With Shielding Structure Patents (Class 361/800)
  • Patent number: 8773867
    Abstract: A camera module is disclosed. The camera module in accordance with the present invention includes: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Yong-Gu Kim
  • Patent number: 8767407
    Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: July 1, 2014
    Assignee: LG Electronics Inc.
    Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
  • Patent number: 8760859
    Abstract: Electromagnetically shielded portable storage devices are disclosed. One such device includes an electromagnetically shielded enclosure having an interior volume, the electromagnetically shielded enclosure including a plurality of shielded walls and sized to be manually carried by a person. The interior volume of the enclosure is isolated from high-frequency electromagnetic energy generated external to the enclosure. The device includes at least one storage device positioned within the interior volume, and at least one communicative connection extending from the at least one storage device to a communicative socket accessible external to the electromagnetically shielded enclosure. The at least one communicative connection is configured to allow access to the storage device by a computing system external to the electromagnetically shielded enclosure.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: June 24, 2014
    Assignee: Emprimus, LLC
    Inventors: Greg Fuchs, Gale Nordling, George Anderson, David Blake Jackson
  • Patent number: 8749980
    Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: June 10, 2014
    Assignee: LG Electronics Inc.
    Inventors: Dongsu Won, Seunghwan Jang, Yongsang Cho
  • Patent number: 8735736
    Abstract: The electronic component module includes a substrate; an electronic component mounted on an electronic component mounting surface of the substrate; an insulating body that covers the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate. The substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: May 27, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Tamon Kasajima, Masashi Shiraishi
  • Patent number: 8723047
    Abstract: A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: May 13, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaolan Shen, Qingsong Ye, Konggang Wei
  • Patent number: 8699235
    Abstract: The Mobile Phone/PDA Security Masking Box is a sound insulated box for use as a temporary storage location for cellular and other mobile devices in locations at which confidential and sensitive conversations and discussions are being conducted. A pink/white noise generating device within the box generates a masking noise such that the cellular or other mobile devices inside the box are unable to pick up or record conversations outside the box.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: April 15, 2014
    Assignee: CDD Ventures LLC
    Inventor: Ali H Soufan
  • Patent number: 8665607
    Abstract: An anti-eavesdropping device is described. The device comprises a receiving compartment for receiving an electronic device, a noise generator, and an EMI filter. The receiving compartment is sealable to minimize signal emissions from the interior to the exterior and from the exterior to the interior, and the noise generator is coupled with the receiving compartment and the EMI filter. The EMI filter is operatively coupled with the noise generator.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: March 4, 2014
    Assignee: Vector Technologies, LLC
    Inventors: Jose M. Bouza, II, Salvador Aguirre, Jr., Daniel Ashley McDonnell, Timothy Wayne Eaton, Stephen Robert Woodruff, Frank Augustine Mason
  • Patent number: 8659912
    Abstract: A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: February 25, 2014
    Assignee: Biotronik SE & Co. KG
    Inventors: Singjang Chen, Jonathan Benson, Erica L. McCay
  • Patent number: 8653633
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: February 18, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung
  • Patent number: 8644027
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: February 4, 2014
    Assignee: SynQor, Inc.
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Patent number: 8624133
    Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: January 7, 2014
    Assignee: Fujitsu Limited
    Inventors: Albert Pedoeem, Paul V. Shannon, Mahesh Mistry, Larry Fox, Roberto Medrano, Jimmy O. Goodwin
  • Patent number: 8625293
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: January 7, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Allen E. Oberlin, John Michael Matly, Kip R. Piel, Jerry J. Wendling
  • Patent number: 8625295
    Abstract: An interface circuit board apparatus can include a shared circuit board base, a transceiver section disposed on the circuit board base, and having circuit transceiver sites configured to receive a plurality of transceiver component types, a termination section disposed on the circuit board base, and having circuit termination sites configured to receive a plurality of termination component types, and a connection section operatively coupled to the transceiver and termination sections, wherein the transceiver section, the termination section and the connection section are configurable to support a plurality of interface types based on the plurality of transceiver component types and the plurality of termination component types.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: January 7, 2014
    Assignee: General Electric Company
    Inventors: Daniel Milton Alley, Longhui Shen, Ye Xu
  • Patent number: 8605457
    Abstract: An integrated antenna and electromagnetic (EM) noise shield apparatus for use with a radio frequency communicating device and EM noise generating electronic equipment housed within a generally cylindrical outer glass enclosure or bezel of wireless utility meter. A flexible printed circuit (PC) board has an upper region and a lower ground plane region. A radiating element is defined on the PC board in the upper region. A metal ground plane component has a first portion having the shape of a circle segment and a second orthogonal portion. The ground plane component is mechanically fixed and electrically connected to the ground plane region of the PC board, with the orthogonal second portion being proximate to and shielding the radiating element. The ground plane component and the ground plane portion of the PC board define an electromagnetic shield for electromagnetic emissions between EM noise generating electronic equipment housed within said outer bezel and the radiating element.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: December 10, 2013
    Assignee: Itron, Inc.
    Inventor: Zafarullah Khan
  • Patent number: 8599576
    Abstract: Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: December 3, 2013
    Assignee: Emprimus, LLC
    Inventors: Frederick R. Faxvog, Greg Fuchs, Wallace Jensen, David Blake Jackson, Bill Volna, Gale Nordling, James Nicholas Ruehl
  • Patent number: 8599541
    Abstract: An electronic apparatus includes a casing, a cap, and an access module. An accommodation space of the casing is used for accommodating a data storage apparatus, and the access module is disposed inside the accommodation space. The casing is formed with an opening at a position corresponding to an access unit, so that an external card is inserted in or pulled out through the opening. A terminal of the access module is pivoted on the casing. The cap is used for covering and thus sealing the accommodation space, so that the access module is arranged between the data storage apparatus and the cap. Thereby, the space is saved, and the access module and the data storage apparatus can be detached or assembled conveniently.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: December 3, 2013
    Assignee: Inventec Corporation
    Inventor: Chien-Hua Lai
  • Patent number: 8576372
    Abstract: An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 5, 2013
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Patent number: 8570766
    Abstract: A shield case includes a first shield member and a second shield member coupled to the first shield member to form the shield case. A concave portion is capable of accommodating a sealing member for sealing inner space of the shield case by contacting the first shield member and the second shield member, and is formed on the second shield member. On each of the first shield member and the second shield member, a paint film portion is formed on an area of the shield case external to the concave portion. On the first shield member or the second shield member or combination thereof, a convex portion is formed on the area of the shield case on the inner space side and internal to the concave portion. The surfaces of the first shield member and the second shield member contact each other at the convex portion.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: October 29, 2013
    Assignee: Fujitsu Limited
    Inventors: Kazuya Noguchi, Hiromi Maeda, Toshimitsu Kobayashi, Atsushi Kaneko, Yoshihiro Waki, Masaki Yamamoto
  • Patent number: 8570735
    Abstract: An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: October 29, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xue-Dong Tang, Ke-Hui Peng, Ren-Wen Wang, Ping Li
  • Patent number: 8558122
    Abstract: A filler panel for blocking an unused portion of a communications system. That filler panel may include an electromagnetic shielding base and a base cover removably coupled to the electromagnetic shielding base. The filler panel may also include an air dam composed substantially of low-cost, nonconductive material coupled to either the electromagnetic shielding base or to the base cover through the electromagnetic shielding base.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: October 15, 2013
    Assignee: Fujitsu Limited
    Inventors: Albert Pedoeem, Mahesh Mistry
  • Patent number: 8559192
    Abstract: The display device includes: a panel module 4 that includes a display panel 16 and a driving circuit for driving the display panel 16; a metallic front housing 11 that partially covers the panel module 4 from a display surface side of the display panel 16; and a metallic back housing 12 that covers the panel module 4 from a back surface side of the display panel 16. A conductive cloth 24 is disposed between the panel module 4, and the front housing 11 and the back housing 12, the conductive cloth 24 continuously covering a circumferential edge portion of the panel module 4 on the display surface side, a side surface portion of the panel module 4 and a circumferential edge portion of the panel module 4 on the back surface side and being connected electrically to the front housing 11 and the back housing 12.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: October 15, 2013
    Assignee: Panasonic Corporation
    Inventors: Masato Murakata, Kazuhiro Oota, Toshiharu Ishimura
  • Patent number: 8525024
    Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: September 3, 2013
    Assignee: NOK Corporation
    Inventors: Hiroaki Kaneda, Takeshi Yamada
  • Publication number: 20130208435
    Abstract: The disclosure relates generally to an electronics device having a first housing part connected with a second housing part. The second housing part includes a Printed Circuit Board (PCB) with electronics components, an electromagnetic shielding cover being mounted for electromagnetic shielding (ES) of the electronics components, the cover including a bottom or base wall spaced apart from the PCB and projecting walls contacting the PCB, the projecting walls being arranged to surround one or more of the electronics components. The device includes compressible members arranged between the cover and the first housing part, an engagement structure opposite the cover engaging and compressing the compressible member. In this manner the screws required for fixing the cover is reduced substantially, or eliminated.
    Type: Application
    Filed: December 28, 2012
    Publication date: August 15, 2013
    Applicant: Huawei Technologies Co., Ltd.
    Inventor: Huawei Technologies Co., Ltd.
  • Patent number: 8507808
    Abstract: A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 13, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Li-Zhi Xiong, Liang Su, Wen-Jun Liu, Cheng-Rui Liu, Jun-Sheng Qiao, Pei-Chin Kuo
  • Patent number: 8467195
    Abstract: An electronic apparatus includes: a first circuit board having a mounting surface; a shield casing disposed so as to face the mounting surface of the first circuit board and cover an electronic component mounted on the mounting surface; a battery disposed so as to face the shield casing at a position next to the first circuit board in a first direction which is parallel to the mounting surface of the first circuit board; and a first rib provided on a surface of the shield casing so as to extend in the first direction, one end of the first rib being disposed at a position corresponding to the first circuit board in a second direction, the other end of the first rib being disposed at a position corresponding to the battery in the second direction, the second direction being perpendicular to the mounting surface.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: June 18, 2013
    Assignee: KYOCERA Corporation
    Inventor: Masayuki Zaitsu
  • Patent number: 8462521
    Abstract: A shielding assembly comprises a pair of opposite first sidewalls, a pair of opposite second sidewalls, a pair of opposite first covers, a pair of latching portion and a pair of opposite second covers. The first sidewalls and the second sidewalls are connected with each other to collectively form a hollow frame. The first covers are resiliently connected to the first sidewalls, respectively, and suitable to be bent to collectively cover the hollow frame. The pair of latching portions extend the first covers and are bent perpendicular to the first covers, respectively. A pair of gaps are defined respectively on two tail ends of each of the latching portions. The second covers are resiliently connected to the second sidewalls, respectively, and are bent to cover on the first covers and latched in corresponding gaps.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: June 11, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shih-Wei Lin
  • Patent number: 8451622
    Abstract: A circuit board module includes a circuit board, a plurality of electronic components, a plurality of connectors and a cover. The circuit board includes a heat dissipation unit. The electronic components, the connectors and the heat dissipation unit are disposed on a first surface of the circuit board. The cover has a plurality of openings with the shapes and the sizes corresponding to the connectors and the heat dissipation unit. When the cover covers the circuit board, the openings expose the connectors and the heat dissipation unit. Users can plug and pull the connectors of the circuit board through the openings. The size of the cover is corresponding to the circuit board. The circuit board module is dust-proof and can prevent the users from accidentally touching the electronic components.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: May 28, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventor: Yen-Po Yu
  • Patent number: 8446715
    Abstract: A portable electronic device includes a housing formed with a first receiving space, and a second receiving space communicating spatially with the first receiving space. A keyboard is disposed within the second receiving space. A pop-up mechanism is disposed within the first receiving space, and includes a hollow post body disposed within the first receiving space, and an ejecting member disposed movably within the hollow post body and abutting against a bottom side of the keyboard. The ejecting member is movable between first and second height positions when the keyboard is pressed downwardly. When the ejecting member is in the first height position, the keyboard is in a horizontal position within the second receiving space. When the ejecting member is in the second height position, the keyboard is in a tilted position tilting outwardly from the second receiving space.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: May 21, 2013
    Assignee: Wistron Corporation
    Inventors: Hou-Chu Su, Chih-Yi Wang, Tzu-Jai Lee
  • Patent number: 8422248
    Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: April 16, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Jae-Joon Lee, Mi-Ja Han, Dae-Hyun Park
  • Patent number: 8422234
    Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: April 16, 2013
    Assignee: Sierra Wireless
    Inventors: Jacques Goriaux, Alain Bironneau, Jean-Pierre Mauclerc
  • Patent number: 8411447
    Abstract: A power amplifier chassis for an n+1 redundant power amplifier system. The power amplifier chassis includes an embedded controller and a power amplifier. The embedded controller operates the power amplifier chassis in a master controller mode or a slave controller mode. When operated in the master controller mode, the embedded controller monitors operating parameters associated with the power amplifier chassis, and can transfer control of the power amplifier system when the embedded controller senses that the monitored operating parameters indicate a failure or impending failure of the power amplifier chassis. When operated in the slave controller mode, the embedded controller receives control instructions from the master controller power amplifier module, and is enabled to reconfigure the power amplifier chassis from the slave controller mode to the master controller mode in response to a failure or imminent failure indication of a first power amplifier chassis operated in master controller mode.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 2, 2013
    Assignee: Teledyne Paradise Datacom, LLC
    Inventor: Stephen D. Turner
  • Patent number: 8406012
    Abstract: In a flat panel display (FPD), a conductive heat proof plate is inserted between the back surface of a display panel, on which printed circuit boards (PCBs) and signal lines are formed, and signal lines. A back frame positioned on the back surface of the display panel is provided to cover the printed circuit boards and the signal lines. A shield can is formed in the internal surface region of the back frame corresponding to the printed circuit board on which a timing controller is mounted. The shield can is electrically coupled to the heat proof plate to improve resistance against the electromagnetic compatibility of a large flat panel display and to improve a thermal characteristic.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: March 26, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventor: Min-Cheol Kim
  • Patent number: 8406001
    Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: March 26, 2013
    Assignee: DualSonic, Inc.
    Inventor: Michael Chy Chao
  • Patent number: 8379164
    Abstract: The invention provides a casing structure for an electronic apparatus that achieves a thin size and light weight. The casing structure is capable of accommodating a display module, and comprises a sidewall and a bottom surface in which a conductive resin region and a nonconductive resin region are butt joined in a curved line. The casing structure of the electronic apparatus does not become thick due to the butt joining even when the joint portions are in a projection area of the display module. Furthermore, on the display side of the casing structure, there is no need to have special frame members for securing strength in addition to the display casing. The display casing accommodates and protects the display module from an external pressing force and also has a design function that the outer surface of the casing resembles that of an outer surface of a conventional notebook PC.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: February 19, 2013
    Assignee: Lenovo (Singapore) Pte. Ltd
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Patent number: 8373998
    Abstract: A shield that protects high-value input resistors in a power meter against unwanted effects due to electromagnetic interference from a nearby power supply and/or due to crosstalk from adjacent phases. The shield includes multiple printed circuit board shields that are arranged between each of the input resistors on a main printed circuit board in the power meter. Each PCB shield has a conductive layer that provides the shielding against unwanted energy. The resistors are arranged in a diagonal or parallel manner between each pair of PCB shields to prevent the resistor from movement, which prevents pin fatigue and fixes the value of the parasitic capacitance that is produced in the resistor-PCB-shield combination. In another configuration, the PCB shield is made of a flexible material, and snakes between and over the top or around the side ends of each resistor in a serpentine fashion, protecting the resistors from unwanted energies from both the top and the sides.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: February 12, 2013
    Assignee: Schneider Electric USA, Inc.
    Inventors: Marc A. Ricci, Jonathan Knoll
  • Patent number: 8369096
    Abstract: An electronic apparatus includes a wiring board, a main member to which the wiring board is fixed, a first component mounted rigidly on the wiring board and positioned with respect to the main member, and a second component mounted movably on the wiring board and positioned with respect to the main member, and a positioning portion provided on the wiring board to determine a position of the wiring board with respect to the main member, wherein a distance from the positioning portion to the first component is shorter than a distance from the positioning portion to the second component.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: February 5, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventor: Motonari Yamada
  • Patent number: 8363424
    Abstract: A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: January 29, 2013
    Assignee: Wistron Corporation
    Inventor: Kun-Hui Lai
  • Patent number: 8350150
    Abstract: An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: January 8, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Hung Liu, Po-Chuan Hsieh, Yu-Chang Pai
  • Patent number: 8350367
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of a grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: January 8, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Tsung Chiu, Chih-Pin Hung, Jui-Cheng Huang
  • Patent number: 8351221
    Abstract: The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: January 8, 2013
    Assignee: RF Micro Devices, Inc.
    Inventors: John Robert Siomkos, Mark Alan Crandall, Carl Hinshaw
  • Patent number: 8345448
    Abstract: A mobile terminal includes a noise shielding structure for an electronic circuit board for shielding noise generated from the at least one electronic part. The mobile terminal includes a lower case and an upper case slidably moving on the lower case. The mobile station also includes an electronic circuit board installed in the lower case and having at least one electronic part mounted on its front surface. The noise shielding structure includes a front cover installed on the front surface of the electronic circuit board and formed with an opening for receiving the at least one electronic part and a sliding hinge installed between the upper case and the lower case. A shielding wall installed between the rear surface of the front cover and the front surface of the electronic circuit board and elongated around at least a part of a periphery of the opening.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: January 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Ju Lee, Ji Hyung Kim
  • Patent number: 8339800
    Abstract: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 25, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshihiro Yamaguchi, Tomonori Ito
  • Patent number: 8325495
    Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated from conductive members of adjacent cells by a gap and a cavity is defined in the non-conductive substrate at a location of each gap.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: December 4, 2012
    Assignee: The Boeing Company
    Inventors: Tai A. Lam, Minas H. Tanielian
  • Patent number: 8319114
    Abstract: A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 27, 2012
    Assignee: Densel Lambda K.K.
    Inventors: Sun-Wen Cyrus Cheng, Paulette Lemond, Carl Milton Wildrick
  • Patent number: 8310326
    Abstract: Example methods include calculating a first number of turns of a shield winding included in an energy transfer element of a power supply. A first number of turns of the shield winding is calculated for the power supply to have a low noise current in an input conductor of the power supply. The method then includes increasing the first number of turns to a second number of turns. The power supply is then operated, which generates a first voltage waveform of a voltage between the input conductor and an output conductor of the power supply. An impedance is then inserted between the shield winding and the input conductor. The noise current is reduced by adjusting a value of the impedance until a second voltage waveform of the voltage between the input conductor and the output conductor reverses polarity to be the opposite of a polarity of the first voltage waveform.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: November 13, 2012
    Assignee: Power Integrations, Inc.
    Inventor: Marvin C. Espino
  • Patent number: 8305763
    Abstract: In a housing case for housing an electronic circuit board, comprising a case body, a cover, a pedestal formed on the case body to support the board, a holder formed on the cover at a location to face the pedestal to hold the board from opposite side of the pedestal, a recess formed at the case body near the pedestal, and a convex formed on the cover at a position corresponding to the recess, it is configured such that the convex is inserted in and adhered to the recess to attach the cover to the case body. With this, it becomes possible to change the amount of adhesive member in accordance with the environment, etc., with the simple structure.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: November 6, 2012
    Assignee: Keihin Corporation
    Inventor: Hiroshi Kato
  • Patent number: 8295060
    Abstract: A mounting apparatus includes a mounting member and a bracket. The mounting member includes a base piece and a latch piece located on the base piece. The latch piece is configured for securing a riser card. The bracket is configured for securing a PCI card, which is electronically coupled to the riser card. The bracket is secured to the base piece and the latch piece.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: October 23, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Lei Liu, Xiao-Zhu Chen
  • Patent number: 8283576
    Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 9, 2012
    Assignee: Rittal GmbH & Co. KG
    Inventors: Michael Schell, Tobias Becker, Igor Harry Schaaf
  • Patent number: 8278553
    Abstract: A harness module structure includes a module mounting portion, which is formed upon an obverse surface of a steering support member, which extends in approximately the direction of the width of a vehicle. A harness module is installed upon the module mounting portion. The harness module includes a harness module body proper, and a module cover, which is mounted upon the harness module body proper. The harness module body proper is enclosed by the module cover and the module mounting portion, and the module cover includes a grounding portion with respect to the module mounting portion, such that the harness module body proper has an interstice with respect to the module mounting portion, and is supported in a non-contact state thereupon, by way of the grounding portion.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: October 2, 2012
    Assignee: Calsonic Kansei Corporation
    Inventors: Hitoshi Suzuki, Fumihiro Okazaki, Takeshi Anzai, Kazuhiko Horikoshi, Takeshi Ogasawara