Abstract: A circuit comprises a control line and a two terminal semiconductor device having a first terminal is coupled to a signal line, and a second terminal coupled to the control line. The semiconductor device has a capacitance when a voltage on the first terminal is above a threshold and has a smaller capacitance when a voltage on the first terminal is below the threshold. A signal is placed on the signal line and a voltage on the control line is modified. When the signal falls below the threshold, the semiconductor device acts as a very small capacitor and the output will be a small value. When the signal is above the threshold, the semiconductor device acts as a large capacitor and the output will be influenced by the signal and the modified voltage on the control line and the signal is amplified.

Abstract: A semiconductor integrated circuit device includes a first signal line and a second signal line, and a sense amplifier that includes a plurality of PMOS transistors and a plurality of NMOS transistors. The sense amplifier is configured to sense amplify a potential difference between the first signal line and the second signal line. The junction regions of the NMOS and PMOS transistors having the same conductivity type, and to which the same signal is applied, are formed in one integrated active region.

Abstract: A sense amplifier circuit for a nonvolatile memory that includes a first amplifier to perform a switching operation to output a first signal on a sense amplifier based logic (SABL) node depending on the state of a sensing enable signal, a second amplifier to perform a switching operation to output a second signal on the SABL node depending on the state of the sensing enable signal, a current mirror that sinks current on the SABL node depending on the sensing enable signal and a bit line signal, and an inverter arranged to output the signal on the SABL node as a data signal.

Abstract: In embodiments of the invention, a memory circuit includes a static random access memory (SRAM), rows of M sense amplifiers, a global read precharge tracking control circuit controlling a precharge of global read lines, a sense amplifier output tracking circuit generating a reset sense amplifier signal for the sense amplifier control circuits, and a read delay circuit generating a trigger signal for the global read precharge tracking control circuit and the sense amplifier output tracking circuit and performing a fixed delay tracking of a read operation in a read cycle. A dummy global read line is coupled to the global read precharge tracking control circuit and returns from a half way to the top of the SRAM forming a tracking dummy global read line that determines a completion of the precharge of the global read lines before the sense amplifiers start discharging the global read lines in the read cycle.

Abstract: A memory device uses a global input/output line or a pair of complementary global input/output lines to couple write data signals and read data signals to and from a memory array. The same input/output line or pairs of complementary global input/output lines may be used for coupling both write data signals and read data signals.

Abstract: A method for storing data. The method includes providing an addressable memory including a memory space, wherein the memory space includes a plurality of memory cells. The method includes configuring the addressable memory such that a majority of the plurality of memory cells in the memory space stores internal data values in a preferred bias condition when a first external data state of one or more external data states is written to the memory space, wherein the first external data state is opposite the preferred bias condition.

Abstract: A semiconductor memory device including an open bit line structure is disclosed. The semiconductor memory device including an open bit line structure includes a first mat, a second mat contiguous to the first mat, a first sense amplifier coupled to a first bit line of the first mat, a second sense amplifier coupled to a second bit line of the first mat and a third bit line of the second mat, a third sense amplifier coupled to a fourth bit line of the second mat, and a plurality of bit line precharge voltage providers for varying a level of a bit line precharge voltage provided to the first, second, and third sense amplifiers, selectively providing the resultant bit line precharge voltage level, and providing the same voltage as that of data of a selected cell to a non-selected sense amplifier during a read operation.

Abstract: A memory device includes a plurality of sense amplifiers, an array of memory cells including a first subset of memory cells, and a plurality of word lines. Each word line is coupled to each memory cell in a respective row of the memory cells and each row of the memory cells includes one memory cell of the first subset of memory cells. Each of a plurality of control word lines is coupled to a respective one of the memory cells in the first subset of memory cells and each of the memory cells in the first subset of memory cells generates a sense amplifier control signal coupled to control operation of a respective one of the plurality of sense amplifiers.

Abstract: A memory circuit to reduce active power is disclosed (FIG. 7). The circuit includes a sense amplifier (600). A first bit line (BL) is coupled to a memory array. A second bit line (BLB) that is a complementary bit line to the first bit line is also coupled to the memory array. A first transistor (TG) is coupled between the first bit line (BL) and the sense amplifier. A second transistor (TG) is coupled between the second bit line (BLB) and the sense amplifier. A first drive circuit (700) is coupled between the sense amplifier and the first bit line and is operable to drive a first data signal from the sense amplifier onto the first bit line when the second transistor is off.

Abstract: Disclosed herein is a semiconductor device comprising complementary pair of bit lines, memory cells connected to the bit lines, dummy cells having the same structure as the memory cells, a differential sense amplifier, an equalizing circuit equalizing potentials of the bit lines, and a control circuit. The memory cells are disconnected from the bit lines and the dummy cells are connected to the bit lines, and subsequently the bit lines are equalized by the equalizing circuit. When accessing a selected memory cell, the equalizing circuit is inactivated, a corresponding dummy cell is disconnected from the bit line, and subsequently the selected memory cell is connected to the bit line. Thereafter, the sense amplifier is activated so that potentials of the bit lines are amplified respectively.

Abstract: A sense amplifier comprises a cross coupled pair of inverters, a first transistor, a second transistor, and a capacitive device. The cross coupled pair of inverters includes a first end, a second end, and a third end. The first end is configured to receive a first supply voltage. The second end is coupled with a first terminal of the capacitive device and a first terminal of the first transistor. The third end is coupled with a second terminal of the capacitive device and a first terminal of the second transistor. A second terminal of the first transistor and a second terminal of the second transistor are coupled together and are configured to receive a first control signal. A third terminal of the first transistor and a third terminal of the second transistor are coupled together and are configured to receive a second supply voltage different from the first supply voltage.

Abstract: A sense amplifier circuit is divided into a plurality of sense amplifier groups. The plurality of sense amplifier groups are each further divided into a plurality of sense units. A sense amplifier control circuit is configured to sequentially select the plurality of sense amplifier groups according to a physical address, and to sequentially select the plurality of sense units included in a selected sense amplifier group. The sense amplifier control circuit is configured to, when there is a defect related to a selected sense unit in a selected first sense amplifier group, select, in place of the first sense amplifier group, a sense unit included in a second sense amplifier group selected following after the first sense amplifier group.

Abstract: Described embodiments provide a memory having at least one sense amplifier. The sense amplifier has a first capacitor, an inverting amplifier, a switch, an amplifier, and a second capacitor. The first capacitor is coupled between the input of the sense amplifier and a first node. The inverting amplifier has an input coupled to the first node and an output coupled to an internal node and the switch is coupled between the input and output of the inverting amplifier. The amplifier has an input coupled to the internal node and an output coupled to an output of the sense amplifier and the second capacitor is coupled between the internal node and a control node. When data is to be read from the memory, the second capacitor forces a small voltage reduction onto the intermediate node, helping the sense amplifier resolve the data value stored in the memory cell.

Abstract: Provided is a bit line sense amplifier source node control circuit of a semiconductor memory device. The sense amplifier source node control circuit may include a source driver connected between a source node of a sense amplifier and a sense amplifier driving signal line, for driving the source node of the sense amplifier to a set voltage level. The sense amplifier source node control circuit may also include: a floating circuit for floating the sense amplifier driving signal line in a set operating mode; and a controller connected in parallel with the source driver between the source node of the sense amplifier and the sense amplifier driving signal line, for controlling a level of the sense amplifier driving signal line in the set operating mode.

Abstract: Embodiments of a memory are disclosed that may reduce the likelihood of a miss-read while reading a weak data storage cell. The memory may include a number of data storage cells, a column multiplexer, a first sense amplifier and a second sense amplifier, and an output circuit. The gain level of the first sense amplifier may be higher than the gain level of the second sense amplifier. The output circuit may include a multiplexer and the multiplexer may be operable to controllably select one of the outputs of the first and second sense amplifiers and pass the value of the selected sense amplifier. The output circuit may include a node that couples the outputs of the first and second sense amplifiers and the outputs of the first and second sense amplifiers may be able to be set to a high impedance state.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A semiconductor memory device includes a switching unit coupled between a local sense amplifier and a bit line sense amplifier and configured to be turned on in response to a switching signal which is enabled in synchronization with an enable signal for enabling the local sense amplifier and disabled at a time point where a preset period passes after a first power for enabling the bit line sense amplifier is precharged.

Abstract: A static random-access memory (SRAM) module includes a column select (RSEL) driver coupled to an input/output (I/O) circuit by an RSEL line. The I/O circuit is configured to read bit line signals from a bit cell within the SRAM module. During a read operation, the RSEL driver pulls the RSEL line to zero in order to cause p-type metal-oxide-semiconductors (PMOSs) within the I/O circuit to sample the bit line signals output by the bit cell. In response, an aggressor driver drives the RSEL line to a negative voltage, thereby reducing the resistance of the PMOSs within the I/O circuit.

Abstract: A semiconductor memory device including an open bit line structure is disclosed. The semiconductor memory device including an open bit line structure includes a first mat, a second mat contiguous to the first mat, a first sense amplifier coupled to a first bit line of the first mat, a second sense amplifier coupled to a second bit line of the first mat and a third bit line of the second mat, a third sense amplifier coupled to a fourth bit line of the second mat, and a plurality of bit line precharge voltage providers for varying a level of a bit line precharge voltage provided to the first, second, and third sense amplifiers, selectively providing the resultant bit line precharge voltage level, and providing the same voltage as that of data of a selected cell to a non-selected sense amplifier during a read operation.

Abstract: A semiconductor memory device is provided which includes a sense amplifier, a bit line connected to a plurality of memory cells of a first memory block, a complementary bit line connected to a plurality of memory cells of a second memory block, a first switch configured to connect the bit line to the sense amplifier, and a second switch configured to connect the complementary bit line to the sense amplifier. The first switch is configured to electrically separate the bit line from the sense amplifier when the second memory block performs a refresh operation.

Abstract: Memories, current mode sense amplifiers, and methods for operating the same are disclosed, including a current mode sense amplifier including cross-coupled p-channel transistors and a load circuit coupled to the cross-coupled p-channel transistors. The load circuit is configured to provide a resistance to control at least in part the loop gain of the current mode sense amplifier, the load circuit including at least passive resistance.

Abstract: Disclosed is a semiconductor memory device that includes a sense amplifier section. The sense amplifier section includes first n-type diffusion layers, second n-type diffusion layers, first to fifth gates, and first to eighth contacts. The first to fourth contacts are formed over the first n-type diffusion layers. The fifth to eighth contacts are formed over the second n-type diffusion layers. The first and fourth gates are formed in a region between the first n-type diffusion layers. The third gate is formed in a region between the first n-type diffusion layers and in a region between the second n-type diffusion layers. The second and fifth gates are formed in a region between the second n-type diffusion layers.

Abstract: A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of an operational amplifier.

Abstract: Systems and methods are disclosed for providing selective threshold voltage characteristics via use of MOS transistors having differential threshold voltages. In one exemplary embodiment, there is provided a metal oxide semiconductor device comprising a substrate of semiconductor material having a source region, a drain region and a channel region therebetween, an insulating layer over the channel region, and a gate portion of the insulating layer. Moreover, with regard to the device, the shape of the insulating layer and/or the shape or implantation of a junction region are of varied dimension as between the gate-to-drain and gate-to-source junctions to provide differential threshold voltages between them.

Abstract: A semiconductor integrated circuit includes an input data line pair, a sense amplifier configured to sense and amplify data loaded in the input data line pair and transmit the amplified data to an output data line pair, in response to a control signal, and a sense amplification controller configured to sense an amplification level of the output data line pair, limit an activation period of a sense amplification enable signal, and output the limited signal as the control signal.

Abstract: A sense amplifier circuit for a nonvolatile memory that includes a first amplifier to perform a switching operation to output a first signal on a sense amplifier based logic (SABL) node depending on the state of a sensing enable signal, a second amplifier to perform a switching operation to output a second signal on the SABL node depending on the state of the sensing enable signal, a current mirror that sinks current on the SABL node depending on the sensing enable signal and a bit line signal, and an inverter arranged to output the signal on the SABL node as a data signal.

Abstract: Embodiments of the invention provide a sense amplifier, a SRAM chip comprising the sense amplifier and a method of performing read operation on the SRAM chip. The sense amplifier according to embodiments of the invention comprises an additional driving assist portion, which further takes a global data bus as input, the driving assist portion is configured to enable the sense amplifier to provide assisted driving for other sense amplifiers. With the solution according to embodiments of the invention, driving capability of a sense amplifier on global data bus can be enhanced.

Abstract: A semiconductor device including a sense amplifier that includes a first transistor and a second transistor. The first transistor includes a first gate electrode formed over a first channel region and connected to a first bit line, a first diffusion region connected to a second bit line with a first side edge defining the first channel region, and a second diffusion region connected to a power line and includes a second side edge defining the first channel region. The second transistor includes a second gate electrode formed over a second channel region and connected to the second bit line, a third diffusion region connected to the first bit line and includes a third side edge defining the second channel region, and a fourth diffusion region connected to the power line with a fourth side edge defining the second channel region. Directions of the bit lines and diffusion side edges are prescribed.

Abstract: A semiconductor memory includes a circuit block that is configured to receive a test mode command, a first sense amplifier that is coupled to sense and amplify a state of a first memory cell when enabled, and a second sense amplifier that is coupled to sense and amplify a state of a second memory cell when enabled. In an active cycle, the circuit block generates one or more control signals in response to the test mode command that cause the second sense amplifier to be enabled a predetermined amount of time after the first sense amplifier is enabled.

Abstract: Some embodiments regard a circuit comprising a memory cell, a first data line, a second data line, a sensing circuit coupled to the first data line and the second data line, a node selectively coupled to at least three voltage sources via at least three respective switches, a fourth switch, and a fifth switch. A first voltage source is configured to supply a retention voltage to the node via a first switch. A second voltage source is configured to supply a ground reference voltage to the node via a second switch, and a third voltage source is configured to supply a reference voltage to the node via a third switch. The fourth switch and fifth switch are configured to receive a respective first control signal and second control signal and to pass a voltage at the node to the respective first data line and second data line.

Abstract: A single-ended sense amplifier circuit of the invention comprises first and second MOS transistors and first and second precharge circuits. The first MOS transistor drives the bit line to a predetermined voltage and switches connection between the bit line and a sense node and the second MOS transistor whose gate is connected to the sense node amplifies the signal via the first MOS transistor. The first precharge circuit precharges the bit line to a first potential and the second precharge circuit precharges the sense node to a second potential. Before sensing operation, the bit line is driven to the predetermined voltage when the above gate voltage is controlled to decrease. The predetermined voltage is appropriately set so that a required voltage difference at the sense node between high and low levels can be obtained near a changing point between charge transfer/distributing modes.

Abstract: Embodiments of a memory are disclosed that may reduce the likelihood of a miss-read while reading a weak data storage cell. The memory may include a number of data storage cells, a column multiplexer, a first sense amplifier and a second sense amplifier, and an output circuit. The gain level of the first sense amplifier may be higher than the gain level of the second sense amplifier. The output circuit may include a multiplexer and the multiplexer may be operable to controllably select one of the outputs of the first and second sense amplifiers and pass the value of the selected sense amplifier. The output circuit may include a node that couples the outputs of the first and second sense amplifiers and the outputs of the first and second sense amplifiers may be able to be set to a high impedance state.

Abstract: A CMOS latch-type sense amplifying circuit is disclosed. The circuit comprises a CMOS differential amplifier configured to amplify a voltage signal of an input line pair to generate a first amplified voltage signal pair, and provide the first amplified voltage signal pair to an output line pair, a first pre-charge voltage having a first voltage level being applied to the input line pair. The circuit further comprises a CMOS latch-type sense amplifier configured to amplify a voltage signal of the output line pair to generate a second amplified voltage signal pair, and provide the second amplified voltage signal pair to the output line pair. The circuit additionally comprises a first common node controlled by a first common enable signal and connected to both the CMOS differential amplifier and the CMOS latch-type sense amplifier, such that the first common enable signal controls both the CMOS differential amplifier and the CMOS latch-type sense amplifier.

Abstract: A memory array includes: at least one differential local bit line pair; at least one differential global bit line pair; at least a column selection signal, for charging the differential local bit line pair to a predetermined voltage; at least an enable signal for coupling the differential local bit line pair to the differential global bit line pair when a voltage of the differential local bit line pair reaches a specific value; and a local sense accelerator, coupled to the differential local bit line pair, for determining a voltage of the differential local bit line pair, and enabling an accelerator signal for latching one of the differential local bit line pair and pulling the other low when the voltage reaches the specific value.

Abstract: A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.

Abstract: A circuit includes a degeneration p-channel metal-oxide-semiconductor (PMOS) transistor, a load PMOS transistor, and a clamp transistor configured to clamp a voltage applied to a resistance based memory element during a sensing operation. A gate of the load PMOS transistor is controlled by an output of a not-AND (NAND) circuit.

Abstract: A memory cell includes a capacitor, a first transistor, and a second transistor whose off-state current is smaller than that of the first transistor. The first transistor has higher switching speed than the second transistor. The first transistor, the second transistor, and the capacitor are electrically connected in series. Accumulation of charge in the capacitor and release of charge from the capacitor are performed through the first transistor and the second transistor. In this manner, the power consumption of the semiconductor device can be reduced and data can be written and read at higher speed.

Abstract: In a static random access memory (SRAM) device having a hierarchical bit line architecture, a local sense amplifier (SA) circuit includes P-channel transistors which precharge local bit lines connected to memory cells, P-channel transistors each having a gate connected to a corresponding one of the local bit lines and a drain connected to a corresponding one of global bit lines, and N-channel transistors each having a gate connected to a corresponding one of the global bit lines and a drain connected to a corresponding one of the local bit lines. As a result, restore operation to a non-selected memory cell during write operation can be achieved without the need of a fine timing control, the speed of read operation by a feedback function can be increased, and the area can be reduced.

Abstract: A SRAM device which can set a threshold voltage of a selection transistor appropriate for all the cells on an SRAM array is disclosed. The SRAM device uses a field effect transistor as the selection transistor. The field effect transistor includes a gate to drive the transistor and a terminal to control a threshold voltage, which are electrically separated from each other. The SRAM device also includes a circuit which, in a reading operation, gradually increases a voltage supplied to the terminal at the start of the reading to control the threshold of the selection transistor.

Abstract: Determining that a first input of a sense amplifier is to receive information based upon a state of a storage cell during a first portion of a read cycle, and determining that a conductance at the first input is substantially equal to a conductance at a second input of the sense amplifier during the first portion. A plurality of NAND string modules are connected to a global bit line of a memory device that includes a memory column where a plurality of NAND strings and a buffer are formed.

Abstract: An integrated circuit precharges a node 6 to a precharge voltage using precharging circuitry 4. During a discharge phase discharging circuitry 8 selectively discharges that node 6 is to represent a data/signal value. Sensing circuitry 10 detects a discharge characteristic to identify the data/signal value being represented. During the subsequent precharging operation of the node 6 back to the precharge voltage, validating circuitry 12 detects a precharge characteristic, such as the precharge current, the charge transferred, changes in the node voltage or a like, and compares this to the detected discharge characteristic corresponding to the data/signal value sensed by the sensing circuitry. If there is a mismatch, then an operation error signal is generated. The operation error signal may be used to adjust operation parameter, such as the operating voltage/frequency, the timing of the operation of a portion of the integrated circuit or another parameter.

Abstract: A semiconductor memory device includes a switching unit coupled between a local sense amplifier and a bit line sense amplifier and configured to be turned on in response to a switching signal which is enabled in synchronization with an enable signal for enabling the local sense amplifier and disabled at a time point where a preset period passes after a first power for enabling the bit line sense amplifier is precharged.

Abstract: A level detector, an internal voltage generator including the level detector, and a semiconductor memory device including the internal voltage generator are provided. The internal voltage generator includes a level detector that compares a threshold voltage that varies with temperature with an internal voltage to output a comparative voltage, and an internal voltage driver that adjusts an external supply voltage in response to the comparative voltage and that outputs an internal voltage.

Abstract: A semiconductor device includes a first amplifier circuit, a second amplifier circuit, first and second bit lines coupled to the first amplifier circuit, third and fourth bit lines coupled to the second amplifier circuit, a first equalizer circuit being coupled to the first and second bit lines, and a second equalizer circuit being coupled between the second and third bit lines. The second equalizer circuit being closer to the second amplifier circuit than the first equalizer circuit, the first equalizer circuit being closer to the first amplifier circuit than the second equalizer circuit.

Abstract: Systems and methods are disclosed for providing selective threshold voltage characteristics via use of MOS transistors having differential threshold voltages. In one exemplary embodiment, there is provided a metal oxide semiconductor device comprising a substrate of semiconductor material having a source region, a drain region and a channel region therebetween, an insulating layer over the channel region, and a gate portion of the insulating layer. Moreover, with regard to the device, the shape of the insulating layer and/or the shape or implantation of a junction region are of varied dimension as between the gate-to-drain and gate-to-source junctions to provide differential threshold voltages between them.

Abstract: A semiconductor device is disclosed which comprises first and second local bit lines coupled to a plurality of memory cells arranged in first and second areas, respectively, a differential type local sense amplifier amplifying a voltage difference between the first and second local bit lines, a global bit line arranged in an extending direction of the first and second local bit lines, and first and second switches controlling electrical connections between the first and second local bit lines and the global bit line, respectively.

Abstract: An ultra low power sense amplifier circuit for amplifying a low swing input signal to a full swing output signal is disclosed. In one aspect, the amplifier circuit includes a first amplifier stage for pre-amplifying the input signal to an intermediate signal on its internal nodes, a second amplifier stage for amplifying the intermediate signal to the output signal, and a control circuit for sequentially activating the first and second amplifier. The first amplifier has a capacitor for limiting energy consumption and two upsized PMOS transistors without NMOS transistors.

Abstract: A memory macro comprises a plurality of memory cells, a plurality of first amplifying circuits, a first driver circuit, and a first level shifter. The plurality of memory cells is arranged in groups of a first direction and groups of a second direction. Each amplifying circuit is coupled to a plurality of first memory cells arranged in a first group of the first direction via a first data line. The first driver circuit is configured to drive the plurality of first amplifying circuits. The first level shifter is configured to level shift an input signal operating in a first power domain to an output signal operating in a second power domain. The output signal of the first level shifter is for use by the first driver circuit. The first driver circuit and a sense amplifier of an amplifying circuit operate in the second power domain.

Abstract: A memory with extra digit lines in full size end arrays with an open digit architecture, which can use the extra digit lines to form repair cells. In one example, folded digit sense amplifiers are connected to an end array with an open digit architecture such that each sense amplifier corresponds to a group of four digit lines. Two digit lines of the group connect to two open digit sense amplifiers and the other two digit lines connect to the corresponding folded digit sense amplifier. A repair method can be performed on memories including the end arrays with folded digit sense amplifiers. A row in a core array including a replaceable IO is activated and a row in an end array is activated. The repair cells in the end array can be sensed by the folded digit sense amplifiers to generate a replacement IO, which is selected rather than the replaceable IO.

Abstract: For example, four driver transistors are arranged in wells so as to adjoin both sides of each of two element isolation regions. Two pairs of cross-coupled sense transistors are arranged in the wells at positions farther from the element isolation regions than the driver transistors are. Such an arrangement provides more than a certain distance between the sense transistors and the respective corresponding element isolation regions. This reduces the effect of a phenomenon that threshold of a transistor varies according to a distance from an element isolation region. As a result, it is possible to exactly match the characteristics of each pair of cross-coupled transistors.