Abstract: The present disclosure provides a semiconductor device and a semiconductor memory device. The semiconductor device can be used as a memory cell, and may comprise a first P-type semiconductor layer, a first N-type semiconductor layer, a second P-type semiconductor layer, and a second N-type semiconductor layer arranged in sequence. A first data state may be stored in the semiconductor device by applying a forward bias, which is larger than a punch-through voltage VBO, between the first P-type semiconductor layer and the second N-type semiconductor layer. A second data state may be stored in the semiconductor device by applying a reverse bias, which is approaching to the reverse breakdown region of the semiconductor device, between the first P-type semiconductor layer and the second N-type semiconductor layer. In this way, the semiconductor device may be effectively used for data storage. The semiconductor memory device comprises an array of memory cells consisted of the semiconductor devices.

Abstract: The invention relates to a memory cell having an FET transistor with a source, a drain and a floating body between the source and the drain, and an injector that can be controlled to inject a charge into the floating body of the FET transistor. The injector includes a bipolar transistor having an emitter, a base and a collector formed by the body of the FET transistor. Specifically, in the memory cell, the emitter of the bipolar transistor is arranged so that the source of the FET transistor serves as the base for the bipolar transistor. The invention also includes a memory array comprising a plurality of memory cells according to the first aspect of the invention, and to methods of controlling such memory cells.

Abstract: There is provided a technology which can allow a semiconductor chip formed with a nonvolatile memory to be sufficiently reduced in size. There is also provided a technology which can ensure the reliability of the nonvolatile memory. In a memory cell of the present invention, a boost gate electrode is formed over a control gate electrode via an insulating film. The boost gate electrode has the function of boosting a voltage applied to a memory gate electrode through capacitive coupling between the boost gate electrode and the memory gate electrode. That is, during a write operation or an erase operation to the memory cell, a high voltage is applied to the memory gate electrode and, to apply the high voltage to the memory gate electrode, the capacitive coupling using the boost gate electrode is subsidiarily used in the present invention.

Abstract: In accordance with an aspect of the present disclosure, a memory cell (1) or select element is provided. The element includes an ion conductor element (3) formed of a ion conductor material with mobile metal ions, a first electrically conducing electrode (4) in electrical contact with the ion conductor element, and a second electrically conducting electrode (6) in electrical contact with the ion conductor element, so that the memory cell or select element is programmable by applying an electrical voltage between the first electrode and the second electrode that causes the metal ions to be influenced so that an electrical resistance across the ion conductor element is caused to vary, for example because a metallic protrusion (7) is caused to grow or decompose. In contrast to prior art approaches, the ion conductor element has a shape that is asymmetrical with respect to an exchange of the first electrode (4) and the second electrode (6) for each other.

Abstract: An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array which includes (i) a plurality of memory cells, wherein each memory cell is programmable to store one of a plurality of data states, and (ii) a bit line, having a plurality of memory cells coupled thereto. Memory cell control circuitry applies one or more read control signals to perform a read operation wherein, in response to the read control signals, a selected memory cell conducts a current which is representative of the data state stored therein. Sense amplifier circuitry senses the data state stored in the selected memory cell using a signal which is responsive to the current conducted by the selected memory cell. Current regulation circuitry is responsively and electrically coupled to the bit line during a portion of the read operation to sink or source at least a portion of the current provided on the bit line.

Abstract: According to one embodiment, a semiconductor memory device includes first and second upper-layer contact members. The upper-layer contact members are arranged alternately with the first upper-layer contact members in a first direction and shifted in a second direction orthogonal to the first direction. Plugs are formed on the second upper-layer contact members. First metal wirings are provided on the first upper-layer contact members. Second metal wirings are provided on the plugs. A height of a top surface of the plugs is higher than a top surface of the first metal wirings. A width of a bottom surface of the first metal wirings in a shorter-side direction is shorter than a width of a top surface of the first metal wirings. A width of a bottom surface of the second metal wirings in a shorter-side direction is shorter than a width of a top surface of the second metal wirings.

Abstract: An object of the current invention is to provide DRAM that is not limited by capacitors.

Abstract: A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line with about a same first spacing provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines.

Abstract: An integrated circuit includes an array of memory cells. Each memory cell includes a diode. The integrated circuit includes a doped semiconductor line formed in a semiconductor substrate. The doped semiconductor line is coupled to a row of diodes. The integrated circuit includes conductive cladding contacting the doped semiconductor line.

Abstract: The invention relates to an organic electronic memory component having an electrode and a counterelectrode and an organic layer arrangement formed between said electrode and counterelectrode and in electrical contact herewith, wherein the organic layer arrangement comprises the following organic layers: an electrode-specific charge carrier transport layer and a counterelectrode-specific charge carrier-blocking layer and disposed between said electrode-specific charge carrier transport layer and counterelectrode-specific charge carrier-blocking layer a memory layer region having a charge carrier-storing layer and a further charge carrier-storing layer between which charge carrier-storing layer and a further charge carrier-storing layer is disposed a charge carrier barrier layer. Furthermore the invention relates to a method for the operating of an organic electronic memory component.

Abstract: A highly integrated gain cell-type semiconductor memory is provided. A first insulator, a read bit line, a second insulator, a third insulator, a first semiconductor film, first conductive layers, and the like are formed. A projecting insulator is formed thereover. Then, second semiconductor films and a second gate insulating film are formed to cover the projecting insulator. After that, a conductive film is formed and subjected to anisotropic etching, so that write word lines are formed on side surfaces of the projecting insulator. A third contact plug for connection to a write bit line is formed over a top of the projecting insulator. With such a structure, the area of the memory cell can be 4 F2 at a minimum.

Abstract: A nonvolatile memory cell is described, the memory cell comprising a semiconductor diode. The semiconductor material making up the diode is formed with significant defect density, and allows very low current flow at a typical read voltage. Application of a programming voltage permanently changes the nature of the semiconductor material, resulting in an improved diode. The programmed diode allows much higher current flow, in some embodiments one, two or three orders of magnitude higher, at the same read voltage. The difference in current allows a programmed memory cell to be distinguished from an unprogrammed memory cell. Fabrication techniques to generate an advantageous unprogrammed defect density are described. The memory cell of the present invention can be formed in a monolithic three dimensional memory array, having multiple stacked memory levels formed above a single substrate.

Abstract: A non-volatile microelectronic memory device that includes a depletion mode circuit protection device that prevents high voltages, which are applied to bitlines during an erase operation, from being applied to and damaging low voltage circuits which are electrically coupled to the bitlines.

Abstract: A semiconductor device that can transmit and receive data without contact is popular partly as some railway passes, electronic money cards, and the like; however, it has been a prime task to provide an inexpensive semiconductor device for further popularization. In view of the above current conditions, a semiconductor device of the present invention includes a memory with a simple structure for providing an inexpensive semiconductor device and a manufacturing method thereof. A memory element included in the memory includes a layer containing an organic compound, and a source electrode or a drain electrode of a TFT provided in the memory element portion is used as a conductive layer which forms a bit line of the memory element.

Abstract: A ferroelectric capacitor comprising a transistor layer superimposed on a semiconductor substrate, a ferroelectric capacitor layer provided superior to the transistor layer, a wiring layer provided superior to the ferroelectric capacitor layer, and a passivation film. Further, at least one layer of barrier film capable of inhibiting penetration of moisture and hydrogen into the underlayer is provided between the ferroelectric capacitor layer and the passivation film, and the passivation film is characterized by containing a novolac resin.

Abstract: Systems and methods for CMOS-based MEMS programmable memories are described. In one aspect, the systems and methods provide for a programmable memory having multiple memory cells. Each memory cell includes an electrode disposed within the memory cell, and a conductor material having two ends disposed proximate to the electrode. The programmable memory provides means for applying a voltage between the electrode and the conductor material, e.g., a voltage source. The applied voltage generates an electrostatic force sufficient to permanently alter the conductor material, thereby programming the memory cell.

Abstract: The present disclosure includes GCIB-treated resistive devices, devices utilizing GCIB-treated resistive devices (e.g., as switches, memory cells), and methods for forming the GCIB-treated resistive devices. One method of forming a GCIB-treated resistive device includes forming a lower electrode, and forming an oxide material on the lower electrode. The oxide material is exposed to a gas cluster ion beam (GCIB) until a change in resistance of a first portion of the oxide material relative to the resistance of a second portion of the oxide material. An upper electrode is formed on the first portion.

Abstract: A semiconductor memory device includes a data storage area wherein a plurality of data cells, respectively storing one bit of data, is arranged in a lattice form, a redundant data storage area that stores one bit parity data, the one bit parity data corresponding respectively to a line of data read out of the data storage area as a data group, a first switch section that receives a data group read out from the data storage area and a parity data bit, and a composite unit that receives an output of the first switch section and that generates correction data for the read data group, as based upon defect position information of the data storage area. The first switch section is selectively controlled to provide the parity data bit associated with the read data group as an input into the composite unit based on the defect position information.

Abstract: A non-volatile storage device includes a substrate, a monolithic three-dimensional memory array of non-volatile storage elements arranged above a portion of the substrate, a plurality of sense amplifiers in communication with the non-volatile storage elements, a plurality of temporary storage devices in communication with the sense amplifiers, a page register in communication with the temporary storage devices, and one or more control circuits. The one or more control circuits are in communication with the page register, the temporary storage devices and the sense amplifiers. The sense amplifiers are arranged on the substrate underneath the monolithic three-dimensional memory array. The temporary storage devices are arranged on the substrate underneath the monolithic three-dimensional memory array. The page register is arranged on the substrate in an area that is not underneath the monolithic three-dimensional memory array.

Abstract: Integrated circuits with memory elements are provided. The memory elements may be arranged in a memory block. The memory block may include cross-coupled inverters that store data. The stored data may be used to program pass transistors. Transistors in the memory block may be stressed. Depending on the type of stress-inducing layer used, a tensile stress or a compressive stress may be built in into the transistors. Stressed transistors may help improve the routing speed of the memory block. Stressed transistors may be implemented using dual gate-oxide process.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device includes an electrically floating body region and a gate disposed about a first portion of the body region. The device includes a source region adjoining a second portion of the body region, the second portion adjacent the first portion and separating the source region from the first portion. The device includes a drain region adjoining a third portion of the body region, the third portion adjacent the first portion and separating the drain region from the first portion, wherein the source and drain regions are opposing.

Abstract: The present disclosure provides a read only memory (ROM) cell array. The ROM cell array includes a plurality of fin active regions oriented in a first direction and formed on a semiconductor substrate; a plurality of gates formed on the plurality of fin active regions and oriented in a second direction perpendicular to the first direction; and a plurality of ROM cells formed by the plurality of fin active regions and the plurality of gates, the plurality of ROM cells being coded such that each cell of a first subset of ROM cells has a source electrically connected to a Vss line, and each cell of a second subset of ROM cells has a source electrically isolated. Each cell of the first subset of ROM cells includes a drain contact having a first contact area and a source contact having a second contact area at least 30% greater than the first contact area.

Abstract: It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor.

Abstract: A nonvolatile memory device including one-time programmable (OTP) unit cell is provided. The nonvolatile memory device includes: a unit cell; a detecting unit configured to detect data from the unit cell; and a read voltage varying unit configured to vary an input voltage and supply a varied read voltage to the unit cell.

Abstract: An integrated circuit device (e.g., a logic or memory device) having a memory section including a plurality of memory cells, wherein each memory cell thereof includes at least one n-channel transistor having a gate, gate dielectric and first, second and body regions, wherein the gate of the at least one n-channel transistor of each memory cell includes one or more gate materials, disposed on or over the gate dielectric material. The one or more gate materials may include a semiconductor material having one or more acceptor-type doping species disposed therein. The integrated circuit device may further include a logic section including at least one n-channel transistor having a gate, gate dielectric and first, second and body regions, wherein the gate of the n-channel transistor of the logic section may include a gate semiconductor material disposed on or over the gate dielectric material.

Abstract: Antifuses and program circuits having the same. The antifuses are embodied as a transistor. When a first power supply voltage is applied to a source, a first program voltage for causing impact ionization is applied to a gate and drain, and a second program voltage for causing channel initiated secondary electron/channel initiated secondary hole (CHISEL/CHISHL) is applied to a well, a dielectric material may be ruptured between the gate adjacent to the drain and the well so that an antifuse may be programmed.

Abstract: A write-once read-many times memory device is made up of first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The present method provides for the programmed memory device a second erase activation energy greater than the first erase activation energy.

Abstract: A memory device is provided. The memory device includes a plurality of memory cells and a controller to write data to and read data from the memory cells. Each memory cell includes a first semiconductor material having a spontaneous polarization, a resistive ferroelectric material having a switchable spontaneous polarization, and a second semiconductor material having a spontaneous polarization, the resistive ferroelectric material being positioned between and in contact with the first and second semiconductor materials. The memory device can be configured to store energy that can be released by applying a voltage pulse to the memory device.

Abstract: A semiconductor device to improve layout uniformity may include an active region formed in a substrate, a dummy active region formed in the substrate and separated from the active region, a word line crossing over the active region, and a dummy word line. The dummy word line is formed over the dummy active region to overlap at least part of the dummy active region and may have an end positioned within the dummy active region.

Abstract: A data read/write device according to an example of the present invention includes a recording layer, and means for applying a voltage to the recording layer, generating a resistance change in the recording layer, and recording data. The recording layer is composed of a composite compound having at least two types of cation elements, at least one type of the cation element is a transition element having a “d” orbit in which electrons have been incompletely filled, and the shortest distance between the adjacent cation elements is 0.32 nm or less.

Abstract: An apparatus and method for providing a read-only memory (ROM) bit cell having one each of a PMOS transistor and an NMOS transistor, which has reduced static and dynamic electric power losses, are described. In particular, the bit cell does not require a pre-charge transistor. The sense amplifier for determining the voltages on ROM bit lines may be a digital inverter, address decoding may be simplified since there are no timing requirements with respect to transistor pre-charge, and chips containing a plurality of ROM bit cell may be readily programmed. In one embodiment of the invention, each bit cell includes one PMOS transistor having its source in electrical connection with a voltage source, its drain connected or unconnected to a bit line, and its gate connected to an inverted version of the word line signal; and one NMOS transistor having its source connected to a lower voltage source, its drain connected or disconnected to the bit line, and its gate connected to the word line.

Abstract: To provide a nonvolatile storage device (100) which is capable of achieving stable operation and includes variable resistance elements. The nonvolatile storage device (100) includes: memory cells (M111, M112, . . .) each of which is provided at three-dimensional cross-points between word lines (WL0, WL1, . . .) and bit lines (BL0, BL1, . . .) and having a resistance value that reversibly changes based on an electrical signal; a row selection circuit-and-driver (103) provided with transistors (103a) each of which applies a predetermined voltage to a corresponding one of the word lines (WL0, WL1, . . .); a column selection circuit-and-driver (104) provided with transistors (104a) each of which applies a predetermined voltage to a corresponding one of the bit lines (BL0, BL1, . . .); and a substrate bias circuit (110) which applies a forward bias voltage to a substrate of such transistors (103a and 104a).

Abstract: Memory storage requirements for digital signal processing operations, for example, motion-compensated video scan rate conversion, that produce intermediate output data, which is then used as an input to the operation, are reduced by reordering operations and organizing memory allocations in a special manner to allow intermediate output at a particular execution time, to substantially share the same memory space as the intermediate output of a previous execution time. Such a reduction in the amount of memory required for processing operations advantageously reduces cost and power consumption.

Abstract: A memory device comprises an array of memory cells each capable of storing multiple bits of data. The memory cells are arranged in memory strings that are connected to a common source line. Each memory cell includes a programmable transistor connected in series with a resistance. The transistor includes a gate dielectric that is switchable between a plurality of different resistance values. The threshold voltage of the transistor changes according to the resistance value of the gate dielectric. Memory states of the memory cells can thus be associated with respective resistance values of the dielectric layer of the transistor.

Abstract: A method of forming a semiconductor device is provided, comprising forming a plurality of hard masks on a substrate by patterning an insulating layer; forming a plurality of trenches in the substrate, each trench having trench walls disposed between two adjacent masks and extending vertically from a bottom portion to an upper portion; forming an insulating layer on the hard masks and the trench walls; forming a conductive layer on the insulating layer; etching the conductive layer to form conductive layer patterns to fill the bottom portions of the trenches; depositing a buffer layer on the conductive layer patterns and the trench walls; and filling the upper portions of the trenches with a capping layer.

Abstract: The MONOS vertical memory cell of the present invention allow miniaturization of the memory cell area. The two embodiments of split gate and single gate provide for efficient program and erase modes as well as preventing read disturb in the read mode.

Abstract: Arrays of memory elements may have data lines and address lines. Each memory element may have five transistors. An address decoder may receive an undecoded address signal and may produce a corresponding decoded address signal. The decoded version of the address signal may be used in addressing the memory elements in the memory array. The memory array may be loaded with configuration data. Loaded memory elements may each provide a static output control signal that configures a programmable logic transistor in programmable logic. The memory elements may be powered with an elevated voltage during normal operation. Boosted address signals may be used when addressing the memory array. The address decoder may contain circuitry that is responsive to a clear control signal and an address output enable signal. The memory element array may be cleared by asserting the clear control signal and address output enable signal.

Abstract: A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region.

Abstract: A Static Random Access Memory (SRAM) cell without dedicated access transistors is described. The SRAM cell comprises a plurality of transistors configured to provide at least a pair of storage nodes for storing complementary logic values represented by corresponding voltages. The transistors comprise at least one bitline transistor, at least on wordline transistor and at least two supply transistors. The bitline transistor is configured to selectively couple one of the storage nodes to at least one corresponding bitline, the bitline for being shared by SRAM cells in one of a common row or column. The wordline transistor is configured to selectively couple another of the storage nodes to at least one corresponding wordline, the wordline for being shared by SRAM cells in the other of the common row or column. The supply transistors are configured to selectively couple corresponding ones of the storage nodes to a supply voltage.

Abstract: The invention provides a memory device on a substrate. The memory device comprises semiconductor layers, common word lines, common bit lines and a common source line. The semiconductor layers are stacked on the substrate, wherein each semiconductor layer has a plurality of NAND strings, and each NAND string includes memory cells and at least a string selection transistor. The common word lines are configured above the semiconductor layers, wherein each common word line is coupled to the memory cells arranged in a same row of the semiconductor layers. The common bit lines are configured on the common word lines, wherein each common bit line is coupled to a first ends of the NAND strings arranged in the same column of the semiconductor layers. The common source line is configured on the common word lines and coupled to a second ends of the NAND strings of the semiconductor layers.

Abstract: A memory cell device is provided which includes a substrate, a plurality of unit memory cells connected between a word line and respective bit lines, where each memory cell including a resistance variable element, such a phase-change element, and a diode connected in series between the word line and the respective bit line, and a biasing circuit which applies a biasing voltage to the substrate to decrease a current flow in the word line.

Abstract: The invention provides a semiconductor device where data can be written after the production and forgery caused by rewriting of data can be prevented, and which can be manufactured at a low cost using a simple structure and an inexpensive material. Further, the invention provides a semiconductor device having the aforementioned functions, where wireless communication is not blocked by the internal structure. The semiconductor device of the invention has an organic memory provided with a memory cell array including a plurality of memory cells, a control circuit for controlling the organic memory, and a wire for connecting an antenna. Each of the plurality of memory cells has a transistor and a memory element. The memory element has a structure where an organic compound layer is provided between a first conductive layer and a second conductive layer. The second conductive layer is formed in a linear shape.

Abstract: An information recording/reproducing device includes a recording layer, and a recording circuit which records data to the recording layer by generating a phase change in the recording layer. The recording layer includes a first chemical compound having a spinel structure. The recording layer is AxMyX4 (0.1?x?2.2, 1.0?y?2.0), where A includes one selected from a group of Zn, Cd and Hg, M includes one selected from a group of Cr, Mo, W, Mn and Re, and X includes O.

Abstract: A semiconductor memory device includes a memory cell array, which includes a cell array having multiple cell blocks. Each cell block includes source and word lines arranged in one direction, bit lines arranged in a perpendicular direction, and memory cells having corresponding floating bodies. Adjacent memory cells share source or drain regions to form common source or drain regions, respectively. The source regions are arranged in a word line direction and connected to corresponding source lines, and the drain regions are arranged in the bit line direction and connected to corresponding bit lines. Gates of the memory cells are arranged in the word line direction and are connected to form the word lines. The source lines are formed on a layer of the word lines, and the bit lines are formed at a different layer to be insulated from the word and source lines.

Abstract: A non-volatile memory is provided. The non-volatile memory comprises at least a silicon-on-insulator transistor including a substrate; an insulating layer disposed on the substrate; an active region disposed on the insulating layer; and an energy barrier device disposed in the active region and outputting a relatively small current when the non-volatile memory is read.

Abstract: A computing system for implementing at least one electronic circuit with gain comprises at least one two-dimensional molecular switch array. The molecular switch array is formed by assembling two or more crossed planes of wires into a configuration of devices. Each device comprises a junction formed by a pair of crossed wires and at least one connector species that connects the pair of crossed wires in the junction. The junction has a functional dimension in nanometers, and includes a switching capability provided by both (1) one or more connector species and the pair of crossed wires and (2) a configurable nano-scale wire transistor having a first state that functions as a transistor and a second state that functions as a conducting semiconductor wire. Specific connections are made to interconnect the devices and connect the devices to two structures that provide high and low voltages.

Abstract: This disclosure concerns a semiconductor memory device including bit lines; word lines; semiconductor layers arranged to correspond to crosspoints of the bit lines and the word lines; bit line contacts connecting between a first surface region and the bit lines, the first surface region being a part of a surface region of the semiconductor layers directed to the word lines and the bit lines; and a word-line insulating film formed on a second surface region adjacent to the first surface region, the second surface region being a part of out of the surface region, the word-line insulating film electrically insulating the semiconductor layer and the word line, wherein the semiconductor layer, the word line and the word-line insulating film form a capacitor, and when a potential difference is given between the word line and the bit line, the word-line insulating film is broken in order to store data.

Abstract: An object of the present invention is to provide a technique of reducing the power consumption of an entire low power consumption SRAM LSI circuit employing scaled-down transistors and of increasing the stability of read and write operations on the memory cells by reducing the subthreshold leakage current and the leakage current flowing from the drain electrode to the substrate electrode. Another object of the present invention is to provide a technique of preventing an increase in the number of transistors in a memory cell and thereby preventing an increase in the cell area. Still another object of the present invention is to provide a technique of ensuring stable operation of an SRAM memory cell made up of SOI or FD-SOI transistors having a BOX layer by controlling the potentials of the wells under the BOX layers of the drive transistors.

Abstract: The invention relates to a memory cell having an FET transistor with a source, a drain and a floating body between the source and the drain, and an injector that can be controlled to inject a charge into the floating body of the FET transistor. The injector includes a bipolar transistor having an emitter, a base and a collector formed by the body of the FET transistor. Specifically, in the memory cell, the emitter of the bipolar transistor is arranged so that the source of the FET transistor serves as the base for the bipolar transistor. The invention also includes a memory array comprising a plurality of memory cells according to the first aspect of the invention, and to methods of controlling such memory cells.

Abstract: Disclosed are methods and devices, among which is a device that includes a first semiconductor fin having a first gate, a second semiconductor fin adjacent the first semiconductor fin and having a second gate, and a third gate extending between the first semiconductor fin and the second semiconductor fin. In some embodiments, the third gate may not be electrically connected to the first gate or the second gate.