Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.

Abstract: An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package.

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: A power conversion device includes a capacitor for smoothing DC current; power semiconductor modules having power semiconductor devices stored in a module case and DC terminals, an AC terminal and signal terminals are extracted from an extracting part of the module case; a capacitor bus bar that connects the capacitor with the DC terminals; a first channel body having a first coolant channel formed to allow the power semiconductor modules to be inserted therein; a second channel body in which a second coolant channel for cooling the capacitor and the capacitor bus bar is formed; and a housing having a base on which the first and second channel bodies are arranged in parallel across a prescribed space and openings formed in areas of the base facing the prescribed space.

Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

Abstract: Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.

Abstract: In order to provide a capacitance element housing unit with which the effect of suppressing heat transfer between capacitance elements can be increased more suitably, a capacitance element housing unit (10) is equipped with: a common package (104), which integrally houses a filter-use capacitance element (14) and a smoothing-use capacitance element (18), and which is provided with a slit part (105) at the location between the filter-use capacitance element (14) and the smoothing-use capacitance element (18) where the temperature is high; a case (102) having cooling flow paths (108) for cooling a DC/DC converter (16) and an inverter (20); and an anchoring part (106) that anchors the common package (104) and the case (102) in the slit part (105).

Abstract: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Abstract: A power inverter includes a plurality of power modules; a first casing housing the power modules and a cooling path in which a coolant flows is formed; a plurality of AC busbars connected to AC terminals of the power modules; a holding member, in which a positioning pin protruding to an upper side in a direction opposite to the first casing is formed, that maintains the AC busbars and is fixed to the first casing; a current sensor module including a plurality of current sensors detecting the AC currents of the AC busbars; a frame body for maintaining the current sensors, and a lead terminal protruding from the frame body to the upper side; and a driver circuit board, in which a through-hole used for the lead terminal and a board positioning through-hole are formed, arranged on the upper side of the frame body arranged on the holding member.

Abstract: The passage from a cooling medium inlet to a cooling medium outlet of a cooler includes: an upstream cooling portion and a downstream cooling portion for cooling heat generating bodies; an upstream distribution portion located on the cooling medium inlet side; a downstream distribution portion located on the cooling medium outlet side; a connecting portion for connecting the upstream cooling portion and the downstream cooling portion; and a partition portion for partitioning the upstream cooling portion and the downstream cooling portion, and the upstream distribution portion and the downstream distribution portion. The passage is connected so that the cooling medium flows in order of the upstream distribution portion, the upstream cooling portion, the connecting portion, the downstream cooling portion, and the downstream distribution portion.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.

Abstract: A stacked structure of a power converter is disclosed. The stacked structure has a power conversion circuit that provides an output or input of alternating current in three phases and is composed of odd-numbered parallel-connected power semiconductor element modules for each phase, and a heat sink for cooling the power semiconductor element modules. An odd number of the parallel-connected power semiconductor element modules are arranged in a first phase and a third phase, and an even number of the parallel-connected power semiconductor element modules are arranged in a second phase respectively in two rows on the heat sink relative to a ventilation direction of air for cooling the heat sink.

Abstract: A sub-high frequency transformer with water-cooled heat dissipation includes a magnetic core (8), primary coils (10), secondary coils (9a1, 9a2, 9b1, 9b2, 9c1, 9c2, 9d1, 9d2), secondary leading terminals of the transformer, and a rectifying tube circuit connected with the secondary leading terminals of the transformer. The rectifying tube circuit includes plane-type rectifying diodes (11, 12), positive leading plates (3, 4, 5, 6) of the diodes, a rectifier positive output plate (2), and a rectifier negative output plate (1) which is also the central tap of the transformer. A secondary current of the transformer, after being rectified by the plane-type rectifying diodes, is connected to and is output from the rectifier positive output plate. The positive leading plates of the plane-type rectifying diode, the rectifier positive output plate and the rectifier negative output plate have a copper plate structure with a certain thickness and having water passages for heat dissipation inside.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.

Abstract: The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having an evaporation section and a condensation section. The evaporation section is buried in the inner layer of the heat dissipation substrate, and the condensation section is used to dissipate the heat from the evaporation section to the air. The power elements of the high-power medium-voltage drive power cell are disposed on the first surface and the second surface, respectively.

Abstract: An electric power converter includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked. Each of the semiconductor modules is provided with a main body that has semiconductor elements therein, a plurality of power terminals, and control terminals. Among the plurality of the power terminals respectively included in the two semiconductor modules adjoining in a stacking direction of the stacked body, at least parts of the power terminals are configured so as not to overlap each other when viewed from the stacking direction.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the at least some of the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The frame has such a shape that at least some of the electronic components constituting the internal unit are disposed inside the frame. The frame includes a terminal block on which input/output terminals for inputting and outputting controlled power are mounted for providing connection between the input/output terminals and external devices.

Abstract: An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

Abstract: A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, t

Abstract: A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path.

Abstract: Power switching circuitry has a heat absorbing structure, and a heat conductive substrate having power switching components on a first surface and a second surface adjacent to the heat absorbing structure. Electrically conductive members, comprising first and second members, are on the first surface and extend along a first axis orthogonal to the heat conductive substrate. The second portion is more remote from the heat conductive substrate, and has a smaller cross-sectional area than, the first portion to define a shoulder region orthogonal to the first axis. A circuit board is located on the shoulder regions, with the second portions extending through the circuit board. An urging mechanism urges the circuit board against the shoulder regions, whereby the electrically conductive members provide a current path between the heat conductive substrate and the circuit board, and urge the heat conductive substrate into thermal contact with the heat absorbing structure.

Abstract: A power converter equipped with a plurality of semiconductor modules, a cooling device, a control circuit board, a smoothing capacitor, and a discharging resistor. The discharging resistor mounted on the control circuit board in parallel connection to the smoothing capacitor. The control circuit board has fabricated thereon a timing controller working to control timings of on/off operations of the semiconductor modules, a driver coupled to control terminals of the semiconductor modules to control voltage applied to the control terminals, and a power supply circuit working to transform a voltage input to the control circuit board into operating voltages for the timing controller and the driver. The driver is disposed between at least one of the timing controller and the power supply circuit and the discharging resistor, thereby protecting the timing controller and/or the power supply circuit mounted on the control circuit board from thermal energy radiating from the discharging resistor.

Abstract: A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device.

Abstract: A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally.

Abstract: A semiconductor device includes at least one arm series circuit, a conductive first thermal buffer member, and a conductive second thermal buffer member. The arm series circuit includes an upper arm, a lower arm, a positive-electrode terminal, a negative-electrode terminal, and an output terminal. The first thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the first switching device and smaller than a linear expansion coefficient of one of the positive-electrode terminal and the output terminal. The second thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the second switching device and smaller than a linear expansion coefficient of one of the negative-electrode terminal and the output terminal.

Abstract: A switching frequency setting unit sets switching frequency of a switching element, based on both the temperature of a cooling medium which cools a DC-DC converter and the temperature of a switching element of the DC-DC converter. A switching controller controls the voltage conversion ratio of the DC-DC converter by controlling switching operation of the switching element at the set switching frequency.

Abstract: Provided is a power supply device that can suitably release heat with a small number of parts. In an AC-DC converter that is a power supply device according to an embodiment of the present invention, a heat conductive member thermally connected to a base plate is thermally connected to an upper surface of a stacked coil board including a main circuit board and circuit boards. This configuration causes heat generated in the stacked coil board to be transferred to the base plate also from the upper surface of the stacked coil board via the heat conducting member, whereby the heat release effect can be increased. In addition, since the heat conducting member is the only member used for releasing heat, the heat release effect can be increased while the number of parts is kept from increasing.

Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

Abstract: An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.

Abstract: A power supply unit is provided for supplying low voltage power. The supply unit includes at least one power plug contact connectable to a supply voltage; at least one output lead for outputting the low voltage; and a voltage transformer unit having at least one electronic component for transforming the supply voltage to the low voltage. The power supply unit includes a casing made of a casing base element and a lid element, such that the power plug contact is held in the casing base element or in the lid element in such a way that it can be plugged into a power socket. The voltage transformer unit is mounted on a circuit carrier which is arranged in the casing base element in such a way that a defined first region of the circuit carrier is received in a casting space filled with an electrically insulating casting compound.

Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.

Abstract: A power converter (100) comprises a cooler (20) having a cooling flow path (21) in which a refrigerant flows, a base plate (31) to which switching elements (32) are attached, a control circuit board (33) on which power-generating elements (34) are attached, and securing pins (40) that secure the base plate (31) onto the lower cooler wall (22) of the cooler (20) and support the control circuit board (33) so as to be spaced apart from the base plate (31). Upper end parts (41) of the securing pins (40) pass through the base plate (31) and the cooler lower wall (22), reaching inside the cooling flow path (21). First pass-through parts (42) of the securing pins for the lower cooler wall (22) are fitted by pressure into the lower cooler wall (22). Support column parts (46) of the securing pins (40) extend in a direction opposite the lower cooler wall (22), and the control circuit board (33) is secured to lower flanges (47) thereof. Thus, power converter can be reduced in size with a simple constitution.

Abstract: The present invention relates to a switched power converter comprising a base plate on which at least one heat sink is arranged. The converter further comprises at least one power transistor arranged on a side of the at least one heat sink. Further, at least one spring element is arranged to press against the power transistor arranged on a side of the at least one heat sink and an oppositely facing side of either an adjacent heat sink or a base plate end face parallel to the at least one heat sink. This is highly advantageous in that a force is applied to the power transistor by the spring element. This will press the power transistor against the heat sink on whose side the transistor is arranged. Thermal contact is thus established between the power transistor and the heat sink, and heat dissipation from the transistor via the heat sink is greatly facilitated. Further, the spring elements are a cost-effective way of attaining a high compressive force on the power transistors.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A power conversion apparatus according to an embodiment includes a cooling jacket. The cooling jacket includes a mounting face on which a power module including a power semiconductor device is mounted, a plurality of radiation fins that are arranged along a predetermined direction over the substantially whole area of the back side of the mounting face, and a boss that is placed along the predetermined direction in the central area of the substantially whole area of the back side.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: A fuel cell system including: a hydrogen generator for causing a reforming reaction of a material gas to generate a hydrogen-containing fuel gas; a fuel cell configured to cause a reaction between the fuel gas generated by the hydrogen generator and an oxygen-containing oxidizing gas; a combustor configured to combust at least one of the material gas and an off fuel gas discharged from the fuel cell; a casing configured to accommodate the hydrogen generator, the fuel cell, and the combustor; a first exhaust port, formed on the casing and through which the flue gas from the combustor is discharged to an outside of the casing; a first intake port formed on the casing; suction units configured to suction air through the first intake port into the casing; and a CO detector configured to detect carbon monoxide contained in the air suctioned through the first intake port.

Abstract: Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt?0.015)×?r, where a relative permittivity of the insulating member is Er and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.

Abstract: A power converter module for use alone or with other modules in a multiphase power converter. The power converter module has an enclosure that surrounds internal components to prevent radiation of electromagnetic energy, which internal components also limit conduction of electromagnetic energy. The internal components include an EMI filter, a ripple filter, a power converter, and a control interface that communicates with a control system of a power conversion system. The control interface includes a memory that stores information related to the power converter modules so as to improve interchangeability of similar power modules with the multiphase power converter.

Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: An inverter (1) for supplying electric energy from a DC source to an AC grid includes a housing (2) in which electrical and electronic components (21, 22, 30) are accommodated. A cooling air channel (9) with cooling fins (37) arranged along its longitudinal axis runs across the back of the housing (2) in the middle. Sockets (13) for large electrical components (21, 22) that are closed in on at least three sides by the metal outer walls (14-19) of the housing (2) are provide on both sides of the cooling air channel (9) in the housing (2).

Abstract: An alternating current-to-direct current (AC-to-DC) power supply has a first stage providing a first DC voltage and a second stage providing a second DC voltage. The AC-to-DC power supply has a first efficiency at the first stage and a second efficiency at the second stage that is less than the first efficiency. The second DC voltage is also less than the first DC voltage. A blower is electrically connected to the first stage of the AC-to-DC power supply to receive the first DC voltage from the AC-to-DC power supply to power the blower. Electrical connection of the blower to the first stage of the AC-to-DC power supply instead of to the second stage of the AC-to-DC power supply wastes less power and is more efficient.

Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.