Abstract: A method for refreshing a Dynamic Random Access Memory (DRAM) includes performing a refresh on at least a portion of the DRAM at a first refresh rate, and performing a refresh on a second portion of the DRAM at a second refresh rate. The second portion includes one or more rows of the DRAM which do not meet a data retention criteria at the first refresh rate, and the second refresh rate is greater than the first refresh rate.

Abstract: A semiconductor memory apparatus includes a counting control circuit and an address counting circuit. The counting control circuit is configured to generate a first counting start signal, a second counting start signal and a counting count signal in response to an auto-refresh signal, a voltage stabilization signal and a fuse control signal. The address counting circuit is configured to count a plurality of count addresses in response to the first counting start signal, and to count one or more specified count addresses from among the plurality of count addresses in response to the second counting start signal and the counting control signal.

Abstract: A burst read control circuit acts as an interface to allow a burst-read capable device to execute burst reads from a page-mode capable memory device. The burst read control circuit coordinates burst read requests from the burst-read capable device and subsequent responses from the page-mode capable memory device by accessing subsequent and contiguous memory locations of the page-mode capable memory device.

Abstract: Multi-rank memories and methods for self-refreshing multi-rank memories are disclosed. One such multi-rank memory includes a plurality of ranks of memory and self-refresh logic coupled to the plurality of ranks of memory. The self-refresh logic is configured to refresh a first rank of memory in a self-refresh state in response to refreshing a second rank of memory not in a self-refresh state in response to receiving a non-self-refresh refresh command for the second rank of memory.

Abstract: A semiconductor memory device includes a mask information storage circuit that stores therein mask information indicating an area for which the self refresh operation is not performed among a plurality of areas in a memory cell array, a mask determining circuit that is activated by a self refresh command and generates a match signal in response to a detection of a match between a refresh address and the mask information, and a refresh operation control circuit that disables the self refresh operation in response to an activation of the match signal. When a test mode signal is activated, the mask determining circuit is also activated by the auto refresh command. With this configuration, it is possible to perform a test of a partial array self refresh function without actually entering a self refresh mode.

Abstract: To include an AL counter that outputs a second ODT signal after counting a clock signal by an additive latency after receiving a first ODT signal, and a counter control circuit that controls the AL counter such that the second ODT signal having the same logic value as a logic value of the first ODT signal at a time of shifting from an asynchronous mode to a synchronous mode is output during a period until when at least the clock signal is input by an additive latency after the shifting. With this configuration, an interruption of an CDT operation can be prevented without separately providing a CKE counter. Therefore, the circuit scale can be reduced and the power consumption can be also reduced.

Abstract: A system including a wear-leveling module, a nonvolatile memory, and a control module. The wear-leveling module is configured to distribute write operations across a plurality of memory blocks of a memory, wherein the write operations include erase operations, and wherein charge decay in memory cells of one of the memory blocks depends on a number of erase operations performed on the one of the memory blocks. The nonvolatile memory is configured to store a count representing the erase operations performed on all of the memory blocks. The control module is configured to (i) determine charge decay in memory cells of all the memory blocks based on the count, and (ii) increase a charge level of the memory cells of the memory blocks based on the count.

Abstract: In one embodiment of the invention, a memory integrated circuit is provided including a memory array, a register, and control logic coupled to the register. The memory array in the memory integrated circuit stores data. The register includes one or more bit storage circuits to store one or more identity bits of an identity value. The control logic provides independent sub-channel memory access into the memory integrated circuit in response to the one or more identity bits stored in the register.

Abstract: A semiconductor memory device includes a random address generation unit configured to receive a multi-bit source address and generate a multi-bit random address and a signal mixing unit configured to mix the multi-bit random address with a data, wherein the random address generation unit has a plurality of transmission lines configured to electrically connect the plurality of input terminals respectively corresponding to bits of the source address and the plurality of output terminals respectively corresponding to bits of the random address in one-to-one correspondence regardless of an order of the bits of the source address.

Abstract: A semiconductor device includes a first bit line section coupled to a first cell string, a second bit line section coupled to a second cell string, a page buffer coupled to the first bit line section and a switching circuit formed between the first bit line section and the second bit line section, wherein the switching circuit couples the first bit line section to second bit line section in response to a select signal.

Abstract: A latency counter includes a counter circuit and a point-shift FIFO circuit. Latch circuits included in the point-shift FIFO circuit are divided into n groups having wired-OR outputs, and an output of a latch circuit that belongs to a group different from a current group is selected each time a count value is updated.

Abstract: A semiconductor device according to the present invention has an address scrambling circuit for performing address scrambling operation of an address and a redundancy judging circuit for judging that redundancy judgment is performed about the address scrambled by the address scrambling circuit. This structure makes it possible to completely refresh operation concerned with normal word lines and redundancy word lines.

Abstract: A method of sensing a data value stored at a resistance based memory is disclosed. The method includes receiving a data signal from a data cell. The data cell includes a resistance based memory element. A reference signal is received from a reference circuit. The reference circuit includes a resistance based memory element. The data signal is converted to a data output signal having a first frequency. The reference signal is converted to a reference output signal having a second frequency. A first output signal is generated when the first frequency exceeds the second frequency. A second output signal is generated when the second frequency exceeds the first frequency.

Abstract: A Random Access Memory (RAM) and method of using the same are disclosed. The RAM includes a plurality of memory cells arranged in columns and in rows with each memory cell coupled to at least one word line and at least one bit line. The RAM includes a plurality of switches with at least one of the switches coupled between two of the memory cells to allow data to be copied from one of the two memory cells to the other of the two memory cells. In another aspect, the two memory cells can be considered a dual bit cell that contains a copying mechanism. There are two interleaved memory planes, assembled from bit cells that contain two bits of information. One bit is the primary bit that corresponds to the normal RAM bit. The second bit is able to receive a copy and hold the primary value. When the copying mechanism is over, the two memory planes may act as two completely independent structures.

Abstract: A semiconductor memory device includes a latency controller which provides a power-saving effect. The latency controller includes a first-in first-out (FIFO) register. After a read command is applied, when a precharge command or power-down command is applied, the latency controller outputs a latency signal corresponding to the applied read command and blocks application of sampling and transmission clock signals to the FIFO register.

Abstract: A card controller includes an arithmetic processing device. The controller writes data to a semiconductor memory having a first memory block and a second memory block each including a plurality of nonvolatile memory cells each configured to hold at least 2 bits, data in the first memory block and data in the second memory block being each erased at a time. The arithmetic processing device writes the data to the memory cells in the first memory block using an upper bit and a lower bit of the at least 2 bits and writes the data to the memory cells in the second memory block using only the lower bit of the at least 2 bits.

Abstract: Methods for sensing, method for programming, memory devices, and memory systems are disclosed. In one such method for sensing, a counting circuit generates a count output and a translated count output. The count output is converted into a time varying voltage that biases a word line coupled to memory cells being sensed. Target data for each memory cell is stored in a data cache associated with that particular memory cell. When it is detected that a memory cell has turned on, the translated count output associated with the count output that is indicative of the voltage level that turned on the memory cell is compared to the target data. The comparison determines the state of the memory cell.

Abstract: The present disclosure includes various method, device, system, and module embodiments for memory cycle voltage adjustment. One such method embodiment includes counting a number of process cycles performed on a first memory block in a memory device. This method embodiment also includes adjusting at least one program voltage, from an initial program voltage to an adjusted voltage, in response to the counted number of process cycles.

Abstract: To provide a semiconductor device including a skew detecting circuit activated in a write leveling mode, and an ODT control circuit that activates a terminating resistance circuit connected to a data strobe terminal by using an ODT signal. The ODT control circuit includes counters that delay the ODT signal, activates the terminating resistance circuit by using the ODT signal having passed the counters in a normal operation mode, and activates the terminating resistance circuit by using the ODT signal having bypassed the counters in the write leveling mode. With this configuration, in the write leveling mode, a write leveling operation can be performed quickly without waiting for latency of the ODT signal.

Abstract: Circuits and refresh address circuits for providing a refresh address, and methods for refreshing memory cells. An example method includes refreshing a first plurality of memory cells and interrupting the refreshing of the first plurality of memory cells. A second plurality of memory cells is refreshed, at least one of the second plurality of memory cells the same as one of the first plurality of memory cells. Refreshing of the first plurality of memory cells is resumed following the refreshing of the second plurality of memory cells. An example refresh address circuit includes a refresh address counter configured to provide addresses to be refreshed and a refresh address interrupt circuit configured to interrupt the provision of addresses. An alternate refresh address circuit is configured to provide an alternate address and the refresh address counter resumes providing the addresses responsive to completing the refreshing of the alternate address.

Abstract: A semiconductor memory device includes an open-loop-type delay locked loop (DLL) configured to generate a clock signal locked by reflecting a first delay amount which actually occurs in a data path and a second delay amount which is required for locking the clock signal, a latency control unit configured to shift an inputted command according to a latency code value corresponding to the first delay amount and latency information, and output the shifted command, and an additional delay line configured to delay the shifted command according to a delay code value corresponding to the second delay amount, and output the command of which operation timing is controlled.

Abstract: According to one embodiment, a semiconductor memory device includes a memory array, an address counter, an address detecting circuit and a control circuit. The memory array has a plurality of memory cells arranged at crossing positions of word lines and bit lines. The address counter increments an address including a row address and a column address in synchronism with a clock to sequentially output the incremented addresses. The address detecting circuit detects an address previous to an address including a row address to which the row address is switched at the address output from the address counter to output a detection signal. The control circuit performs a precharging operation to the bit lines connected to the memory cells according to the detection signal output from the address detecting circuit.

Abstract: A memory device is provided. The memory device comprises a plurality of memory chips. The plurality of memory chips receive an input address code and alternately operate in an active mode. Each memory chip receives a selection signal and operates according to an internal address counter code. For each memory chip, the respective internal address counter code is initially set according to the input address code and the respective selection signal.

Abstract: The column address counter circuit of a semiconductor memory device includes at least one lower bit counter unit configured to generate a first bit of a column address by counting an internal clock, where the first bit is not a most significant bit of the column address, and a most significant counter unit configured to generate the most significant bit of the column address in response to a mask clock, where the mask clock is toggled when the internal clock is toggled by a set number of times.

Abstract: A semiconductor memory device includes a plurality of memory chips each including a chip identification (ID) generation circuit. The chip ID generation circuits of the respective memory chips are operatively connected together in a cascade configuration, and the chip ID generation circuits are activated in response to application of a power supply voltage the memory device to sequentially generate respective chip ID numbers of the plurality of device chips.

Abstract: A latency counter includes an input selecting circuit that selects one of a plurality of signal paths and supplies an internal command to the selected signal path, a shift circuit that switches a correspondence relation between the signal paths and a latch circuit, and an output selecting circuit that causes the internal command taken in the latch circuit to be output. The input selection circuit includes a timing control circuit allocated to each of the signal paths. The timing control circuit includes an SR latch circuit that is set by the internal command and is reset in response to deactivation of a corresponding count value. Therefore, it becomes possible to suppress shortening of an active period of the internal command that is output from the input selecting circuit.

Abstract: This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation.

Abstract: A semiconductor memory device configured to perform a clock synchronous burst read operation includes a plurality of buffer memories having different bank structures, and first and second data latch circuits storing read data read from the plurality of buffer memories. The semiconductor memory device further includes a control circuit that controls a timing of starting counting up addresses and a timing of storing read data in the first data latch circuit at the time of the clock synchronous burst read operation in accordance with the bank structure of the buffer memory as a read operation target.

Abstract: A refresh signal generating circuit of a semiconductor memory device includes a flag signal generator which generates a flag signal in response to a refresh signal and a precharge signal, a clock enable signal buffer which generates first and second buffer enable signals based on an external clock enable signal in response to the flag signal, and a chip select signal buffer which generates an internal chip select signal based on an external chip select signal in response to the flag signal.

Abstract: A semiconductor memory device includes a memory cell array including primary word lines and one or more redundant word lines, a timing signal generating circuit configured to generate a refresh timing signal comprised of a series of pulses arranged at constant intervals, and a refresh-target selecting circuit configured to successively select all the primary word lines and all the one or more redundant word lines one by one in response to the respective pulses of the refresh timing signal, wherein a refresh operation is performed with respect to the word lines that are successively selected by the refresh-target selecting circuit.

Abstract: A row address control circuit of a semiconductor memory device including dynamic memory cells includes a test mode setting unit, an address counter and a row address generating unit. The test mode setting unit is configured to provide a test mode signal that indicates whether a test operation is performed or not, in response to a test command; the address counter is configured to generate a first address that increases gradually; and the row address generating unit is configured to selectively choose one of the first address and a second address as a refresh address based on the test mode signal, the second address being externally provided.

Abstract: A memory system has a memory unit that is made of memory cells, each of which assumes a record state with a threshold voltage according to data. If an inverter has performed reverse processing on a data sequence so as to make the number of the memory cells in a predetermined record state great based on a count of a counter in a record operation, the memory system sets a flag added to the data sequence to indicate that the reverse processing has been performed, and performs re-reverse processing on the data sequence to which the flag indicating that the inverter has performed the reverse processing is added in a reproducing operation.

Abstract: A semiconductor memory apparatus and refresh control method are presented. The semiconductor memory apparatus includes a memory cell block composed of a multiplicity of floating body cell (FBC) transistors. Each FBC transistor has a gate connected to a word line, a drain connected to a bit line, and a source connected to a source line. FBC transistor pairs are formed by sharing the source lines in the plurality of the floating body cell transistors. When a refresh signal is enabled, the semiconductor memory apparatus is configured to read data stored in the memory cell block by enabling a refresh read signal and then configured to rewrite the read data in the memory cell block by enabling a refresh write signal.

Abstract: A non-volatile storage subsystem is capable of serving as a configuration controller for configuring/programming one or more field-programmable devices, such as FPGAs, of a target computer system. The storage subsystem may be in the form of a memory card or drive that plugs into a standard slot or external port of the target system. When connected to the target system, the storage subsystem uses the appropriate download interface/protocol to stream or otherwise send configuration data stored in its non-volatile storage to the target system's field-programmable device(s). Thus, the need for a configuration controller in the target system is avoided. Once the configuration process is complete, the storage subsystem preferably acts as a standard storage subsystem, such as an ATA storage drive, that may be used by the target system to store data.

Abstract: A non-volatile memory device including a memory cell array; a read/write circuit configured to drive bit lines of the memory cell array with a negative bit line voltage according to data to be programmed; a bit line setup-time measuring circuit configured to measure the bit line setup-time, which may be a function of the amount of data to be programmed, at each ISPP program loop; and a control logic configured to control the program voltage and/or the applied time of a program voltage applied to the selected wordline of the memory cell array based on the measured bit line setup-times measured at each ISPP program loop.

Abstract: A memory device that, in certain embodiments, includes a memory element and a digital filter. The digital filter may include a counter and a divider, where the divider is configured to divide a count from the counter by a divisor.

Abstract: A memory system that reduces the memory cycle time of a memory cell by performing an incomplete write operation. The voltage on a storage node of the memory cell does not reach a full supply voltage during the incomplete write operation. The incomplete write operation is subsequently completed by one or more additional accesses, wherein the voltage on the storage node is pulled to a full supply voltage. The incomplete write operation may be completed by: subsequently writing the same data to the memory cell during an idle cycle; subsequently writing data to other memory cells in the same row as the memory cell; subsequently reading data from the row that includes the memory cell; or refreshing the row that includes the memory cell during an idle cycle. One or more idle cycles may be forced to cause the incomplete write operation to be completed in a timely manner.

Abstract: A voltage regulating method applied to a memory to regulate a word line voltage corresponding to a set of memory cells of the memory includes the following steps. Firstly, a first value, which is for indicating an amount of data having a specific data value in a set of written data, is counted, wherein the set of written data is written into the set of memory cells. Next, a second value, which is for indicating an amount of data having the specific data value in a set of read data, is counted, wherein the set of read data is obtained by reading the set of written data. Then, a regulating voltage is determined according to a difference between the first and second values. After that, the word line voltage is regulated to be a sum of the word line voltage and the regulating voltage.

Abstract: A method of reading a memory system including a flash memory includes: reading data from a page in a first block of the flash memory, incrementing a counter each time data is read from the page to store a corresponding number of read-out cycles of the flash memory, and copying data from the first block of the flash memory to a second block of the flash memory when the counter exceeds a reference number of read-out cycles. The data from the first block includes data from the page.

Abstract: Circuits, methods, and apparatus for memory interfaces that compensate for skew between a clock signal and DQ/DQS signals that may be caused by a fly-by routing topology. The skew is compensated by clocking the DQ/DQS signals with a phase delayed clock signal, where the phase delay has been calibrated. In one example calibration routine, a clock signal is provided to a receiving device. A DQ/DQS signal is also provided and the timing of their reception compared. A delay of the DQ/DQS signal is changed incrementally until the DQ/DQS signal is aligned with the clock signal at the receiving device. This delay is then used during device operation to delay a signal that clocks registers providing the DQ/DQS signals. Each DQ/DQS group can be aligned to the clock, or the DQS and DQ signals in a group may be independently aligned to the clock at the receiving device.

Abstract: To provide a semiconductor memory device including: a first clock generation circuit and a second clock generation circuit that generate a first internal clock and a second internal clock, respectively; a latency counter that counts latency synchronously with the first internal clock; and a recovery counter that counts a write recovery period synchronously with the second internal clock. The second clock generation circuit activates the second internal clock when auto-precharge is designated, and deactivates the second internal clock when the auto-precharge is not designated. With this configuration, the recovery counter does not perform any counting operation when an auto-precharge function is not operated, and thus unnecessary power consumption can be prevented.

Abstract: Methods, memory devices, and systems are disclosed, such as those for accessing a memory circuit through the use of reduced external pins. With one such system, a single external pin receives a global memory select signal which transmits an access signal for one of a plurality of memory circuits in a system. The memory circuits may be stacked and may also be ranked memory circuits. The global memory select signal may be sent to a counter. Such a counter could count the length of time that the global memory select signal is active, and based on the counting, sends a count signal to a comparator. The comparator may compare the count signal with a programmed value to determine if a specific memory chip and/or port is to be accessed. This configuration may be duplicated over multiple ports on the same memory device, as well as across multiple memory ranks.

Abstract: A semiconductor memory device includes a bank having a plurality of mats, an address counting unit configured to receive an auto-refresh command consecutively applied at predetermined intervals corresponding to a number of the mats, and sequentially count an internal address in response to the auto-refresh command, and an address transferring unit configured to enable the plurality of mats in response to the auto-refresh command, and transfer the internal address to the plurality of mats at predetermined time intervals.

Abstract: Systems, devices and methods are disclosed, such as a system and method of sensing the voltage on bit lines that, when respective memory cells coupled to the bit lines are being read that compensates for variations in the lengths of the bit lines between the memory cells being read and respective bit line sensing circuits. The system and method may determine the length of the bit lines between the memory cells and the sensing circuits based on a memory address, such as a block address. The system and method then uses the determined length to adjust either a precharge voltage applied to the bit lines or the duration during which the bit lines are discharged by respective memory cells before respective voltages on the bit lines are latched.

Abstract: A signaling system includes a signaling path, a master device coupled to the signaling path, a slave device coupled to the signaling path, and a clock generator. The slave device includes timing circuitry to generate an internal clock signal having a phase offset relative to a clock signal supplied by the clock generator, the phase offset being determined at least in part by a signal propagation time on the signal path.

Abstract: To provide a counter circuit capable of accurately counting a high-frequency signal in which hazard or the like is easily generated. There are provided: a frequency dividing circuit that generates first and second frequency dividing clocks, which differ in phase to each other, based on a clock signal; a first counter that counts the first frequency dividing clock; a second counter that synchronizes with the second frequency dividing clock to fetch a count value of the first counter; and a selection circuit that exclusively selects count values of the first and second counters. According to the present invention, a relation of the count values between the first and second counters is kept always constant, and thus, even when hazard occurs, the count values are only made to jump and the count values do not fluctuate.

Abstract: Circuits, methods, and apparatus that provide highly accurate DCPs. One example provides a DCP that includes a resistor string having taps that may be selected by a corresponding number of switches under the control of a digital word. To compensate for parasitic switch resistances and for variations in the values of the resistor sting caused by processing tolerances, a voltage-controlled resistor (VCR) is placed in parallel with the resistor string and switches. A control voltage generated using a control loop adjusts the parallel VCR such that the resistance seen across the DCP is the desired value. The control loop compares a reference resistor to loop components that are scaled to the resistor string, switches, and VCR. The reference resistor may be an external resistor or an internal resistor. If the resistor is internal, it may be trimmed, for example with lasers or fuses.

Abstract: A semiconductor memory device includes output enable signal generation means configured to be reset in response to an output enable reset signal, count a DLL clock signal and an external clock signal, and generate an output enable signal in correspondence to a read command and an operating frequency; and activation signal generation means configured to generate an activation signal for inactivating the output enable signal generation means during a write operation interval.

Abstract: A method provides improved signal quality in a computer memory system. In one embodiment, a digital signal is generated having a voltage interpreted with respect to a reference voltage. The reference voltage is dynamically adjusted as a function of the traffic intensity at which the digital signal is directed to a particular receiver. A training phase may be performed for each DIMM of the memory system, to construct a lookup table correlating suitable reference voltages with different traffic intensities. The lookup table may be referenced during a subsequent execution phase, to dynamically select a reference voltage according to changing traffic intensity. The dynamically selected reference voltage value may be enforced by using transistors to selectively recruit resistors of a resistor network.

Abstract: A priority encoder (PE) for a CAM, comprising a plurality of PE blocks, each receiving a plurality of match results corresponding to data entries in a corresponding data array block and, for determining an address of a highest priority data entry based on a physical location in the data array block during a CAM search-and-compare operation a register for storing a user defined priority value assigned to each PE block and means for evaluating priority values and the address determined by the plurality of PE blocks to select a PE block having the highest priority data entry.