Abstract: A memory device includes a memory cell, a sensing circuit connected to sense data stored in a memory cell and to connect the memory cell by first and second paths separate from one another A sample and hold circuit connected between the memory cell and the sensing circuit may separate a period during which voltages of the first and second paths are developed by the data stored in the memory cell from a period during which the sensing circuit senses the data stored in the memory cell by detecting the developed voltages of the first and second paths.

Abstract: A flash memory controller, a non-transitory computer readable medium and a method for reading flash memory cells of a flash memory module. The method may include calculating a group of read thresholds to be applied during a reading operation of a set of flash memory cells that belong to a certain row of the flash memory module based upon a compressed representation of reference read thresholds associated with multiple reference rows of the flash memory module; and reading the set of flash memory cells by applying the group of reference read thresholds to provide read results.

Abstract: A semiconductor device avoids the disturb problem and the collision between write and read operations in a DP-SRAM cell or a 2P-SRAM cell. The semiconductor device 1 includes a write word line WLA and a read word line WLB each coupled to memory cells 3. A read operation activates the read word line WLB corresponding to the selected memory cell 3. A write operation activates the write word line WLA corresponding to the selected memory cell 3. The selected write word line WLA is activated after activation of the selected read word line WLB in an operation cycle that performs both read and write operations.

Abstract: A semiconductor memory device includes a memory cell block including memory cells, a random value generation circuit configured to generate random value data using a page address and a column address, a page buffer section connected to bit lines of the memory cell block and configured to store input data inputted in response to the column address and the random value data, and a controller configured to control the page buffer section to generate random data by performing a logic operation on the input data and the random value data stored in the page buffer section.

Abstract: A semiconductor memory includes a memory cell array that includes data cells of x bits and redundant cells of y bits for each word; a position-data storage unit that stores, for each word, defective-cell position data of defective cells of the data cells and the redundant cells; and a read circuit that reads data from cells of x bits based on the defective-cell position data stored in the position-data storage unit for a specified word of which address is specified as read address, the cells of x bits being formed by the data cells of x bits and the redundant cells of y bits of the specified word other than the defective cells.

Abstract: An integrated circuit with SRAM cells containing dual passgate transistors and a read buffer, all connected to one word line is disclosed. The read buffer and one passgate transistor may be variously configured to a separate read data line and write data line, or a combined data line, in different embodiments. The read buffer in addressed SRAM cells may be biased during read operations. The read buffer in half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line. The read buffer in addressed and half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line.

Abstract: The present disclosure relates to a semiconductor memory device and a method of operation the semiconductor memory device, which sets an encoding value by sequentially defining ranges used for recognizing distribution of memory cells based on a middle range and then performing a read operation in an order from the middle ranges to an outermost range, thereby capable of using infinite ranges for recognizing the distribution of the memory cells without addition of a circuit to an inside of the semiconductor memory device.

Abstract: A memory device uses a global input/output line or a pair of complementary global input/output lines to couple write data signals and read data signals to and from a memory array. The same input/output line or pairs of complementary global input/output lines may be used for coupling both write data signals and read data signals.

Abstract: A semiconductor element and an operating method thereof are provided. The semiconductor element comprises a first metal oxide semiconductor (MOS) and a second MOS. The second MOS is electrically connected to the first MOS. The second MOS includes a floating bipolar junction transistor (BJT).

Abstract: A memory device is provided which includes a memory circuit that allows a circuit which carries out a refresh operation to suitably carry out an original operation of the circuit even if an off-leakage current occurs in a transfer element used in a transfer section. A memory cell includes a switching circuit, a first retaining section, a transfer section, a second retaining section, a first control section, and a voltage supply, and the first control section is controlled to be in (i) a state in which the first control section carries out a first operation in which the first control section is in an active state or a non-active state and (ii) a state in which the first control section carries out a second operation.

Abstract: A semiconductor device includes a data memory cell for storing data; a reference data memory cell for storing reference data to be compared with the data; an inverted data memory cell for storing inverted data of the reference data; a sense amplifier unit; and a data output unit. In a first retrieving process, the sense amplifier unit differentially amplifies the data and the reference data, and adjusts an output thereof when a voltage difference between the data and the reference data becomes a predetermined retrievable voltage difference. In a second retrieving process, the sense amplifier unit differentially amplifies the data and the inverted data, and adjusts an output thereof when a voltage difference between the data and the inverted data becomes the predetermined retrievable voltage difference. The data output unit determines and outputs the data according to a result of the first retrieving process and the second retrieving process.

Abstract: A semiconductor memory apparatus including a test circuit configured for generating compressed data by comparing and compressing data stored in a plurality of memory cells inside a memory bank during a first test mode, and configured for outputting the compressed data as test data to an input/output pad through one selected global line during the first test mode, and the test circuit is configured for transmitting the compressed data to a plurality of global lines during a second test mode, combining the compressed data loaded in the respective global lines during the second test mode, and outputting the combination result as the test data to the input/output pad during the second test mode.

Abstract: A semiconductor memory device includes memory cells arranged at regions where word lines and bit lines cross each other; a randomizing and de-randomizing circuit configured to perform a first randomizing operation on data to be programmed to the memory cells, based on a seed value, so as to generate first randomized data; a data reading/writing circuit configured to perform a second randomizing operation on the first randomized data using a data inverting operation so as to generate second randomized data and program the second randomized data to the memory cells; and a control logic configured to control the randomizing and de-randomizing circuit and the data reading/writing circuit.

Abstract: The invention provides a memory apparatus and a signal delay circuit thereof. The signal delay circuit provided by present disclosure includes an input inverter, a first inverter, a capacitor, a first transistor, a second inverter and output inverter. The input inverter receives an input signal and output a signal to the first inverter. The capacitor coupled to an output terminal of the first inverter. The second terminal of the first transistor coupled to the output terminal of the first inverter and the first terminal of the first transistor coupled to an operating voltage. An input terminal of the second inverter is coupled to the output terminal of the first inverter and an output terminal of the second inverter is coupled to the control terminal of the first transistor. The output inverter is used to generate a delayed output signal.

Abstract: A novel mask read-only memory is provided. After the mask read-only memory leaves the factory, the mask read-only memory has two types of cell structures. The first type cell structure records a first storing state (e.g. the logic state “1”), and the second type cell structure records a second storing state (the logic state “0”).

Abstract: A semiconductor device and a method for operating the same are provided relating to a nonvolatile memory device for sensing data using resistance change. The semiconductor device comprises a verification read control unit configured to sequentially output verification read data received from a sense amplifier into a global input/output line in response to a test signal, and a read data latch unit configured to store sequentially the verification read data received from the global input output line in response to a latch enable signal in activation of the test signal.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: A data alignment circuit includes: a select transmission unit configured to selectively transmit a first pulse or ground voltage as a first control pulse and selectively transmit a second pulse or ground voltage as a second control pulse, in response to a control signal; and a data latch unit configured to latch data in response to the first and second pulses and the first and second control pulses, and generate first to fourth data.

Abstract: A system on chip (SoC) includes one or more core logic blocks that are configured to operate on a lower supply voltage and a memory array configured to operate on a higher supply voltage. Each bitcell in the memory has two ferroelectric capacitors connected in series between a first plate line and a second plate line to form a node Q. A data bit voltage is transferred to the node Q by activating a write driver to provide the data bit voltage responsive to the lower supply voltage. The data bit voltage is boosted on the node Q by activating a sense amp coupled to node Q of the selected bit cell, such that the sense amp senses the data bit voltage on the node Q and in response increases the data bit voltage on the node Q to the higher supply voltage.

Abstract: A self-timed memory includes a plurality of timer cells each including an access transistor coupled to a true node and having a gate coupled to a reference wordline actuated by a reference wordline driver. Self-timing is effectuated by detecting completion of reference true bitline discharge in the timer cells resulting in enabling a sense amplifier. To better align detected completion of the discharge by the timer cells to a read from actual memory cells at any voltage in the operating voltage range of the memory, the gate to source voltage of the timer cells' access transistors is lowered by decreasing the logic high voltage level applied by the reference wordline. The timer cells may also, or alternatively, have pulldown transistors coupled to the internal true node, wherein a gate terminal of the pulldown is coupled to the reference wordline node and activated with the lowered gate to source voltage.

Abstract: Embodiments of the invention provide a sense amplifier, a SRAM chip comprising the sense amplifier and a method of performing read operation on the SRAM chip. The sense amplifier according to embodiments of the invention comprises an additional driving assist portion, which further takes a global data bus as input, the driving assist portion is configured to enable the sense amplifier to provide assisted driving for other sense amplifiers. With the solution according to embodiments of the invention, driving capability of a sense amplifier on global data bus can be enhanced.

Abstract: Disclosed is an system and method for reading a flash memory cell with an adjusted read level. A current read level is adjusted to a new read level associated with increasing a first error rate to decrease a second error rate. The first error rate is associated with determining that the most significant bit of the flash memory cell is a binary 1 and the second error rate is associated with determining that the most significant bit is a binary 0. On reading the memory cell, a probability value is generated for the most significant bit, the probability being higher if the bit is equivalent to a binary 0 than if the bit is equivalent to a binary 1.

Abstract: A semiconductor device which is capable of high-speed writing with less power consumption and suitable for multi-leveled memory, and verifying operation. A memory cell included in the semiconductor device included a transistor formed using an oxide semiconductor and a transistor formed using a material other than an oxide semiconductor. A variation in threshold value of the memory cells is derived before data of a data buffer is written by using a writing circuit. Data in which the variation in threshold value is compensated with respect to the data of the data buffer is written to the memory cell.

Abstract: A semiconductor device includes at least one memory cell die. The at least one memory cell die includes a data storage unit. The at least one memory cell die includes at least one read assist enabling unit electrically connected to the data storage unit. The at least one read assist enabling unit configured to lower a voltage of a word line. The memory cell die also includes at least one write assist enabling unit electrically connected to the data storage unit. The at least one write assist enabling unit configured to supply a negative voltage to at least one of a bit line or a bit line bar.

Abstract: A variable resistance nonvolatile memory device includes a memory cell array, a memory cell selection circuit, a write circuit, and a read circuit. The read circuit determines that a selected memory cell has a short-circuit fault when a current higher than or equal to a predetermined current passes through the selected memory cell. The write circuit sets another memory cell different from the faulty memory cell and located on at least a bit or word line including the faulty memory cell to a second high resistance state where a resistance value is higher than a resistance value in the first high resistance state, by applying a second high-resistance write pulse to the other memory cell.

Abstract: A nonvolatile memory device is provided, which includes a memory core including a plurality of nonvolatile memory cells, a first read circuit that reads a first codeword from the memory core during a Read While Write (RWW) operation, a second read circuit that reads a second codeword from the memory core during a Read Modification Write (RMW) operation, and a common decoder that is shared by the first read circuit and the second read circuit and selectively decodes the first codeword or the second codeword.

Abstract: According to one embodiment, a non-volatile semiconductor storage device includes a memory cell array, a row decoder, a potential generating circuit, first plural potential selection circuits, a second potential selection circuit, a first discharge circuit, and a second discharge circuit. The first plural potential selection circuits select one of output potentials of the potential generating circuit by receiving a first control signal and apply the selected output potential to a first signal line. The second potential selection circuit applies a potential of the first signal line to a second signal line connected to the row decoder by receiving a second control signal. The first discharge circuit is arranged in the first potential selection circuit. The second discharge circuit is arranged in the second potential selection circuit.

Abstract: This disclosure relates to selectively performing a read with increased accuracy, such as a self-reference read, from a memory. In one aspect, data is read from memory cells, such as magnetoresitive random access memory (MRAM) cells, of a memory array. In response to detecting a condition associated with reading from the memory cells, a self-reference read can be performed from at least one of the memory cells. For instance, the condition can indicate that data read from the memory cells is uncorrectable via decoding of error correction codes (ECC). Selectively performing self-reference reads can reduce power consumption and/or latency associated with reading from the memory compared to always performing self-reference reads.

Abstract: An object is to provide a semiconductor device with a novel structure, which can hold stored data even when power is not supplied and which has an unlimited number of write cycles. The semiconductor device is formed using a memory cell including a wide band gap semiconductor such as an oxide semiconductor. The semiconductor device includes a potential change circuit having a function of outputting a potential lower than a reference potential for reading data from the memory cell. When the wide band gap semiconductor which allows a sufficient reduction in off-state current of a transistor included in the memory cell is used, a semiconductor device which can hold data for a long period can be provided.

Abstract: A local evaluation circuit for a memory array includes first and second NAND gates and first, second, third, and fourth switches. The first switch is configured to couple a first node of the second NAND gate to a first power supply node in response to a first read signal. The second switch is configured to couple a first node of the first NAND gate to the first power supply node in response to a second read signal. The third switch is configured to couple a second node of the first NAND gate to a second power supply node in response to the first read signal. The fourth switch is configured to couple a second node of the second NAND gate to the second power supply node in response to the second read signal.

Abstract: A local evaluation circuit for a memory array includes first and second NAND gates and first, second, third, and fourth switches. The first switch is configured to couple a first node of the second NAND gate to a first power supply node in response to a first read signal. The second switch is configured to couple a first node of the first NAND gate to the first power supply node in response to a second read signal. The third switch is configured to couple a second node of the first NAND gate to a second power supply node in response to the first read signal. The fourth switch is configured to couple a second node of the second NAND gate to the second power supply node in response to the second read signal.

Abstract: Described herein are various principles for designing, manufacturing, and operating integrated circuits having functional components and one or more metal interconnect layers, where the dimensions of signal lines of the metal interconnect layers are larger than dimensions of the functional components. In some embodiments, a signal line may have a width greater than a width of a terminal of a functional component to which the signal line is connected. In some embodiments, two functional components formed in a same functional layer of the integrated circuit may be connected to metal signal lines in different metal interconnect layers. Further, the metal signal lines of the different metal interconnect layers may overlap some distance.

Abstract: A memory cell and method for operating a memory cell including a bidirectional access device and memory element electrically coupled in series. The bidirectional access device includes a tunneling capacitance. The memory element programmable to a first and second state by application of a first and second write voltage opposite in polarity to one another. The memory element has a lower capacitance in the first state than the second state. A read unit senses a transient read current due to a voltage drop upon application of a read voltage. Determining if the memory element is the first or second state is based on whether the read current is greater or less than a sense threshold. The sense threshold is based on a capacitance ratio between the first and second state.

Abstract: Controllable readout circuit for performing a self-referenced read operation on a memory device comprising a plurality of magnetic random access memory (MRAM) cells comprising a selecting device for selecting one of the MRAM cells, and a sense circuit for sourcing a sense current to measure the first and second resistance value; the sense circuit comprising a sample and hold circuit for performing said storing said first resistance value, and a differential amplifier circuit for performing said comparing the second resistance value to the stored first resistance value; wherein the controllable readout circuit further comprises a control circuit adapted to provide a pulse-shaped timing signal with a pulse duration controlling the duration of the first read cycle and the second read cycle. The controllable readout circuit allows for controlling the duration of the first and second read cycles after completion of the MRAM cell and readout circuit fabrication.

Abstract: A semiconductor memory includes a word line driver and a negative voltage generator. The word line driver includes a first inverter configured to drive a word line at one of a first voltage supplied by a first voltage source and a second voltage supplied by a second voltage source. The negative voltage generator is configured to provide a negative voltage with respect to the second voltage to an input of the first inverter in response to a control signal for performing at least one of a read or a write operation of a memory bit cell coupled to the word line.

Abstract: A method includes reading a group of analog memory cells using first explicit read thresholds, to produce first readout results. The group is re-read using second explicit read thresholds, to produce second readout results. The group is read using one or more sets of auxiliary thresholds so as to produce auxiliary readout results, such that the number of the auxiliary thresholds in each set is the same as the number of the first explicit read thresholds and the same as the number of the second explicit read thresholds. A readout performance of third read thresholds, which include at least one of the first explicit read thresholds and at least one of the second explicit read thresholds, is evaluated using the first, second and auxiliary readout results.

Abstract: Provided is a semiconductor integrated circuit including: an anti-fuse element that electrically connects a first node and a first power supply terminal when data is written and electrically disconnect the first node and the first power supply terminal when data is not written; a first switch circuit that is connected between the first node and a first data line applied with a predetermine first voltage, and enters an off state from an on state according to a first control signal; and a detection part that detects write data of the anti-fuse element according to whether a voltage of the first node is substantially the same as the first voltage or substantially the same as a supply voltage of the first power supply terminal when the first switch circuit enters the off state.

Abstract: A Static Random Access Memory (SRAM) cell includes a first long boundary and a second long boundary parallel to a first direction, and a first short boundary and a second short boundary parallel to a second direction perpendicular to the first direction. The first and the second long boundaries are longer than, and form a rectangle with, the first and the second short boundaries. A CVss line carrying a VSS power supply voltage crosses the first long boundary and the second long boundary. The CVss line is parallel to the second direction. A bit-line and a bit-line bar are on opposite sides of the CVss line. The bit-line and the bit-line bar are configured to carry complementary bit-line signals.

Abstract: A memory array includes a memory segment having at least one memory bank. The at least one memory bank includes an array of memory cells, and wherein at least two first read tracking cells are disposed in a read tracking column of the at least one memory bank. The memory array further includes a read tracking circuit coupled to the at least two first read tracking cells. Outputs of the at least two first read tracking cells are connected to a tracking bit connection line (TBCL). A tracking circuit connected to the TBCL is configured to output a tracking-cells output signal to generate a global tracking result signal to a memory control circuitry. The memory control circuitry is configured to reset a memory clock based on the global tracking result signal.

Abstract: A circuit includes one or more memory cells, a data line associated with the one or more memory cells, one or more reference cells, a reference data line associated with the one or more reference cells, a first circuit coupled to the reference data line and the data line, and a second circuit. The first circuit is configured to output a first logical value based on a voltage level of the data line upon occurrence of a voltage level of the reference data line reaching a trip point. The second circuit is configured to output a second logical value based on the voltage level on the data line prior to the occurrence of the voltage level of the reference data line reaching the trip point, and to output the first logical value after the occurrence of the voltage level of the reference data line reaching the trip point.

Abstract: A data storage circuit for receiving and holding a data value includes an input stage configured to receive a data value in response to the precharge phase changing to an evaluation phase and to hold the data value during the evaluation phase. An output stage has an output latching element for holding the value, two switching devices for updating the output latching element and an output. The switching devices each being controlled by respective signals from dual data lines, wherein, in response to the data value held in the input stage being a logical one, the first switching device updates the output latching element with a value indicative of the logical one and in response to the data value held in the input stage being a logical zero, the second switching device updates the output latching element with a value indicative of the logical zero.

Abstract: A memory cell and method for operating a memory cell including a bidirectional access device and memory element electrically coupled in series. The bidirectional access device includes a tunneling capacitance. The memory element programmable to a first and second state by application of a first and second write voltage opposite in polarity to one another. The memory element has a lower capacitance in the first state than the second state. A read unit senses a transient read current due to a voltage drop upon application of a read voltage. Determining if the memory element is the first or second state is based on whether the read current is greater or less than a sense threshold. The sense threshold is based on a capacitance ratio between the first and second state.

Abstract: An electronic device comprising a semiconductor memory unit that may include a plurality of data transfer lines; a plurality of columns including a plurality of memory cells; at least one redundancy column including a plurality of redundancy memory cells and configured to replace at least one column among the plurality of columns; a repair select information generation unit configured to store a column address of the at least one column to be replaced among the plurality of columns and generate a plurality of repair select information in response to the stored column address; and a plurality of repair selection units connected with data transfer lines corresponding to them among the plurality of data transfer lines, columns corresponding to them among the plurality of columns and the at least one redundancy column, and each configured to electrically connect a column selected among a column corresponding to it and the at least one redundancy column, to a data transfer line corresponding to it, in response to

Abstract: Sense amplifiers, memories, and apparatuses and methods for sensing a data state of a memory cell are disclosed. An example apparatus includes a differential amplifier configured to amplify a voltage difference between voltages applied to first and second amplifier input nodes to provide an output. The example apparatus further includes first and second capacitances coupled to the first and second amplifier input nodes. A switch block coupled to the first and second capacitances is configured to couple during a first phase a reference input node to the first and second capacitances and to the first amplifier input node. The switch block is further configured to couple during the first phase an output of the amplifier to the second amplifier input node to establish a compensation condition. During a second phase, the switch block couples its input nodes to the first and second capacitances.

Abstract: A semiconductor memory system can include a memory device having a memory cell array that includes a plurality of memory cells. A memory controller can be configured to perform domain transformation on data written to and/or read from the plurality of memory cells to provide domain-transformed data and configured to perform signal processing on the domain-transformed data to output processed data or a control signal.

Abstract: An analog read circuit measures the resistance of each of a plurality of bits in an array of resistive memory elements. Data stored within a latch determines whether to selectively enable the analog read circuit. In an alternate embodiment, a sense amplifier is coupled to the latch and the array, and the data stored in the latch determines whether to selectively enable the sense amplifier.

Abstract: A memory system supports high-performance and low-power modes. The memory system includes a memory core and a core interface. The memory core employs core supply voltages that remain the same in both modes. Supply voltages and signaling rates for the core interface may be scaled down to save power. Level shifters between the memory core and core interface level shift signals as needed to accommodate the signaling voltages used by the core interface in the different modes.

Abstract: A data read start decision device includes: a storing circuit configured to store code key data; a read check circuit configured to output a read start signal in response to code key data read from the storing circuit, and a controller configured to start reading environment setting data from the storing circuit in response to the read start signal. The read check circuit is configured to at least one of: receive the read start signal from the controller and transfer the read start signal to the controller in response to the read code key data; and generate the read start signal based on the read code key data and output the read start signal to the controller.

Abstract: A static RAM includes a plurality of word lines, a plurality of global bit line pairs, a plurality of static-type memory cells, a plurality of sense amplifiers, a plurality of local bit line pairs provided in correspondence with each global bit line pair, and a plurality of global switches, wherein the plurality of static-type memory cells is connected to the corresponding local bit line pair in response to a row selection signal, and at the time of read, the row selection signal is applied to the word line and after the corresponding local bit line pair is brought into a state corresponding to contents stored in the memory cell, application of the row selection signal is stopped and then the corresponding global switch is brought into a connection state and after changing the state of the global bit line pair, the corresponding sense amplifier is operated.

Abstract: A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and outputting a current with said current mirror.