Abstract: A processing device selectively backups only certain data based on a priority or binning structure. In one approach, a non-volatile logic controller stores the machine state by storing in non-volatile logic element arrays a portion of data representing the machine state less than all the data of the machine state. Accordingly, the non-volatile logic controller stores the machine state in the plurality of non-volatile logic element arrays by storing a first set of program data of the machine state according to a first category for backup and restoration and storing a second set of program data of the machine state according to a second category for backup and restoration.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory array may be operated in a half density mode, in which a subset of the memory cells is designated as reference memory cells. Each reference memory cell may be paired to an active memory cell and may act as a reference signal when sensing the active memory cell. Each pair of active and reference memory cells may be connected to a single access line. Sense components (e.g., sense amplifiers) associated with reference memory cells may be deactivated in half density mode. The entire memory array may be operated in half density mode, or a portion of the array may operate in half density mode and the remainder of the array may operate in full density mode.

Abstract: Various embodiments comprise apparatuses and methods of forming the apparatuses. In one embodiment, an exemplary apparatus includes a plurality of memory cells. At least a portion of the memory cells have a bottom electrode with each bottom electrode being at least partially electrically isolated from remaining ones of the bottom electrodes. At least one resistive interconnect electrically couples two or more of the bottom electrodes. The resistive interconnect is arranged to discharge at least a portion of excess charge from the two or more bottom electrodes. Additional apparatuses and methods of forming the apparatuses are disclosed.

Abstract: Methods, systems, and devices for a single plate configuration and memory array operation are described. A non-volatile memory array may utilize a single plate to cover a subset of the array. One or more memory cells of the subset may be selected by operating the plate and an access line of an unselected memory cell at a fixed voltage. A second voltage may be applied to an access line of the selected cell, and subsequently reduced to perform an access operation. Removing the applied voltage may allow for the memory cell to undergo a recovery period prior to a subsequent access operation.

Abstract: Methods, systems, and devices for time-based access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. The duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.

Abstract: Methods, systems, and apparatuses for self-referencing memory cells are described. A reference value for a cell may be created through multiple sense operations on the cell. The cell may be sensed several times and an average of at least two sensing operations may be used as a reference for another sense operation. For example, the cell may be sensed and the resulting charge stored at a capacitor. The cell may be biased to one state, sensed a second time, and the resulting charge stored at another capacitor. The cell may be biased to another state, sensed a third time, and the resulting charge stored to another capacitor. The values from the second and third sensing operations may be averaged and used as a reference value in a comparison with value of the first sensing operation to determine a logic state of the cell.

Abstract: A temperature related to a memory device is identified. It is determined whether the temperature related to the memory device satisfies a threshold temperature condition. Responsive to detecting that the temperature related to the memory device satisfies the threshold temperature condition, a parameter for a programming operation is adjusted from a first value to a second value to store data at the memory device.

Abstract: A semiconductor memory apparatus includes a memory cell coupled between a bit line and a word line. A sensing line is disposed adjacent to the word line to form a capacitor together with the word line. A sense amplifier coupled to the sensing line generates an output signal by detecting a voltage level of the sensing line.

Abstract: Methods, systems, devices, and techniques for read operations are described. In some examples, a memory device may include a first transistor (e.g., memory node transistor) configured to receive a precharge voltage at a first gate and output first voltage based on a threshold of the first transistor to a reference node via a first switch. The device may include a second transistor (e.g., a reference node transistor) configured to receive a precharge voltage and output a second voltage based on a threshold of the second transistor to a memory node via a second switch. The first voltage may be modified by a reference voltage and input to the second transistor. The second voltage may be modified by a voltage stored on a memory cell and input to the first transistor. The first and second transistor may output third and fourth voltages to be sampled to a latch.

Abstract: To provide an information processing apparatus, a reading control method, and a computer readable storage medium that can improve the secrecy of information written in a secret area compared with the case of controlling access only by authentication, the information processing apparatus includes a nonvolatile memory that has a secret area where secret information is stored, an authentication controller that authenticates access to the nonvolatile memory, a flag information storage unit that stores flag information, and a memory controller that controls access to the nonvolatile memory by using the flag information stored in the flag information storage unit. The memory controller allows reading of the secret information from the secret area when a value of the flag information is a specified value and validity of access is authenticated by the authentication controller.

Abstract: Described is an apparatus which comprises a transistor including: a layer of ferroelectric material; a layer of insulating material; and an oxide layer or a metal layer sandwiched between the layer of ferroelectric material and the layer of insulating material, wherein thickness of the ferroelectric material is less than thickness of the layer of insulating material; and a driver coupled to the transistor. Described is an apparatus which comprises: a transistor including: a first oxide layer of High-K material; a second oxide layer; and a layer of nanocrystals sandwiched between the first and second oxide layers, wherein thickness of first oxide layer is greater than thickness of the second oxide layer; and a driver coupled to the transistor.

Abstract: Detecting a word line leakage in a non-volatile memory array. Various methods include: in a first step, enabling a M-bit “coarse” digital-to-analog converter (DAC) logic of an N-bit analog-to-digital converter (ADC) to, according to a clock signal of the coarse DAC, compare a reference voltage and a biased input voltage of a load current of the memory array, wherein the reference voltage is dependent upon the voltage level at which the input voltage becomes non-linear, and, in a second step, if the input voltage is greater than or equal to the reference voltage, enabling a P-bit “fine” ramp digital-to-analog converter (DAC) logic of the ADC to enable drawing a second current from the load current to ramp down the input voltage and to begin a counter and conduct leakage detection with the ADC when the input voltage is in the range between a first voltage and a second voltage.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A portion of charge of a memory cell may be captured and, for example, stored using a capacitor or intrinsic capacitance of the memory array that includes the memory cell. The memory cell may be recharged (e.g., re-written). The memory cell may then be read, and a voltage of the memory cell may be compared to a voltage resulting from the captured charge. A logic state of the memory cell may be determined based at least in part on the voltage comparison.

Abstract: Methods, systems, and devices for memory array operation are described. A series of pulses may be applied to a fatigued memory cell to improve performance of memory cell. For example, a ferroelectric memory cell may enter a fatigue state after a number of access operations are performed at an access rate. After the number of access operations have been performed at the access rate, a fatigue state of the ferroelectric memory cell may be identified and the series of pulses may be applied to the ferroelectric capacitor at a different (e.g., higher) rate. For instance, a delay between pulses of the series of pulses may be shorter than the delay between access operations of the ferroelectric memory cell.

Abstract: In embodiments of the present disclosure improved capabilities are described for a method and system for a radio frequency (RF) tag comprising a controller, a memory, and a memory manager, wherein the controller utilizes the memory manager to manage different memory types.

Abstract: Techniques are described for maintaining a stable voltage difference in a memory device, for example, during a critical operation (e.g., a sense operation). The voltage difference to be maintained may be a read voltage across a memory cell or a difference associated with a reference voltage, among other examples. A component (e.g., a local capacitor) may be coupled, before the operation, with a node biased to a first voltage (e.g., a global reference voltage) to sample a voltage difference between the first voltage and a second voltage while the circuitry is relatively quiet (e.g., not noisy). The component may be decoupled from the node before the operation such that a node of the component (e.g., a capacitor) may be allowed to float during the operation. The voltage difference across the component may remain stable during variations in the second voltage and may provide a stable voltage difference during the operation.

Abstract: Methods, systems, and devices for operating a memory device are described. A sense amplifier may be used to precharge an access line to increase the reliability of the sensing operation. The access line may then charge share with the memory cell and a capacitor, which may be a reference capacitor, which may result in high-level states and low-level states on the access line. By precharging the access line with the sense amplifier and implementing charge sharing between the access line and a capacitor, the resulting high-level state and the low-level states on the access line may account for any offset voltage associated with the sense amplifier.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may obtain first multiple samples of a signal conveyed via a coupling of a memory medium of an information handling system; may convert the first multiple samples to respective first multiple digital values; may determine an impedance based at least on the first multiple digital values; may compare the impedance with a baseline impedance; may determine an inconsistency based at least on comparing the impedance with the baseline impedance of the coupling of the memory medium; and may, in response to determining the inconsistency, shut down the information handling system.

Abstract: A semiconductor device includes a substrate having a volatile memory region and a non-volatile memory region. The volatile memory region includes a cell capacitor disposed in the substrate and a cell transistor connected to the cell capacitor. The non-volatile memory region includes a plurality of non-volatile memory cells disposed on the substrate. The volatile memory region and the non-volatile memory region are disposed side by side.

Abstract: A read circuit of storage class memory comprises: an array; a read reference circuit, having the same bit line parasitic parameters as the array, having the same read transmission gate parasitic parameters as the array, used to generate a read reference current; a sense amplifier, providing the same current mirror parasitic parameters as the reference side, used to generate a read current from a selected memory cell, compare the said read current with the said read reference current and output a readout result. In the present invention, the said read current and the said read reference current are generated at the same time, the transient curve of the said read reference current is between the low resistance state read current and the high resistance state read current from an early stage. The present invention largely reduces the read access time, has a good process variation tolerance, has a wide application, and is easy to be used in the practical product.

Abstract: Embodiments include nonvolatile a memory (NVM) device that can be configured for logic switching and/or digital computing. For example, embodiments of the NVM device can be configured as any one or combination of a memory cell, a D flip flop (DFF), a Backup and Restore circuit (B&R circuit), and/or a latch for a DFF. Any of the NVM devices can have a Fe field effect transistors (FeFET) configured to exploit the IDS?VG hysteresis of the steep switch at low voltage for logic memory synergy. The FeFET-based devices can be configured to include a wide hysteresis, a steep hysteresis edge, and high ratio between the two IDS states at VG=0.

Abstract: Methods and devices for reading a memory cell using multi-stage memory sensing are described. The memory cell may be coupled to a digit line after the digit line during a read operation. A transistor may be activated to couple an amplifier capacitor with the digit line during the read operation. The transistor may be deactivated for a portion of the read operation to isolate the amplifier capacitor from the digit line while the memory cell is coupled to the digit line. The transistor may be reactivated to recouple the amplifier capacitor to the digit line to help determine the value of the memory cell.

Abstract: In various embodiments, a ternary memory cell is provided, the ternary memory cell including: a first ferroelectric memory cell and a second ferroelectric memory cell in a parallel or serial arrangement, wherein each of the first ferroelectric memory cell and the second ferroelectric memory cell is switchable into a first ferroelectric memory cell state and a second ferroelectric memory cell state; and wherein a first matching state is defined by the first ferroelectric memory cell in the first ferroelectric memory cell state and the second ferroelectric memory cell in the second ferroelectric memory cell state, wherein a second matching state is defined by the first ferroelectric memory cell in the second ferroelectric memory cell state and the second ferroelectric memory cell in the first ferroelectric memory cell state, and wherein a third matching state is defined by the first ferroelectric memory cell and the second ferroelectric memory cell being in the same ferroelectric memory cell state.

Abstract: An electronic device can include a semiconductor material including a channel region configured to conduct a current, a source contact electrically coupled to the channel region at a first location, a drain contact electrically coupled to the channel region at a second location spaced apart from the first location, a partial-polarization material on the semiconductor material between the source contact and the drain contact opposite the channel region and a gate contact on the partial-polarization material opposite the channel region and ohmically coupled to the drain contact or ohmically coupled to the source contact.

Abstract: The present disclosure discloses a transposable feedback field-effect electronic device and an array circuit using the feedback field-effect electronic device. According to one embodiment of the present disclosure, the feedback field-effect electronic device may include a diode structure, a plurality of gate electrodes, and a plurality of access electronic devices, wherein, when the diode structure receives voltage through a first gate electrode of the gate electrodes and a first access electronic device of the access electronic devices, first direction access may be performed, and when the diode structure receives voltage through a second gate electrode of the gate electrodes and a second access electronic device of the access electronic devices, second direction access may be performed.

Abstract: Techniques, systems, and devices for time-resolved access of memory cells in a memory array are described herein. During a sense portion of a read operation, a selected memory cell may be charged to a predetermined voltage level. A logic state stored on the selected memory cell may be identified based on a duration between the beginning of the charging and when selected memory cell reaches the predetermined voltage level. In some examples, time-varying signals may be used to indicate the logic state based on the duration of the charging. In some examples, the duration of the charging may be based on a polarization state of the selected memory cell, a dielectric charge state of the selected state, or both a polarization state and a dielectric charge state of the selected memory cell.

Abstract: Methods, systems, and devices for ferroelectric memory plate power reduction are described. A plate line may be coupled with a voltage source, a capacitor, and one or more sections of a bank of ferroelectric memory cells. During a write operation, the capacitor may be discharged onto the plate line and the resulting voltage may be adjusted (e.g., increased) by the voltage source before writing one or more memory cells. During a write-back operation, a capacitor associated with one or more memory cells may be discharged onto the plate line and stored at the capacitor. The charge may be re-applied to the plate line and adjusted (e.g., increased) by the voltage source during the write-back.

Abstract: Disclosed herein is an apparatus that includes a first semiconductor chip including a memory cell array having a volatile memory cell and an access control circuit configured to perform a refresh operation on the volatile memory cell, and a second semiconductor chip including a power generator configured to supply a first power supply voltage to the first semiconductor chip. The access control circuit is configured to activate a first enable signal during the refresh operation. The second semiconductor chip is configured to change a capability of the power generator based on the first enable signal.

Abstract: A semiconductor memory device and method for providing the semiconductor memory device are described. The semiconductor memory device includes a ferroelectric capacitor. The ferroelectric capacitor includes a first electrode, a second electrode and a multilayer insulator structure between the first and second electrodes. The multilayer insulator structure includes at least one ferroelectric layer and at least one dielectric layer. The at least one ferroelectric layer and the at least one dielectric layer share at least one interface and have a strong polarization coupling.

Abstract: An FMD including a plurality of FM chips and an FM-CTL equipped with a flash I/F for executing I/O processes to and from the FM chips, wherein the FM-CTL is provided with a flash I/F in correspondence with each of a plurality of channels, and the FM-CTL is configured to: acquire a higher-level operating frequency between a DKC and the FM-CTL; determine an operating frequency of the flash I/F such that a total transfer rate to and from the FM chips produced by the flash I/Fs of the respective channels should be a transfer rate that equals a higher-level transfer rate corresponding to the higher-level operating frequency or a transfer rate that approximates the higher-level transfer rate; and perform a configuration of an operating frequency determined with respect to each of the flash I/Fs.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be initialized to a first state and a second ferroelectric memory cell may be initialized to a different state. Each state may have a corresponding digit line voltage. The digit lines of the first and second ferroelectric memory cells may be connected so that charge-sharing occurs between the two digit lines. The voltage resulting from the charge-sharing between the two digit lines may be used by other components as a reference voltage.

Abstract: Methods of operating memory, and apparatus configured to perform similar methods, include obtaining information indicative of a data value stored in a particular memory cell of the memory, programming additional data to the particular memory cell, determining if a power loss to the memory is indicated while programming the additional data to the particular memory cell, and, if a power loss to the memory is indicated, programming a first plurality of differential storage devices responsive to the information indicative of the respective data values stored in the plurality of memory cells, programming a second plurality of differential storage devices responsive to the address, and programming a third differential storage device to have a particular value.

Abstract: Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.

Abstract: Devices and methods for sensing a memory cell are described. The memory cell may include a ferroelectric memory cell. During a read operation, a cascode may couple a precharged capacitor with the memory cell to transfer a charge between the precharged capacitor and the memory cell. The cascode may isolate the capacitor from the memory cell based on the charge transferred between the capacitor and the memory cell. A second capacitor (e.g., a parasitic capacitor) may continue to provide an additional amount of charge to the memory cell during the read operation. Such a change in capacitance value during the read operation may provide a large sense window due to a non-linear voltage characteristics associated with the change in capacitance value.

Abstract: Embodiments of methods for operating ferroelectric memory cells are disclosed. In one example, a method for writing a ferroelectric memory cell is provided. The ferroelectric memory cell includes a transistor and N capacitors. The transistor is electrically connected to a bit line and a word line, respectively, and each of the N capacitors is electrically connected to a respective one of N plate lines in parallel. A plate line signal pulsed between 0 V and Vdd is applied to each of the N plate lines according to a plate line time sequence. A bit line signal pulsed between 0 V and the Vdd is applied to the bit line according to a bit line time sequence to write a valid state of data into the N capacitors. The data consists of N+1 valid states that can be written into the N capacitors. The valid states of the data are determined based on the plate line time sequence. The bit line time sequence is determined based on the valid state of the data written into the N capacitors.

Abstract: A variable resistance memory device includes first memory cells and second memory cells. The first memory cells are between first and second conductive lines, and at areas at which the first and second conductive lines overlap. The second memory cells are between the second and third conductive lines, and at areas at which the second and third conductive lines overlap. Each first memory cell includes a first variable resistance pattern and a first selection pattern. Each second memory cell includes a second variable resistance pattern and a second selection pattern. At least one of the second memory cells is shifted from a closest one of the first memory cells.

Abstract: Semiconductor memory devices and methods of operating the same are provided. The method of operation may include the steps of selecting a ferroelectric memory cell for a read operation, coupling a first pulse signal to interrogate the selected ferroelectric memory cell, the selected ferroelectric memory cell outputting a memory signal to a bit-line in response to the first pulse signal, coupling the memory signal to a first input of a sense amplifier via the bit-line, electrically isolating the sense amplifier from the selected ferroelectric memory cell, and enabling the sense amplifier for sensing after the sense amplifier is electrically isolated from the selected ferroelectric memory cell. Other embodiments are also disclosed.

Abstract: A magnetic device may include a layer stack. The layer stack may include a first ferromagnetic layer; a non-magnetic spacer layer on the first ferromagnetic layer, where the non-magnetic spacer layer comprises at least one of Ru, Ir, Ta, Cr, W, Mo, Re, Hf, Zr, or V; a second ferromagnetic layer on the non-magnetic spacer layer; and an oxide layer on the second ferromagnetic layer. The magnetic device also may include a voltage source configured to apply a bias voltage across the layer stack to cause switching of a magnetic orientation of the second ferromagnetic layer without application of an external magnetic field or a current. A thickness and composition of the non-magnetic spacer layer may be selected to enable a switching direction of the magnetic orientation of the second ferromagnetic layer to be controlled by a sign of the bias voltage.

Abstract: The disclosed technology includes an electronic device. The electronic device includes a semiconductor memory, and the semiconductor memory includes a variable resistance element that exhibits different resistance states for storing different data and is structured to include a planar shape including two curved potions of different curvatures.

Abstract: The present disclosure includes apparatuses and methods related to sensing operations in memory. An example apparatus can include an array of memory cells; and a controller coupled to the array configured to sense a first memory cell based upon a first input associated with the memory cell and a second input and a third input associated with a second memory cell.

Abstract: A capacitor may include a first conductive layer forming a first capacitor plate, a second conductive layer forming a second capacitor plate, and a first insulating material on the first conductive layer. The first insulating material may include a positive capacitance material. The capacitor may further include a second insulating material disposed over the first insulating material and between the first insulating material and the second conductive layer. The second insulating material may include a negative capacitance ferroelectric material.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. In some examples, multi-level accessing, sensing, and other operations for ferroelectric memory may be based on sensing multiple charges, including a first charge associated with a dielectric of the memory cell and a second charge associated with a polarization of the memory cell. In some cases, multi-level accessing, sensing, and other operations may be based on transferring a first charge associated with a dielectric of the memory cell to a sense amplifier, isolating the sense amplifier, activating the sense amplifier, transferring a second charge associated with a polarization of the memory cell to the sense amplifier, and activating the sense amplifier a second time.

Abstract: Present disclosure provides OLED driving circuit, comprising: first switch unit, electrically connected between first end of first capacitor and data input end; second switch unit, electrically connected between second end of first capacitor and data input end; third switch unit, its first end electrically connected to voltage input end, its second end electrically connected to OLED, its third end electrically connected to first end of first capacitor, third switch unit configured to switch connection and disconnection between first and second ends of third switch unit; fourth switch unit, its first end electrically connected to first end of first capacitor, its second end electrically connected to second end of third switch unit; wherein first and second ends of second capacitor are electrically connected to voltage input end and second end of first capacitor, respectively. Present disclosure further provides OLED driving method, display substrate and display apparatus.

Abstract: A perpendicularly magnetized spin-orbit magnetic device including a heavy metal layer, a magnetic tunnel junction, a first antiferromagnetic layer, a first block layer and a first stray field applying layer is provided. The magnetic tunnel junction is disposed on the heavy metal layer. The first block layer is disposed between the magnetic tunnel junction and the first antiferromagnetic layer. The first stray field applying layer is disposed between the first antiferromagnetic layer and the first block layer. The first stray field applying layer provides a stray magnetic field parallel to a film plane. The first antiferromagnetic layer contacts the first stray field applying layer to define the direction of the magnetic moment in the first stray field applying layer.

Abstract: Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Abstract: In a method of operating a ferroelectric device, a ferroelectric device including a first electrode layer, a ferroelectric layer and a second electrode layer that are sequentially disposed is provided. A first remanent polarization is written in the ferroelectric layer. An operating voltage is applied between the first and second electrode layers to write a second remanent polarization having a polarization value different from a polarization value of the first remanent polarization in the ferroelectric layer. An amplitude of the operating voltage varies within a voltage application time period and varies in a set voltage range.

Abstract: Methods, systems, and devices for techniques to mitigate disturbances of unselected memory cells in a memory array during an access operation are described. A shunt line may be formed between a plate of a selected memory cell and a digit line of the selected memory cell to couple the plate to the digit line during the access operation. A switching component may be positioned on the shunt line. The switching component may selectively couple the plate to the digit line based on instructions received from a memory controller. By coupling the plate to the digit line during the access operation, voltages resulting on the plate by changes in the voltage level of the digit line may be reduced in magnitude or may be altered in type.

Abstract: Methods, systems, and apparatuses related to a reprogrammable non-volatile latch are described. A latch may include ferroelectric cells, ferroelectric capacitors, a sense component, and other circuitry and components related to ferroelectric memory technology. The ferroelectric latch may be independent from (or exclusive of) a main ferroelectric memory array. The ferroelectric latch may be positioned anywhere in the memory device. In some instances, a ferroelectric latch may be positioned and configured to be dedicated to single piece of circuitry in the memory device.

Abstract: An object is to provide a semiconductor device with a novel structure. The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is provided in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.

Abstract: The present disclosure includes apparatuses, methods, and systems for current separation for memory sensing. An embodiment includes applying a sensing voltage to a memory cell having a ferroelectric material, and determining a data state of the memory cell by separating a first current output by the memory cell while the sensing voltage is being applied to the memory cell and a second current output by the memory cell while the sensing voltage is being applied to the memory cell, wherein the first current output by the memory cell corresponds to a first polarization state of the ferroelectric material of the memory cell and the second current output by the memory cell corresponds a second polarization state of the ferroelectric material of the memory cell.