Abstract: An input/output (I/O) line sense amplifier includes a buffer unit, a sense amplifier, and a precharge unit. The buffer unit is driven by a first level voltage to buffer a strobe signal, and the sense amplifier is driven by a second level voltage to amplify a signal of an I/O line in response to an output signal of the buffer unit. The precharge unit is driven by the first level voltage to precharge an output signal of the sense amplifier in response to the output signal of the buffer unit.

Abstract: A semiconductor memory device can stabilize a voltage level of a normal driving voltage terminal in a normal driving operation, which is performed after an overdriving operation, even when an overdriving voltage is unstable due to environmental factors of the semiconductor memory device in the overdriving operation. The semiconductor memory device includes a bit line sense amplifier for performing an amplification operation using a normal driving voltage or an overdriving voltage to sense and amplify data applied to bit lines, a normal driving voltage compensator configured to drive a normal driving voltage terminal according to a voltage level of the normal driving voltage terminal and target normal driving voltage levels, and a discharge enable signal generator configured to generate a discharge enable signal by adjusting an activation period of the discharge enable signal according to the overdriving voltage.

Abstract: A sense amplifier having an amplifier stage with decreased gain is described. The sense amplifier includes a first input/output (“I/O”) node and a second complementary I/O node. The sense amplifier includes two amplifier stages, each for amplifying a signal on one of the I/O nodes. The first amplifier stage, having a first conductivity-type, amplifies one of the I/O node towards a first voltage. The second amplifier stage, having a second conductivity-type, amplifies the other I/O node towards a second voltage. The sense amplifier also includes a resistance circuit coupled to the second amplifier stage to reduce the gain of the second amplifier stage thereby reducing the rate of amplification of the signal on the corresponding I/O node.

Abstract: A memory array and computer program product for operating a memory cell and memory array. An embodiment of the invention entails receiving a binary value to be stored by a memory cell. A determining operation determines a target discharge time corresponding to the binary value. The target discharge time being the time needed to discharge a pre-charged circuit through the said memory cell to a predetermined level. A storing operation stores a characteristic parameter in the memory cell such that an electron discharge time through an electronic circuit formed, at least partially, by the memory cell, is substantially equal to the target discharge time.

Abstract: One or more external control pins and/or addressing pins on a memory device are used to set one or both of a burst length and burst type of the memory device.

Abstract: A semiconductor memory apparatus includes: a cell region having a plurality of unit cells each of which has a switching MOS transistor for transferring data. A peripheral circuit unit accesses data stored in the unit cell. A threshold voltage control unit controls the threshold voltage of the switching MOS transistor.

Abstract: A semiconductor according to an embodiment of the invention has a supply voltage generator circuit generating a supply voltage based on a received radio signal, a voltage detector circuit detecting a reference voltage dependent on the supply voltage, a memory circuit storing data, and a control circuit executing write operation to the memory circuit according to a reference voltage detected by the voltage detector circuit.

Abstract: A device and corresponding method of using a temperature dependent bias generator to generate a voltage that is applied to a control gate of a sense amplifier is disclosed. By applying the temperature dependent bias signal to the sense amplifier, a substantially temperature independent disclosing time can be achieved at a sense node of a sense amplifier.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: A method for operating a memory cell and memory array. The method of memory cell operation entails receiving a request to read a binary value stored in the memory cell. A pre-charging operation pre-charges a bit-line capacitor in an electronic circuit formed by the memory cell to a pre-charge voltage. A word-line in the electronic circuit is then activated. A discharging operation discharges the bit-line capacitor through the said memory cell in the electronic circuit to the word-line. Additionally, an electron discharge time measurement is started when the word-line is activated. The electron discharge time measurement is stopped when the voltage level in the bit-line falls below a pre-defined reference voltage. A determining operation determines the binary value from the measured electron discharge time.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: Systems and methods for accessing data in a memory, where a register is provided to temporarily store data from a write operation and to make the data available for read operations that are performed immediately following the write operation and are directed to the same data. In one embodiment, a memory system includes an array of a first type of memory cells and a register having cells of a second type. The second type of cells is designed to stabilize data more quickly than the first type. Data is written concurrently into the memory array and the register. When a read operation is directed to the location of an immediately preceding write operation, the data is read from the register. When a read operation is directed to a location that is not coincident with an immediately preceding write operation, the data is read from the memory array.

Abstract: Systems and/or methods that facilitate accessing data in a memory are presented. The memory can be flash memory that includes a plurality of sectors in an array that can be associated with a decoder component that includes a regulator component, which facilitates performing read operations within a desired period of time. Each sector can be associated with a decoder subcomponent and associated regulator subcomponent. Parasitic resistance and capacitance elements can increase the further in distance a sector and associated decoder component are from a booster component, which is utilized to increase the voltage at a boost-strap node within each decoder subcomponent to facilitate performing read operations. To counter the parasitic elements, each regulator subcomponent can include one or more capacitors, where the number of capacitors and total capacitance value can be determined based on the distance the associated decoder subcomponent is from the booster component.

Abstract: A semiconductor memory device includes: a semiconductor layer provided on an insulating substrate or an insulating layer; active areas each defined in the semiconductor layer with a device insulating film buried therein; and NAND cell units formed on the active areas, each NAND cell unit including a plurality of electrically rewritable and non-volatile memory cells connected in series, both ends of each NAND cell unit being coupled to a source line and a bit line, wherein the device has such a carrier discharging mode as to discharge channel carriers in the NAND cell unit to at least one of the source line and the bit line.

Abstract: A memory device operates according to a method for reading includes pre-charging a first set of selected bit lines to a pre-charge voltage and sensing data from the cells coupled to the first set of selected bit lines. Then, residual charge is transferred from the first set of selected bit lines to corresponding members of a second set of selected bit lines. The second set of selected bit lines, having an initial charge transferred from the first set, is then pre-charged to the pre-charge voltage. The data from the cells coupled to the second set of selected bit lines it is then sensed. In embodiments described herein, the read operation occurs in a burst read mode, where a volume of data having consecutive addresses is read.

Abstract: A semiconductor memory is disclosed, which comprises a plurality of memory cells, at least one high voltage power supply (CVDD) line coupled to the plurality of memory cells for supplying power to the same, and at least one controllable discharging circuit coupled between the CVDD line and a complementary low voltage power supply (ground), wherein only during a write operation the controllable discharging circuit is turned on for discharging the CVDD line.

Abstract: Exemplary embodiments of the present invention provide a flash memory device which includes a memory cell array. A decoder circuit is connected to the memory cell array via a plurality of select lines and a plurality of word lines. The detector circuit supplies voltages for a read operation to the plurality of select lines and the plurality of word lines during the read operation. A word line discharge unit is connected to the memory cell array via the plurality of word lines. The word line discharge unit discharges a voltage level of a selected word line during the read operation.

Abstract: A NAND EEPROM having a shielded bit line architecture reduces supply voltage and ground noise resulting from charging or discharging bit lines. The EEPROM has a PMOS pull-up transistor and an NMOS pull down transistor connected to a virtual power node. A control circuit for charging or discharging bit lines controls the gate voltage of the PMOS or NMOS transistor to limit peak current when charging or discharging bit lines via the virtual power node. In particular, the control circuit operates the PMOS or NMOS transistor in a non-saturation mode to limit current. One such control circuit creates a current mirror or applies a reference voltage to control gate voltages. A programming method sets up bit lines by pre-charging unselected bit lines via the PMOS pull-up transistor having controlled gate voltage while latches in the programming circuitry charge or discharge selected bit lines according to respective data bits being stored. Another bit line setup includes two stages.

Abstract: A memory erase management system is provided, including providing a resistive change memory cell, coupling a first line to the resistive change memory cell, coupling a line buffer to the first line, providing a charge storage device coupled to the line buffer, and performing a single pulse erase of the resistive change memory cell by discharging a current from the charge storage device through the resistive change memory cell.

Abstract: In memory array of a memory circuit, a discharging module and an auxiliary module are disposed on each column line. While accessing an objective memory unit on a column line of the memory, the memory unit discharges the corresponding row line of the objective memory unit according to a discharging signal and a column selective signal. When the objective memory unit is enabled, the voltage level of the corresponding column line is changed, if the voltage level reaches a threshold voltage level, the auxiliary module enhances the increment of the voltage level of the column line.

Abstract: A switched capacitor sense amplifier includes capacitively coupled input, feedback, and reset paths to provide immunity to the mismatches in transistor characteristics and offsets. The sense amplifier includes a cross-coupled pair of inverters with capacitors absorbing offset voltages developed as effects of the mismatches. When used in a dynamic random access memory (DRAM) device, this immunity to the mismatches and offsets allows the sense amplifier to reliably detect and refresh small signals.

Abstract: A switched capacitor sense amplifier includes capacitively coupled input, feedback, and reset paths to provide immunity to the mismatches in transistor characteristics and offsets. The sense amplifier includes a cross-coupled pair of inverters with capacitors absorbing offset voltages developed as effects of the mismatches. When used in a dynamic random access memory (DRAM) device, this immunity to the mismatches and offsets allows the sense amplifier to reliably detect and refresh small signals.

Abstract: A method supplies voltage to a bit line of a memory device. The method includes precharging, with a precharging device, the bit line to an output potential, deactivating the precharging device during a read action related to the bit line, reading, during the read action, an information via the bit line, and routing, during the read action, a virtual voltage supply line to a supply potential of the memory device to supply voltage to memory cells of the memory device assigned to the bit line. The precharging device of the bit line is activated/deactivated as a function of the potential of the virtual voltage supply line.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array of a plurality of memory cells; and a voltage generating circuit for generating a programming voltage to be applied to the memory cells. The voltage generating circuit includes a first voltage generating unit for generating a negative voltage through a first charge pump; and a second voltage generating unit for generating a positive voltage through a second charge pump. During an accelerated programming operation, the first voltage generating unit increases a pumping efficiency of the first charge pump using an external power supply voltage, and the second voltage generating unit directly outputs the external power supply voltage.

Abstract: Circuits for writing, reading, and erasing a programmable metallization cell are disclosed. The programming circuits compensate for parasitic capacitance and/or parasitic resistance. The parasitic resistance and/or capacitance is compensated for using a feedback loop or a time current filter. Various circuits also measure a switching speed of the programmable metallization cell.

Abstract: An apparatus and method for transferring a signal from a first bus circuit to a second bus circuit. The apparatus and method includes a first constant current circuit connected to the first bus circuit, a first capacitor connected between the first bus circuit and the first constant current circuit, a second constant current circuit connected to the second bus circuit, a second capacitor connected between the second bus circuit and the second constant current circuit, and an opto-coupler connected between the first and second constant current circuits and providing signal transfer control from the first capacitor to the second capacitor.

Abstract: A semiconductor memory device includes: a semiconductor layer provided on an insulating substrate or an insulating layer; active areas each defined in the semiconductor layer with a device insulating film buried therein; and NAND cell units formed on the active areas, each NAND cell unit including a plurality of electrically rewritable and non-volatile memory cells connected in series, both ends of each NAND cell unit being coupled to a source line and a bit line, wherein the device has such a carrier discharging mode as to discharge channel carriers in the NAND cell unit to at least one of the source line and the bit line.

Abstract: A semiconductor memory device includes a memory cell array, a charge circuit which compensates for OFF leakage current developed at selected bit lines, a reset circuit having a ground potential corresponding to a potential at non-selected bit lines, a read circuit constituted by a plurality of transistors whose gates are connected to the bit lines, and a bit line precharge circuit which charges the selected bit lines for a fixed time period. As a result of adopting such a configuration, there is no need to provide a transmission gate, such as a column decoder, to a charging path between the read circuit and the bit lines, so that a low-power supply voltage operation can be effected without the influence of a substrate bias effect.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: Methods and apparatus to control voltage output of a write assist circuit are disclosed. An example method includes regulating pull down voltage from a write assist circuit having a write assist capacitor coupled to a discharge node coupled to a bit line. The write assist circuit further includes a transistor to receive an enable signal to couple the bit line to a low voltage rail. A voltage source is provided to charge the capacitor. The voltage produced by the voltage source is limited to limit the pull down voltage at the discharge node from the write assist capacitor.

Abstract: In one aspect, a non-volatile memory device is provided which is operable in a programming mode and a read mode. The memory device includes a memory cell array which includes a plurality of non-volatile memory cells, a plurality of word lines, and a plurality of bit lines. The memory device further includes an internal data output line for outputting data read from the bit lines of the memory array, and a page buffer operatively connected between a bit line of the memory cell array and the internal data output line. The page buffer includes a sense node which is selectively connected to the bit line, a latch circuit having a latch node which is selectively connected to the sense node, a latch input path which sets a logic voltage of the latch node in the programming mode and the read mode, and a latch output path which is separate from the latch input path and which sets as logic voltage of the internal date output line according to the logic voltage of the latch node.

Abstract: A sensing module operates with a sense amplifier sensing a conduction current of a memory cell via a coupled bit line under constant voltage condition in order to minimize bit-line to bit-line coupling. The rate of discharge of a dedicated capacitor as measured by a change in the voltage drop thereacross in a predetermined period is used to indicate the magnitude of the conduction current. The voltage cannot drop below a minimum level imposed by a circuit for maintaining the constant voltage condition on the bit line. A voltage shifter is used to boost the voltage during the discharge and to unboost the voltage after the discharge, so that the change in voltage drop properly reflects the rate of discharge without running into the minimum level.

Abstract: An auxiliary voltage generation circuit is part of a high voltage generation and regulation circuit. The auxiliary voltage generation circuit generates an auxiliary intermediate voltage that is coupled to a negative level shifting circuit to reduce the drain-source stress experienced by transistors in that circuit that are in an off state. The auxiliary voltage generation circuit also generates a logic control signal that indicates to a high voltage discharge path to perform either a slow discharge operation or a fast discharge operation.

Abstract: Exemplary embodiments of the present invention provide a flash memory device which includes a memory cell array. A decoder circuit is connected to the memory cell array via a plurality of select lines and a plurality of word lines. The detector circuit supplies voltages for a read operation to the plurality of select lines and the plurality of word lines during the read operation. A word line discharge unit is connected to the memory cell array via the plurality of word lines. The word line discharge unit discharges a voltage level of a selected word line during the read operation.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a memory matrix having a plurality of memory cells arranged according to a plurality of rows and a plurality of columns and a plurality of bit lines, each bit line being associated with at least one respective column of said plurality. The semiconductor memory device further includes a bit line selection structure for selecting at least one among said bit lines and a voltage clamping circuit structure adapted to cause the clamping at a prescribed voltage of unselected bit lines adjacent and capacitively coupled to a selected bit line during a read operation.

Abstract: An apparatus and method for operating a sense amplifier connecting/disconnecting circuit arrangement, in particular for a semiconductor memory device, including a switching device for connecting/disconnecting a sense amplifier to/from a bit line of a first cell field region, and for connecting/disconnecting the sense amplifier to/from from a bit line of a second cell field region, as a function of the state of control signals applied at control lines. Driver devices drive the control signal. Additional switches change the state of the control signals.

Abstract: Structures, systems and methods for memory cells utilizing trench bit lines formed within a buried layer are provided. A memory cell is formed in a triple well structure that includes a substrate, the buried layer, and an epitaxial layer. The substrate, buried layer, and epitaxial layer include voltage contacts that allow for the wells to be biased to a dc voltage level. The memory cell includes a transistor which is formed on the epitaxial layer, the transistor including a source and drain region separated by a channel region. The trench bit line is formed within the buried layer, and is coupled to the drain region of the transistor by a bit contact.

Abstract: A method and apparatus for charging large capacitances of a circuit, such as an integrated circuit, without imparting noise on an operating voltage. A comparator compares a reference voltage to a voltage representing the voltage on the capacitance and a multiplexer routes one of an external voltage or an operating voltage derived from said external voltage to charge the capacitance depending on the output of the comparator.

Abstract: A sensing circuit including a sense amplifier to resolve a data signal generated by a memory cell is disclosed herein. The sensing circuit includes a bit line to receive the data signal, a first pre-charge device coupled to the bit line and configured to pre-charge the bit line, a device for providing a bias coupled to the bit line and configured to provide a bias to the bit line, and a reference node configured to be at least one pre-determined level. In one embodiment the pre-determined level is equal to a low potential such as ground and in another embodiment equal to a high potential such as VDD. One or more switching devices allows for the activation or deactivation of the pre-charge device allowing to pre-charge the bit line to a certain potential and the sensing circuit quickly and accurately determines whether a logical state of ‘1’ or ‘0’ is being applied to the bit line.

Abstract: A memory includes a selected bitline coupled to the array of memory cells. A column voltage booster produces a boosted column enable signal. A column multiplexer passes a signal on the selected bitline as a sense amplifier input in response to the boosted column enable signal. A sense amplifier produces a data output.

Abstract: An internal voltage generator for generating a back bias voltage includes a back bias voltage pumping block for comparing a reference voltage with a feedback back bias voltage to generate a back bias enable signal and the back bias voltage in response to an activated self refresh signal and a back bias voltage discharge controlling unit for discharging the back bias voltage into a ground voltage in response to the activated self refresh signal and the back bias enable signal.

Abstract: A semiconductor memory device has a memory cell array in which a plurality of nonvolatile memory cells are arranged. The memory device also has word lines, bit lines connected with the memory cells by a virtual grounding scheme, a row decoder, shift registers, a write voltage control circuit for controlling voltages to be applied to bit lines, and a write voltage applying circuit for applying voltages to the bit lines. The write voltage control circuit controls the write voltage applying circuit such that when writing data 1 to a memory cell, different voltages V0 and VP are applied to two bit lines associated with the memory cell, while a same voltage V0 or VP is applied to the two bit lines when writing data 0 to the memory cell.

Abstract: The present invention provides a method for eliminating crosstalk (coupling noise) in a metal programmable read only memory. The metal programmable read only memory comprises a plurality of bit lines, a plurality of word lines, a plurality of precharge transistors, and a plurality of clamp transistors. When one of the bit lines is selected, bit lines adjacent to the selected bit line are fixed to a voltage value (VDD, GND or other voltages) by the clamp transistors. The clamping method can not cause voltage drops to the adjacent bit lines, and the crosstalk on the selected bit line can be eliminated simultaneously, so that the problem of read failures caused by the crosstalk in the high-speed metal programmable read only memory can be solved, and a higher speed can be reached.

Abstract: A semiconductor memory device includes memory cells, a memory cell array, word lines, a first charge pump circuit, and a discharge circuit. The memory cell has a first MOS transistor with a stacked gate including a floating gate and a control gate. The memory cell array includes the memory cells arranged in a matrix. The word line connects commonly the control gates of the first MOS transistors in a same row. The first charge pump circuit is activated and generates a first voltage in a write operation and erase operation. The first voltage is supplied with either the well region or the word lines. The discharge circuit, when the first charge pump circuit is deactivated, discharges the charge generated by the first charge pump circuit to ground or to a power-supply potential, while causing current to flow to an output node of the first voltage.

Abstract: A method, system, and circuit for performing a memory related operation are disclosed. An operating voltage is applied to a bitline and a neighboring bitline is precharged. The precharge voltage has a magnitude less than the operating voltage. Both voltages ramp up at like or different rates. The precharge voltage can reach its effective magnitude prior to or with the operating voltage reaching its effective value.

Abstract: A semiconductor memory device in which only global I/O buses, which receive one or more data groups that must be output first among a N number of data groups that are prefetched in a N-bit prefetch type, from an array of memory cells are precharged with a ½ power supply voltage, thereby making the output speed of the data groups that must be output first thing faster than that of the remaining data groups. The semiconductor memory device includes a data bus controller for precharging predetermined data buses that receive one or more data group that must be output to the outside first among a N number of data groups that are prefetched in a N-bit prefetch type from an array of memory cells, using information to decide an I/O sequence of the N number of the data groups.

Abstract: A fast pre-charge circuit and method of providing a fast pre-charge for an integrated circuit memory device is disclosed. The fast pre-charge circuit comprises an address calculating unit and a multi-power driver. The address calculating unit detects the sector distance from driver of the integrated circuit memory device, and the driver provides a voltage to the loading of the integrated circuit memory device based on an output of the address calculating unit. Unlike a conventional fixed-power wordline driver, the driver of the present invention provides multiple voltage levels to the wordline or dynamically adjusts for different loading situations.

Abstract: A memory device includes a sense amplifier circuit, a tri-state buffer, a data latch circuit and a data line. The sense amplifier circuit senses and amplifies a current of a memory cell. The tri-state buffer receives an output of the sense amplifier circuit. The data latch circuit latches an output of the tri-state buffer. The data line connects the tri-state buffer and the data latch circuit. The memory device removes charge on the data line using a latch enable signal, which is applied to the tri-state buffer before a read operation.

Abstract: Charge pump and discharge circuitry for a non-volatile memory device that splits up the discharge operation into two discharge periods. In a first discharge period, the voltage being discharged (e.g., erase voltage) is discharged through a pair of discharge transistors until the discharging voltage reaches a first voltage level. The path through the pair of discharge transistors is controlled by an intermediate control voltage so that none of the transistors of the pair enter the snapback condition. In the second discharge period, the remaining discharging voltage is fully discharged from the first level through a third discharge transistor.

Abstract: The invention includes an apparatus and method of selecting memory cells within a memory array. The method includes receiving a memory cell address. A column address and a row address are generated from the memory cell address. Row select lines or column select lines are pre-charged. A self-timed charging circuit is initiated to provide an adequate amount of time to charge a selected row, and to initiate elimination of static current flowing to unselected rows after a self-timed delay. The other of the row select lines or the column select lines are then pre-charged. Memory cells are selected based upon the column address and the row address. One of two states of the memory cells can be based upon sensing threshold voltages of sense lines that correspond with the selected memory cells.