Abstract: A NAND flash memory in which a command/address pin is separated from a data input/output pin. The NAND flash memory includes a memory cell array used for storing data, a command/address pin through which a command and an address are received for transmitting data in the memory cell array, and a data input/output pin through which data are transmitted in the memory cell array. The command/address pin is separated from the data input/output pin in the NAND flash memory. Data input/output speed is increased. Furthermore, the NAND flash memory can perform a bank interleaving operation with a minimal delay time.

Abstract: A memory device includes a nonvolatile memory and a controller. The nonvolatile memory includes a storage area having a plurality of memory blocks each including a plurality of nonvolatile memory cells, and a buffer including a plurality of nonvolatile memory cells and configured to temporarily store data, and in which data is erased for each block. If a size of write data related to one write command is not more than a predetermined size, the controller writes the write data to the buffer.

Abstract: A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: A circuit arrangement, having a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic component is coupled with at least one first access line and at least one second access line; an access controller configured to control an access to at least one electronic component of the plurality of electronic components via the at least one first access line and the at least one second access line; a bias circuit configured to provide a defined potential to at least one of the first access lines, wherein the bias circuit is configured, during an access to an electronic component via one selected first access line of the plurality of first access lines, to provide the defined potential to one or two first access lines of the plurality of first access lines, wherein the one or two first access lines are arranged adjacent to the selected first access line, and, wherein during the access to the electronic component, the potentials of the first access lines of

Abstract: A memory device comprises a nonvolatile memory device and a controller. The nonvolatile memory comprises a first memory area comprising single-bit memory cells and a second memory area comprising multi-bit memory cells. The controller is configured to receive a first unit of write data, determine a type of the first unit of write data, and based on the type, temporarily store the first unit of write data in the first memory area and subsequently migrate the temporarily stored first unit of write data to the second memory area or to directly store the first unit of write data in the second memory area, and is further configured to migrate a second unit of write data temporarily stored in the first memory area to the second memory area where the first unit of write data is directly stored in the second memory area.

Abstract: The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

Abstract: An embodiment of a method for automated test pattern generation (ATPG), a system for ATPG, and a memory configured for ATPG. For example, an embodiment of a memory includes a first test memory cell, a data-storage memory cell, and a test circuit configured to enable the test cell and to disable the data-storage cell during a test mode.

Abstract: A refresh circuit and a semiconductor memory device including the refresh circuit are disclosed. The refresh circuit includes a mode register, a refresh controller and a multiplexer circuit. The mode register generates a mode register signal having information relating to a memory bank on which a refresh operation is to be performed. The refresh controller generates a self-refresh active command and a self-refresh address based on a self-refresh command and an oscillation signal. The multiplexer circuit may include a plurality of multiplexers. Each of the multiplexers selects one of an active command and the self-refresh active command in response to bits of the mode register signal. Each of the multiplexers generates a row active signal based on the selected command, and selects one of an external address and the self-refresh address to generate a row address.

Abstract: A semiconductor memory device includes a first semiconductor chip including a first pad group configured to input/output first data and a second pad group configured to input/output second data; and a second semiconductor chip in a stack with the first semiconductor chip and configured to be electrically connected to the first semiconductor chip by at least one chip through via, wherein the second semiconductor chip includes a first unit bank group including at least one first upper bank group and at least one first lower bank group, a second unit bank group including at least one second upper bank group and at least one second lower bank group, and a data path selector configured to electrically connect one among the first and second upper bank groups and the first and second lower bank groups with the chip through via.

Abstract: A memory circuit, including a memory array (such as a cross-point array), may include circuit elements that may function both as selection elements/drivers and de-selection elements/drivers. A selection/de-selection driver may be used to provide both a selection function as well as an operation function. The operation function may include providing sufficient currents and voltages for WRITE and/or READ operations in the memory array. When the de-selection path is used for providing the operation function, highly efficient cross-point implementations can be achieved. The operation function may be accomplished by circuit manipulation of a de-selection supply and/or de-selection elements.

Abstract: An output circuit includes first and second output drivers. The first output driver is configured to transfer a first data signal directly to an output pad in synchronization with a clock signal. The second output driver is configured to transfer a second data signal directly to the output pad in synchronization with an inversion clock signal. The clock signal and the inversion clock enable multiplexing of the first data signal and the second data signal to provide a multiplexed output data signal.

Abstract: Systems and methods are provided for a random access memory controller. A random access memory controller includes a column multiplexer and sense amplifier pair, where the column multiplexer and sense amplifier pair includes a column multiplexer and a sense amplifier that are configured to utilize common circuitry. The common circuitry is shared between the column multiplexer and the sense amplifier so that the memory controller includes a single instance of the common circuitry for the column multiplexer and sense amplifier pair. The common circuitry includes a common pre-charge circuit, a common equalizer, or a common keeper circuit.

Abstract: A hierarchical memory architecture includes an array of memory sub-arrays, each of which includes an array of memory cells. Each sub-array is supported by local wordlines, local column-select lines, and bitlines. The local wordlines are controlled using main wordlines that extend past multiple sub-arrays in a direction parallel to a first axis, whereas the local column-select lines are controlled using main column-select lines that extend between sub-arrays in a direction perpendicular to the first axis. At the direction of signals presented on the local wordlines and column-select lines, subsets of the bitlines in each sub-array are connected to main data lines that extend over a plurality of the sub-arrays in parallel with the second axis. Some embodiments include redundant data resources that are selected based on a decoding of row addresses.

Abstract: A memory device comprises a nonvolatile memory device and a controller. The nonvolatile memory comprises a first memory area comprising single-bit memory cells and a second memory area comprising multi-bit memory cells. The controller is configured to receive a first unit of write data, determine a type of the first unit of write data, and based on the type, temporarily store the first unit of write data in the first memory area and subsequently migrate the temporarily stored first unit of write data to the second memory area or to directly store the first unit of write data in the second memory area, and is further configured to migrate a second unit of write data temporarily stored in the first memory area to the second memory area where the first unit of write data is directly stored in the second memory area.

Abstract: A semiconductor memory device includes a memory bank configured to store data, a buffering unit including a plurality of buffers, which are disposed to extend to a X-axis of the memory bank to store data transferred from the memory bank, a plurality of data transmission lines configured to transfer the data stored in the plurality of buffers, and a path multiplexing unit configured to select one of a plurality of data transmission paths in response to addresses and transfer the data through the selected data transmission path.

Abstract: A memory includes a redundant sense amplifier and a plurality of sense amplifier pairs. Each sense amplifier pair includes a first sense amplifier and a second sense amplifier. Each sense amplifier pair drives a common load line. The memory is configured to implement column redundancy using a single redundant sense amplifier without requiring local read lines for each sense amplifier.

Abstract: A semiconductor memory device includes a data transmission unit configured to transmit first input data to only a first global line driver or to the first global line driver and a second global line driver in response to a test signal, and a transmission element configured to transmit second input data only to the second global line driver in response to the test signal.

Abstract: A nonvolatile programmable logic switch according to an embodiment includes first and second cells, each of the first and second cells including: a first memory having a first to third terminals, the third terminal being receiving a control signal; a first transistor connected at one of source/drain to the second terminal; and a second transistor connected at a gate to the other of the source/drain of the first transistor, the third terminal of the first memory in the first cell and the third terminal of the first memory in the second cell being connected in common. When conducting writing into the first memory in the first cell, the third terminal is connected to a write power supply generating a write voltage, the first terminals in the first and second cells are connected to a ground power supply and a write inhibit power supply generating a write inhibit voltage respectively.

Abstract: A semiconductor system including a semiconductor integrated circuit or a semiconductor chip, and a method of driving the semiconductor system are described. The semiconductor integrated circuit includes a plurality of semiconductor chips, at least one first chip through via suitable for penetrating through the plurality of semiconductor chips and interfacing a source ID code between the plurality of semiconductor chips, a plurality of second chip through vias suitable for penetrating through the plurality of semiconductor chips and interfacing a plurality of chip selection signals between the plurality of semiconductor chips, wherein the semiconductor chip uses one of chip selection signals as an internal chip selection signal in response to a chip ID code by selecting one of a unique ID code for the semiconductor chip and an alternative ID code for a preset semiconductor chip when the semiconductor chip fails.

Abstract: An integrated driver system is disclosed. The driver system includes decoding logic and a driver portion. The decoding logic is configured to receive select signals and data signals. The driver portion is configured to generate driver signals according to the decoded signals.

Abstract: An apparatus including a protocol engine and a built-in self test (BIST) engine. The built-in self test (BIST) engine is coupled to the protocol engine. The built-in self test (BIST) engine may be configured to directly control when to open and close rows of a synchronous dynamic random access memory (SDRAM) during double data rate (DDR) operations.

Abstract: Described herein are embodiments of selectively setting a memory command clock as a memory buffer reference clock. An apparatus configured for setting a memory command clock as a memory buffer reference clock may include a memory buffer configured to interface between a host and memory, and reference clock selection logic configured to selectively set a memory command clock as a memory buffer reference clock. Other embodiments may be described and/or claimed.

Abstract: A semiconductor memory storage device comprises an array of storage devices including a plurality of rows of the storage devices and a plurality of columns of the storage devices, a first plurality of write ports, a write select signal coupled to the write ports, a plurality of write port address lines coupled as input to each of the write ports, and a first plurality of word line select circuits coupled to receive an address signal and the write select signal for each of the write ports and to provide a single selected write word line signal to a respective one of the rows of the storage devices for one of the first plurality of write ports activated by the write select signal.

Abstract: A semiconductor device that can be manufactured with reduced costs and that includes a first connecting terminal, a second connecting terminal, a third connecting terminal, and a first circuit module configured to operate in response a first signal and a second signal. When a mode signal is in a first state, the first circuit module receives the first signal from the first connecting terminal and receives the second signal from the second connecting terminal. Otherwise, when the mode signal is in a second state, the first circuit module receives the first signal from the first connecting terminal and receives the second signal from the third connecting terminal. A memory module including at least one such memory device may also be provided.

Abstract: A signal driving device includes a constant current circuit configured to provide a constant current, a first mirror circuit configured to generate a mirror current from the constant current and provide a voltage according to the mirror current of the constant current, a circuit comprising a switch device and configured to provide a driver current, a second mirror circuit configured to generate a mirror current of the driver current and output a voltage that includes a voltage drop caused when the mirror current of the driver current flows through a replica switch device, and a differential amplifier configured to receive the voltage from the first mirror circuit and the voltage from the second mirror circuit to provide a biased voltage for the bias circuit and thereby induce the driver current.

Abstract: Apparatus and methods are provided for concurrently selecting multiple arrays of memory cells when accessing a memory element. A memory element includes a first array of one or more memory cells coupled to a first bit line node, a second array of one or more memory cells coupled to a second bit line node, access circuitry for accessing a first memory cell in the first array, a first transistor coupled between the first bit line node and the access circuitry, and a second transistor coupled between the second bit line node and the access circuitry. A controller is coupled to the first transistor and the second transistor, and the controller is configured to concurrently activate the first transistor and the second transistor to access the first memory cell in the first array.

Abstract: The present disclosure includes apparatuses and methods related to a data interleaving module. A number of methods can include interleaving data received from a bus among modules according to a selected one of a plurality of data densities per memory cell supported by an apparatus and transferring the interleaved data from the modules to a register.

Abstract: A column select multiplexer, a method of reading data from a random-access memory and a memory subsystem incorporating the multiplexer or the method. In one embodiment, the column select multiplexer includes: (1) a first field-effect transistor having a gate coupled via an inverter to a bitline of a static random-access memory array, (2) a second field-effect transistor coupled in series with the first field-effect transistor and having a gate coupled to a column select bus of the static random-access memory array and (3) a latch having an input coupled to the first and second field-effect transistors.

Abstract: A method and apparatus for memory power and/or area reduction. An array of memory cells may be scanned to detect faulty memory cells, if any, in the array. A supply voltage Vmem applied to the array of memory cells may be controlled based on a result of the scan, and based on a sensitivity coefficient of one, or more, of the array of memory cells. The sensitivity coefficient may indicate an impact that the one, or more, of the array of memory cells being faulty may have on the performance of a device that reads and writes data to the memory array. Additionally or alternatively, the physical dimensions of the memory cells may be determined based on the sensitivity coefficient(s) and/or based on a number of faulty memory cells that can be tolerated in the array of memory cells.

Abstract: A memory device comprises a memory array, at least one row address buffer, a set of row data buffers, a row decoder, an array of sense amplifiers, and a demultiplexer. The memory array comprises data elements organized into rows and columns. Each of the rows is addressable by a row address. Each of the data elements in each of the rows is addressable by a column address. The at least one row address buffer holds a selected row address of a set of successive selected row addresses. The set of row data buffers holds respective contents of selected rows that correspond to the set of successive selected row addresses. The row decoder decodes the selected row address to access a selected row. The array of sense amplifier reads the selected row and transmits content of the selected row to one of the row data buffers through the demultiplexer, and writes the content of the selected row back to the selected row.

Abstract: A semiconductor apparatus according to an aspect of the present invention includes first and second bus-interface circuits, a first memory core connected to the first bus-interface circuit through a first data bus, the first memory core being connected to a first access control signal output from the first bus-interface circuit, a second memory core connected to the second bus-interface circuit through a second data bus, and a select circuit that selectively connects one of the first access control signal and a second access control signal output from the second bus-interface circuit to the second memory core.

Abstract: An SRAM multiplexing apparatus comprise a plurality of local multiplexers and a global multiplexer. Each local multiplexer is coupled to a memory bank. The global multiplexer has a plurality of inputs, each of which is coupled to a corresponding output of the plurality of local multiplexers. In response to a decoded address in a read operation, an input of a local multiplexer is forwarded to a corresponding input of the global multiplexer. Similarly, the decoded address allows the global multiplexer to forward the input signal to a data out port via a buffer.

Abstract: A semiconductor device includes a memory cell array that is divided into a plurality of memory cell mats by a plurality of sense amplifier arrays. Each of the plurality of memory cell mats includes a plurality of word lines and a test circuit for performing a test control to activate, at one time, a plurality of word lines included in each of a plurality of selected memory cell mats that are not disposed adjacent each other in the plurality of memory cell mats. The memory cell mats with the plurality of activated word lines are distributed. Therefore, the load applied to a driver circuit for driving word lines and the load applied to a power supply circuit for supplying an operation voltage to the driver circuit are reduced.

Abstract: A memory circuit includes first and second word lines, a plurality of memory cells and a timing controller. Each memory cell includes a first access port and a second access port. The first access port is coupled to the first word line and configured to be enabled by a first word line signal on the first word line. The second access port is coupled to the second word line and configured to be enabled by a second word line signal on the second word line. The timing controller is configured to receive a timing select signal and to control a time delay between the first word line signal and the second word line signal to be different in response to different first and second states of the timing select signal.

Abstract: A nonvolatile memory device includes a plurality of memory blocks vertically arranged, first and second row decoder groups configured to couple first and second local global word lines and the word lines of upper memory blocks among the plurality of memory blocks, third and fourth row decoder groups configured to couple third and fourth local global word lines and the word lines of lower memory blocks among the plurality of memory blocks, a first local decoder switch configured to couple a plurality of global lines and the first or second local global word lines, a second local decoder switch configured to couple the plurality of global lines and the third or fourth local global word lines, and a high voltage generator configured to supply operating voltages to the plurality of global word lines.

Abstract: According to an exemplary embodiment, a memory array arrangement includes a plurality of word lines, where at least two of the plurality of word lines are concurrently active word lines. Each of the plurality of word lines drive at least one group of columns. The memory array arrangement also includes a multiplexer for coupling one memory cell in a selected group of columns to at least one of the plurality of sense amps, thereby achieving a reduced sense amp-to-column ratio. The memory array arrangement further includes a plurality of I/O buffers each corresponding to the at least one of the plurality of sense amps. The memory array arrangement thereby results in the plurality of word lines having reduced resistive and capacitive loading.

Abstract: A nonvolatile memory device is provided relating to a test operation for a Low Power Double-Data-Rate (LPDDR) nonvolatile memory device. The nonvolatile memory device comprises a command decoder configured to decode a test mode signal in a test mode to output program and erasure signals into a memory, an address decoder configured to decode a command address inputted through an address pin in the test mode to output a cell array address into the memory, and an overlay window configured to store a data inputted through a data pin in the test mode.

Abstract: Circuits and refresh address circuits for providing a refresh address, and methods for refreshing memory cells. One such method includes refreshing a first plurality of memory cells and interrupting the refreshing of the first plurality of memory cells. A second plurality of memory cells is refreshed, at least one of the second plurality of memory cells the same as one of the first plurality of memory cells. Refreshing of the first plurality of memory cells is resumed following the refreshing of the second plurality of memory cells. One such refresh address circuit includes a refresh address counter configured to provide addresses to be refreshed and a refresh address interrupt circuit configured to interrupt the provision of addresses. An alternate refresh address circuit is configured to provide an alternate address and the refresh address counter resumes providing the addresses responsive to completing the refreshing of the alternate address.

Abstract: Provided is a stacked semiconductor device including n stacked chips. Each chip includes “j” corresponding upper and lower electrodes, wherein j is a minimal natural number greater than or equal to n/2, and an identification code generator including a single inverter connecting one of the j first upper electrode to a corresponding one of the j lower electrodes. The upper electrodes receive a previous identification code, rotate the previous identification code by a unit of 1 bit, and invert 1 bit of the rotated previous identification code to generate a current identification code. The current identification code is applied through the j lower electrodes and corresponding TSVs to communicate the current identification code to the upper adjacent chip.

Abstract: Described herein are embodiments of selectively setting a memory command clock as a memory buffer reference clock. An apparatus configured for setting a memory command clock as a memory buffer reference clock may include a memory buffer configured to interface between a host and memory, and reference clock selection logic configured to selectively set a memory command clock as a memory buffer reference clock. Other embodiments may be described and/or claimed.

Abstract: A semiconductor memory includes a delay locked loop (DLL) configured to generate a timing code based on a clock signal. A plurality of memory devices are coupled to the DLL. Each of the plurality of memory devices is configured to generate internal control signals for operating a memory array based on the timing code received from the DLL.

Abstract: Integrated circuits with first-in-first-out (FIFO) buffer circuits are provided. A FIFO may be implemented using multiport memory elements arranged in an array. The array may be coupled to first and second row address decoders and column multiplexers. The first and second row address decoders may be respectively controlled using first and second row address signals, whereas the column multiplexers may be controlled using column address signals. A FIFO control circuit may generate the row and column address signals. In one suitable arrangement, the FIFO control circuit may be configured to compare the first and second row address signals to determine whether read and write access requests can be simultaneously performed. In another suitable arrangement, the FIFO control circuit may be configured to monitor a count value reflective of the number of data words the FIFO is currently storing to determine whether simultaneous read and write access requests are permitted.

Abstract: A bus driver circuit divides an internal data bus for an integrated circuit memory into at least two groups, designated by speed. A faster group of data lines and a slower group of data lines are placed in an interleaved fashion in order to provide a two group shielding solution. At the earliest opportunity following the reception of a read command, the data from memory banks in the memory is sorted into these two groups. For a DDR3 memory, the sorting method is based on the A2 column address, known as C2. All of the data is brought out of the banks in parallel and sorted as it enters the main amplifiers. These main amplifiers are also divided into two groups, faster and slower. Each amplifier then connects to a data line (G-line) of the same group. The clock assigned to the fast group fires right away, thereby connecting the data associated with the fast amplifiers to the fast data group. This data group then proceeds to the output buffers through the entire data path as fast as possible.

Abstract: A method of reading sequential pages of flash memory from alternating memory blocks comprises loading data from a first page into a first primary data cache and a second page into a second primary data cache simultaneously, the first and second pages loaded from different blocks of flash memory. Data from the first primary data cache is stored in a first secondary data cache, and data from the second primary data cache is stored in a second secondary data cache. Data is sequentially provided from the first and second secondary data caches by a multiplexer coupled to the first and second data caches.

Abstract: An apparatus comprises a clock generator, first and second memory drivers and a multiple-port memory device having at least first and second ports configured to receive input signals from and supply output signals to respective ones of the first and second memory drivers, the multiple-port memory device further comprising a single-port memory device and control circuitry coupled between the first and second ports and the single port of the single-port memory device. The clock generator generates first and second clock signals having respective first and second clock rates, the clock rate of the second clock signal being an integer multiple of the clock rate of the first clock signal. The first and second memory drivers are configured to operate using the first clock signal at the first clock rate, and the single-port memory device is configured to operate using the second clock signal at the second clock rate.

Abstract: In at least one embodiment, a multiplexer has a plurality of sub-circuits, and each of the plurality of sub-circuits has a first transistor, a second transistor, and a third transistor. Drains of the first transistors are coupled with a first terminal of a fourth transistor, and drains of the second transistors are coupled with a second terminal of the fourth transistor. In at least one embodiment, a method of outputting data using the multiplexer includes turning on the second transistor of a selected one of the plurality of sub-circuits responsive to a clock signal and address information. The second transistor of a non-selected one of the plurality of sub-circuits is turned off. The fourth transistor is turned on responsive to the clock signal.

Abstract: A pseudo-dual port memory address multiplexing system includes a control circuit operative to identify a read request and a write request to be accomplished during a single clock cycle. A self time tracking circuit monitors a read operation and generates a switching signal when the read operation is determined to be complete. A multiplexer is responsive to the switching signal for selectively providing a read address and a write address to a memory address unit at the proper time.

Abstract: Controllable arrays in a memory may be activated and deactivated independently. In one embodiment, a processor may include a memory. The memory may be a de-interleaved memory with independently selectable arrays. Based on an address bit of an address used to access data from the memory, a wordline and downstream components may be activated while another wordline and downstream components may be deactivated.

Abstract: A device comprises an address storage device. A first circuit includes a first flash memory, configured to sequentially receive first and second addresses and store the first address in the address storage device. The first circuit has a first set of control inputs for causing the first circuit to perform a first operation from the group consisting of read, program and erase on a cell of the first flash memory corresponding to a selected one of the first and second addresses. A second circuit includes a second flash memory, configured to receive the second address. The second circuit has a second set of control inputs for causing the second circuit to read data from a cell of the second flash memory corresponding to the second address while the first operation is being performed.

Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.