Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.

Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Abstract: The present invention is directed to an electromagnetic interference (EMI) shielding device. The EMI shielding device may be formed of a material (ex.—Beryllium Copper) having a thickness which allows the shielding device to provide a desired range of compression. Further, the EMI shielding device may be constructed for accommodating tolerances and compression forces which may be encountered in various implementation environments. Further, the EMI shielding device may be sized and shaped for promoting compatibility of the EMI shielding device with Surface Mount Technology (SMT) processes.

Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Abstract: An electronic signal transmitting device is disposed in a housing of an integrated circuit. The integrated circuit includes at least one first signal end and at least one second signal end. The electronic signal transmitting device includes at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end; and an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference.

Abstract: A method is provided for assembling a connector assembly to a case. The case includes an inside surface defining an inside of the case, an outside surface defining an outside of the case, and an aperture therethrough providing communication from the inside surface to the outside surface. The connector assembly includes an outer connector having a body with a passage therethrough, an electromagnetic shield, and an inner connector with a terminal therein with a conductor extending from the inner connector in electrical communication with the terminal. The method includes positioning the outer connector on the outside of the case to align the passage of the outer connector with the aperture of the case. The method also includes positioning the inner connector on the inside of the case. The method also includes inserting the inner connector into the passage of the outer connector from the inside of the case.

Abstract: A carrier includes main body, a conductive elastic element, and a handle. The main body is adapted to carrying an electronic device and has a cavity. The conductive elastic element is disposed in the cavity. The handle is pivotally coupled to the main body. When the handle locks the main body to be located in a lock position, the handle exerts force on the conductive elastic element such that the conductive elastic element protrudes outside the main body through the cavity. When the handle does not lock the main body and exert force on the conductive elastic element to be located at a release position, the conductive elastic element is located inside the main body where it does not interfere with an outside device. This allows convenient insertion and removal of the carrier relative to a cage. Accordingly, the conductive elastic element is not damaged easily.

Abstract: An electromagnetic shield for a storage device comprising a printed circuit board (PCBA) defining a plated through hole defining a generally cylindrical plated surface. The electromagnetic shield may comprise a top surface and sides oriented generally perpendicular to the top surface. One or more of the sides comprise a press-fit connector configured for removable insertion in the plated through hole. The press-fit connector may comprise at least one resilient member defining a longitudinal axis and configured to resiliently bow out in a direction generally perpendicular to the longitudinal axis during insertion and press against the plated surface of the through hole to displace plating material formed thereon to form a gas-tight seal between the at least one resilient member and the plated surface.

Abstract: An electronic device includes a motherboard defining a number of through holes, a bottom wall forming a number of posts, and a fixing member including a fixing body mounted to the bottom wall and a movable body slidably mounted to the fixing body. Each through hole includes a first hole and a second hole communicating with each other. Each post includes a supporting portion, a head, and a neck. The fixing body forms a protrusion. The movable body includes a main portion, a connecting portion connected to the main portion and defining a limiting slot. The heads are extended through the first holes; the necks abut end walls bounding the second holes. The motherboard is sandwiched between the heads and the supporting portions, the protrusion is engaged in the limiting slot, and the main body abuts against an end of the motherboard adjacent to the fixing member.

Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.

Abstract: An apparatus may be provided. The apparatus may comprise a circuit board. In addition, the apparatus may comprise an integrated connector mounted to the circuit board. A choke, external to the integrated connector, may be included in the apparatus. The choke may be electrically connected to the integrated connector through the circuit board.

Abstract: A power converter for an engine generator includes an insulative support that receives and supports circuit components for converting incoming AC power to desired power, such as power suitable for a welding application. One or more rectifier modules are provided that are received and supported by the support. Three such modules may be provided for receiving three phase power from a generator. DC power from the rectifier module is applied to DC bus plates. The plates may be coupled to capacitors. A power conversion circuit, such as a buck converter, is coupled to the DC bus plates to convert the DC power to output power.

Abstract: Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).

Abstract: An insertion member provided with a male thread on the peripheral surface thereof is inserted through an opening of a receiving member. The insertion member is fastened by a fastening member provided with a female thread on the inner surface thereof. A first O-ring is provided between the insertion member and the fastening member, and a second O-ring is provided between the fastening member and the receiving member. When viewing each circular cross-section of the first and second O-rings along a surface parallel to a moving direction of the fastening member at the point of fastening the insertion member by rotating the fastening member, a first point of each circular cross-section is pressed against a surface perpendicular to the moving direction, and a position displaced from a second point opposite to the first point of each circular cross-section is pressed against an inclined surface inclined to the moving direction.

Abstract: A power converter is described which is comprised of a filter circuit component including a reactor and capacitor wherein the reactor includes a core which consists of a magnetic substance which is disposed around a conductive wiring member, a noise generating component which radiates noise wherein the noise generating components are disposed adjacently to the filter circuit component and a shielding plate which shields out the radiating noise. The shielding plate is disposed between the filter circuit component and the noise generating component. The conductive wiring member and the shielding plate are composed as one body electrically insulated from each other.

Abstract: In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by an electrode non-formation portion are provided. The first, second, fourth, and fifth internal ground electrode are connected to the respective switching regulator devices. The third internal ground electrode is connected to the linear regulator device. The first to fifth internal ground electrodes are connected to respective different external ground terminals.

Abstract: An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: First and second units are mounted on a rear side of a housing of a storage system. Either of the first and second units includes a fan. The rear side of the housing includes an upper-tier portion defining an upper-tier opening, and a lower-tier portion defining a lower-tier opening, and the housing further includes a boundary portion that is a boundary between the upper-tier portion and the lower-tier portion, and a shutter unit. The boundary portion includes a first through hole that is a through hole connecting an upper-tier passage and a lower-tier passage. When the fan is operating, if the first unit is removed from the upper-tier portion, the shutter unit blocks the upper-tier passage, and if the second unit is removed from the lower-tier portion, the shutter unit blocks the lower-tier passage.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract: An electromagnetic interference blocking device is provided for blocking electromagnetic interference between transmission lines formed on a surface of a circuit board. The electromagnetic interference blocking device includes a body configured to be inserted into a slot formed in the surface of the circuit board between the transmission lines, the body including a bottom portion having a comb shape insertable within the slot.

Abstract: An electronic device of the invention includes a main chassis, an electronic module, a cage and an EMI shielding structure. The main chassis has an opening. The cage is assembled to the main chassis and covers the opening. The electronic module is disposed in the cage. The EMI shielding structure includes a conductive frame and at least one first conductive spring clip. The conductive frame is assembled to the cage and electrically connected to the electronic module. The first conductive spring clip is connected to the conductive frame and contacts the main chassis, in which an electromagnetic wave emitted by the electronic module sequentially passes through the conductive frame and the first conductive spring clip to be transmitted to the main chassis.

Abstract: An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern.

Abstract: A radiation shield standoff comprises a support section having a mounting surface for an electronic component, with the support section configured to separate the electronic component a predetermined distance from a chassis wall. The standoff also includes a coupling section configured to couple the standoff to the chassis wall. A flange is located between the support section and the coupling section, with the flange configured to hold a radiation shield layer in place on the chassis wall and provide radiation shielding. A boss is located between the flange and the coupling section, with the boss abutted against the flange and smaller than the flange. The standoff also comprises a radiation shielding metal.

Abstract: An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Abstract: A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance.

Abstract: An LCD device adapted to become thinner and simultaneously prevent a defect (or fault) due to static electricity is discussed. The LCD device according to an embodiment includes a liquid crystal display panel, an upper case formed from an insulation material and configured to encompass edges of the liquid crystal display panel, a driver PCB (printed circuit board) configured to apply drive signals to one edge of the liquid crystal display panel, a light source configured to apply light to the liquid crystal display panel, a bottom cover formed from a metal material and configured to receive the light source, and a shielding film disposed under one edge of the upper case opposite to the driver PCB and electrically connected to the bottom cover.

Abstract: Systems and methods are provided for a sheet of graphite material on an electromagnetic interference shield for enhanced heat transfer. An electronic device component may be enclosed by an EMI shield, which may retain heat generated by the component. To help dissipate heat, a sheet of material selected for its heat transfer properties may be disposed over the EMI shield. A portion of the sheet may be folded over an edge of the EMI shield such that the sheet may cover a top surface of the sheet as well as tabs extending perpendicular to the top surface of the EMI shield. To facilitate the adhesion of the sheet to a smaller surface area of tabs, the sheet may include features forming a discontinuity in regions of the sheet aligned with the edge of the shield to facilitate folding the sheet. The discontinuity can include, for example, one or more holes or windows.

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract: An assembly (600) includes a substrate (601), an electrical component (1202), and a shield (400). The electrical component is disposed beneath the shield, with both being coupled to a major face (602) of the substrate. The shield can include an upper surface (401) including one or more indentations (408,409) disposed above, and extending toward, the electrical component. A shim (1106) or an injected material (1209) can be substituted for, or used with, the indentations.

Abstract: An electronic device enclosure configured to shield against electromagnetic interference (EMI). The electronic device enclosure includes an electronic device-enclosure base and at least one laterally disposed blunt boss. The electronic device-enclosure base includes a bottom, and sides and attached to the bottom in a boxlike configuration. The laterally disposed blunt boss is configured so as to be disposed between, and to couple electrically, a side of the electronic device-enclosure base and a vertical flange of an electronic device-enclosure cover. The electronic device-enclosure base and the electronic device-enclosure cover are configurable with respect to said laterally disposed blunt boss to shield an interior space enclosed by the electronic device-enclosure base and the electronic device-enclosure cover against EMI at a resonant frequency of a slot of the electronic device enclosure.

Abstract: One embodiment of the present invention is a unique platform. Another embodiment is a unique engine system. Another embodiment is a unique wiring harness system. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for one or more of various types of platforms, such as aircraft, ground vehicles, water-borne vessels and stationary platforms; engine systems; and wiring harness systems. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

Abstract: An accessory may be provided with a button controller having a microphone and switches. The switches may include dome switch members and metal switch terminals mounted in a switch module housing structure. The switch module housing structure may include one or more recesses in which electrical components are mounted. A conductive backplate may cover the recesses and may be coupled to the switch module housing structure. A conductive film may be attached to the switch module housing structure over the dome switch members. The conductive film and the conductive backplate may form an electromagnetic interference shield around the electrical components in the recesses. The switch module housing structure may include a non-conductive plastic overmolded onto a metal frame or may be formed from a first shot of non-conductive plastic and a second shot of conductive plastic to form an electromagnetic interference shield for the electrical components.

Abstract: A radio frequency shield is disclosed.

Abstract: A fixing apparatus for fixing a waveguide plate includes a number of conductive fixing members fixed to corresponding sides of the waveguide plate, and a bracket. Each fixing member includes a fixing portion having an identical length to the corresponding sidewall and a resilient abutting portion extending from a side of the fixing portion. Each fixing portion is in tight contact with the corresponding side of the waveguide plate. The waveguide plate is received in the bracket. The resilient abutting portions resiliently abut against an inner surface of the bracket.

Abstract: A shielded three-terminal flat-through EMI/energy dissipating filter includes an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and a second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. In preferred embodiments, the active electrode plate and the shield plates are at least partially disposed with a hybrid flat-through substrate that may include a flex cable section, a rigid cable section, or both.

Abstract: Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. Enclosure systems and methods for protecting telecommunications equipment from electromagnetic fields include cabinets having a maximum width dimension that does not exceed about 26 inches and a maximum depth dimension that does not exceed about 22? inches. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

Abstract: A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.

Abstract: An electromagnetic shield comprises a single sheet of metal having outer and inner peripheries. The outer periphery forms a plurality of outer deflectable fingers extending outward from a bent edge of the outer periphery for contacting a surface of a faceplate. The plurality of outer deflectable fingers is deflectable to allow for installation and removal of the faceplate. The inner periphery has an opening for receiving an HDMI connector and forming a plurality of inner deflectable fingers extending inwardly from a bent edge of the inner periphery. The plurality of inner deflectable fingers is deflectable to allow for insertion and removal of the HDMI connector.

Abstract: An electric shielding enclosure that encloses a volume. The electric shielding enclosure includes a conductive structure that partially encloses the volume and that has an edge defining an opening into the volume. A conductive power pack surface is configured to fill at least a part of the opening and has a number of conductive connections. The conductive connections include a first conductive connection located in proximity to a first point of the edge, and a second conductive connection located in proximity to a second point of the edge, where the second point is across the opening from the first point. Each of the conductive connections within the conductive connections is electrically coupled to the conductive structure.

Abstract: Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.

Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.

Abstract: An electronic device includes a metal shield, a housing, a circuit board, an engaging element, and a fixing element. The circuit board is located between the metal shield and the housing. The engaging element is disposed on the circuit board. The circuit board is fixed on the housing and connected to the metal shield via the engaging element.

Abstract: An electronic device includes a printed circuit board (PCB), at least one socket mounted to the PCB, at least one connector inserted into the at least one socket, a first member mounted to the PCB, a second member mounted to the PCB, and a first cover. The first cover covers and presses against the at least one connector, the first cover includes a first end for being fixed to the first member and a second end opposite to the first end for being fixed to the second member. At least one of the first member and the second member is soldered to the PCB, and a soldered area of the at least one of the first member and the second member is larger than a predetermined value.

Abstract: A radio frequency (RF) circuit is configured for impedance matching, such as for mitigating noise. In connection with an example embodiment, an RF circuit includes a transceiver in a substrate, and a conductive ring-type of material in the substrate and around at least a portion of the transceiver circuit. An upper conductive ring material is over the substrate and separated from the conductive ring-type material by an insulating layer. The upper conductive ring material is configured to generate an inductance that matches input impedance characteristics of the transceiver circuit. In some implementations, the upper conductive ring material connects a gate input pin of the circuit with the gate of an input transistor of an amplifier in the transceiver, and exhibits an impedance that matches the impedance of the input transistor.

Abstract: A computer comprising at least one outer chamber, compartment, or bladder, at least one inner chamber, compartment, or bladder inside said outer chamber, compartment, or bladder, at least one internal sipe separating at least a part of said outer chamber, compartment, or bladder and at least a part of said inner chamber, compartment, or bladder, at least one Faraday cage; and the computer being configured to connect to at least one network of computers and comprising at least a first internal hardware firewall configured to deny access to at least a first protected portion of said computer from said network. At least a portion of an outer surface of said outer chamber, compartment, or bladder is proximate to an outer surface of said computer.

Abstract: Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.

Abstract: An electromagnetic interference (EMI) shielding device includes first and second housing portions assembled along an assembly direction, at least two spaced-apart female fasteners fixed to one of the first and second housing portions, a plurality of male fasteners corresponding in number to the female fasteners and spacedly fixed to the other one of the first and second housing portions, and at least one grip member connected to one of the first and second housing portions. The grip member is applied with a force along the assembly direction or along a direction opposite to the assembly direction to engage or disengage the male and female fasteners.