Abstract: A ratio meter includes a converter circuit, a first counter, a delay circuit, and a second counter. The converter circuit is configured to receive a temperature-independent signal, to convert the received temperature-independent signal into a first frequency signal during a first phase, to receive a temperature-dependent signal, and to convert the temperature-dependent signal into a second frequency signal during a second phase. The first counter is configured to receive the first frequency signal and to generate a control signal by counting a predetermined number of pulses of the first frequency signal count. The delay circuit is configured to delay the control signal for a predetermined time delay. The second counter is configured to receive the second frequency signal and to generate a count value by counting the second frequency signal.

Abstract: An on die thermal sensor (ODTS) of a semiconductor memory device includes a high voltage generating unit for generating a high voltage having a voltage level higher than that of a power supply voltage of the semiconductor memory device; and a thermal information output unit for sensing and outputting a temperature as a thermal information code, wherein the thermal information output unit uses the high voltage as its driving voltage.

Abstract: A method, system or computer usable program product for providing alerts of inefficiency of an environmental conditioning system including, responsive to a cycle initiation by the environmental conditioning system, measuring a difference between an intake temperature and an outlet temperature after a predetermined period of time, and responsive to the difference being below a minimum level, generating an alert.

Abstract: A temperature detecting apparatus includes a temperature detecting circuit configured to output a first pulse signal according to a temperature detected by a temperature sensor, and an insulating transformer configured to transmit the first pulse signal to an integrated circuit which is operated by an operation voltage different from that of the temperature detecting circuit. The insulating transformer is installed between the temperature detecting circuit and the integrated circuit. The temperature detecting circuit and the insulating transformer are mounted on a common substrate.

Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.

Abstract: A time-domain temperature sensing system includes a cyclic delay line, a path selection circuit and a counter. The cyclic delay line includes a plurality of logic components connected. The path selection circuit connects with the cyclic delay line and the counter connects with the path selection circuit. The cyclic delay line is operated to sense and convert a temperature into a time pulse to generate a temperature-related time pulse width signal, and the cyclic delay line is further operated to measure the temperature-related time pulse width signal via the path selection circuit. The cyclic delay line is operated to convert the temperature into the time pulse and the counter is further operated to convert the temperature-related time pulse width signal into a digital signal via the path selection circuit, thereby generating a temperature-to-digital signal.

Abstract: Embodiments disclosed in the detailed description include digital temperature estimators (DTEs) disposed in integrated circuits (ICs) for estimating temperature within the ICs. Related systems and methods are also disclosed. In one embodiment, the DTEs can be used to estimate temperatures in an IC by implementing a temperature estimation model (TEM). The TEM can provide an estimated temperature of an IC block disposed in the IC based on activity event(s) associated with the IC block, as opposed to providing temperature sensors in the IC to measure temperature of the IC block directly. The DTEs can be operated in real time so that power and/or thermal regulation systems of the IC can obtain accurate and reliable temperature estimation from the DTEs. In this manner, thermal dissipation in the IC may be regulated more effectively.

Abstract: A thermal sensor includes a comparator having a first and second input nodes. A reference voltage generator is electrically coupled with the first input node. The reference voltage generator is configured to provide a reference voltage that is substantially temperature-independent. A temperature sensing circuit is electrically coupled with the second input node. The temperature sensing circuit is configured to provide a temperature-dependent voltage. The temperature sensing circuit includes a current mirror. A first metal-oxide-semiconductor (MOS) transistor is electrically coupled between the current mirror and ground. A first resistor is electrically coupled with the current mirror. A second MOS transistor is electrically coupled with the first resistor in series. The second MOS transistor and the first resistor are electrically coupled with the first MOS transistor in a parallel fashion.

Abstract: A temperature sensor includes a signal delaying apparatus, a comparison apparatus, a multiplier and a counting apparatus. The signal delaying apparatus is configured to receive a step signal, perform a phase delay operation on the received step signal according to a temperature degree, and thereby forming a first output signal. The comparison apparatus is configured to receive the first output signal and the step signal, and accordingly output a second output signal. The multiplier is configured to receive the second output signal and a clock signal, and accordingly output a third output signal. The counting apparatus is configured to receive the third output signal, count the number of pulses of the third output signal, and generate a digital code accordingly.

Abstract: Provided is a semiconductor apparatus including a plurality of memory chips which are sequentially stacked. Each of the memory chips includes: a temperature sensor configured to sense the temperature of the memory chip; and a chip ID output unit configured to generate a chip ID for the memory chip based on an output of the temperature sensor.

Abstract: A temperature detection device includes a diode and an analog-digital converter. An output voltage signal of the diode is applicable to an input of the analog-digital converter. The temperature detection device is adapted for the purpose of coupling a reference voltage of the analog-digital converter and the diode current of the diode such that effects of variations of the reference voltage or the diode current on the digital output signal of the analog-digital converter are partially or completely suppressed.

Abstract: Temperature is determined by measuring the time it takes to charge a capacitor with a resistive temperature sensor. A clock, time counter, a voltage comparator and voltage reference are used in determining a coarse time measurement. The time measurement resolution is enhanced with the addition of a constant current source charging another timing capacitor within a single clock pulse time to provide a fine time measurement.

Abstract: A circuit for sensing a physical quantity according to an embodiment of the present invention includes a first oscillator circuit configured to provide a first clock signal including a first frequency depending on the physical quantity, and a second oscillator circuit configured to provide a second clock signal comprising a second frequency depending on the physical quantity. The circuit also includes a frequency comparator circuit configured to provide a frequency signal indicative of the physical quantity, the frequency signal being based on the first and second frequencies, wherein the first and second oscillator circuits are configured to provide the first and second clock signals such that due to a change in the physical quantity one frequency of the first and second frequencies increases, while the other frequency of the first and second frequencies decreases.

Abstract: A temperature sensor, a processor including the same, and a method of operating the same are provided.

Abstract: A temperature sensing device for an integrated circuit comprises an oscillator (2) having a characteristic frequency dependent on the temperature and a digital counter (16) arranged to count a number of pulses generated by the oscillator (2) in a given time interval, or the time taken for the oscillator to generate a given number of pulses. Either of these gives a measured value. The device is configured to use a difference between the measured value and a stored reference value in a linearisation algorithm to estimate a temperature.

Abstract: A non-touch thermometer that senses temperature from a digital infrared sensor is described. A digital signal representing a temperature without conversion from analog is transmitted from the digital infrared sensor received by a microprocessor and converted to body core temperature by the microprocessor.

Abstract: A temperature test unit includes two thermometers each having a probe for detecting a temperature at a heat exchanging system, a processing mechanism electrically connected to the thermometers for receiving and processing the temperature readouts, and for obtaining a temperature difference between the temperature readouts, and a displayer device electrically connected to the processing mechanism and having two portions for displaying the temperature readouts of the thermometers, and another portion for displaying the temperature difference between the temperature readouts of the thermometers and for allowing the user to diagnose the problem in the heat exchanging system correctly and instantly.

Abstract: In one embodiment, a current sensing circuit corrects for the transient and steady state temperature measurement errors due to physical separation between a resistive sense element and a temperature sensor. The sense element has a temperature coefficient of resistance. The voltage across the sense element and a temperature signal from the temperature sensor are received by processing circuitry. The processing circuitry determines a power dissipated by the sense element, which may be instantaneous or average power, and determines an increased temperature of the sense element. The resistance of the sense element is changed by the increased temperature, and this derived resistance Rs is used to calculate the current through the sense element using the equation I=V/R or other related equation. The process is iterative to continuously improve accuracy and update the current.

Abstract: The present disclosure relates to an apparatus and method for estimating a temperature of a motor using a Hall sensor. The method includes detecting, at a digital Hall sensor, a position of a rotor included in a motor and outputting an on signal in an operating period and an off signal in a release period according to a relative position of the rotor, calculating, at a temperature determining module, a difference between duration of the operating period and duration of the release period according to an output waveform of the digital Hall sensor, and then determining, at the temperature determining module, a temperature of the motor with reference to a temperature corresponding to the duration difference. Accordingly, it is possible to estimate the internal temperature of a motor without installing a temperature sensor in the motor, to maintain a small size of the motor, and to reduce production costs.

Abstract: A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

Abstract: In accordance with some embodiments of the present disclosure, a calibrated temperature measurement system comprises a resistor, a thermistor, a resistance-to-current converter configured to generate a current signal based on a resistance, and an analog-to-digital converter (ADC) configured to receive a first current signal based on the resistor, convert the first current signal into a first digital signal, receive a second current signal based on the thermistor, and convert the second current signal into a second digital signal. A memory may comprise resistor-characterization information. A calculation stage communicatively coupled to an ADC output may be configured to determine a first digital value based on the first digital signal, determine a second digital value based on the second digital signal, calculate a resistance ratio based on the first digital value and the second digital value, and determine a temperature output value based on the resistance ratio and the resistor-characterization information.

Abstract: A temperature measurement system is disclosed. In accordance with some embodiments of the present disclosure, a temperature measurement system may comprise a resistor, a thermistor, a resistance-to-current converter configured to generate a current signal based on a resistance, an analog-to-digital converter (ADC) configured to receive a first current signal based on the resistor, convert the first current signal into a first digital signal, receive a second current signal based on the thermistor, and convert the second current signal into a second digital signal, and a calculation stage communicatively coupled to an ADC output and configured to determine a first digital value based on the first digital signal, determine a second digital value based on the second digital signal, calculate a resistance ratio based on the first digital value and the second digital value, and determine a temperature output value based on the resistance ratio.

Abstract: A detached-type temperature indicator and method for using the same is disclosed. The indicator includes a temperature sensing module and a temperature display module. These two modules are separated apart with a distance, and the temperature change sensed by the temperature sensing module can be displayed on the separate temperature display module without using any power sources. This indicator is suitable for observing the magnetic sensing patterns which reflect the temperature variations within the package from the exterior of the package without opening the package. Also, this indicator may be used repeatedly.

Abstract: A coupling-based non-contact type temperature measurement system includes a controller, a drive circuit connected to the controller, a switch circuit connected to the drive circuit, a resonance circuit connected to the switch circuit, a temperature sensor coupled to the resonance circuit, and a signal detection circuit connected to the resonance circuit and the controller. In the measurement system, the temperature sensor is isolated from other components of the system, and non-contact type temperature measurement of an object is implemented through electromagnetic coupling. Further provided is a measurement method of a coupling-based non-contact type temperature measurement system.

Abstract: A temperature sensor generates a variable voltage whose level decreases linearly as a temperature increases, and compares the variable voltage with first and second reference voltages to generate first and second temperature codes to measure the temperature.

Abstract: An apparatus, in one embodiment, can include a configuration including a plurality of heat generation devices. The apparatus also includes a plurality of thermal sensors respectively, operably connected to each of the plurality of heat generation devices, wherein each thermal sensor of the plurality of thermal sensors includes a respective output terminal configured to provide a voltage representative of the temperature of the respective heat generation device. The apparatus further includes an output circuit configured to output the highest temperature information among the heat generation devices. The output terminals of the plurality of thermal sensors are tied together. A corresponding method is also discussed.

Abstract: During operation of the device, a drive circuit may provide a drive signal having a fundamental frequency to two electrothermal filters (ETFs) having different temperature-dependent time constants. In response to the drive signal, the two ETFs may provide signals having the fundamental frequency and phases relative to the drive signal corresponding, respectively, to the time constants of the ETFs. Then, phase-shift values of the phases may be measured using a phase detector, and a signal may be output based on the phase-shift values. Note that the signal may correspond to a value that is a function of a temperature of the device.

Abstract: According to one aspect of the present disclosure, a device and technique for monitoring temperature of an environment of a sensitive object is disclosed. The device includes a housing configured to be disposed within or affixed to a transport container for the object, a sensor coupled to the housing and configured to obtain a plurality of temperature readings, and monitor logic configured to compare the plurality of temperature readings to a temperature threshold. The device also includes counter logic configured to generate an excursion count indicating a quantity of time periods the temperature readings exceeded the temperature threshold, generate a consecutive count indicating a quantity of consecutive temperature readings exceeding the temperature threshold, and generate a cumulative count indicating a cumulative quantity of temperature readings exceeding the temperature threshold.

Abstract: An on-the-go monitor and control means and method for an agriculture machines includes on-the-go soil sensors that can be used to control tillage and seeding depth. On seeder implements, the sensors provide information that affects uniform plant emergence.

Abstract: In a method for determining a state of an apparatus, detected temperatures are received from a plurality of sensors and are compared to at least one preset condition. The state of the apparatus is determined based upon the comparison.

Abstract: A thermometer includes a temperature sensor, a controller configured to receive a signal from the temperature sensor, and an output configured to display a temperature determined by the controller from the signal.

Abstract: At least one indicator light is located on the body or probe sections of a thermometer to indicate to the user that adjustments should be made to the timing or probe cover positioning of the thermometer. Additionally or alternatively the thermometer retains and displays information from previous uses, and in particular displays information pertaining to how long ago the last temperature measure was taken. Additionally, the thermometer may include additional buttons which can function to toggle the display to provide various types of information to the user, or toggle between thermometer usage modes, icon display, and LED color, among others. In another aspect, an internal body section with an access door provides access to a button allowing the user to toggle the interface of the thermometer, such as whether the temperature output is in degrees Fahrenheit or degrees Centigrade.

Abstract: A power device temperature monitor is provided. The power device temperature monitor includes a power device having a control terminal and an output terminal, where the output terminal is configured to output a current as directed by a voltage of the control terminal. The power device temperature monitor includes an inductor coupled to the output terminal of the power device and an amplifier coupled to the inductor. The power device temperature monitor includes a computing device that receives an output of the amplifier, the computing device is configured to derive a temperature of the power device based upon the output of the amplifier.

Abstract: An electronic thermometer capable of displaying temperature by picture includes a body, a micro-controller, a display screen and a temperature-sensing element. The body has a measurement portion. The micro-controller is disposed in the body. The display screen is combined in the body. The temperature-sensing element is provided in the measurement portion and electrically connected to the micro-controller. A temperature signal sensed by the temperature-sensing element is transmitted to the micro-controller. The micro-controller converts the temperature signal into a temperature value comprising a measured integer value and a measured decimal value. The micro-controller converts the measured decimal value into a picture. The display screen is configured to display the measured integer value and the picture. The present invention further provides a method for displaying temperature measured by an electronic thermometer by picture.

Abstract: Both a device-identification feature and a temperature-sensor feature are combined on a single integrated circuit. In various embodiments, both features are not operative simultaneously.

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: According to one embodiment, an electronic thermometer includes a temperature sensing unit, a conversion unit, an FSK modulation unit, and a transmission unit. The temperature sensing unit detects the temperature of a subject. The conversion unit converts a result detected by the temperature sensing unit to a digital signal. The FSK modulation unit converts the digital signal from the conversion unit to an FSK modulation signal. The transmission unit outputs a transmission signal including a pilot signal having a frequency assigned to the FSK (frequency shift keying) modulation signal and the FSK modulation signal subsequent to the pilot signal.

Abstract: An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

Abstract: A temperature detection circuit on an integrated circuit has a temperature sensitive oscillator, at least one temperature insensitive oscillator, a reference clock, process detection circuitry coupled to an output of the temperature insensitive oscillator and the output of the reference clock, the process detection circuitry to compare the outputs and produce a process signal, and temperature reference circuitry coupled to an output of the temperature sensitive oscillator, the output of the reference clock, and the process signal, the temperature detection circuitry to produce a temperature for the integrated circuit.

Abstract: A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.

Abstract: Provided is a temperature sensing circuit and a temperature sensing method including a delay unit delaying an input clock signal to generate a feedback clock signal, and including logic gates of which delay times are variable according to temperature, a delay control unit comparing the feedback clock signal with a reference clock signal and controlling each of the logic gates of the delay unit according to the comparison result, and an input signal control unit selecting, as the input clock signal, any one of the feedback clock signal and the reference clock signal to input the input clock signal to the delay unit.

Abstract: In one aspect, a data processing system includes a virtual temperature sensor to provide system temperature for different system configurations, and a controller coupled to the sensor to control operations of the data processing system according to the virtual temperature. The virtual temperature sensor typically derives the temperature of a particular configuration of the data processing system using mathematical models or one or more operating parameters of the data processing system. In one example, the mathematical models include a characterization table which provides the measured temperature data from various system configurations. These measurements are performed with temperature sensors positioned in ideal locations for different configuration, and are preprocessed to provide the virtual temperature computation. The characterization table also includes thermal characteristics, such as thermal time constant and thermal resistance, of the critical components at multiple thermal control states.

Abstract: A method of calibrating a thermal sensor includes setting a wafer to a control temperature. The wafer includes the thermal sensor and other chip logic. The method also includes applying power exclusively to a thermal sensor circuit, calibrating the thermal sensor, and storing a calibration result. The method also includes retrieving the calibration result upon application of power to the other chip logic.

Abstract: A time-domain temperature sensing system for supporting a single-point calibration is disclosed. Under a single calibration temperature, the digital output of the temperature sensing system is adjusted by a calibration circuit to a specific value, and the generated calibration parameter thereof can be stored in the same chip of the temperature sensing system or in an off-chip component such as a non-volatile memory. Accordingly, the drawback which is caused by the high cost of a conventional two-point calibration in prior art is solved.

Abstract: An apparatus, in one embodiment, can include a configuration including a plurality of heat generation devices. The apparatus also includes a plurality of thermal sensors respectively, operably connected to each of the plurality of heat generation devices, wherein each thermal sensor of the plurality of thermal sensors includes a respective output terminal configured to provide a voltage representative of the temperature of the respective heat generation device. The apparatus further includes an output circuit configured to output the highest temperature information among the heat generation devices. The output terminals of the plurality of thermal sensors are tied together. A corresponding method is also discussed.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal sensor power savings using a toggle control. In some embodiments, an integrated circuit (e.g., a memory device) includes an on-die thermal sensor, a storage element (e.g., a register), and toggle logic. The toggle logic may transition the thermal sensor from a first power consumption level to a second power consumption level responsive, at least in part, to a toggle indication.

Abstract: A time difference adder included in a system-on-chip (SOC) includes a first register unit and a second register unit. The first register unit is configured to receive first and second input signals having a first time difference, and generate a first output signal in response to a first signal. The second register unit is configured to receive third and fourth input signals having a second time difference, and generate a second output signal having a third time difference with respect to the first output signal in response to the first signal. The third time difference corresponds to a sum of the first time difference and the second time difference.

Abstract: A system and method for using a common subchannel to assess operating characteristics of one of a plurality of transducers coupled to said subchannel is disclosed. The transducers are divided into subsets, with each subset is coupled to a subchannel. The system is configured to activate a selected transducer on the subchannel and the subchannel delivers operational information on the activated transducer. The present invention reduces the number of subchannels required to collect information on the plurality of transducers. The present invention permits a more compact ablation device to be constructed based on the invention's ability to reduce the total number of subchannels required to collect transducer information.

Abstract: Systems, methods and apparatus are provided through which in some implementations a digital thermometer generating the measured temperature by a microprocessor that is operably coupled to an infrared sensor through a data acquisition circuit, determining by the microprocessor in which temperature range of a plurality of temperature ranges is the measured temperature, yielding a determined temperature range, identifying by the microprocessor a display characteristic that is associated with the determined temperature range, yielding an identified display and activating the color display device through a bridge in accordance with the identified display characteristic.

Abstract: A temperature sensing apparatus disposed inside a chip includes first and second current generation circuits, first and second current-to-frequency converters, and a counting unit. The first current generation circuit is configured to generate a first current varying proportional to the temperature of the temperature sensing apparatus. The second current generation circuit is configured to generate a second current independent of temperature. The first current-to-frequency converter is configured to generate a first frequency signal with a first frequency indicative of the first current, and the second current-to-frequency converter is configured to generate a second frequency signal with a second frequency indicative of the second current. The counting unit is configured to generate a digital signal indicative of the temperature according to the difference between the first and second frequencies.