Abstract: An image sensor has multiple blocks each with multiple pixels; each block uses a separate analog-to-digital converter (ADC). The ADCs feed digitized images into an image DRAM, and the image DRAM feeds digitized images to an alignment buffer in turn providing images to an image processor. The ADCs feed digitized image data into the image DRAM in hyperlong words, using staggered, overlapping, word lines to write each hyperlong word. A method of imaging includes exposing a photosensor array to light, reading pixels of the array in sequence within each block of pixels, one pixel in each block simultaneously; and digitizing pixels in separate ADCs for each block. Digitized pixels are written to image DRAM as hyperlong words with one pixel from each block in parallel using staggered, overlapping, word lines. Pixels are read from the image DRAM into an alignment buffer and thence to the image processor.

Abstract: A memory system includes memory devices sharing a data bus and a control bus and controlling the memory devices through the control bus, wherein the memory devices have different latencies each other, and a controller transceiving a data with the memory devices through the data bus, wherein the controller may transceive a data with the memory devices during a time corresponding to a data burst length for a moment being the each latencies of the memory devices after transmitting same control signals to the memory devices.

Abstract: Data checking and correction for a volatile memory of a data storage device, the data storage device further including a non-volatile memory and a controller. The controller operates the non-volatile memory in accordance with requests issued from a host. The controller uses the volatile memory for temporary storage of temporary data required for operations of the non-volatile memory. The controller generates error checking and correction content for the temporary data and writes the temporary data and the error checking and correction content into the volatile memory in at least one burst length for temporary storage of the temporary data. In this manner, it is not necessary to manufacture any additional pin on the volatile memory for data checking and correction.

Abstract: A memory controller issues a targeted refresh command. A specific row of a memory device can be the target of repeated accesses. When the row is accessed repeatedly within a time threshold (also referred to as “hammered” or a “row hammer event”), physically adjacent row (a “victim” row) may experience data corruption. The memory controller receives an indication of a row hammer event, identifies the row associated with the row hammer event, and sends one or more commands to the memory device to cause the memory device to perform a targeted refresh that will refresh the victim row.

Abstract: A semiconductor storage device according to the present embodiment includes a plurality of memory units respectively comprising a plurality of memory cells. A data bus is shared by the memory units and transfers data from the memory units or to the memory units. A timing controller includes a delay time unit shared by the memory units sharing the data bus. The timing controller is configured to output a control signal for driving the memory units after a predetermined delay time elapses since receiving an input signal.

Abstract: The semiconductor integrated circuit includes a command decoder, a shift register unit and a command address latch unit. The command decoder is responsive to an external command defining write and read modes and configured to provide a write command or a read command according to the external command using a rising or falling clock. The shift register unit is configured to shift an external address and the write command by a write latency in response to the write command. The column address latch unit is configured to latch and provide the external address as a column address in the read mode, and to latch a write address, which is provided from the shift register unit, and provide the write address as the column address in the write mode.

Abstract: A data strobe control device is disclosed, which relates to a technology for controlling a data write path of a semiconductor memory device. The data strobe control device includes: a plus-mode controller configured to output a first control signal for controlling a first mode and a plus on-the-fly signal upon receiving a plus-mode signal and an on-the-fly signal; an on-the-fly controller configured to output a second control signal for controlling a second mode according to the on-the-fly signal and an operation signal; a path controller configured to latch an address in response to the second control signal during the second mode, latch the address in response to the first control signal during the first mode, and accordingly output an address latch signal; and a strobe pulse generator configured to output a strobe control signal synchronized with a control clock signal in response to the address latch signal and a burst length signal.

Abstract: A memory control device that can reduce a power consumption at the time of writing a memory. The memory control device includes a data output buffer circuit that burst-transfers data to a memory device through a data bus, and a mask signal output buffer circuit that outputs, to the memory device, a mask signal indicative of data that prohibits write into a memory cell within the memory device among the data. The data output buffer circuit puts an output node into a high impedance state when the mask signal is indicative of write prohibition.

Abstract: A semiconductor memory device includes a signal generation unit configured to generate a toggling signal and first and second pulse signals in response to a test signal and a burst pulse signal. An address output unit may be configured to receive first to fourth input addresses and output sequentially first to fourth output addresses in response to the toggling signal and the first and second pulse signals. A repair unit may be configured to perform a repair operation on a word line selected by the first to fourth output addresses.

Abstract: Systems and methods are provided for perform device selection in multi-chip package NAND flash memory systems. In some embodiments, the memory controller performs device selection by command. In other embodiments, the memory controller performs device selection by input address.

Abstract: A semiconductor memory device includes a plurality of address input blocks configured to respectively receive a plurality of addresses that are related to burst ordering and a control circuit configured to selectively disable all or a part of the address input blocks in response to a burst length information during a write operation mode.

Abstract: A nonvolatile memory device is provided relating to a test operation for a Low Power Double-Data-Rate (LPDDR) nonvolatile memory device. The nonvolatile memory device comprises a command decoder configured to decode a test mode signal in a test mode to output program and erasure signals into a memory, an address decoder configured to decode a command address inputted through an address pin in the test mode to output a cell array address into the memory, and an overlay window configured to store a data inputted through a data pin in the test mode.

Abstract: Correction of duty cycle distortion of DQ and DQS signals between a memory controller and a memory is corrected by determining a duty cycle correction factor. The duty cycle distortion is corrected by applying the duty cycle correction factor to the plurality of differential DQS signals. The duty cycle distortion is corrected across a plurality of differential DQS signals between the memory controller and the bursting memory.

Abstract: A memory apparatus is configured to generate refresh addresses with different values in response to one refresh command and an address, and perform a plurality of refresh operations with time differences in response to the refresh addresses. Herein, the refresh operations are performed within a refresh row cycle time.

Abstract: A clock applying circuit for a synchronous memory is comprised of a clock input for receiving a clock input signal, apparatus connected to the synchronous memory for receiving a driving clock signal, and a tapped delay line for receiving the clock input signal for delivering the clock driving signal to the synchronous memory in synchronism with but delayed from the clock input signal, the delay being a small fraction of the clock period of the clock input signal.

Abstract: Embodiments of a data capture system and method may be used in a variety of devices, such as in memory controllers and memory devices. The data capture system and method may generate a first set of periodic signals and a second set of periodic signals that differs from the first set. Either the first set of periodic signals or the second set of periodic signals may be selected and used to generate a set of data capture signals. The selection of either the first set or the second set may be made on the basis of the number of serial data digits in a previously captured burst of data. The data capture signals may then be used to capture a burst of serial data digits.

Abstract: Provided is a semiconductor integrated circuit according to an exemplary aspect of the present invention including a data transmitting circuit and a data receiving circuit that receives data transmitted from the data transmitting circuit. The data transmitting circuit includes a data output circuit that outputs the data or sets an output to a high impedance state, and a control circuit that outputs a control signal to the data output circuit so that the data output circuit outputs the data when the data transmitting circuit transmits the data, and the data output circuit keeps outputting data last output in the previous data transmission, during a predetermined period after the previous data transmission when the data transmitting circuit further transmits another data after transmitting the data.

Abstract: An asynchronously pipelined SDRAM has separate pipeline stages that are controlled by asynchronous signals. Rather than using a clock signal to synchronize data at each stage, an asynchronous signal is used to latch data at every stage. The asynchronous control signals are generated within the chip and are optimized to the different latency stages. Longer latency stages require larger delays elements, while shorter latency states require shorter delay elements. The data is synchronized to the clock at the end of the read data path before being read out of the chip. Because the data has been latched at each pipeline stage, it suffers from less skew than would be seen in a conventional wave pipeline architecture. Furthermore, since the stages are independent of the system clock, the read data path can be run at any CAS latency as long as the re-synchronizing output is built to support it.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: At least one embodiment includes a non-volatile memory cell array, a write buffer configured to store data being written into the non-volatile memory cell array, and a write unit configured to write data into the non-volatile memory cell array. The write unit is configured to perform writing of data such that each data will have reached a stable storage state in the non-volatile memory prior to being over-written in the write buffer.

Abstract: A non-volatile memory device is operated by outputting data in response to an alternating sequence of first and second edges of a read control signal, respectively. A determination is made whether the read control signal and a write control signal are in synchronization at one of the first edges. Output of the data is stopped at the second edge that follows the one of the first edges of the read control signal if the read control signal and the write control signal are in synchronization at the one of the first edges.

Abstract: The internal command generation circuit includes a burst pulse generation unit and a pulse shifting unit. The burst pulse generation unit is configured to receive a command for a read or write operation, and generate a first burst pulse. The pulse shifting unit is configured to shift the first burst pulse and generate an internal command.

Abstract: A burst order control circuit includes a signal transmitting unit transmitting a second address as first and second signals in response to a mode signal and a first address, a signal delay unit delaying a read command, the first signal, and the second signal to generate a delayed read command, a first delayed signal, and a second delayed signal, a signal generating unit configured to generate a burst signal in response to the first address and generate first and second transmission signals in response to the delayed read command and the first and second delayed signals, and an output unit sorting and outputting a plurality of data in response to the burst signal, the first transmission signal, and the second transmission signal.

Abstract: A semiconductor memory device includes a burst termination control unit and a data output control unit. The burst termination control unit generates a termination control signal, a read command, a write command and a mode resister read command. The data output control unit stops a data output operation in response to the termination control signal.

Abstract: A burst read control circuit acts as an interface to allow a burst-read capable device to execute burst reads from a page-mode capable memory device. The burst read control circuit coordinates burst read requests from the burst-read capable device and subsequent responses from the page-mode capable memory device by accessing subsequent and contiguous memory locations of the page-mode capable memory device.

Abstract: A semiconductor memory device includes an internal clock signal generator configured to generate an internal clock signal by dividing a frequency of an external clock signal; a default latency determiner configured to determine a default latency in outputting a signal; and a latency reflector configured to, for each of consecutive commands, selectively add a half latency equal to a half cycle of the internal clock signal to the default latency in response to a half latency selection information signal.

Abstract: A semiconductor device includes a plurality of semiconductor memories, a clock signal synchronization circuit, and a first circuit. The clock signal synchronization circuit is electrically coupled to the plurality of semiconductor memories. The first circuit is electrically coupled to the plurality of semiconductor memories. The first circuit changes a bit width of data. The data is transferred between the first circuit and the plurality of semiconductor memories.

Abstract: The data access apparatus comprises a phase locked loop (PLL) and a data receiving circuit. The PLL provides a plurality of internal clocks and selecting a strobe clock from the plurality of internal clocks according to a phase selection signal. The data receiving circuit comprises a latching module, for latching of the data signal according to trigger of the strobe clock and a calibrating circuit, for generating the phase selection signal for matching the data with a predetermined data according to the plurality of internal clocks in a training mode and finally determining the phase selection signal corresponding to a preferred clock used in a normal mode.

Abstract: A clock applying circuit for a synchronous memory is comprised of a clock input for receiving a clock input signal, apparatus connected to the synchronous memory for receiving a driving clock signal, and a tapped delay line for receiving the clock input signal for delivering the clock driving signal to the synchronous memory in synchronism with but delayed from the clock input signal, the delay being a small fraction of the clock period of the clock input signal.

Abstract: Provided is a delay adjustment device for adjusting delay of a strobe signal, which specifies when to read a data signal on a data line, with respect to the data signal in order to perform data transfer with an external memory. A testing unit 150 included in a delay adjustment unit is provided with a memory bandwidth monitoring unit 212 that monitors memory bandwidth in use on the data line used for data transfer with a memory circuit. The testing unit 150 performs delay adjustment when the memory bandwidth in use is lower than a predetermined threshold. Delay adjustment is performed by delaying the strobe signal from the data signal by a variety of predetermined delays and determining whether data transfer is successful at each delay, calculating an optimal delay, and thereafter delaying the strobe signal by the calculated delay.

Abstract: The internal command generation circuit includes a burst pulse generation unit and a pulse shifting unit. The burst pulse generation unit is configured to receive a command for a read or write operation, and generate a first burst pulse. The pulse shifting unit is configured to shift the first burst pulse and generate an internal command.

Abstract: A burst address generator includes a burst bit counter for receiving at least one burst bit, and increasing or decreasing the at least one burst bit, a burst bit splitter for receiving the increased or decreased at least one burst bit from the burst bit counter, and dividing the increased or decreased at least one burst bit into an X burst bit and a Y burst bit, and a selector for receiving an X address, a Y address, the X burst bit, and the Y burst bit, and generating an X burst address based on the X address and the X burst bit and a Y burst address based on the Y address and the Y burst bit.

Abstract: The internal command generation circuit includes a burst pulse generation unit and a pulse shifting unit. The burst pulse generation unit is configured to receive a command for a read or write operation, and generate a first burst pulse. The pulse shifting unit is configured to shift the first burst pulse and generate an internal command.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: A semiconductor memory device comprises a latency delay unit that toggles a delay clock signal on during a first interval between a time point where read burst signal is activated and a time point where a latency signal is activated, and subsequently toggling the delay clock signal on during a second interval between a time point where the read burst signal is inactivated and a time point where the latency signal is inactivated.

Abstract: A memory interface allows access to SDRAM by receiving a column address for a data read or write of a burst of data units. Each data unit in the burst has an expected bit size. The interface generates n (n>1) column memory addresses from the received column address. The interface accesses the synchronous dynamic memory to read or write n bursts of data at the n column memory addresses. Preferably, the SDRAM is clocked at n times the rate of the interconnected memory accessing device, and the memory units. The data units in the n bursts preferably have one nth the expected bit size. In this way, SDRAM may be accessed with high memory bandwidth, without requiring an increase in the size of data units in the SDRAM, and the associated data bus. Conveniently, the interface may be operable in two separate modes or configurations. In one mode, SDRAM may be accessed through the interface in a conventional manner. In the second mode, SDRAM is accessed in multiple bursts for each received burst access.

Abstract: Dual I/O data read is performed in an integrated circuit which includes a serial peripheral interface memory device. In one example, a second page read address is transmitted to the memory device using a first input pin and a second input pin concurrently, while transferring data from the memory device associated with a first page read address using a first output pin and a second output pin concurrently. The first page read address is associated with a first location in the memory device and the second page read address is associated with a second location in the memory device.

Abstract: A semiconductor memory device includes a burst pulse generation unit configured to store a burst length information signal in response to a first control signal and output the burst length information signal as a burst pulse signal in response to a second control signal; and an input/output(I/O) control unit configured to generate the first and second control signals in response to a read pulse signal and a latency signal, respectively.

Abstract: A circuit for a semiconductor memory device includes: a filtering control signal generation unit configured to synchronize a seed signal activated in a pre-amble period of a data strobe signal with the data strobe signal and sequentially generate a plurality of filtering control signals in response to the seed signal; and a filtering signal output unit configured to generate a filtering signal for filtering the data strobe signal in response to the plurality of filtering control signals and a plurality of burst length (BL) control signals.

Abstract: A buffer control signal generation circuit includes a burst start signal generator, a command decoder, a burst controller, and a burst column controller. The burst start signal generator shifts a write pulse into a first period to generate a first burst start signal and shifts the write pulse into a second period to generate a second burst start signal, such that the second period being shorter than the first period. The command decoder generates a burst period pulse and a column active pulse in response to the second burst start signal and a column control signal. The burst controller receives the column active pulse and buffers the burst period pulse to generate a burst end signal. The burst column controller generates the column control signal from the burst end signal and the column active pulse.

Abstract: Embodiments of a data capture system and method may be used in a variety of devices, such as in memory controllers and memory devices. The data capture system and method may generate a first set of periodic signals and a second set of periodic signals that differs from the first set. Either the first set of periodic signals or the second set of periodic signals may be selected and used to generate a set of data capture signals. The selection of either the first set or the second set may be made on the basis of the number of serial data digits in a previously captured burst of data. The data capture signals may then be used to capture a burst of serial data digits.

Abstract: A semiconductor memory device includes an internal clock signal generator configured to generate an internal clock signal by dividing a frequency of an external clock signal; a default latency determiner configured to determine a default latency in outputting a signal; and a latency reflector configured to, for each of consecutive commands, selectively add a half latency equal to a half cycle of the internal clock signal to the default latency in response to a half latency selection information signal.

Abstract: A burst termination control circuit includes: a pull-up unit for pulling up a first node in response to a burst termination signal, a latch unit for latching a signal of the first node, a buffer for generating a first termination control signal for stopping data output operation by buffering an output signal of the latch unit, and a logic unit for generating a second termination control signal for stopping burst operation and generation of an output enable signal in response to an output signal of the latch unit.

Abstract: An asynchronously pipelined SDRAM has separate pipeline stages that are controlled by asynchronous signals. Rather than using a clock signal to synchronize data at each stage, an asynchronous signal is used to latch data at every stage. The asynchronous control signals are generated within the chip and are optimized to the different latency stages. Longer latency stages require larger delays elements, while shorter latency states require shorter delay elements. The data is synchronized to the clock at the end of the read data path before being read out of the chip. Because the data has been latched at each pipeline stage, it suffers from less skew than would be seen in a conventional wave pipeline architecture. Furthermore, since the stages are independent of the system clock, the read data path can be run at any CAS latency as long as the re-synchronizing output is built to support it.

Abstract: The semiconductor integrated circuit includes a command decoder, a shift register unit and a command address latch unit. The command decoder is responsive to an external command defining write and read modes and configured to provide a write command or a read command according to the external command using a rising or falling clock. The shift register unit is configured to shift an external address and the write command by a write latency in response to the write command. The column address latch unit is configured to latch and provide the external address as a column address in the read mode, and to latch a write address, which is provided from the shift register unit, and provide the write address as the column address in the write mode.

Abstract: A circuit for controlling the read cycle includes plurality of shift stages configured to sequentially shift read signals; and an activating unit configured to activate a read cycle signal which represents a read cycle, by performing logical operation for output signals of the plurality of the shift stages, wherein the plurality of the shift stages are configured to sequentially shift the read signals for a period corresponding to burst setting information.

Abstract: A semiconductor memory device has a command decoder responsive to a plurality of commands to set the semiconductor memory device to a normal mode, for generating control signals corresponding to the commands, respectively, and a row address prelatch circuit for holding a row address except for a bank address input together with a precharge command, and outputting the row address to a row address latch circuit, when the semiconductor memory device is in a test mode. The row address latch circuit holds the row address output from the row address prelatch circuit in synchronism with a control signal which is generated when an active command is input. The column address latch circuit holds the column address which has already been input when the active command is input, in synchronism with a control signal which is generated when either a read command or a write command is input.

Abstract: A circuit for controlling the loading of write data in a semiconductor memory device includes a global bus; a data block configured to selectively load data of a predetermined first burst length or data of a second burst length, which is a half of the first burst length, for writing on the global bus in response to a control signal; and a memory bank configured to write the data of the first burst length or the data of the second burst length.

Abstract: A burst mode control unit includes a burst period signal generation unit for generating a burst period signal which is enabled during a burst mode operation period, a burst pulse generation unit for generating a burst pulse, which is generated at every predetermined number of cycles during the enabled period of the burst period signal, in response to a read command and a write command, and a column access signal generation unit for receiving the burst signal and a clock signal and generating a column access signal which controls input and output of data during the burst mode operation period.

Abstract: A semiconductor memory device includes a strobe signal generator for receiving a write command and generating a write strobe signal that defines an activation period variably according to an operation frequency, and a data transfer unit for transferring data from an external device to an internal data line in response to the write strobe signal.