Abstract: A programmable memory device. The device comprises at least four memory cells, each cell comprising a data storage element connected to a switching element. The device is arranged such that each switching element is connected to at least two selection lines for selecting of at least one of the at least four memory cells. At least one of the four memory cells is selectable by applying a voltage to at least one of the at least two selection lines, such that at least two switching elements share one of the at least two selection lines and one of the at least two switching elements shares another one of the at least two selection lines with another switching element and such that each data storage element is connected to a shared data line for applying a programming or reading voltage to each storage element of the at least four memory cells to allow for programming or reading of the selected memory cell.

Abstract: Techniques are provided for writing a high-level state to a memory cell capable of storing three or more logic states. After a sense operation performed by a first sense component and a second sense component, a digit line may be isolated from the first sense component and the second sense component. The high-level state may be stored in the memory cell, then a second state may be stored in the memory cell, in which the second state may be a mid-level state or a low-level state. The second state may be stored based on a write-back component identifying that the second state was stored in the memory cell before the write back procedure.

Abstract: A voltage generating circuit, a semiconductor memory device, and a voltage generating method are provided. The voltage generating circuit includes: an oscillation signal generating part generating an oscillation signal that alternately repeats a state of a first voltage and a state of a second voltage; a capacitor having one end receiving the oscillation signal and an other end connected to an output node; a switch element receiving a control voltage and set to an on state or an off state according to the control voltage, and applying the first voltage to the output node when set to the on state; and a switch control part supplying, as the control voltage to the switch element, the second voltage when the oscillation signal is in the state of the first voltage, and a voltage of the output node when the oscillation signal is in the state of the second voltage.

Abstract: According to a first aspect of the present disclosure, a fingerprint sensor module is provided, comprising: an assembly comprising a substrate and a fingerprint sensor mounted on one side of the substrate; wherein the fingerprint sensor comprises a set of sensor elements and a measurement unit; and wherein the measurement unit is configured to concurrently measure capacitances on subsets of the set of sensor elements. According to a second aspect of the present disclosure, a corresponding method of producing a fingerprint sensor module is conceived.

Abstract: A negative bitline write assist circuit includes a bias capacitor configured to facilitate driving the capacitance of a bitline. The negative bitline write assist circuit may be modularly replicated within a circuit to change the amount of negative voltage on the bitline during write operations. The bitline write assist circuit may be coupled directly to the bitline, removing the need to add a pull-down transistor to the write driver.

Abstract: Devices and techniques for adjustable memory device write performance are described herein. An accelerated write request can be received at a memory device from a controller of the memory device. The memory device can identify that a target block for external writes is opened as a multi-level cell block. The memory device can then write data for the accelerated write request to the target block using a single-level cell encoding.

Abstract: An example apparatus includes an array of memory cells coupled to an array power supply and a controller. The controller may be configured to cause a data value to be stored in at least one memory cell of the array of memory cells while the array of memory cells is operating in a first power state and a determination to be made that a change in a power status to a computing system coupled to the array of memory cells has occurred, wherein the change in the power status of the computing system is characterized by the computing device operating in a reduced power state. Responsive to the determination, the controller may be configured to cause the array power supply to be disabled to operate the array of memory cells in a second power state.

Abstract: In a particular implementation, a method of storing dynamic random-access memory (DRAM) data in respective magneto-electric magnetic tunnel junctions (ME-MTJ) of D-MRAM bit-cells of a D-MRAM bit-cell memory array, the method comprising: for each of the D-MRAM bit-cells: writing a first data value in a storage capacitor; and in a first cycle, providing a first voltage to a source line coupled to an ME-MTJ, wherein in response to the storage capacitor storing the first data value, the ME-MTJ is configured to store the first data value if the first voltage generates a voltage difference between first and second terminals of the ME-MTJ.

Abstract: A dynamic memory system having multiple memory regions respectively storing multiple types of data. A controller coupled to the dynamic memory system via a communication channel and operatively to: monitor usage of a communication bandwidth of the communication channel; determine to reduce memory bandwidth penalty caused by refreshing the dynamic memory system; and in response, reduce a refresh rate of at least one of the memory regions based on a type of data stored in the respective memory region.

Abstract: One embodiment facilitates operation of non-volatile memory. During operation, the system determines, by a flash translation layer module, a physical block address associated with a first request which indicates data to be read, wherein the non-volatile memory is divided into separate physical zones, wherein the physical block address is associated with a first physical zone, and each separate physical zone has a dedicated application to read or write data thereto. The system obtains a free page frame in a volatile memory by writing data from a cold page in the volatile memory to a second physical zone, wherein a cold page is a page with a history of access which is less than a predetermined threshold. The system loads, based on the physical block address, data from the non-volatile memory to the free page frame. The system executes the request based on the data loaded into the free page frame.

Abstract: A minute transistor is provided. A transistor with low parasitic capacitance is provided. A transistor having high frequency characteristics is provided. A semiconductor device including the transistor is provided. A semiconductor device includes an oxide semiconductor, a first conductor, a second conductor, a third conductor, a first insulator, and a second insulator. The first conductor overlaps with the oxide semiconductor with the first insulator positioned therebetween. The second insulator has an opening and a side surface of the second insulator overlaps with a side surface of the first conductor in the opening with the first insulator positioned therebetween. Part of a surface of the second conductor and part of a surface of the third conductor are in contact with the first insulator in the opening. The oxide semiconductor overlaps with the second conductor and the third conductor.

Abstract: A high retention time memory element is described that has dual gate devices. A memory element has a write transistor with a gate having a source coupled to a write bit line, a gate coupled to a write line, and a drain coupled to a storage node, wherein a value is written to the storage node by enabling the gate and applying the value to the bit line, and a read transistor having a source coupled to a read line, a gate coupled to the storage node, and a drain coupled to a read bit line, wherein the value of the storage node is sensed by applying a current to the source and reading the sense line to determine a status of the gate.

Abstract: A device can be used for detecting faults. A shift register is suitable for shifting, in tempo with a clock, a binary signal alternating between two logic levels, in successive cells of the shift register. A first logic circuit is suitable for comparing values contained in at least one pair of cells of the register.

Abstract: There are provided a data buffer and a memory system having the same. The data buffer includes first and second amplifiers configured to output output data by inverting input data, the first and second amplifiers having coupled output nodes to which the output data is output, wherein both of the first and second amplifiers are activated to output the output data when the input data has a first swing level, and wherein one of the first and second amplifiers is activated to output the output data when the input data has a second swing level narrower than the first swing level.

Abstract: Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. Groups of cells may be operated in different ways depending, for example, on a relationship between cell plates of the group of cells, pages of cells, and/or sections of cells. Cells may be selected in pairs or in larger multiples in order to accommodate an electric current relationship (such as a short) between two or more cells within a group, a page, and/or a section. When performing an access based on a smaller page size, a larger page size of cells may be selected to accommodate a short between plates within the smaller page, the larger page, and/or a section of memory that includes the smaller page or the larger page.

Abstract: An RFID tag manufacturing apparatus that includes an antenna base material conveying part that conveys an antenna base material with antenna patterns in a first direction. Moreover, the apparatus includes a conveying part for an RFIC element that supplies an RFIC element having terminal electrodes for connection with the antenna patterns on one principal surface. A plotter is further provided that conveys the supplied RFIC element to a predetermined position of the antenna patterns and temporarily bonds the RFIC element to the antenna patterns. Finally, the apparatus includes a pressurizing part that applies a pressure to the temporarily bonded RFIC element to permanently bond the RFIC element to the antenna patterns. In an aspect, the plotter includes a fixed arm portion and a movable suction head.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which redundancy match is disabled to permit activating more word lines in parallel during refresh operations to increase a refresh rate of memory cells in a memory array. In one embodiment, a memory device is provided, comprising a memory array including a plurality of word lines arranged in a plurality of memory banks. The memory device further comprises circuitry configured to (i) store a value indicating one or more addresses corresponding to word lines in the plurality of word lines, (ii) disable redundancy match, (iii) activate one or more first word lines in the memory array corresponding to the one or more addresses indicated by the value to refresh first data stored in the memory array, and (iv) update the value based at least in part on activating the one or more first word lines.

Abstract: The beginning of using Complementary Metal-Oxide-Semiconductor (CMOS) process technology to implement Static Random-Access Memory (SRAM) which transistor number is six. And then reducing transistor number for increasing integration density, but it will diminish the stability of memory, and also may enhance the complexity of access circuit, thus increasing the power consumption. For increasing the integration density of SRAM, and according to the electrical characteristics of reduced transistor number therefore designing the memory possess low power consumption and its corresponding circuits, and then implementing an access system. If electrical characteristic of the other various memories are similar to SRAM, such as Dynamic Random-Access Memory (DRAM), so they can also use the corresponding access circuit of SRAM.

Abstract: Apparatuses and methods are disclosed that include two transistor-one capacitor memory and for accessing such memory. An example apparatus includes a capacitor coupled to first and second selection components. The apparatus further includes a first digit line and the first selection component configured to couple a first plate of the capacitor to the first digit line, and also includes a second digit line and the second selection component configured to couple the second plate to the second digit line. A sense amplifier is coupled to the second digit line and is configured to amplify a voltage difference between a voltage coupled to the second digit line and the reference voltage.

Abstract: An apparatus, method and computer program for operating an apparatus. The apparatus comprises: a scintillator and an array of photodetectors; the scintillator configured to be rotatable around the periphery of a computed tomography scanner, the scintillator configured to receive X-rays incident on the scintillator, convert the received X-rays to visible light and transmit the visible light towards a corresponding photodetector of the array of photodetectors; and the array of photodetectors fixed around the periphery of the computed tomography scanner, each of the photodetectors in the array of photodetectors configured to output an electrical signal in response to detecting the visible light received from the scintillator.

Abstract: A sense amplifier includes a first sense amplification circuit electrically connected between a bit line, to which a multi-bit memory cell is also connected, and a complementary bit line. The first sense amplification circuit is configured to sense a least significant bit (LSB) of 2-bit data in the memory cell and latch the LSB in a first sensing bit line pair. A second sense amplification circuit is provided, which is configured to sense a most significant bit (MSB) of the 2-bit data and latch the MSB in a second sensing bit line pair. A switching circuit is provided, which is configured to selectively connect between bit lines of the first sensing bit line pair and bit lines of the second sensing bit line pair.

Abstract: Memory with an error correction circuit includes: a first error correction circuit performing error correction on first partial data to generate first partial write data or first partial read data; and a second error correction circuit performing error correction on second partial data to generate second partial write data or second partial read data. In a write mode, a plurality of sensing drive circuits respectively receive a plurality of first partial write bits of the first partial write data and a plurality of second partial write bits of the second partial write data, and each sensing drive circuit combines the first partial write bits with the corresponding second partial write bits and writes them to corresponding memory cell columns; in a read mode, the sensing driving circuits respectively sense stored data in the memory cell columns to generate a plurality of first partial read data and second partial read data.

Abstract: An object is to shorten the time for rewriting data in memory cells. A memory module includes a first memory cell, a second memory cell, a selection transistor, and a wiring WBL1. The first memory cell includes a first memory node. The second memory cell includes a second memory node. One end of the first memory cell is electrically connected to the wiring WBL1 through the selection transistor. The other end of the first memory cell is electrically connected to one end of the second memory cell. The other end of the second memory cell is electrically connected to the wiring WBL1. When the selection transistor is on, data in the first memory node is rewritten by a signal supplied through the selection transistor to the wiring WBL1. When the selection transistor is off, data in the first memory node is rewritten by a signal supplied through the second memory node to the wiring WBL1.

Abstract: A memory device includes a memory cell array including a plurality of memory cells arranged at points where a plurality of word lines and a plurality of bit lines intersect; a sense amplifier configured to amplify, in a read operation mode of the memory device, a voltage difference value between a voltage of a selected word line connected to a selected memory cell of the plurality of memory cells and a reference voltage; and a leakage current compensation circuit connected to a selected word line path between the selected memory cell and the sense amplifier and configured to compensate for a total leakage current generated by unselected memory cells connected to the selected word line in the read operation mode.

Abstract: Methods, systems, and devices for operating a memory cell or memory cells are described. Cells of a memory array may be pre-written, which may include writing the cells to one state while a sense component is isolated from digit lines of the array. Read or write operations may be executed at the sense component while the sense component is isolated, and the cell may be de-isolated (e.g., connected to the digit lines) when write operations are completed. The techniques may include techniques accessing a memory cell of a memory array, isolating a sense amplifier from a digit line of the memory array based at least in part on the accessing of the cell, firing the sense amplifier, and pre-writing the memory cell of the memory array to a second data state while the sense amplifier is isolated. In some examples, the memory cell may include a ferroelectric memory cell.

Abstract: Apparatuses and methods are disclosed that include two transistor-one capacitor memory and for accessing such memory. An example apparatus includes a capacitor coupled to first and second selection components. The apparatus further includes a first digit line and the first selection component configured to couple a first plate of the capacitor to the first digit line, and also includes a second digit line and the second selection component configured to couple the second plate to the second digit line. A sense amplifier is coupled to the second digit line and is configured to amplify a voltage difference between a voltage coupled to the second digit line and the reference voltage.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a data storage circuit and a control circuit. The data storage circuit holds first data to be written into the memory cell and holds 1 bit data calculated from the first data. The control circuit writes the data of n bits into the memory cell in a first write operation and then executes a second write operation. The control circuit carries out the following control in the second write operation. It reads data stored in the memory cell in the first write operation. It restores the first data based on the data read from the memory cell and the 1 bit data held in the data storage circuit. It writes the restored first data into the memory cell.

Abstract: A negative bitline write assist circuit includes a bias capacitor configured to facilitate driving the capacitance of a bitline. The negative bitline write assist circuit may be modularly replicated within a circuit to change the amount of negative voltage on the bitline during write operations. The bitline write assist circuit may be coupled directly to the bitline, removing the need to add a pull-down transistor to the write driver.

Abstract: Embodiments of three-dimensional (3D) memory devices with a 3D memory device includes a first semiconductor structure having a peripheral circuit, an array of SRAM cells, and a first bonding layer having a plurality of first bonding contacts. The 3D memory device also includes a second semiconductor structure having an array of 3D NAND memory strings and a second bonding layer including a plurality of second bonding contacts and a bonding interface between the first bonding layer and the second bonding layer, wherein the first bonding contacts are in contact with the second bonding contacts at the bonding interface.

Abstract: A bit line architecture for dual-port static random-access memory (DP SRAM) is provided. An array of memory cells is arranged in rows and columns, and comprises a first subarray and a second subarray. A first pair of complementary bit lines (CBLs) extends along a column, from a first side of the array, and terminates between the first and second subarrays. A second pair of CBLs extends from the first side of the array, along the column, to a second side of the array. The CBLs of the second pair of CBLs have stepped profiles between the first and second subarrays. A third pair of CBLs and a fourth pair of CBLs extend along the column. The first and third pairs of CBLs electrically couple to memory cells in the first subarray, and the second and fourth pairs of CBLs electrically couple to memory cells in the second subarray.

Abstract: Apparatuses and methods are disclosed that include two transistor-one capacitor memory and for accessing such memory. An example apparatus includes a capacitor coupled to first and second selection components. The apparatus further includes a first digit line and the first selection component configured to couple a first plate of the capacitor to the first digit line, and also includes a second digit line and the second selection component configured to couple the second plate to the second digit line. A sense amplifier is coupled to the second digit line and is configured to amplify a voltage difference between a voltage coupled to the second digit line and the reference voltage.

Abstract: A sense amplifier includes a first transistor having a source/drain connected to a data line, a drain/source connected to a first node and a gate connected to a setting line. The sense amplifier further includes a second transistor having a source/drain connected to ground or a power supply voltage, a drain/source connected to a second node and a gate connected to the setting line.

Abstract: A semiconductor device includes a plurality of first conductive lines in a first wiring layer, a plurality of second conductive lines in a second wiring layer, and a plurality of memory cells between the first and second conductive lines in a first direction in a first region. A plurality of third conductive lines in the first wiring layer, a plurality of fourth conductive lines in the second wiring, and a plurality of first memory lines are in a second region. The third conductive lines extends in a second direction and are spaced from each other in a third direction. The fourth conductive lines extend in the second direction and are spaced in the third direction. The first memory lines are between the third conductive lines and the fourth conductive lines in the first direction. The first memory lines comprise the same materials as the memory cells.

Abstract: A volatile memory and a method for efficient bulk data movement, backup operation in the volatile memory device are provided. The volatile memory device includes: a plurality of subarray, configured to access data, wherein each of the subarray is electrically coupled to each other. The row address control, configured to control the row of each of the plurality of subarray. The column control, configured to control the column of each of the plurality of subarray. The plurality of sense amplifier, adapted to each of the plurality of sub array is periodically enabled during the data access operation. The plurality of sub word driver, adapted on the adjacent to the plurality of sub array provides a driving signal to the corresponding word line in the plurality of subarray. The volatile memory device performs a data movement operation in a predetermined block and determine an odd data and an even data in the predetermined block.

Abstract: The on-vehicle device includes: an oscillation unit configured to output a clock signal; at least one calculation unit configured to operate on the basis of the clock signal; a temperature sensor; a load estimation unit configured to estimate a load on the calculation unit, and on the basis of the estimated load, estimate whether or not there is a possibility of temperature increase in the calculation unit; and a clock setting unit configured to set a frequency of the clock signal to be outputted from the oscillation unit, wherein the clock setting unit decreases the frequency of the clock signal, if the load estimation unit estimates that there is a possibility of temperature increase in the calculation unit, and the temperature measured by the temperature sensor is equal to or greater than a predetermined temperature.

Abstract: An image formation apparatus includes a first non-volatile memory, a second non-volatile memory smaller in allowable number of times of rewriting of data than the first non-volatile memory and higher in rate of reading of data than the first non-volatile memory, and a processor. The processor backs up control data for the image formation apparatus to the first non-volatile memory, backs up the control data to the second non-volatile memory less frequently than to the first non-volatile memory, and reads the control data from the second non-volatile memory when the control data stored in the first non-volatile memory matches with the control data stored in the second non-volatile memory at the time of start-up of the image formation apparatus and otherwise reads the control data from the first non-volatile memory.

Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: Apparatuses and methods related to comparing data patterns in memory. An example method can include comparing a number of data patterns stored in a memory array to a target data pattern. The method can include determining whether a data pattern of the number of data patterns matches the target data pattern.

Abstract: A memory device includes a memory cell array and a peripheral circuit. The memory cell array includes a plurality of memory blocks. The peripheral circuit performs a dummy operation on a dummy area among the plurality of memory blocks of the memory cell array.

Abstract: A memory system is provided. The memory system includes a number of memory cells and a number of bit lines. The memory cells are interlocked with each other in rows and columns. The memory cells include respective capacitors, respective first transistors and respective second transistors. Respective upper plates of the respective capacitors are electrically connected to respective gates of the respective first transistors, and respective drains of the respective second transistors are connected to respective sources of the respective first transistors. The bit lines are arranged along an extending direction of the rows. Respective bit lines are connected to the respective first transistors through respective bit-line contacts, and each of the respective bit-line contacts is shared by two adjacent memory cells of the extending direction of the rows.

Abstract: A system and method for efficiently managing switching power of bit lines. In various embodiments, a first bit line in a memory array is pre-charged in multiple discrete steps, rather than in one continuous step. For a read operation that completed and read a logic low level from a first storage node, the first bit line is pre-charged from a ground reference level to a first power supply voltage. Similarly, a second bit line corresponding to a second storage node storing an inverse voltage level of the first storage node is pre-charged from a larger second power supply voltage to the smaller first power supply voltage. When the first time interval has elapsed, the first and second bit lines are pre-charged from the first power supply voltage to the second power supply voltage during a second time interval. Discrete steps are also used for pre-charging after write operations.

Abstract: Disclosed are methods, systems and devices for operation of correlated electron switch (CES) devices. In one aspect, a CES device may be placed in any one of multiple impedance states in a write operation by controlling a current and a voltage applied to terminals of the non-volatile memory device. In one implementation, a CES device may be placed in a high impedance or insulative state, or two more distinguishable low impedance or conductive states.

Abstract: A method for producing an active matrix substrate includes the steps of: (A) forming in individual pixels a thin-film transistor element, a first insulating film, a pixel electrode to be connected to a drain electrode of the thin-film transistor element through a contact hole formed at least in the first insulating film, a second insulating film, and a common electrode to be superposed on the pixel electrode outside the contact hole, with the second insulating film in between; (B) detecting a short-circuited pixel among the pixels; (C) removing the pixel electrode inside the contact hole in the short-circuited pixel and thereby isolating the pixel electrode from the drain electrode; and (D) forming a through hole that penetrates the second insulating film outside the contact hole in the short-circuited pixel, and connecting the pixel electrode and the common electrode to each other through the through hole.

Abstract: An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit formed on the substrate includes a plurality of protection diodes that are connected in series with each other, and the protection circuit is connected to an output terminal of the amplifier circuit. A pad conductive layer at least partially includes a pad for connecting to a circuit outside the substrate. The pad conductive layer and the protection circuit at least partially overlap each other in plan view.

Abstract: A sense amplifier includes a first sense amplification circuit electrically connected between a bit line, to which a multi-bit memory cell is also connected, and a complementary bit line. The first sense amplification circuit is configured to sense a least significant bit (LSB) of 2-bit data in the memory cell and latch the LSB in a first sensing bit line pair. A second sense amplification circuit is provided, which is configured to sense a most significant bit (MSB) of the 2-bit data and latch the MSB in a second sensing bit line pair. A switching circuit is provided, which is configured to selectively connect between bit lines of the first sensing bit line pair and bit lines of the second sensing bit line pair.

Abstract: The beginning of using Complementary Metal-Oxide-Semiconductor (CMOS) process technology to implement Static Random-Access Memory (SRAM) which transistor number is six. And then reducing transistor number for increasing integration density, but it will diminish the stability of memory, and also may enhance the complexity of access circuit, thus increasing the power consumption. For increasing the integration density of SRAM, and according to the electrical characteristics of reduced transistor number therefore designing the memory possess low power consumption and its corresponding circuits, and then implementing an access system. If electrical characteristic of the other various memories are similar to SRAM, such as Dynamic Random-Access Memory (DRAM), so they can also use the corresponding access circuit of SRAM.

Abstract: A memory circuit includes a first memory cell and a second memory adjacent to the first memory cell. The first memory cell includes a first word line strapping line segment electrically coupled with a pass device of the first memory cell; and a second word line strapping line segment. The second memory cell includes a first word line strapping line segment; and a second word line strapping line segment electrically coupled with a pass device of the second memory cell. The first word line strapping line segment of the first memory cell and the first word line strapping line segment of the second memory cell are connected with each other at a first interconnection layer. The second word line strapping line segment of the first memory cell and the second word line strapping line segment of the second memory cell are connected with each other at the first interconnection layer.

Abstract: In the non-volatile semiconductor memory device, a mobile charge collector layer, a mobile charge collecting contact, a mobile charge collecting first wiring layer, an in-between contact between the mobile charge collector layers, and a mobile charge collecting second wiring layer are disposed adjacent to a floating gate. Thereby, without increasing areas of active regions in the non-volatile semiconductor memory device, the number of mobile charges collected near the floating gate is reduced. The non-volatile semiconductor memory device allows high-speed operation of a memory cell while reducing fluctuations in a threshold voltage of the memory cell caused by collection of the mobile charges, which are attracted from an insulation layer, near the floating gate.

Abstract: A circuit includes selected sense circuits configured to be connected to selected bit lines and unselected sense circuits configured to be connected to unselected bit lines during a sense operation. When the sense circuit is connected to the unselected bit line during the sense operation, the sense circuit is locked out in order to reduce current consumption. However, noise from the locked out sense circuit may be transmitted to the sense circuits connected to the selected bit lines through adjacent bit line coupling. In order to reduce the effect of the noise, charge transfer from the sense node may be blocked from passing to the unselected bit lines. Or, charge may be drained from the sense node, thereby preventing the charge from passing to the unselected bit lines.

Abstract: A data storage device includes a controller and a memory die. The controller includes a host interface and a memory interface. A method includes receiving a message from a host device via the host interface. The message indicates that the host device is to perform a first adjustment process associated with the host interface. The method further includes performing a second adjustment process associated with the memory interface in response to receiving the message indicating that the host device is to perform the first adjustment process.