Abstract: A voltage regulating method applied to a memory to regulate a word line voltage corresponding to a set of memory cells of the memory includes the following steps. Firstly, a first value, which is for indicating an amount of data having a specific data value in a set of written data, is counted, wherein the set of written data is written into the set of memory cells. Next, a second value, which is for indicating an amount of data having the specific data value in a set of read data, is counted, wherein the set of read data is obtained by reading the set of written data. Then, a regulating voltage is determined according to a difference between the first and second values. After that, the word line voltage is regulated to be a sum of the word line voltage and the regulating voltage.

Abstract: A content addressable memory (CAM) device includes a plurality of CAM rows, a number of sequencing logic circuits, and a programmable interconnect structure. Each CAM row includes a number of CAM cells to generate a match signal on a match line and includes an enable input. Each sequencing logic circuit includes an input and an output, and is configured to count sequences of match signals from the CAM rows. The programmable interconnect structure selectively connects the match line of any CAM row to the input of any sequencing logic circuit, and selectively connects the output of any sequencing logic circuit to the enable input of any CAM row.

Abstract: Memory devices and methods are disclosed, such as those facilitating a data conditioning scheme for multilevel memory cells. For example, one such memory device is capable of inverting the lower page bit values of a complete page of MLC memory cells when a count of the lower page data values is equal to or greater than a particular value or a comparison of current levels compared with a reference current level is equal to or exceeds some threshold condition. Memory devices and methods are also disclosed providing a means for determining initial programming pulse conditions for a population of memory cells based on the number of lower page data values being programmed to a logical 0 or a logical 1 data state.

Abstract: Systems, devices and methods are disclosed, such as a system and method of sensing the voltage on bit lines that, when respective memory cells coupled to the bit lines are being read that compensates for variations in the lengths of the bit lines between the memory cells being read and respective bit line sensing circuits. The system and method may determine the length of the bit lines between the memory cells and the sensing circuits based on a memory address, such as a block address. The system and method then uses the determined length to adjust either a precharge voltage applied to the bit lines or the duration during which the bit lines are discharged by respective memory cells before respective voltages on the bit lines are latched.

Abstract: In a method of estimating a self refresh period of a semiconductor memory device according to an exemplary embodiment, a plurality of internal address signals are reset in response to a refresh reset signal. The plurality of internal address signals are sequentially changed synchronously with an oscillation signal. A refresh completion signal is generated based on the plurality of internal address signals. The self refresh period is detected based on the refresh reset signal and the refresh completion signal.

Abstract: A refresh method for a semiconductor memory device having more than one bank group is provided. The refresh method may include applying an all-refresh command to one the bank groups, determining if one of the bank groups includes a bank undergoing a refresh operation when the all-refresh command is received, and performing an all-refresh operation based on the determination.

Abstract: A number of read cycles applied to a selected memory location of a memory device, such as a variable-resistance memory device, is monitored. Write data to be written to the selected memory location is received. Selective pre-write verifying and writing of the received write data to the selected memory location occurs based on the monitored number of read cycles. Selectively pre-write verifying and writing of the received write data may include, for example, writing received write data to the selected memory cell region without pre-write verification responsive to the monitored number of read cycles being greater than a predetermined number of read cycles.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes an adder with first and second inputs and an output. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the adder, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the adder.

Abstract: An apparatus which uses channel counters in combination with channel count read instructions as a means of providing information that data in a given channel is valid or has not been previously read. The counter may also, in the situation of the channel being defined as blocking, be used to prevent the unintentional overwriting of data in a register used by the channel or, alternatively, prevent further communications with the device assigned to that channel when a given count occurs. Intelligent external devices may also use channel count read instructions sent to the counting mechanism for reading from and writing to the channel.

Abstract: A memory cell accessing method may include receiving an input address, determining whether the input address has been accessed at least a predetermined number of times, and converting a memory cell enabled by the input address when it is determined that the input address has been accessed the predetermined number of times or more.

Abstract: A semiconductor memory device includes a memory cell array configured of at least a first portion and a second portion each including a plurality of memory cells each with a variable resistor which stores an electrically rewritable resistance value as a data, and a control circuit which controls a first operation including selected one of operations to erase, write and read the data in the first portion and a second operation including selected one of operations to erase, write and read the data in the second portion, the first operation and the second operation being performed in temporally overlapped relation with each other.

Abstract: A Random Access Memory (RAM) and method of using the same are disclosed. The RAM includes a plurality of memory cells arranged in columns and in rows with each memory cell coupled to at least one word line and at least one bit line. The RAM includes a plurality of switches with at least one of the switches coupled between two of the memory cells to allow data to be copied from one of the two memory cells to the other of the two memory cells. In another aspect, the two memory cells can be considered a dual bit cell that contains a copying mechanism. There are two interleaved memory planes, assembled from bit cells that contain two bits of information. One bit is the primary bit that corresponds to the normal RAM bit. The second bit is able to receive a copy and hold the primary value. When the copying mechanism is over, the two memory planes may act as two completely independent structures.

Abstract: A latency counter includes: a frequency-dividing circuit that generates a plurality of divided clocks LCLKE and LCLKO of which the phases differ each other based on an internal clock LCLK; and frequency-divided counter circuits each of which counts a latency of an internal command based on the corresponding divided clocks LCLKE and LCLKO. Thus, the counting of the latency is performed based not on the internal clock LCLK itself but on the divided clocks LCLKE and LCLKO obtained by frequency-dividing the internal clock LCLK. Thus, even when a frequency of the internal clock LCLK is high, an operation margin can be sufficiently secured.

Abstract: A memory device that, in certain embodiments, includes a memory element and a digital filter. The digital filter may include a counter and a divider, where the divider is configured to divide a count from the counter by a divisor.

Abstract: A memory device and a refresh method are provided herein. The memory device includes a memory array having memory rows. When an array refresh strobe (ARS) signal is received, it is determined whether the memory rows are required to be refreshed according to tag flags and reset statuses corresponding to the memory rows. When a row refresh strobe (RRS) signal is received, it is determined whether to refresh one of the memory rows according to a plurality of parameters including a value of a row to refresh counter, a value of a refresh deadline counter and/or a queue. When it is decided to start a refresh operation, one of the memory rows is selected according to the tag flag and the status, and the status of the selected memory row is updated after the selected memory row is refreshed.

Abstract: A semiconductor memory apparatus and refresh control method are presented. The semiconductor memory apparatus includes a memory cell block composed of a multiplicity of floating body cell (FBC) transistors. Each FBC transistor has a gate connected to a word line, a drain connected to a bit line, and a source connected to a source line. FBC transistor pairs are formed by sharing the source lines in the plurality of the floating body cell transistors. When a refresh signal is enabled, the semiconductor memory apparatus is configured to read data stored in the memory cell block by enabling a refresh read signal and then configured to rewrite the read data in the memory cell block by enabling a refresh write signal.

Abstract: Methods of performing multi-block erasing operations on a memory device that includes a plurality of memory blocks are provided. Pursuant to these methods, the rate at which a first voltage that is applied to the memory blocks that are to be erased during the multi-block erasing operation rises is controlled based on the number of memory blocks that are to be erased. The memory device may be a flash memory device, and the first voltage may be an erasing voltage that is applied to a substrate of the flash memory device. The rate at which the first voltage rises may be set so that the substrate of the flash memory device reaches the erasing voltage level at approximately the same time regardless of the number of memory blocks that are to be erased.

Abstract: The data output control signal generating circuit includes a delay correction signal generating unit that delays an input signal by a phase difference between a clock and a delay locked loop clock, and latches the delayed signal to generate a plurality of output enable signals. A column address strobe latency control multiplexer selects the output enable signal corresponding to column address strobe latency among the plurality of output enable signals, on the basis of the signal obtained by delaying the input signal by the phase difference between the clock and the delay locked loop clock, and outputs the selected signal as the data output control signal.

Abstract: Circuits, memories, and methods for latching a write command and later provided write data including write command and write data timing circuits. One such timing circuit includes internal write command latch to latch an internal write command in response to write command latch signal. The internal write command latch releases the latched write command in response to the write command latch signal after a latency delay. The timing circuit further includes a write leveling flip-flop (FF) circuit and a write data register. The FF circuit latches the internal write command in response to an internal write command FF signal based on a write clock signal and generates an internal write enable signal in response to latching the internal write command. The write data register captures write data in response to the write clock signal and releases the captured write data in response to a delayed internal write enable signal.

Abstract: A memory system comprises charge storage cells and a refresh control module. The charge storage cells have a charge level decay that is based on lifetime erase operations performed on the charge storage cells. The refresh control module increases charge levels of the charge storage cells to offset the charge level decay without first erasing the charge storage cells. A method of controlling a memory system comprises determining charge level decay of charge storage cells having charge level decay characteristics that are based on lifetime erase operations performed on the charge storage cells; and increasing charge levels of the charge storage cells to offset the charge level decay without first erasing the charge storage cells.

Abstract: A semiconductor memory device executes a refresh operation on memory banks, and includes: a command decoder that decodes a command from outside the semiconductor memory device, and outputs a refresh instruction when the command is an auto-refresh command; a refresh command generating unit that outputs a refresh command signal by a predetermined number of times corresponding to the number of word lines to be refreshed in response to the refresh instruction; a bank address counter that holds a bank address for selecting a memory bank to be refreshed, counts up the bank address every time the refresh command signal is output, and performs a carry-over action when count-up operations equivalent to the number of the memory banks are performed; and a row address counter that holds a row address for selecting a word line to be refreshed, and counts up the row address in response to the carry-over action.

Abstract: The present invention relates to a memory on a silicon microchip, having a serial input/output, an integrated memory array addressable under N bits, and at least one register that is read accessible, after applying a command for reading the register to the memory. The memory stores a most significant address allocated to the memory within an extended memory array wherein the memory is incorporated or intended to be incorporated. A master memory signal is generated based on the most significant address allocated to the memory. A central processing unit executes a command for reading the register and supplies the content of the register to the serial input/output of the memory only if the memory is the master memory within the extended memory array. The memory includes slave memories whose operation depends upon the read/write status of the master memory.

Abstract: A bad block address of a flash memory device is stored through a fuse circuit and then compared with an input address in order to disable bad blocks. The flash memory device includes a bad block information unit for storing an address of a bad block, a comparator for comparing an input address including a memory block address and the address of the bad block stored in the bad block information unit, and for outputting a first control signal according to the comparison result, and an address counter for outputting a second control signal to enable or disable a memory block corresponding to the memory block address in response to the first control signal.

Abstract: The semiconductor device includes a temperature sensor controlled so that temperature measurement is made once at each of a plurality of different reference temperatures at an interval of a preset number of times of refresh operations and a plurality of latch circuits holding the results of temperature measurement. A refresh period is set from outputs of the latch circuits inclusive of the result of temperature measurement carried out last time for each of a plurality of different reference temperatures. After start of measurement, temperature measurements are repeated every wait time corresponding to circulation of the refresh operations. The refresh period is set such that the high-temperature side results of temperature measurement are prioritized(FIG. 2).

Abstract: A memory device that, in certain embodiments, includes a memory element and a digital filter. The digital filter may include a counter and a divider, where the divider is configured to divide a count from the counter by a divisor.

Abstract: The invention is directed to decreasing a circuit size of a system in which a plurality of devices or circuit blocks share and use one memory. A system is configured so that a memory block serves as a master and each of circuit blocks serves as a slave, and thus the slave side (the circuit blocks) receives necessary data from the memory block by only having decoders corresponding to addresses assigned thereto in advance and registers. In this case, since the registers have been also needed in a conventional system in order to hold data read out from a memory, the circuit size decreases in the whole system. Since this effect is enhanced in proportion to the number of the circuit blocks sharing the memory block, the effect is enhanced as the system size increases.

Abstract: The present disclosure includes various method, device, system, and module embodiments for memory cycle voltage adjustment. One such method embodiment includes counting a number of process cycles performed on a first memory block in a memory device. This method embodiment also includes adjusting at least one program voltage, from an initial program voltage to an adjusted voltage, in response to the counted number of process cycles.

Abstract: To provide a plurality of memory banks, each of which is divided into a plurality of segments; a bank address register that designates a memory bank that becomes a refresh target; a segment address register that designates a segment that becomes a refresh target; and a refresh control circuit that prohibits a refresh operation of the memory bank or the segment not designated by at least one of the bank address register and the segment address register. This semiconductor device is capable of designating whether to perform a refresh operation not only in a memory bank unit but also in a segment unit within the memory bank, and thus it achieves a further reduction of the power consumption.

Abstract: Auto-refresh of a semiconductor device may be controlled by setting the number of auto-refresh to be performed in a period of time, based on temperature, when an auto-refresh command is detected.

Abstract: A semiconductor memory device executes a refresh operation on memory banks, and includes: a command decoder that decodes a command from outside the semiconductor memory device, and outputs a refresh instruction when the command is an auto-refresh command; a refresh command generating unit that outputs a refresh command signal by a predetermined number of times corresponding to the number of word lines to be refreshed in response to the refresh instruction; a refresh address counter that counts up an address designating a memory bank and a word line every time the refresh command signal is output; and a refresh number controller that controls the number of times that refresh command signals are output so that each memory bank is refreshed and, after a count value for designating the word line of the refresh address counter has been changed, at least one of the memory banks is further refreshed.

Abstract: A semiconductor device includes a latency setting circuit setting the latency, an input command circuit outputting a normal-phase (reverse-phase) command signal obtained by capturing an input command signal using a normal-phase (reverse-phase) clock, first and second counter circuits each including latch circuits sequentially shifting the normal-phase (reverse-phase) command signal based on the normal-phase (reverse-phase) clock, a selector circuit controlling a signal path so that the normal-phase (reverse-phase) command signal is transmitted through the first (second) counter circuit when an even latency is set and the normal-phase (reverse-phase) command signal is transmitted so as to be shifted from the first (second) counter circuit to the second (first) counter circuit when an odd latency is set, and a control circuit controlling so that the latch circuits of the first (second) counter circuit are activated in response to the input command signal and stopped after an operation period is elapsed.

Abstract: The reliability of data is significantly increased without considerably increasing costs by performing minor data corrections within an information storage device and performing major error corrections in an information processing device. When a request to transfer user data for reading is issued from an information processing device, a control circuit transfers the user data and management data to an error detection circuit, which checks the user data for errors. If the user data contains no error, the control circuit notifies the information processing device that the user data can be transferred, and transfers it to the information processing device. If the user data contains errors, an X count error position and correction data calculation circuit uses the user data and the management data to calculate correction locations and correction data, and judges whether the correction locations are correctable.

Abstract: A method of reading a memory system including a flash memory includes: reading data from a page in a first block of the flash memory, incrementing a counter each time data is read from the page to store a corresponding number of read-out cycles of the flash memory, and copying data from the first block of the flash memory to a second block of the flash memory when the counter exceeds a reference number of read-out cycles. The data from the first block includes data from the page.

Abstract: In a phase change memory, the memory array may be written in relatively small chunks. The writing of data to the array and, particularly, the writing of set data, may be accelerated using a hardware accelerator. The hardware accelerator may include an edge detector which detects a short duration signal pulse to trigger the writing of the set data to a cell. As a result, the writing of data may be accelerated, reducing the time to write in some cases.

Abstract: A flash memory apparatus of an embodiment is configured to include a flash memory including a plurality of blocks and a read operation control circuit determining whether to replace a block in accordance with the number of times a read process is performed for each block of the plurality of blocks.

Abstract: A semiconductor memory device includes a memory core unit including a memory cell array including a plurality of memory cells and a sense amplifier to sense and amplify data of the plurality of memory cells, and a self refresh control unit to apply at least one first core voltage to the memory core unit and to control a self refresh operation to be performed at every first self refresh cycle, in a first self refresh mode, and to apply at least one second core voltage to the memory core unit and to control the self refresh operation to be performed at every second self refresh cycle, in a second self refresh mode. In the semiconductor memory, a level of the at least one first core voltage is higher than that of a corresponding one of the at least one second core voltage, and the first self refresh cycle is shorter than the second self refresh cycle.

Abstract: To provide a semiconductor memory device including: a first clock generation circuit and a second clock generation circuit that generate a first internal clock and a second internal clock, respectively; a latency counter that counts latency synchronously with the first internal clock; and a recovery counter that counts a write recovery period synchronously with the second internal clock. The second clock generation circuit activates the second internal clock when auto-precharge is designated, and deactivates the second internal clock when the auto-precharge is not designated. With this configuration, the recovery counter does not perform any counting operation when an auto-precharge function is not operated, and thus unnecessary power consumption can be prevented.

Abstract: The semiconductor integrated circuit includes a command decoder, a shift register unit and a command address latch unit. The command decoder is responsive to an external command defining write and read modes and configured to provide a write command or a read command according to the external command using a rising or falling clock. The shift register unit is configured to shift an external address and the write command by a write latency in response to the write command. The column address latch unit is configured to latch and provide the external address as a column address in the read mode, and to latch a write address, which is provided from the shift register unit, and provide the write address as the column address in the write mode.

Abstract: A method for reading data in a nonvolatile memory at a power-on stage is provided and includes the following steps. Firstly, the data are read through a reference voltage. Next, a failure number is counted when reading the data has a fail result. Next, the reference voltage is adjusted when the failure number reaches a predetermined number. The effect effectively and exactly reading configuration information at a power-on stage is accomplished through the method.

Abstract: A system that includes a controller for enabling an enumeration operation. The enumeration operation is performed by a controller (110) and logic elements (120) in a system, such that each logic element in the system assigns itself a unique identifier. Each logic element can then be controlled by another source or have a means to communicate with other logic elements in the system. The unique identifier enables greater system flexibility, thereby reducing cost and improving efficiency.

Abstract: A signal masking circuit includes a detection circuit, a delayed read data strobe signal generation circuit, a gating circuit, a counting circuit, and a masking circuit. The detection circuit detects a period of a logic “L” of a read data strobe signal. The gating circuit gates a delayed read data strobe signal, and generates a first masked read data strobe signal. The counting circuit counts the falls of the first masked read data strobe signal until the count reaches a predetermined number, and generates a masking signal for masking the first masked read data strobe signal. The masking circuit masks the first masked read data strobe signal, and outputs a second masked read data strobe signal.

Abstract: Disclosed is an apparatus for controlling an enable interval of a signal controlling an operation of data buses which connect a bit line sense amplifier with a data sense amplifier according to a variation of an operational frequency of a memory device. The apparatus comprises a pulse width control section for changing the pulse width of an input signal depending on the operational frequency of the memory device after receiving the input signal, a signal transmission section for buffering a signal outputted from the pulse width control section, and an output section for receiving a signal outputted from the signal transmission section so as to output a first signal for controlling the signal to control the operation of the data buses.

Abstract: A semiconductor memory device includes a command decoder, a refresh address counter, an address delivery unit, and an address output selector. The command decoder decodes a command signal to generate a refresh signal. The refresh address counter generates a refresh address in response to the refresh signal. The address delivery unit delivers one of the refresh address and an address from outside of the semiconductor memory device to a memory core area. The address output selector outputs the refresh address to the outside of the semiconductor memory device.

Abstract: Disclosed is a semiconductor storage device in which a cell array including a plurality of cells in need of refresh for data retention includes the redundancy area, which has a plurality of redundant cells for replacing faulty cells of a normal area within the cell array. When the redundancy area is tested, a refresh counter circuit for generating and outputting refresh addresses rearranges the address in such a manner that a row address of the redundancy area is substantially reduced and placed on a lower-order bit side inclusive of the LSB of the counter.

Abstract: A multipurpose terminal receives an address signal and a data signal. An address valid terminal receives an address valid signal indicating that a signal supplied to the multipurpose terminal is the address signal. An arbiter determines which of an external access request and an internal refresh request is given priority. The arbiter disables reception of the internal fresh request in response to a fact that both a chip enable signal and the address valid signal reach a valid level (an external access request). The arbiter enables the reception of the internal refresh request in response to completion of read or write operation. As a result, in a semiconductor memory device including the multipurpose terminal which receives the address signal and the data signal, contention between the read operation and the write operation, and a refresh operation which responds to the internal refresh request is prevented, which prevents a malfunction.

Abstract: An address counter includes FIFO units and first to third command counters that controls the groups. In the FIFO units, latch circuits including input gates and output gates are connected in parallel. The first command counter conducts any one of the input gates in response to a first internal command; the second command counter conducts any one of the output gates in response to a second internal command; and the third command counter conducts any one of the output gates in response to a third internal command. Thereby, the same address signals can be outputted successively at a plurality of timings, and thus, a circuit scale of the address counter can be reduced.

Abstract: The present disclosure includes various method, device, system, and module embodiments for memory cycle voltage adjustment. One such method embodiment includes counting a number of process cycles performed on a first memory block in a memory device. This method embodiment also includes adjusting at least one program voltage, from an initial program voltage to an adjusted voltage, in response to the counted number of process cycles.

Abstract: A semiconductor memory device includes a memory cell array including primary word lines and one or more redundant word lines, a timing signal generating circuit configured to generate a refresh timing signal comprised of a series of pulses arranged at constant intervals, and a refresh-target selecting circuit configured to successively select all the primary word lines and all the one or more redundant word lines one by one in response to the respective pulses of the refresh timing signal, wherein a refresh operation is performed with respect to the word lines that are successively selected by the refresh-target selecting circuit.

Abstract: A semiconductor device comprising a word line wired on a memory bank, a memory cell storing data provided in correspondence with the word line and a sense amplifier provided in correspondence with the word line, refreshing the memory cell corresponding to the word line selected by a row address that has been generated, including refresh counter 2 that generates a counter address corresponding to the row address and sequentially counts up the counter address, controller 1 that determines and outputs, upon receiving a refresh command instructing that a refresh operation be performed, first line number information and second line number information determining a number of word lines to be started based on the counter address and word line selector 3 that determines the row address according to the first line number information and the second line number information, and the counter address.

Abstract: A method for driving a semiconductor memory device, includes initializing first data corresponding to a refresh time of each corresponding row included in a cell array; storing second data corresponding to column data included in the first row after entering a self refresh mode; setting the first data corresponding to the first row by detecting the refresh time of the first row while performing refresh operations on the other rows in the cell array according to a refresh period selected based on the corresponding first data for predetermined refresh cycles, wherein the refresh operation is not performed on the first row during the predetermined refresh cycles; restoring the second data to the first row; and repeating the above steps for the other rows to thereby set the corresponding first data until the setting step is completed for all rows or the self refresh mode expires.