Abstract: A memory card includes a plurality of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 time that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.

Abstract: Control logic in a memory device initiates an erase operation on a memory array and causes an erase voltage signal to be applied to a source terminal of a string of memory cells in a data block of the memory array during the erase operation. The control logic further causes a first voltage signal to be applied to a first select line of the data block and a second voltage signal to be applied to a second select line of the data block, wherein the first select line is coupled to a first device in the string of memory cells and the second select line is coupled to a second device in the string of memory cells, and wherein the first voltage signal and the second voltage signal both have a common first voltage offset with respect to the erase voltage signal during a first stage of the erase operation.

Abstract: A storage device is provided. The storage device includes a memory device including a memory cell array configured to store metadata and main data and a storage controller configured to access the memory device and control the memory device, wherein the storage controller is configured to read data from the memory device at a speed adaptively varying to a first read speed or a second read speed according to a state of the memory device, the second read speed being faster than the first read speed.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses.

Abstract: A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory string including a first memory cell transistor, a second memory cell transistor, and a first select element that connects the first memory cell transistor and the second memory cell transistor in series, a second memory string including a third memory cell transistor, a fourth memory cell transistor, and a second select element that connects the third memory cell transistor and the fourth memory cell transistor in series, and a control circuit. The control circuit is configured to set the second select element to an off state while setting the first select element to an on state when reading data of the first memory string.

Abstract: A semiconductor memory includes a memory cell region that includes multiple memory cells stacked above a semiconductor substrate, first and second dummy regions on opposite sides of the memory cell region, each dummy region including multiple dummy cells stacked above the semiconductor substrate, and a wiring that electrically connects dummy cells of the first and second dummy regions that are at a same level above the semiconductor substrate.

Abstract: A semiconductor device includes a first word line configured to perform a writing operation or a programing operation, a second word line configured to perform a read operation, a first switching device including a first gate electrode and a first node, a second switching device comprising a second gate electrode and a second node, an electrical fuse (e-fuse) disposed between the first node and the second node, and a diode coupled to the first node and the first word line, wherein the first gate electrode and the second gate electrode are coupled to the second word line.

Abstract: A semiconductor structure includes a first-conductivity-type well located in a semiconductor substrate, a semiconductor active area region located adjacent to the a first-conductivity-type well, a first transistor including a source region, a drain region, a channel region located between the source region and the drain region, a gate dielectric layer located over the channel region and a gate electrode located over the gate dielectric layer, such that the transistor is located on the semiconductor active area region, and a cutoff gate electrode located over the semiconductor active area region, and between the first transistor and the first-conductivity-type well.

Abstract: A memory unit, array and operation method thereof are provided. The memory unit includes at least one P-type driver having a first end coupled to a power source, a second end and a control end coupled to a word line; a memory cell having a first end coupled to the second end of the P-type driver, and a second end coupled to a bit line.

Abstract: A semiconductor memory device includes a first conductive layer, a first and a second semiconductor layer opposed to the first conductive layer, a first and a second electric charge accumulating portion disposed between the first conductive layer and the first and the second semiconductor layer, and a first and a second bit line electrically connected to the first and the second semiconductor layer. A distance from a center position of the first conductive layer to the second semiconductor layer is smaller than a distance from the center position of the first conductive layer to the first semiconductor layer. When a read operation is executed on a first memory cell including the first electric charge accumulating portion and a second memory cell including the second electric charge accumulating portion, a voltage of the second bit line is larger than a voltage of the first bit line.

Abstract: Embodiments described herein relate to a method for manufacturing a 1.5T SONOS flash memory. First, a first polysilicon gate layer is deposited and formed on a semiconductor substrate, then a formation area of a memory gate is defined on the first polysilicon gate layer, polysilicon in the formation area of the memory gate is etched away, and etching is stopped on a gate oxide layer. Next, an ONO layer and a second polysilicon gate layer are sequentially deposited, chemical mechanical polishing is performed on the second polysilicon gate layer, the ONO layer remaining on the top of the first polysilicon gate layer is cleaned away, and then gate structures of a logic device and a 1.5T SONOS device are formed at the same time.

Abstract: Testing circuitry and methods are disclosed for use with analog neural memory in deep learning artificial neural networks. The analog neural memory comprises one or more arrays of non-volatile memory cells. The testing circuitry and methods can be utilized during sort tests, qualification tests, and other tests to verify programming operations of one or more cells.

Abstract: A variety of applications can include a high voltage switch configured to translate supply voltages or other voltages to specific magnitudes in memory devices, with the high voltage switch designed to provide enhanced lifetime of components of the high voltage switch. A high voltage switch can include a high voltage diode coupled to an output node and to a gate of a high voltage transistor coupled to the output node. The high voltage diode can provide feedback of an output voltage to the gate of the high voltage transistor to relieve Fowler-Nordheim stress on the dielectric coupled to the gate in the transistor, where large shifts in threshold voltage of the transistor could otherwise result from the Fowler-Nordheim stress. The high voltage diode can be structured using a high voltage field effect transistor. Additional devices, systems, and methods are discussed.

Abstract: A neural network circuit for providing a threshold weighted sum of input signals comprises at least two arrays of transistors with programmable threshold voltage, each transistor storing a synaptic weight as a threshold voltage and having a control electrode for receiving an activation input signal. Additionally, for each array of transistors, a reference network associated therewith, which provides a reference signal to be combined with the positive or negative weight current components of the transistors of the associated array, the reference signal having opposite sign compared to the weight current components of the associated array, thereby providing the threshold of the weighted sums of the currents. Further, at least one bitline is configured to receive the combined positive and/or negative current components, each combined with their associated reference signals.

Abstract: This application relates to a method and apparatus for processing a new read-write-operation instruction added to an instruction set to maximize the performance of processing-in-memory (PIM). The read-write-operation instruction performs reading and writing on an operation result of the PIM by returning the operation result of the PIM to a computer system and, at the same time, writing the operation result to a destination address. An instruction processor in PIM includes a response data selector and a finite state machine to process the read-write-operation instruction. The response data selector includes a selector configured to select one of a response data signal and an operation result, and a three-phase buffer configured to allow or disallow response data. The finite state machine of the instruction processor outputs a response permission signal and a response selection signal for controlling the buffer and the selector.

Abstract: A hybrid memory structure including a substrate, a flash memory, a first resistive random access memory (RRAM), and a second RRAM is provided. The flash memory is located on the substrate. The flash memory includes a gate, a first doped region, and a second doped region. The gate is located on the substrate. The first doped region is located in the substrate on one side of the gate. The second doped region is located in the substrate on another side of the gate. The first RRAM is electrically connected to one of the gate, the first doped region, and the second doped region. The second RRAM is electrically connected to another of the gate, the first doped region, and the second doped region.

Abstract: Generally discussed herein are apparatuses and methods. One such apparatus includes a data line, a first memory cell and a first select transistor. The first transistor has a gate and is coupled between the data line and the first memory cell. The apparatus can include a second memory cell and a second select transistor having a gate. The apparatus can include a third select transistor having a gate. The second select transistor is coupled between the second memory cell and the third select transistor. The third select transistor is coupled between the second select transistor and a source. The apparatus can include a drive transistor coupled to both the gate of the first select transistor and the gate of the second select transistor or the gate of the third select transistor.

Abstract: A memory cell array with memory cells arranged in rows and columns, first sub source lines each connecting together the source regions in one of the rows and in a first plurality of the columns, second sub source lines each connecting together the source regions in one of the rows and in a second plurality of the columns, a first and second erase gate lines each connecting together all of the erase gates in the first and second plurality of the columns respectively, first select transistors each connected between one of first sub source lines and one of a plurality of source lines, second select transistors each connected between one of second sub source lines and one of the source lines, first select transistor line connected to gates of the first select transistors, and a second select transistor line connected to gates of the second select transistors.

Abstract: A display device can include a substrate provided with a first subpixel, a first electrode including a first sub electrode provided on the first subpixel, an organic light emitting layer including first and second organic light emitting layers arranged on the first sub electrode and a second organic light emitting layer arranged on the second sub electrode, a second electrode arranged on the organic light emitting layer, and an auxiliary electrode arranged between the first organic light emitting layer on the first sub electrode and the second organic light emitting layer on the first sub electrode, wherein the auxiliary electrode is connected with the second electrode. Therefore, although the first subpixel has a two-stack structure, the organic light emitting layer can emit light in accordance with a voltage of one-stack, whereby overall power consumption can be reduced.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device may be provided. The semiconductor device may include a source line formed over a substrate. The semiconductor device may include a channel pattern including a connection part disposed over the source line, and pillar parts protruding from the connection part in a first direction. The semiconductor device may include a well structure protruding from the connection part in the first direction and spaced apart from the source line. The semiconductor device may include a source contact structure protruding from the source line in the first direction and passing through the connection part. The semiconductor device may include a gate stack disposed between the source contact structure and the well structure and enclosing the pillar parts over the connection part.

Abstract: A bonded assembly includes a memory die containing a memory device and a plurality of bit lines, and logic die bonded to the memory die. The logic die contains a control circuit configured to control operation of the memory device. The control circuit contains a peripheral circuit region, a sense amplifier region, and a power and control signal region located adjacent to the sense amplifier region and containing at least one power and control signal interconnect structure which is configured to provide a power or control signal to or from the peripheral circuit region.

Abstract: A semiconductor memory device includes a plurality of bit lines extending in a first direction, and arranged in a second direction intersecting with the first direction, a page buffer high-voltage circuit divided into a plurality of page buffer high-voltage regions arranged in the first direction, each of the plurality of page buffer high-voltage regions including a plurality of page buffer high-voltage elements, each page buffer high-voltage element coupled to one of the plurality of bit lines, and a contact pad unit including a plurality of contact pads, each contact pad coupled to one of the plurality of page buffer high-voltage elements. The contact pad unit is arranged, in the first direction, between two of the plurality of page buffer high-voltage regions.

Abstract: Provided herein resistive random access memory matrix multiplication structures and methods. A non-volatile memory logic system can comprise a bit line and at a set of wordlines. Also included can be a set of resistive switching memory cells at respective intersections between the bit line and the set of wordlines. The set of resistive switching memory cells are programmed with a value of an input data bit of a first data matrix and receive respective currents on the set of wordlines. The respective currents comprise respective values of an activation data bit of a second data matrix. A resulting value based on a matrix multiplication corresponds to an output value of the bit line.

Abstract: In one embodiment, a semiconductor device includes a first substrate including first and second regions on its surface, a first control circuit on the first substrate in the first region, a first memory cell array above the first control circuit in the first region and connected to the first control circuit, and a first pad above the first memory cell array in the first region and connected to the first control circuit. The device further includes a second control circuit on the first substrate in the second region, a second memory cell array above the second control circuit in the second region and connected to the second control circuit, a second pad above the second memory cell array in the second region and connected to the second control circuit, and a connection line above the first and second memory cell arrays and connecting the first and second pads.

Abstract: A CAM device includes a cell array including a plurality of CAM cells, a search line driving circuit connected to the cell array through a plurality of search lines, and a match line sensing circuit connected to the cell array through a plurality of match lines. Each of the CAM cells includes a first half CAM cell connected to a first match line and a second half CAM cell connected to a second match line different from the first match line. The first match line connected to the first half CAM cell is precharged in a first phase, and the second match line connected to the second half CAM cell is precharged in a second phase after the first phase. Thus, power consumption of the CAM device is reduced and delay is minimized.

Abstract: A random bit cell includes a selection transistor, a first P-type transistor, and a second P-type transistor. The selection transistor has a first terminal coupled to a source line, a second terminal coupled to a common node, and a control terminal coupled to a word line. The first P-type transistor has a first terminal coupled to the common node, a second terminal coupled to a first bit line, and a floating gate. The second P-type transistor has a first terminal coupled to the common node, a second terminal coupled to a second bit line, and a floating gate. During an enroll operation, one of the first P-type transistor and the second P-type transistor is programmed by channel hot electron injection.

Abstract: A memory device comprises a plurality of stacks of bit lines alternating with insulating strips over an insulating layer on a substrate, and a plurality of vertical gate structures disposed between the stacks. Vertical channel structures and memory elements are disposed between outside surfaces of the vertical gate structures and sidewalls of insulating strips in the stacks of bit lines. The vertical channel structures provide channels between adjacent bit lines in the stacks. A plurality of word line transistors is disposed over and connected to respective vertical gate structures. A plurality of word lines is disposed over and connected to the word line transistors. The memory device comprises circuitry connected to the bit lines to apply bit line and source line voltages to the bit lines.

Abstract: A real-time computational device includes a programmable real-time processor, a communications input port which is connected to the programmable real-time processor through a first broadside interface, and a communications output port which is connected to the programmable real-time processor through a second broadside interface. Both broadside interfaces enable 1024 bits of data to be transferred across each of the broadside interfaces in a single clock cycle of the programmable real-time processor.

Abstract: Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the second substrate with the first substrate such that charges in the second substrate are discharged to the first substrate.

Abstract: High-efficiency control technology for non-volatile memory. A non-volatile memory has single level cells (SLCs) and multiple level cells (e.g., MLCs or TLCs) and is controlled by a controller. According to the controller at the device end, a host allocates a system memory to provide a host memory buffer (HMB). The controller at the device end uses the HMB to buffer write data issued by the host, and then flushes the write data from the HMB to multi-level cells of the non-volatile memory without passing single level cells of the non-volatile memory to reduce write amplification problems due to the frequent use of the single-level cells.

Abstract: Methods include receiving a pattern to be searched in a memory having a plurality of sets of memory elements with each set coupled to a separate data line and corresponding to a same set of bit positions of the pattern. Methods further include receiving a pattern of data to be programmed into a memory, programming a first data state into one memory cell of each cell pair of a plurality of cell pairs of a memory array, and programing a second data state into another memory cell of each cell pair of the plurality of cell pairs for each bit position of the pattern. Memory configured to facilitate such methods include a plurality of cell pairs, each cell pair of the plurality of cell pairs programmed to store a same bit of data corresponding to a particular bit position of a pattern to be searched in the memory.

Abstract: A memory is disclosed. A memory cell comprises three gate structures sequentially arrayed between a first source-drain region and a second source-drain region. A first gate structure and a third gate structure are formed by superposition of a first gate dielectric layer, a floating gate, a second gate dielectric layer and a polysilicon control gate, so that two memory bits and two control gates are formed. A second gate structure is located between the first gate structure and the third gate structure and serves as a select gate. Erasing and programming operations on the two memory bits formed by the floating gates are realized by FN tunneling. During erasing and programming, the first source-drain region and the second source-drain region are grounded, so that the memory bits can be selected and then erased or programmed only by controlling voltages of the first control gate, the select gate and the second control gate. An operation method of a memory is further disclosed.

Abstract: An apparatus (e.g., a content addressable memory system) can have a controller, a first content addressable memory coupled to the controller, and a second content addressable memory coupled to the controller. The controller can be configured to cause the first content addressable memory to write data in the first content addressable memory, cause the second content addressable memory to write the data in the second content addressable memory, and cause the second content addressable memory to query the data written in the second content addressable memory while the first content addressable memory continues to write the data in the first content addressable memory.

Abstract: A semiconductor storage device includes word lines extending in first and second directions, and separated from each other in a third direction, sense amplifier circuits that partially overlap the word lines in the third direction, memory strings intersecting the word lines and extending in the third direction, memory-side bit lines extending in the first direction, separated from each other in the second direction, and including first and second adjacent memory-side bit lines, circuit-side bit lines between the word lines and the sense amplifier circuits and partially overlapping the respective memory-side bit lines in the third direction, and contact plugs extending in the third direction and respectively connecting the memory-side bit lines and the circuit-side bit lines. The contact plugs include first and second contract plugs that are electrically connected to the first and second memory-side bit lines, respectively, and are not aligned along the first or second direction.

Abstract: Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

Abstract: The disclosed technology teaches a memory device with memory cells, each with a sense circuit with an input node in current flow communication, a BLC transistor, a transfer transistor, a current source transistor, and an output circuit to generate data based on a voltage on the sensing node. Also disclosed is a sensing sequence in which control circuits apply BLC voltage to the BLC transistor, transfer voltage to the transfer transistor and current control voltage to the current source transistor to provide a charging current to the BL, and to adjust the current control voltage to provide a keeping current on the BL from the current source transistor, and to apply a read voltage to a selected memory cell on the bit line. Additionally included is applying a timing signal to the output circuit to generate the data based on a voltage on the sensing node.

Abstract: Offsetting or modulating the location of a gate between two transistors may achieve a lower power circuit and a higher speed circuit depending on the new location of the gate. In one example, a gate between a PFET transistor and an NFET transistor may be offset towards the PFET transistor to achieve a higher speed circuit than a conventional circuit with the gate located equal distance between the transistors. In another example, a gate between a PFET transistor and an NFET transistor may be offset towards the NFET transistor to achieve a lower power circuit than a conventional circuit with the gate located equal distance between the transistors.

Abstract: A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a memory cell array, a page-reading portion which selects a page of the memory cell array, reads data of the selected page, and transmits the read data to a data-holding portion, and a control portion which controls continuous reading of pages. When a command related to termination of the continuous reading is input, the control portion terminates the continuous reading. When the command related to the termination of the continuous reading is not input, the continuous reading terminates. During a period in which the continuous reading is performed continuously, even if a chip selection signal is toggled, the continuous reading can be performed continuously without inputting a page-data read command.

Abstract: Methods, systems, and devices for a decoder are described. The memory device may include a substrate, an array of memory cells coupled with the substrate, and a decoder coupled with the substrate. The decoder may include a doped material that may extend between a first conductive line and an access line of the array of memory cells in a first direction (e.g., away from a surface of the substrate) and the doped material may be configured to selectively couple the first conductive line of the decoder with the access line of the array of memory cells. The access line may be coupled with two decoders, in some cases.

Abstract: Techniques are described for reducing an injection type of program disturb in a memory device during the pre-charge phase of a program loop. In one approach, a pre-charge voltage on the selected word line and drain side word lines is adjusted based on a risk of the injection type of program disturb. Risk factors such as temperature, WLn position, Vpgm and the selected sub-block, can be used to set the pre-charge voltage to be lower when the risk is higher. In another approach, the pre-charge voltage on the source side word lines is adjusted to reduce a channel gradient and/or the amount of time in which the injection type of program disturb occurs.

Abstract: Multi-gate NOR flash thin-film transistor (TFT) string arrays (“multi-gate NOR string arrays”) are organized as stacks of horizontal active strips running parallel to the surface of a silicon substrate, with the TFTs in each stack being controlled by vertical local word-lines provided along one or both sidewalls of the stack of active strips. Each active strip includes at least a channel layer formed between two shared source or drain layers. Data storage in the TFTs of an active strip is provided by charge-storage elements provided between the active strip and the control gates provided by the adjacent local word-lines. Each active strip may provide TFTs that belong to one or two NOR strings, depending on whether one or both sides of the active strip are used.

Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.

Abstract: Systems, methods, and apparatus are described that enable a serial bus to be operated in one or more modes that employ additional wires for communicating data. A method includes providing a data payload for a first data frame to be transmitted over a plurality of data lanes of a multilane serial bus operated in accordance with an I3C protocol, providing one or more indicators of validity of one or more bytes included in the data payload, and transmitting the first data frame over the multilane serial bus in accordance with a clock signal transmitted on a clock lane of the multilane serial bus.

Abstract: An electrode structure includes a plurality of electrodes vertically stacked on a substrate. Each of the plurality of electrodes includes an electrode portion, a pad portion and a protrusion. The electrode portion is parallel to a top surface of the substrate, extending in a first direction. The pad portion extends from the electrode portion in an inclined direction with respect to the top surface of the substrate. The protrusion protrudes from a portion of the pad portion in a direction parallel to the inclined direction. Protrusions of the plurality of electrodes are arranged in a direction diagonal to the first direction when viewed from a plan view.

Abstract: A storage device may perform a reprogram operation on a page on which a program operation is interrupted due to a sudden power off. The storage device may include a memory device including a plurality of memory blocks, each of which includes a plurality of pages, and a memory controller configured to perform a reprogram operation on a page in which a program operation is suspended using reprogram data that is set depending on threshold voltages of memory cells included in the page on which the program operation is interrupted, among the plurality of pages.

Abstract: A memory device, which can be configured as a 3D NAND flash memory, includes a plurality of stacks of conductive strips. The plurality of stacks of conductive strips includes a plurality of intermediate levels of conductive strips configured as word lines and an upper level of conductive strips configured as string select lines. A plurality of first patterned conductors is disposed above the plurality of stacks of conductive strips. A plurality of linking elements connects conductive strips in respective intermediate levels in the plurality of intermediate levels of conductive strips to first patterned conductors in the plurality of first patterned conductors. The linking elements in the plurality of linking elements include switches responsive to signals in conductive strips in the upper level of conductive strips.

Abstract: A semiconductor memory includes a memory cell region that includes multiple memory cells stacked above a semiconductor substrate, first and second dummy regions on opposite sides of the memory cell region, each dummy region including multiple dummy cells stacked above the semiconductor substrate, and a wiring that electrically connects dummy cells of the first and second dummy regions that are at a same level above the semiconductor substrate.

Abstract: A NOR string includes a number of individually addressable thin-film storage transistors sharing a bit line, with the individually addressable thin-film transistors further grouped into a predetermined number of segments. In each segment, the thin-film storage transistors of the segment share a source line segment, which is electrically isolated from other source line segments in the other segments within the NOR string. The NOR string may be formed along an active strip of semiconductor layers provided above and parallel a surface of a semiconductor substrate, with each active strip including first and second semiconductor sublayers of a first conductivity and a third semiconductor sublayer of a second conductivity, wherein the shared bit line and each source line segment are formed in the first and second semiconductor sublayers, respectively.