Abstract: Methods, systems, and devices for power switching for embedded memory are described. A system may be configured with circuitry (e.g., power supply switching circuitry) coupled with or between a power supply and a power input node of a memory device, which may support selectively coupling or isolating the memory device and the power supply based on various conditions. For example, the circuitry may be configured for a selective coupling or a selective isolation based on a voltage level of the power supply satisfying various voltage thresholds. The circuitry may also be configured to support various input or output signaling, such as transmitting an indication of an isolation from the power supply, transmitting an indication to perform a memory initialization, or receiving an indication or command to perform a power cycle.

Abstract: A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second IO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: A storage device includes a solid state drive (SSD), a field programmable gate array (FPGA), a power sensor and a global controller. The SSD stores data and receives power through a power rail connected to a host device. The FPGA processes data read from the SSD or data to be stored in the SSD and receives power through the power rail. The power sensor is connected to the power rail and generates a measured power value corresponding to a total power consumed by the SSD and the FPGA by measuring the total power. The global controller determines one of the SSD and the FPGA as a priority component operating with a fixed performance and determines the other of the SSD and the FPGA as a non-priority component operating with a variable performance in a priority mode based on power control information provided from the host device.

Abstract: A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.

Abstract: A high-density low voltage ferroelectric (or paraelectric) memory bit-cell that includes a planar ferroelectric or paraelectric capacitor. The memory bit-cell comprises 1T1C configuration, where a plate-line is parallel to a word-line, or the plate-line is parallel to a bit-line. The memory bit-cell can be 1TnC, where ‘n’ is a number. In a 1TnC bit-cell, the capacitors are vertically stacked allowing for multiple values to be stored in a single bit-cell. The memory bit-cell can be multi-element FE gain bit-cell. In a multi-element FE gain bit-cell, data sensing is done with signal amplified by a gain transistor in the bit-cell. As such, higher storage density is realized using multi-element FE gain bit-cells. In some examples, the 1T1C, 1TnC, and multi-element FE gain bit-cells are multi-level bit-cells. To realize multi-level bit-cells, the capacitor is placed in a partially switched polarization state by applying different voltage levels or different time pulse widths at the same voltage level.

Abstract: The present disclosure generally relates to power management for an external storage device. The external storage device includes a power allocation unit coupled to an array of memory devices. A single bridge is present to provide a connection to a host device. The memory devices have operational power states that utilize a first amount of power and non-operational power states that utilize a second amount of power that is less than the first amount of power. The power allocation unit changes the power state of the individual memory devices between operational and non-operational based upon need, but also ensures that the external storage device does not exceed the total power allocation. Thus, the power allocation unit may change a power state of one memory device from operational to non-operational in order to change the power state of another memory device from non-operational to operational.

Abstract: A disclosed sense circuit for a memory circuit includes sense amplifiers that detect differences in voltage levels on complementary bitlines during read operations. Instead of the sense amplifiers having built-in footer devices that lead to significant leakage, the sense circuit incorporates a common footer device for all sense amplifiers. To ensure that this footer device has sufficient drive strength to enable voltage differential detection by each sense amplifier, the sense circuit also includes a sense signal generation and boost circuit (SSG&B circuit) that generates a sense mode control signal (SEN) to control the on/off states of the footer device and that further boosts SEN, at the appropriate time, to increase the drive current. By using the common footer device and the SSG&B circuit, leakage from the sense circuit is reduced during a pre-charge operation mode without sacrificing performance during a read operation mode. Also disclosed are associated method embodiments.

Abstract: An electronic device and a semiconductor package structure are provided. The device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The semiconductor dies are stacked over the power supply system. The power supply system includes: a voltage generating circuit configured to generate at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies through a power interconnecting structure. The semiconductor package structure includes a package substrate; at least one semiconductor die disposed on the package substrate; and the power supply system disposed on the package substrate. The at least one semiconductor die may include a plurality of semiconductor dies vertically stacked on the package substrate.

Abstract: An embodiment phase-change memory device includes a memory array provided with a plurality of phase-change memory cells, each having a body made of phase-change material and a first state, in which the phase-change material is completely in an amorphous phase, and at least one second state, in which the phase-change material is partially in the amorphous phase and partially in a crystalline phase. A programming-pulse generator applies to the memory cells rectangular dynamic-programming pulses having an amplitude and a duration calibrated for switching the memory cells from the first state to the second state.

Abstract: Dynamic trim selection based on operating voltage levels for semiconductor devices and associated methods and systems are disclosed. Certain semiconductor devices are expected to operate under two or more operating voltage levels. In some embodiments, the semiconductor device can be characterized to determine optimum timing and/or voltage conditions across multiple operating voltage levels. Consequently, multiple sets of timing and/or voltage conditions can be identified depending on the operating voltage levels, which can be stored in a non-volatile memory (NVM) array of the semiconductor device. During operation, the semiconductor device can determine the operating voltage level currently supplied to the semiconductor device and select one of the timing and/or voltage conditions stored in the NVM array such that the semiconductor device can operate with the optimum timing and/or voltage conditions that has been predetermined for the semiconductor device operating under the operating voltage level.

Abstract: Memory devices and methods for operating the same are provided. A memory device can include at least one command contact and at least one data contact. The memory device can be configured to detect a condition in which the at least one command contact is connected to a controller and the at least one data contact is disconnected from the controller, and to enter, based at least in part on detecting the condition, a first operating mode with a lower nominal power rating than a second operating mode. Memory modules including one or more such memory devices can be provided, and memory systems including controllers and such memory modules can also be provided.

Abstract: A motor drive including an inverter and control logic and a method implemented by the control logic to protect an inverter. The method includes determining a temperature value of a temperature associated with the inverter; preventing restarting of the inverter if the temperature value exceeds a first temperature threshold; and preventing restarting of the inverter if the temperature value exceeds a second temperature threshold that is smaller than the first temperature threshold and the inverter was shut down due to a high load condition.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: A capacitor includes: a lower electrode including a metal nitride represented by MM?N, wherein M is a metal element, M? is an element different from M, and N is nitrogen; a dielectric layer on the lower electrode; an interfacial layer between the lower electrode and the dielectric layer and including a metal nitrate represented by MM?ON, wherein M is a metal element, M? is an element different from M, N is nitrogen, and O is oxygen; and an upper electrode on the dielectric layer.

Abstract: A memory device having long data retention time and high reliability is provided. The memory device includes a driver circuit and a plurality of memory cells, the memory cell includes a transistor and a capacitor, and the transistor includes a metal oxide in a channel formation region. The transistor includes a first gate and a second gate, and in a period during which the memory cell retains data, negative potentials are applied to the first gate and the second gate of the transistor.

Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.

Abstract: For solid state drive (SSD) or other memory system formed of multiple memory dies, techniques are presented for operation in a standby mode with increased power savings. The memory dies are operable in a regular standby mode and in a low power standby mode. Based upon the amount of current each of the memory dies in the regular standby mode, when the device goes into standby the memory dies that draw higher amounts of current when in the regular standby mode are instead placed into the low power standby mode. The amount of current drawn by each of the memory die in the regular standby mode can be determined for each of the memory dies at die sort or as part of the memory test process, or can be determine by an assembled SSD itself.

Abstract: Methods, systems, and devices for reduced-voltage operation of a memory device are described. A memory device may operate in different operational modes based on a value of a supply voltage fir the memory device. For example, when the value of the supply voltage exceeds both a first threshold voltage and a second threshold voltage, the memory device may be operated in a normal operation mode. When the value of the supply voltage is between the first threshold voltage and the second threshold voltage, the memory device may be operated in a low voltage operation mode, which may be a reduced performance mode relative to the normal operation mode. When the value of the supply voltage is below the second threshold voltage, the memory device may be deactivated.

Abstract: Methods, systems, and devices for limiting regulator overshoot during power up are described. In some examples, a memory device may generate a first voltage at a first input node of an amplifier of a memory device based on an application, by an external supply, of a second voltage to a terminal of the memory device. The memory device may generate a third voltage at a second node of the amplifier at an amplifier at an offset to the first voltage, where the second node is coupled with a first gate of a first cascode transistor and a second gate of a second cascode transistor. The memory device may activate the amplifier based on generating the third voltage at the second node of the amplifier.

Abstract: Time division peak power management in non-volatile memory systems is disclosed. The memory system has a memory controller and a number of semiconductor dies. Each die is assigned a time slot in which to perform high current portions of memory operations. The memory controller provides an external clock to each die. Each die tracks repeating time slots based on the external clock. The memory controller may synchronize this tracking. If a die is about to perform a high current portion of a memory operation, the die checks to determine if its allocated slot has been reached. If not, the die halts the memory operation until its allocated time slot is reached. When the allocated time slot is reached, the halted memory operation is resumed at the high current portion. Therefore, the high current portion of the memory operation occurs during the allocated time slot.

Abstract: A method of operating a memory sub-system includes receiving an input voltage at a power management (PM) component of a memory sub-system, where the PM component includes a capacitive voltage divider (CVD), a linear voltage regulator (LVR), and a switching voltage regulator (SVR). The method includes determining whether the input voltage corresponds to a low power mode of the memory sub-system and that the input voltage is higher than an uppermost supply voltage at which a memory component of the memory sub-system is configured to operate. The method further includes selectably coupling, responsive to a determination of the low power mode, the CVD and the LVR and sequentially reducing the input voltage by the CVD and the LVR to a supply voltage for the memory component, where the supply voltage is not higher than the uppermost supply voltage at which the memory component is configured to operate.

Abstract: An information processing apparatus that is capable of securing electric power needed to complete data writing to a nonvolatile memory even if supplied voltage drops. The information processing apparatus includes a nonvolatile memory, a volatile memory that caches write data to the nonvolatile memory. A first power supply unit generates electric power supplied to the nonvolatile memory and the volatile memory by a switching operation. A power source controller lowers a switching frequency of the first power supply unit and controls the first power supply unit to supply the electric power to the nonvolatile memory and the volatile memory in a case where voltage supplied to the information processing apparatus drops.

Abstract: A memory subsystem is disclosed comprising at least one memory module, the memory module having a substrate to which a plurality of memory chips is mounted and a voltage regulator, the voltage regulator receiving a power supply signal from a system power supply and outputting two or more power signals, each power signal providing a different, regulated voltage, which regulated voltages are each routed to each of the memory chips; and a redundant voltage regulator external to and not mounted on the memory module and configured to output two or more power signals, providing external different, regulated voltages which are the same voltages as the voltages output by the voltage regulator on the memory module, and supplying the two or more signals to the memory module.

Abstract: A memory driving device, comprising a switch, a voltage setting circuit, and a bias control circuit. The switch is coupled to a memory at a node. The voltage setting circuit is coupled to the switch and configured to provide a set signal during a first period to turn on the switch, so as to generate current flowing through the switch to the memory unit. The bias control circuit is respectively coupled to the switch and the node, and, during a second period, continuously provides a bias signal to control the switch so as to adaptively adjust a value of the setting current of the switch. The configuration setting terminal is coupled to the voltage setting circuit and the bias control circuit to control the first and the second period.

Abstract: Methods, systems, and devices for sequential voltage control for a memory device are described. A memory device may have various voltage sources that support different voltage levels used in various operations of the memory device. Voltage sources of a memory device may be disabled under some circumstances, such as when the memory device is idled, or operated in a low-power or powered-down mode, among other circumstances. In accordance with examples as disclosed herein, voltage sources of a memory device or memory die may be sequentially enabled or sequentially disabled. For example, voltage sources may be enabled in an order from voltage sources having relatively higher nominal voltages to voltage sources having relatively lower voltages, or disabled in an order from voltage sources having relatively lower nominal voltages to voltage sources having relatively higher voltages.

Abstract: A system includes: a first power supply; a second power supply; a headswitch disposed between the first power supply and logic circuitry; an enable driver coupling the second power supply to a control terminal of the headswitch; and a voltage generator operable to adjust a control voltage from the second power supply to the control terminal of the headswitch in response to a first voltage level of the first power supply exceeding a reference voltage level.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of targeted refresh operations. A memory device may include a number of memory banks, at least some of which may be simultaneously entered into a refresh mode. A given memory bank may perform an auto-refresh operation or a targeted refresh operation, which may draw less power than the auto-refresh operation. The timing of the targeted refresh operations may be staggered between the refreshing memory banks, such that a portion of the refreshing memory banks are performing a targeted refresh operation simultaneously with a portion of the refreshing memory banks performing an auto-refresh operation.

Abstract: A voltage regulator dynamically adjusts the voltage distribution on a voltage rail based on multiple feedback measurements. The voltage regulator provides electrical power to a voltage rail at multiple power supply locations along the voltage rail. The voltage regulator obtains voltage measurements from multiple voltage sensing locations on the voltage rail and detects a spatially unequal voltage deviation in the voltage rail. The voltage regulator adjusts the electrical power provided to the voltage rail at each of the power supply locations to compensate for the spatially unequal voltage deviation in the voltage rail.

Abstract: Methods, systems, and devices for circuitry borrowing in memory arrays are described. In one example, a host device may transmit an access command associated with data for a first memory section to a memory device. The first memory section may be located between a second memory section and a third memory section. A first set of circuitry shared by the first memory section and the second memory section may be operated using drivers associated with the first memory section and drivers associated with the second memory section. A second set of circuitry shared by the first memory section and the third memory section may be operated using drivers associated with the first memory section and drivers associated with the third memory section. An access operation may be performed based on operating the first set of circuitry and the second set of circuitry.

Abstract: A solid state memory system includes: an interface circuit; a device processor configured to receive a dynamic power limit command through the interface circuit and update a metadata log based on the dynamic power limit command; a non-volatile memory array coupled to the interface circuit; and a power manager unit, coupled to the device processor, configured by the device processor, the power manager unit configured to adjust voltages for read, write, erase, and monitoring a voltage feedback in order to verify the dynamic power limit command is not exceeded; and a data error detection-and-correction unit, coupled to the power manager unit, configured to pause correction of error data, select a low power error correction code unit, enable a reduced ECC array, switch from error detection-and-correction to error detection, or a combination thereof in response to the dynamic power limit command.

Abstract: A power-supply device and an electronic device including the relate to technology for a data storage device. The electronic device includes a power-supply device and a controller. The power-supply device generates a sudden power loss (SPL) detection signal in a sudden power off (SPO) state by detecting a level of an external power, generates a charging sense signal indicative of a charging capacity of an auxiliary power-supply circuit, divides the charging capacity into a plurality of charging levels, detects a level of the charging capacity, and generates a charging sense signal indicating a charging level of the auxiliary power-supply circuit in response to the detected charging level. The controller stores flushing information in at least one non-volatile memory device when the SPL detection signal is activated, and variably adjust an amount of storage in the non-volatile memory device in response to the charging sense signal.

Abstract: A static random-access memory (SRAM) semiconductor device including a memory unit is provided. The memory unit includes a bit array arranged in rows and columns. The columns are defined by a plurality of bit line pairs connecting to a plurality of memory cells in the column. The memory unit also includes an edge area adjacent an edge row of the bit array, wherein the edge row includes a plurality of dummy memory cells. The memory unit further includes a plurality of bit line drivers adjacent the bit array and opposite the edge area. The bit line drivers are for driving the bit lines with data to the memory cells during a write operation. The dummy memory cells include a write assist circuit for each bit line pair. The write assist circuit is used for facilitating the writing of the data on the bit line pairs to the memory cells.

Abstract: A processing system includes a memory controller that preemptively exits a dynamic random access (DRAM) integrated circuit rank from a low power mode such as power down mode based on a predicted time when the memory controller will receive a request to access the DRAM rank. The memory controller tracks how long after a DRAM rank enters the low power mode before a request to access the DRAM rank is received by the memory controller. Based on a history of the timing of access requests, the memory controller predicts for each DRAM rank a predicted time reflecting how long after entering low power mode a request to access each DRAM rank is expected to be received. The memory controller speculatively exits the DRAM rank from the low power mode based on the predicted time and prior to receiving a request to access the DRAM IC rank.

Abstract: A device includes several first switching units and several second switching units. Each of the first switching units transmits in response to a first select signal, an auxiliary signal. Each of the second switching units is coupled to a corresponding one of the first switching units and transmits in response to a second select signal, a write voltage to a corresponding one of multiple circuit cells. The second switching units are coupled with each other in a node which receives the write voltage.

Abstract: A memory device includes an array of memory cells, such as SRAM cells, and a plurality of peripheral circuits operably coupled to the memory array. A power control circuit is configured to individually control an application of power to each of the plurality of peripheral circuits and the array of memory cells.

Abstract: A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

Abstract: According to one embodiment, there is provided a semiconductor device comprising a first differential amplifier circuit. The first differential amplifier circuit includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor. The second transistor's gate and drain are connected to the first transistor. The third transistor is diode-connected through the first transistor or diode-connected without passing through the first transistor. Thea fourth transistor is diode-connected through the second transistor or diode-connected without passing through the second transistor. The fifth transistor forms a first current mirror circuit with the third transistor. The sixth transistor is connected to a drain of the first transistor in parallel with the third transistor and forms a second current mirror circuit with the fifth transistor.

Abstract: Methods, systems, and apparatuses related to memory operation with multiple sets of latencies are disclosed. A memory device or system that includes a memory device may be operable with one or several sets of latencies (e.g., read, write, or write recovery latencies), and the memory device or system may apply a set of latencies depending on which features of the memory device are enabled. For example, control circuitry may be configured to enable one or more features during operations on a memory array, and the control circuitry may apply a set of latency values based on a number or type of features that are enabled. The sets of latency values may depend, for example, on whether various control features (e.g., dynamic voltage frequency scaling) are enabled, and a device may operate within certain frequency ranges irrespective of other characteristics (e.g., mode register values) or latencies applied.

Abstract: The invention relates to the field of transmitting series of data between electronic circuits, and more specifically a method and a system for transmitting series of data, from a first electronic circuit to at least one second electronic circuit, via an electrical connection line between the first circuit and the second circuit, in reference to a ground line common to the circuits, of at least one series of data pulses. Each data pulse makes it possible to both electrically supply the second circuit and to transmit an item of data which can be interpreted by the second circuit. The supplying of the second circuit by the first circuit is cut between two successive pulses. For each data pulse and before the second circuit is switched off, because of failure in supply, the item of data transmitted by the pulse is stored on a non-volatile memory support of the second circuit.

Abstract: In an embodiment, a voltage regulation circuit includes a regulation circuit with a voltage regulator that provides an output voltage and a control circuit, coupled to the voltage regulator. The control circuit pulls up the output voltage to a reference voltage responsive to the control circuit detecting that a first voltage level of the output voltage is lower than a predefined voltage level. The control circuit decouples the output voltage from the reference voltage responsive to the control circuit detecting that the first voltage level of the output voltage is higher than the predefined voltage level.

Abstract: An integrated circuit device is provided. The integrated circuit device includes: a functional device including a selection device; and a bias generator circuit coupled to the selection device and configured to detect a leakage current of the functional device and generate a bias voltage based on the detected leakage current. The bias voltage is provided to the selection device to control the selection device.

Abstract: A power switch control circuit includes a supply rail configured to supply power to a memory array. A first header switch couples the supply rail to a first power supply that corresponds to a first power domain. A second header switch couples the supply rail to a second power supply that corresponds to a second power domain. A control circuit is configured to receive a select signal and a shutdown signal, and to output control signals to the first and second header switches to selectively couple the first and second header switches to the first and second power supplies, respectively, in response to the select signal and the shutdown signal. The control circuit is configured to output the control signals to the first and second header switches to disconnect both the first and second header switches from the first and second power supplies in response to the shutdown signal and irrespective of the select signal.

Abstract: A semiconductor storage device includes a first word line electrically connected to a first memory cell, a second word line electrically connected to a second memory cell, and a voltage generation circuit configured to supply a first voltage to a first line electrically connected to the first word line and a second voltage to a second line electrically connected to the second word line. The voltage generation circuit includes a first regulator configured to output the first voltage to the first line and output a first signal according to the first voltage, a second regulator configured to output the second voltage to the second line and output a second signal according to the second voltage, and a switch circuit configured to open or close an electrically conductive path between the first line and the second line, based on at least one of the first signal and the second signal.

Abstract: An integrated circuit including: an oscillator configured to generate an oscillating voltage with a predetermined oscillation frequency in an oscillation period; a voltage regulator configured to generate an output voltage for driving the oscillator and provide the output voltage to the oscillator; and a current injection circuit configured to provide an oscillation current to the oscillator, in response to an oscillation enable signal in the oscillation period.

Abstract: A semiconductor device has a first memory circuit comprising a first memory cell comprising a first field effect transistor, a second memory circuit comprising a second memory cell comprising a second field effect transistor, and a regulator for converting the first power supply potential to a second voltage value lower than the voltage value of the first power supply potential. The second gate length of the second field effect transistor is longer than the first gate length of the first field effect transistor, the first memory cell is supplied with a second power supply potential through regulator, and the second memory cell is supplied with a first power supply potential.

Abstract: Compute-in memory circuits and techniques are described. In one example, a memory device includes an array of memory cells, the array including multiple sub-arrays. Each of the sub-arrays receives a different voltage. The memory device also includes capacitors coupled with conductive access lines of each of the multiple sub-arrays and circuitry coupled with the capacitors, to share charge between the capacitors in response to a signal. In one example, computing device, such as a machine learning accelerator, includes a first memory array and a second memory array. The computing device also includes an analog processor circuit coupled with the first and second memory arrays to receive first analog input voltages from the first memory array and second analog input voltages from the second memory array and perform one or more operations on the first and second analog input voltages, and output an analog output voltage.

Abstract: A method of producing an apparatus comprising an electrical circuit that has one or more characteristics that meet a design specification is presented. The method includes designing the electrical circuit with a trim circuit having a trim value that is variable, The electrical circuit is adjustable based on the trim value of the trim circuit. There is encoding of the functional circuit information and/or trim circuit information in a tag, The method has a reading of the functional circuit information and/or the trim circuit information stored in the tag and the determining of the trim value for the trim circuit that results in the characteristic of the electrical circuit meeting the design specification using the functional circuit information and/or the trim circuit information.

Abstract: A memory system may include memory circuitry and power circuitry, which may include a power storage device. The memory system may also include a controller to determine a power demand of the memory circuitry. In response to determining that the power demand is less than an incoming supply power, the controller may generate a first mode signal to induce a charging state of the power storage device. Additionally, in response to determining that the power demand is greater than the incoming supply power, the controller may generate a second mode signal to cause the power storage device to provide a secondary power to the memory circuitry.

Abstract: Memory circuits used in computer systems may have different operating modes. In a retention mode, a voltage level of an array power supply node coupled to memory cells included in the memory circuit is reduced to a level sufficient to retain data, but not to perform read and write operations to the memory cells. A power converter circuit may be configured to generate the retention voltage level, and adjust the retention voltage level using a leakage current of dummy memory cells included in the memory circuit.