a three-dimensional structure, the processing difficulty of the backplane is greatly lowered, the cost is greatly reduced, thus solving the problem of excessively large number of layers and excessively large size, which is caused by large-scale backplane wiring.Type: ApplicationFiled: December 20, 2012Publication date: May 2, 2013Applicant: Huawei Technologies Co., Ltd.Inventor: Huawei Technologies Co., Ltd.
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Patent number: 8422246Abstract: An electronic apparatus includes a front case, a rear case whose peripheral portion is brought into engagement with a peripheral portion of the front case and an electrostatic capacity type sensor portion which is encompassed by the front case and the rear case. A primary conductive portion, which is brought into engagement with the sensor portion for electrical connection, is formed on part of an inner surface of the peripheral portion of one of the cases which extends to the engagement portion. By adopting this configuration, the electronic apparatus can be fabricated easily and the operation of a touch switch provided in the electronic apparatus can be stabilized.Type: GrantFiled: September 14, 2010Date of Patent: April 16, 2013Assignee: Casio Computer Co., Ltd.Inventors: Wataru Nimura, Kenzo Ichikawa
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Patent number: 8413945Abstract: A mounting apparatus includes a mounting tray configured for securing an expansion card, a first securing member, a second securing member, a first rotating member and a second rotating member. The first securing member is attached to a first edge of the mounting tray, and a first stopper portion is disposed on the first securing member. The second securing member is attached to a second opposite edge of the mounting tray, and a second stopper portion is disposed on the second securing member. The first and second rotating members are rotatably secured to the mounting tray. A first and second hooks respectively extend from the first and second rotating members. The first hook is engaged with the first stopper portion, and the second hook engaged with the second stopper portion.Type: GrantFiled: November 30, 2010Date of Patent: April 9, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Da-Long Sun, Sheng-He Li
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Patent number: 8369096Abstract: An electronic apparatus includes a wiring board, a main member to which the wiring board is fixed, a first component mounted rigidly on the wiring board and positioned with respect to the main member, and a second component mounted movably on the wiring board and positioned with respect to the main member, and a positioning portion provided on the wiring board to determine a position of the wiring board with respect to the main member, wherein a distance from the positioning portion to the first component is shorter than a distance from the positioning portion to the second component.Type: GrantFiled: January 14, 2010Date of Patent: February 5, 2013Assignee: Canon Kabushiki KaishaInventor: Motonari Yamada
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Patent number: 8357850Abstract: A housing includes a first base layer and a second base layer integrally combining with the first base layer. The first base layer is formed by a first injection mold, the first base layer has a first combining surface arranged with ribs. The second base layer combines with the first base layer to form the housing with a second injection mold. The second base layer has a second combining surface combining with the first combining surface. The second combining surface defines recesses to correspondingly receive the ribs.Type: GrantFiled: August 24, 2010Date of Patent: January 22, 2013Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventor: Huan-Bing Ye
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Patent number: 8345426Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.Type: GrantFiled: August 16, 2010Date of Patent: January 1, 2013Assignee: Tyco Electronics CorporationInventor: Robert Paul Nichols
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Patent number: 8339793Abstract: An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.Type: GrantFiled: October 14, 2009Date of Patent: December 25, 2012Assignee: Wistron CorporationInventors: Yu-Han Tsai, Chun-Wang Lin, Yu-Hsien Huang, Chi-Jen Lo, Feng-Hsiung Wu
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Publication number: 20120307471Abstract: A card guide may include an aluminum substrate and a hard anodized coating formed on the aluminum substrate. In some examples, the hard anodized coating may have an electrical resistance of greater than about 100,000,000 ohms. Additionally or alternatively, the hard anodized coating may have a thickness of greater than about 38.1 ?m (0.015 inch).Type: ApplicationFiled: June 1, 2011Publication date: December 6, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Joseph M. Juarez, Mark Romero, Kevin Frey, Miguel Perez
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Patent number: 8325486Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.Type: GrantFiled: January 13, 2010Date of Patent: December 4, 2012Assignee: Dy 4 Systems Inc.Inventors: Nauman Arshad, Jing Kwok, Ivan Straznicky, Martin Terence Cassels
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Patent number: 8305763Abstract: In a housing case for housing an electronic circuit board, comprising a case body, a cover, a pedestal formed on the case body to support the board, a holder formed on the cover at a location to face the pedestal to hold the board from opposite side of the pedestal, a recess formed at the case body near the pedestal, and a convex formed on the cover at a position corresponding to the recess, it is configured such that the convex is inserted in and adhered to the recess to attach the cover to the case body. With this, it becomes possible to change the amount of adhesive member in accordance with the environment, etc., with the simple structure.Type: GrantFiled: October 16, 2009Date of Patent: November 6, 2012Assignee: Keihin CorporationInventor: Hiroshi Kato
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Patent number: 8305765Abstract: According to one embodiment, an electronic apparatus includes a housing, a signal wiring and an electronic component. The signal wiring is provided on a first surface which is an inner surface of the housing. The electronic component is accommodated in the housing and includes a conductive member for electrical continuity with the signal wiring. The conductive member is formed on a surface of the electronic component facing the first surface of the housing. The electronic component is fixed to the first surface of the housing by a conductive adhesive agent having conductivity so that the conductive member has electrically continuity with the signal wiring. The electronic component is fixed to the first surface of the housing by a reinforcing adhesive agent having adhesive strength higher than the conductive adhesive agent.Type: GrantFiled: February 15, 2011Date of Patent: November 6, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Takahiro Sugai
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Patent number: 8300424Abstract: A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.Type: GrantFiled: November 25, 2008Date of Patent: October 30, 2012Assignee: GE Intelligent Platforms Embedded Systems, Inc.Inventors: Jerry Wright, David L. McDonald
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Patent number: 8295059Abstract: A system relating to improved traffic-control hardware expansion and component testing. More particularly, this invention relates to providing systems for efficient expansion and portable testing of NEMA-standard TS-1 and TS-2 traffic-control devices used in traffic-control applications. The system is especially useful in extending the service life of “aging” fixed-size traffic-control cabinets, within existing traffic-control networks.Type: GrantFiled: February 23, 2010Date of Patent: October 23, 2012Inventor: William J. Conroy
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Patent number: 8283576Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.Type: GrantFiled: November 29, 2007Date of Patent: October 9, 2012Assignee: Rittal GmbH & Co. KGInventors: Michael Schell, Tobias Becker, Igor Harry Schaaf
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Patent number: 8279614Abstract: A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated by at least one wall, wherein each of the chambers surrounds at least one of the electronic components.Type: GrantFiled: July 24, 2006Date of Patent: October 2, 2012Assignee: Siemens AktiengesellschaftInventors: Vegard Horten, Vidar Steigen
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Patent number: 8264854Abstract: A method includes providing a molded elastomeric mat having an input protrusion, an output device receiving surface including an output device contact, and a battery receiving indentation including a power supply contact. The method further includes insert molding an output conductive path into the elastomeric mat, the output conductive path electrically coupling a circuit carrier output contact to an output device contact, and insert molding a power supply conductive path into the elastomeric mat, the power supply conductive path electrically coupling a circuit carrier power contact to the power supply contact. The method includes interfacing the elastomeric mat with a circuit carrier, aligning the input protrusion with a circuit carrier input contact, interfacing a display device with the output device receiving surface, electrically connecting the display device with the output device contact, and positioning the elastomeric mat into a housing.Type: GrantFiled: November 12, 2009Date of Patent: September 11, 2012Assignee: Roche Diagnostics Operations, Inc.Inventor: Matthew Carlyle Sauers
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Patent number: 8259465Abstract: A chip card holder is secured to a circuit board. The chip card holder comprises a hollow frame including an opening, a first board, a second board opposite to the first board, two opposite sidewalls and an end board opposite to the opening. The frame has two securing blocks protruding from the first board toward the second board and two latching blocks protruding from the end board; the securing blocks and the latching blocks are for latching the chip card holder to the circuit board.Type: GrantFiled: August 6, 2010Date of Patent: September 4, 2012Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., Chi Mei Communication Systems, Inc.Inventor: Ri Zhou
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Patent number: 8259452Abstract: An electronic device according to the present invention comprises a pair of housings coupled to each other openably and closably by a hinge mechanism, and each of the housings comprises a front cabinet and a back cabinet joined to each other. The back cabinet of at least one of the housings is formed from a material having a greater expansion coefficient than that of a material forming the front cabinet, and the back cabinet of at least one of the housings has a cutting part extending in the width direction perpendicular to the longitudinal direction thereof and longitudinally cutting at least a part of the back cabinet.Type: GrantFiled: February 24, 2009Date of Patent: September 4, 2012Assignee: KYOCERA CorporationInventors: Katsushige Kori, Masaki Ikari
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Patent number: 8259450Abstract: A mobile container may include a bottom element, a top element, a front element, a back element, and two side elements defining a containment volume. The two side elements may have a length longer than a length of either the front element or the back element. The containment volume may be configured to include a plurality of rack frames. Each rack frame may include a module insertion area on a first side of the rack frame, a universal backplane area, and a power bus. The universal backplane area may be positioned on a second side of the rack frame opposite to the first side and may include at least one mounting surface configured to mount two or more backplane boards. At least two of the backplane boards may be configured to couple to two respective modules that each have at least two different functions and are insertable through the module insertion area. The at least two different functions of at least one backplane board may include rack power and management functions.Type: GrantFiled: July 21, 2010Date of Patent: September 4, 2012Assignee: Birchbridge IncorporatedInventors: John Craig Dunwoody, Teresa Ann Dunwoody
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Patent number: 8248810Abstract: An electronic device having an integral feeling between a display and an operating member is provided. A mobile phone 1 includes a reinforcing frame 31 arranged between a first case 2 and a sub-display device 29 and having a frame opening 31h formed at a position facing a display surface 29a of the sub-display device 29; a trim plate 35 arranged on a surface facing the case opening 2h of the reinforcing frame 31 to cover the frame opening 31h and positioned in the case opening 2h; a sensor board 39 arranged on the surface facing the case opening 2h of the reinforcing frame 31 and having a board opening 39h in which the trim plate 35 is inserted; a dome switch 45 arranged on a mounting surface 39a facing the case opening 2h of a sensor board 39; and a ring key 7 arranged between the case opening 2h and the trim plate 35 to be able to depress the dome switch 45.Type: GrantFiled: August 24, 2007Date of Patent: August 21, 2012Assignee: Kyocera CorporationInventor: Shiro Arita
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Patent number: 8248771Abstract: A power supply of personal computers equipped with a modular conversion circuit comprises a main circuit board, a conversion module board, a first conversion circuit and a first module slot located on the main circuit board, and a second conversion circuit and a second module slot located on the conversion module board. The first conversion circuit converts an input power to generate at least one output power. The first module slot outputs the output power. The second conversion circuit converts the output power and generates at least one conversion power. The second module slot outputs the conversion power to allow at least one external element to respectively electrically connect to the first module slot and the second module slot according to power requirement.Type: GrantFiled: January 19, 2010Date of Patent: August 21, 2012Assignee: Sea Sonic Electronics Co., Ltd.Inventor: Hsiu-Cheng Chang
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Patent number: 8238097Abstract: A computer system includes a chassis, a motherboard secured in the chassis, and a mounting bracket. A first socket and a second socket is disposed on the motherboard. The mounting bracket is secured to the chassis and located above the motherboard. A first riser card is coupled to the first socket, and a second riser card is coupled to the second socket. The computer system further includes a positioning member attached to the second riser card. The positioning member has two opposite side plates. One of the side plates is secured to the second riser card, and the other side plate is secured to the mounting bracket and aligned with the first riser card in a same plane.Type: GrantFiled: October 26, 2009Date of Patent: August 7, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Li-Ping Chen, Chen-Lu Fan
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Patent number: 8238107Abstract: A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.Type: GrantFiled: February 26, 2010Date of Patent: August 7, 2012Assignee: Lingsen Precision Industries, LtdInventors: Jen-Chuan Yeh, Kuo-Ting Lee
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Patent number: 8238117Abstract: The invention provides, in one aspect, an access control system that comprises an access control panel coupled to an access control expansion box. The access control panel includes one or more access control boards disposed within a first rack-mount enclosure, each control board providing at least an interface for monitoring and/or controlling access to one or more building entry points or zones via associated sensors and/or intrusion prevention devices, collectively, “security devices.” The access control expansion box includes a plurality of input/output (I/O) boards disposed within a second rack-mount enclosure. The I/O boards provide an interface for at least (i) sending signals received from one or more additional security devices to the control boards, and/or (ii) sending signals received from the control boards to one or more of the additional security devices.Type: GrantFiled: March 12, 2008Date of Patent: August 7, 2012Assignee: Surveillance Specialties, Ltd.Inventors: Robert A. Burwell, Andrew J. Pavlik
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Patent number: 8228669Abstract: A server chassis layout structure includes a chassis body, a partition plate, and a power backplane module. The chassis body includes a bottom plate, first and second top plates, and two side plates. The first and second top plates form a first opening therebetween. The side plates are mounted between the bottom and top plates. The partition plate includes at least one retaining portion and is perpendicularly fixed to the bottom plate below the first opening. The partition plate divides the chassis body into first and second sections. The power backplane module includes at least one lock portion and is vertically inserted into the chassis body via the first opening. The lock portion interferes with the retaining portion so as to assemble the power backplane module into the chassis body above the partition plate, and both the power backplane and the partition plate are exposed via the first opening.Type: GrantFiled: December 10, 2009Date of Patent: July 24, 2012Assignee: Inventec CorporationInventors: Yong-Liang Hu, Yang Zhang, Ji-Peng Xu, Tsai-Kuei Cheng
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Patent number: 8218324Abstract: A module includes an outer housing comprising an additive. A first holder is disposed so as to be in integral relationship the outer housing. A second holder is disposed so as to be in integral relationship with the outer housing. A first circuit board is in removable engagement with first holder and the first circuit board adapted to being held in place by the holder without the use of a fastener. A second circuit board is in removable engagement with the second holder, the second circuit board adapted to being held in place by the holder without the use of a fastener. At least one electrical trace element is disposed so as to be in integral relationship with the outer housing. A conductive portion of the trace element provides a first electrical pathway between the first circuit board and the second circuit board. The insulator material and the additive act to provide electromagnetic compatibility (EMC) shielding for electrical components disposed within the outer housing.Type: GrantFiled: June 16, 2009Date of Patent: July 10, 2012Assignee: Continental Automotive Systems, Inc.Inventor: Thomas L. Jones
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Patent number: 8199523Abstract: Communication apparatus includes a case including a front panel and having a rear side opposite the front panel. A computer motherboard includes a processor and a bus having bus slots, and is mounted in the case so that the bus slots are located adjacent to the rear side of the case. One or more communication adapter cards, each of which includes a bus connector compatible with the bus and one or more ports for receiving a communication cable, are mounted in the case so that the ports are accessible at the front panel. Bus extension circuitry is connected inside the case between the bus slots on the motherboard and the one or more communication adapter cards, and includes a backplane including at least one backplane slot, for receiving the bus connector of the one or more communication adapter cards.Type: GrantFiled: April 8, 2010Date of Patent: June 12, 2012Assignee: Silicom Ltd.Inventor: David Castiel
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Patent number: 8189345Abstract: Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.Type: GrantFiled: June 18, 2008Date of Patent: May 29, 2012Assignee: Lockheed Martin CorporationInventors: John W. Rapp, Nicholas J. Nagurny, Brent I. Gouldey, Mark Jones, Wendy S. Normark
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Patent number: 8184442Abstract: A case for an electronic device includes a printed circuit board; a frame capable of storing the printed circuit board; a back board equipped on a back side of the frame, and including a connector for connecting the printed circuit board; rail holders equipped in predetermined positions of the frame and extending from a front side of the case to the back board; and guide rails engaged with the rail holders respectively and including engagement parts capable of engaging with the rail holders respectively, and holding parts for holding both ends of the frame, and extending in accordance with the rail holders, respectively.Type: GrantFiled: October 28, 2009Date of Patent: May 22, 2012Assignee: Fujitsu LimitedInventors: Mitsuo Fujimura, Hideo Araki, Katsuhiko Ikeda, Yoshiyuki Sato
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Publication number: 20120120602Abstract: A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.Type: ApplicationFiled: March 1, 2011Publication date: May 17, 2012Applicant: INVENTEC CORPORATIONInventors: Yi-Hsuan Chen, Chi-Hua Yeh, De-Yang Wu, Ting-Kai Chen, Chin-Yuan Li, Chih-Han Kuo
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Patent number: 8169788Abstract: A printed board to be loaded into a printed-board-receiving structure having a backboard and a guide rail, the backboard having a connector plug-in connectable to a connector on the printed board, the guide rail guiding the printed board toward the backboard and having a groove including a sloping portion, the printed board includes a sloping portion forming a projection at an end of the printed board, the projection being fittable and slidable along the groove in the guide rail.Type: GrantFiled: November 3, 2009Date of Patent: May 1, 2012Assignee: Fujitsu LimitedInventors: Hiroyuki Shouyama, Yoshiyuki Nakayama, Yoshiaki Tobimatsu, Kazuya Fuke
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Publication number: 20120087095Abstract: A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, tType: ApplicationFiled: April 16, 2010Publication date: April 12, 2012Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa
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Patent number: 8154875Abstract: A power bank with a replaceable battery core includes a box and an electric power unit. The electric power unit includes one or more battery core and a power management module. A circuit protection module is disposed on a side of the battery core, and a first connecting unit is disposed between the power management module and the circuit protection module. The connecting unit is provided for connecting the power management module to the circuit protection module separately, such that the battery core can be separated from the power management module for a replacement easily when the battery core is damaged or failed.Type: GrantFiled: July 16, 2008Date of Patent: April 10, 2012Assignee: Tennrich International Corp.Inventors: Shih-Hui Chen, Chin-Tien Lin
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Patent number: 8144476Abstract: A box-shaped housing of an in-vehicle electronic control unit that controls an occupant crash protection system is installed to an installation surface of a vehicle and includes an opening end that defines an opening in an imaginary plane, a ceiling wall, and a peripheral wall. The housing receives a planar control circuit board of the control unit through the opening end toward the ceiling wall and securely holds the circuit board at the peripheral wall such that a plane of the circuit board is parallel to the imaginary plane. The peripheral wall includes an opening side wall section located adjacent to the opening end, and a ceiling side wall section having a thickness larger than a thickness of the opening side wall section.Type: GrantFiled: January 19, 2010Date of Patent: March 27, 2012Assignee: Denso CorporationInventor: Yoshinori Hirose
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Patent number: 8138864Abstract: A circuit interrupter includes a housing having a molded case made of liquid crystal polymer. Separable contacts are disposed within the housing. An operating mechanism is disposed within the housing and is structured to open and close the separable contacts. A trip mechanism is disposed within the housing and is structured to cooperate with the operating mechanism to trip open the separable contacts. The trip mechanism includes an electronic trip circuit and a rigid, conductive base providing a ground to the electronic trip circuit. The rigid, conductive base is insert molded to a portion of the molded case.Type: GrantFiled: June 1, 2009Date of Patent: March 20, 2012Assignee: Eaton CorporationInventors: Patrick W. Mills, Richard G. Benshoff, James M. McCormick
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Patent number: 8134843Abstract: A server is disclosed, which includes two dividing plates disposed between the side plates, several rails disposed on the side plates and the dividing plates, at least one adapter board module, and several main boards. The dividing plates are parallel to the side plates. Each dividing plate has a position pin. The rails are parallel to the bottom plate. The main boards are slid in the rails. The adapter board module has a support piece and an adapter board. The support piece has position holes to be coupled to the position pins and fix the adapter board module on the dividing plates. The adapter board is disposed on the support piece and has two first gold finger interfaces. Each main board has a second gold finger interface. The first gold finger interfaces are coupled to the second gold finger interfaces, thereby each adapter board is connected to two main boards.Type: GrantFiled: February 6, 2010Date of Patent: March 13, 2012Assignee: Inventec CorporationInventors: Jian-Feng Wu, Tsai-Kuei Cheng
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Patent number: 8116078Abstract: A server auxiliary operating system is disclosed, which includes a case, a plurality of swappable GPUs and a printed circuit back plane. The case includes a bottom board and a first mounting bay located at the front portion of the case. The swappable GPUs are disposed in the first mounting bay. The printed circuit back plane is disposed on the bottom board and has a plurality of first interfaces and a plurality of second interfaces electrically corresponding to the first interfaces, wherein the swappable GPUs are respectively coupled to the first interfaces, and the servers are respectively electrically connected to the corresponding swappable GPUs through the second interfaces respectively connected to the servers so as to expand the server operation capability.Type: GrantFiled: May 4, 2010Date of Patent: February 14, 2012Assignee: Inventec CorporationInventors: Ji-Peng Xu, Tsai-Kuei Cheng, Shyn-Ren Chen, Banks Chen
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Patent number: 8116095Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.Type: GrantFiled: October 6, 2010Date of Patent: February 14, 2012Assignee: ADC Telecommunications, Inc.Inventors: James Dorenkamp, Vern Loch, Jeffrey Peters, Wayne Nelson
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Patent number: 8112196Abstract: An electronic control unit includes a sensor circuit board 30 which is mounted with sensors 33, 34 for detecting a predetermined physical quantity; a control circuit board 20 which controls an operation of an electric component on the basis of the physical quantity detected by the sensors 33, 34; and a housing 40 which accommodates the sensor circuit board 30 and the control circuit board 20, wherein at least one of the sensor circuit board 30 and the control circuit board 20 is mounted to a circuit board support stepped portion 47 formed in an inner surface of the housing 40 so that the sensor circuit board 30 and the control circuit board 20 are arranged in a layered state.Type: GrantFiled: July 24, 2008Date of Patent: February 7, 2012Assignee: Nissin Kogyo Co., Ltd.Inventor: Akihide Takayanagi
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Patent number: 8112060Abstract: An electronic device includes a main body and an audio module. The main body includes a first circuit board and a first coil. The first circuit board is configured for processing electrical signals. The first coil is electrically connected with the first circuit board, and configured to convert electrical signals with electromagnetic waves. The audio module includes a second circuit, a speaker, a microphone, and a second coil. The second circuit board is configured for processing electrical signals. The speaker is electrically connected with the second circuit board, and produces a sound according to electrical signals. The microphone is electrically connected with the second circuit board and configured to detect sound wave and generate electrical signals. The second coil is electrically connected with the second circuit board, and configured to convert electromagnetic waves with electrical signal.Type: GrantFiled: June 30, 2009Date of Patent: February 7, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Kim-Yeung Sip
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Patent number: 8107256Abstract: A networking appliance includes a chassis, an off-the-shelf motherboard mounted on said chassis, said motherboard including at least one expansion bus, one or more separately removable expansion module mounted on said chassis, and a number of card slots in the expansion module for accommodating expansion cards. A connection arrangement provides a signal connection between the card slots in the expansion modules and the expansion buses.Type: GrantFiled: October 26, 2007Date of Patent: January 31, 2012Assignee: Solace Systems, Inc.Inventors: Paul Kondrat, James Moser, Scott Drennan, Jonathan Bosloy, Charles Mitchell, Shawn McAllister
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Patent number: 8107242Abstract: A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.Type: GrantFiled: May 29, 2008Date of Patent: January 31, 2012Assignee: Daikin Industries, Ltd,Inventors: Akio Yoshimoto, Mitsuhiro Tanaka
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Patent number: 8102670Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.Type: GrantFiled: September 26, 2008Date of Patent: January 24, 2012Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa