By Thermoelectric Potential Generator (e.g., Thermocouple) Patents (Class 374/179)
  • Patent number: 8920027
    Abstract: In a semiconductor device or test structure, appropriate heating elements, for instance in the form of resistive structures, are implemented so as to obtain superior area coverage, thereby enabling a precise evaluation of the thermal conditions within a complex semiconductor device. In particular, the device internal heating elements may allow the evaluation of hot spots and the response of a complex metallization system to specific temperature profiles, in particular at critical areas, such as edge regions in which mechanical stress forces are typically highest in contact regimes in which the package substrate and the metallization system are directly connected.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: December 30, 2014
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Michael Grillberger, Matthias Lehr, Frank Kuechenmeister, Steffen Koch
  • Publication number: 20140376594
    Abstract: A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 25, 2014
    Applicant: Daily Instruments d/b/a Daily Thermetrics Corp.
    Inventors: Jeffrey N. Daily, Larry Welch, Yean C. Chan
  • Publication number: 20140376593
    Abstract: A cooled thermocouple arrangement (1) including a thermocouple (2) comprising two wires (3,4) joined at a first sensing end (5) to define a hot thermocouple function. At least a portion of the wires (3,4) are in thermal communication with a cooling arrangement, and the cooling arrangement has an inlet (14) for coolant and an outlet (15) for coolant. The thermocouple probe arrangement (1) includes a first inlet temperature sensor (21) for determining the temperature of the coolant as it enters the cooling arrangement, and a flow rate sensor (20) for determining the flow rate of coolant passing through the cooling arrangement. The thermocouple probe arrangement (1) includes connectors for connecting the outputs from the thermocouple (2), first inlet temperature sensor (21) and the flow rate sensor (20) to a correction data processor (23) whereby the data processor can correct the temperature sensed by the thermocouple to take account of the effect of the cooling arrangement.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 25, 2014
    Inventors: James Ewing, Daniel Loveless
  • Publication number: 20140369386
    Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
    Type: Application
    Filed: June 18, 2014
    Publication date: December 18, 2014
    Inventors: Praveen Kumar Radhakrishnan, Dino Faralli
  • Patent number: 8911148
    Abstract: A temperature detector for a contact thermometer of process measurement technology having a thermowell, at least one thermal sensor element arranged in a process-side end of the thermowell, and at least one electrical connecting means connected to the thermal sensor element with a first connection side and extending in the thermowell at least up to an evaluation-side end of the thermowell, so that the thermal sensor element can be electrically contacted via a second connection side of the electrical connecting means, and in which the electrical connecting means is formed by a connection printed circuit board with conducting paths.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: December 16, 2014
    Assignee: INOR Process AB
    Inventor: Hans-Owe Mårtensson
  • Patent number: 8911144
    Abstract: A product critical temperature during freeze drying is determined. The product is imaged using optical coherence tomography (“OCT”). The product is freeze dried while the temperature of the product is measured. The product critical temperature is the temperature at which a product structure event occurs during freeze drying.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: December 16, 2014
    Assignee: Physical Sciences, Inc.
    Inventors: Mircea Mujat, William J. Kessler
  • Publication number: 20140355652
    Abstract: A sealed, immersible, fast responding, coaxial thermocouple assembly and mounting arrangement thereof, for fast temperature reading of high flow rate liquid streams in mixing valves comprising an insulated first-metal wire and a surrounding dissimilar second-metal tube, the second-metal tube is crimped at a first end over a stripped extremity of the insulated first-metal wire to form a large surface area, sealed thermocouple junction, shaped as a radial array of fins axially extending along a tip portion of the thermocouple assembly. A collar ring holder and elbow mounting arrangement is maintaining the thermocouple assembly longitudinal axis principally in the direction of the flow of the liquid stream axially flowing along the tip portion and at least an additional substantial portion of the thermocouple assembly length.
    Type: Application
    Filed: December 23, 2012
    Publication date: December 4, 2014
    Inventor: Eitan Rivlin
  • Patent number: 8899828
    Abstract: A heat sensor has the ability to correct for errors introduced during temperature changes of the hot junction of the thermopile for the heat sensor. For example, the effect of temperature changes at the hot junction of the heat sensor relative to the cold junction is mathematically modeled such that the effect on the temperature determination can be corrected given certain information relating to the thermopile, its electrical output, and the temperature history and current temperature of the cold junction. By accounting for these factors, a processing device can modify the temperature determination output for the heat sensor while correcting for error introduced by temperature changes at the hot junction as determined by the mathematical model.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: December 2, 2014
    Assignee: Texas Instruments Incorporated
    Inventor: Habib Sami Karaki
  • Publication number: 20140348207
    Abstract: A temperature probe comprises a thermocouple with a cross-section having flattened sides and rounded ends, and a method of manufacturing a thermocouple for a temperature probe comprising the step of flattening a round thermocouple wire.
    Type: Application
    Filed: December 24, 2012
    Publication date: November 27, 2014
    Applicant: MARINE CANADA ACQUISITION INC.
    Inventors: Bruce Wilnechenko, Greg Eastman, Steve Locke
  • Publication number: 20140348208
    Abstract: A temperature detector and method of measuring temperature to obtain temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the temperature detector that are influenced by the temperature. The temperature detector can be arranged such that a plurality of measurements can be obtained to provide sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.
    Type: Application
    Filed: August 7, 2014
    Publication date: November 27, 2014
    Inventor: Hashem M. Hashemian
  • Publication number: 20140334523
    Abstract: A probe thermometer comprises a main body, a probe, a self-tapping thread, a temperature sensing unit and a display unit. The interior of the main body has a circuit board. The probe includes a measuring end and a coupling end which couples the main body. The self-tapping thread is formed on the measuring end. The temperature sensing unit is disposed within the probe and the temperature sensing unit is electrically connected to the circuit board. The display unit is disposed on the main body. The display unit, the temperature sensing unit and the circuit board are electrically connected. Thereby, the probe thermometer of the instant disclosure is convenient and effectively reduces cost.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 13, 2014
    Applicant: RADIANT INNOVATION INC.
    Inventors: TSENG-LUNG LIN, HSIAO-YU TSAI, AN-CHIN LAI
  • Publication number: 20140334524
    Abstract: The invention relates to a thermocouple for sensing the temperature at a measurement point, comprising a first conductor that has a first end and a first terminal, and a second conductor that has a second end and a second terminal. The first end of the first conductor and the second end of the second conductor are in electric contact with one another at the measurement point, while the first terminal of the first conductor and the second terminal of the second conductor can each be connected to a terminal line. The first conductor and the second conductor are applied to a substrate using thick-film technology, the first end of the first conductor and the second end of the second conductor overlapping in at least some sections at the measurement point. A hot runner nozzle has a heater and a thermocouple according to the invention.
    Type: Application
    Filed: August 2, 2012
    Publication date: November 13, 2014
    Applicant: GUENTHER Heisskanaltechnik GmbH
    Inventors: Herbert Guenther, Siegrid Sommer, Stefan Sommer, Frédéric Zimmermann
  • Publication number: 20140328374
    Abstract: There is proposed a Pt vs. Pt-Rh based thermocouple such as an S thermocouple (Pt vs. Pt-10% Rh alloy) or an R thermocouple (Pt vs. Pt-13% Rh alloy) having temperature characteristics equivalent to those of conventional ones and being free from disconnection of a wire during handling and use. The present invention is characterized in that, in the Pt—PtRh based thermocouple of Pt vs. Pt—Rh alloy, a Pt wire has a Pt purity of 5N or higher and has an oxide dispersed therein. As for the Pt wire of the thermocouple according to the present invention, it is preferable that a Zr oxide in an amount of 0.02 to 0.5 mass % in terms of Zr is dispersed therein.
    Type: Application
    Filed: November 5, 2012
    Publication date: November 6, 2014
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Haruki Yamasaki, Tokio Hamada, Takeomi Kodama
  • Publication number: 20140328371
    Abstract: A device for measuring the temperature of water covering a road surface includes a member for measuring water temperature and channelling means for channelling the water covering the road surface. The channelling means includes a measuring chamber for measuring the temperature of the water covering the road surface. The measuring member includes a temperature measuring head situated in the measuring chamber. The device also includes driving means for driving the device over the road surface, the means being arranged in such a way that the temperature measuring head is situated at some distance from the road surface.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventor: JEREMY BUISSON
  • Patent number: 8870455
    Abstract: A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: October 28, 2014
    Inventors: Jeffrey N. Daily, Larry Welch, Yean C. Chan
  • Patent number: 8864378
    Abstract: A process variable transmitter for measuring a temperature of an industrial process, includes a first electrical connector configured to couple to a first wire of a thermocouple, the first electrical connector includes a first electrode and a second electrode. The first and second electrodes are configured to electrically couple to the first wire of the thermocouple. A second electrical connector is configured to couple to a second wire of the thermocouple, the second electrical connector includes a third electrode and a fourth electrode. The third and fourth electrodes are configured to electrically couple to the second wire of the thermocouple. The second wire is of a different material than the first wire. Measurement circuitry is coupled to the first and second electrical connectors configured to provide an output related to a temperature of the thermocouple.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: October 21, 2014
    Assignee: Rosemount Inc.
    Inventors: Jason H. Rud, Clarence Holmstadt
  • Patent number: 8868962
    Abstract: A monitoring circuit for an integrated circuit comprises a non-temperature-inverted circuit and a temperature-inverted circuit. Operating parameters of the two circuits are measured, representing the propagation speed of signals in the respective circuits. In response to a change in temperature, the non-temperature-inverted circuit slows down and the temperature-inverted circuit speeds up. In contrast, in response to a change in operating voltage both circuits either speed up or slow down. This divergence in response to temperature and similar response to voltage enables the monitoring circuit to distinguish between changes in operating voltage and changes in operating temperature.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: October 21, 2014
    Assignee: ARM Limited
    Inventors: James Edward Myers, David Walter Flynn, Bal S Sandhu
  • Patent number: 8858074
    Abstract: A temperature probe includes a flange, a support structure, thermocouple wires, and guide plates. The flange has a midline. The support structure is attached to the midline and extends away from the flange. The thermocouple wires extend along the support structure, and terminate in a set of outer sensing tips and a set of inner sensing tips. The guide plates secure the thermocouple wires to the support structure. The guide plates are offset laterally from the midline of the flange.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: October 14, 2014
    Assignee: United Technologies Corporation
    Inventors: Michael D. Greenberg, Ryan Spence, William T. Kelly, Joseph DeLorme, Bobby J. McLarty
  • Patent number: 8840301
    Abstract: A diverse and redundant resistance temperature detector (“D&R RTD”) is provided. The D&R RTD is utilized in obtaining temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the D&R RTD that are influenced by the temperature. Furthermore, the D&R RTD's are arranged such that a plurality of measurements can be obtained, which provides sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: September 23, 2014
    Inventor: Hashem M. Hashemian
  • Publication number: 20140269837
    Abstract: A system to continuously and redundantly monitor a magnetic drive system includes temperature sensors coupled to the magnetic drive system. The temperature sensors are coupled to a transmitter, which generates output signals representing the temperatures of the temperature sensors. The system includes a transreceiver and a controller, where the transreceiver is coupled to the transmitter and configured to receive the output signals of the transmitter. The controller is communicatively coupled to the transreceiver and the magnetic drive system and is configured to control operation of the magnetic drive system based on one or more signals received from the transreceiver.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: MagnaDrive Corporation
    Inventors: Dan Durland, Mike Tomczak, Jeongkwan Lee, Stephen Knudsen
  • Publication number: 20140269821
    Abstract: A method of using a thermocouple is provided. The method includes, but is not limited to, disposing at least one temperature sensor at each of two or more respective portions of an electrical connector adapted to receive thermocouple signals, measuring temperatures at the two or more portions, and calculating the temperatures at each terminal of the electrical connector based on measured temperature values of the two or more respective portions having the disposed temperature sensors. The method also includes, but is not limited to, calculating a cold junction temperature of a terminal for at least one thermocouple channel carrying the thermocouple signals based on measured or calculated temperature values of the terminals, or a combination thereof.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Fred Dennis Egley, John Distinti, Peter Norton, Andrea Wang
  • Publication number: 20140263275
    Abstract: Embodiments of the present disclosure provide apparatus and methods for improving process uniformity. Particularly, embodiments of the present disclosure provide a rotatable temperature controlled substrate support for a semiconductor processing chamber. The rotatable temperature controlled substrate support includes one or more heating elements, one or more temperature sensors and cooling channels for circulating a cooling/heating fluid in the rotatable temperature controlled substrate support. One embodiment of the present disclosure includes a thermocouple extension assembly for extending cold junctions of the thermocouple in the substrate support away from the substrate support. The thermocouple extension assembly includes extension cords formed from materials matching with the materials of thermocouple.
    Type: Application
    Filed: February 14, 2014
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Tuan Anh NGUYEN, Sanjeev BALUJA, Amit Kumar BANSAL, Juan Carlos ROCHA-ALVAREZ
  • Publication number: 20140269835
    Abstract: A method, device, and system for improved measurement of fluid temperatures are provided. In one embodiment, a temperature probe structure comprises a header having a cavity; a longitudinal probe disposed at least partially within the cavity of the header; a temperature detector disposed within the longitudinal probe; and an insulator disposed between the header and the longitudinal probe for insulating the longitudinal probe from the header.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: ROBERT GARDNER, Louis DeRosa
  • Publication number: 20140269836
    Abstract: A sensor is disclosed. The sensor includes a substrate including a cold junction area and a hot junction area and a thermocouple including a pair of thermoelectric elements which is formed to extend linearly between the cold junction area and the hot junction area, and stacked on an upper surface of the substrate. Wherein, a stepwise portion is formed adjacent to an end portion of the thermocouple by removing a portion adjacent to an end portion of one of the pair of thermoelectric elements, and a wiring part of metal is formed in the stepwise portion so as to connect electrically the pair of thermoelectric elements each other.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Inventor: Hidenori KATO
  • Patent number: 8834018
    Abstract: This disclosure is directed to apparatuses, systems, and methods that can quickly and reliably determine a stationary or non-stationary change in temperature. During a simulated test of, for example, the heater system of an automated and/or high-speed composite material placement machine may be evaluated at any single location along a course whether a lay down material is heated below, at, or beyond its particular temperature requirements. Temperature measurements can be of a heat source that is moving at a rate from zero to over 3000 inches/minute. Temperature measurements of a moving heat source are reliable within a variance of approximately plus or minus 3° F. In addition, temperature measurements of a moving heat source on a laminated material may be had with a plurality of sensors along at least one direction and to various depths.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: September 16, 2014
    Assignee: The Boeing Company
    Inventor: Mark Kim
  • Patent number: 8826711
    Abstract: An apparatus for measuring the temperature of a rolling material is capable of accurately measuring the temperature of a rolling material by putting a temperature-measuring unit in contact with a surface of the rolling material that is extracted from a heating furnace and conveyed on a roller table to the next process, and moving the temperature-measuring unit contacting the surface of the rolling material together with the rolling material in the conveyed direction thereof.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: September 9, 2014
    Assignee: Hyundai Steel Company
    Inventors: Gapsoo Lim, Yongkook Park
  • Patent number: 8827553
    Abstract: The exemplary embodiments relate to an autonomous temperature transmitter for use in process installations. In order to feed an electronic component with energy, a thermoelectric transducer is arranged such that it is thermally operatively connected to at least one thermal conducting element between an internal thermal coupling element and an external thermal coupling element, the internal thermal coupling element being thermally coupled to the process medium and the ambient air flowing around the external thermal coupling element.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: September 9, 2014
    Assignee: ABB Technology AG
    Inventors: Holger Kaul, Manfred Wetzko, Marco Ulrich, Peter Krippner, Philipp Nenninger, Yannick Maret
  • Patent number: 8822240
    Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: September 2, 2014
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Tetsuya Kosugi, Masaaki Ueno, Hideto Yamaguchi
  • Patent number: 8821014
    Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: September 2, 2014
    Assignees: Tokyo Electron Limited, Fenwal Controls of Japan, Ltd.
    Inventors: Takanori Saito, Koji Yoshii, Tsutomu Kurihara, Tomoya Okamura
  • Patent number: 8821013
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: September 2, 2014
    Assignee: Corning Incorporated
    Inventors: Daniel R Boudreault, Kenneth P Ehrlich, David D Rye
  • Patent number: 8814428
    Abstract: A temperature sensor is described that comprises a temperature sensing element, a substantially thermally insulating substrate having a first side and a second side and at least one layer of substantially thermally conductive material coated on the first side of the substrate. A first hole is provided on the second side of the substrate and the temperature sensing element is arranged to sense temperature within the first hole. A plurality of additional holes may also be provided on the second side of the substrate, these holes may be coated to aid thermal transfer. The temperature sensing element may be a thermocouple. The temperature sensor may be included in a temperature measurement probe for use in measuring the temperature of workpieces produced using a machine tool.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: August 26, 2014
    Assignee: Renishaw PLC
    Inventor: Jean-Marie Chancy
  • Patent number: 8813539
    Abstract: An electrochemistry apparatus comprises a supporting body and a reaction layer for generating electromotive force. The supporting body is made of a first material. The reaction layer covers the surface of the supporting body and comprises an ion conductive layer, a first film electrode and a second film electrode. The first and the second film electrodes are separately formed on two opposite surfaces of the ion conductive layer. The ion conductive layer is made of a second material having a thermal expansion coefficient approximating to the thermal expansion coefficient of the first material. The second material has an ionic conductivity greater than the ionic conductivity of the first material. The first material has a toughness greater than the second material. The electrochemistry apparatus employs the supporting body with improved toughness and the ion conductive layer with improved ion conductivity, so as to increase sensitivity and thermal shock resistance.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: August 26, 2014
    Assignee: National Taiwan University of Science and Technology
    Inventors: Chen-Chia Chou, Tsung-Her Yeh
  • Patent number: 8801276
    Abstract: A portable temperature sensing probe having a plurality of thermocouples is inserted into a tank mounted on a truck or other receptacle at the time of loading a hot liquid, e.g., molten sulfur. The probe and at least a portion of the associated wiring or leads are attached to the loading pipe and/or discharge nozzle, and the probe is inserted into the interior of the tank before the molten sulfur is discharged. The signals from the plurality of thermocouples are amplified and the corresponding temperature information is transmitted to a display and control device. Due to the significant differential between the temperature of the rising molten sulfur and the vapors in the tank overhead space, the signals generated indicate which of the thermocouple are in contact with molten sulfur or the vapor zone. The generated signals adjust the shut-off valve that controls the flow of molten sulfur into the tank.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: August 12, 2014
    Assignee: Saudi Arabian Oil Company
    Inventor: Adel S. Al-Misfer
  • Publication number: 20140211830
    Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 31, 2014
    Applicants: Fenwal Controls Of Japan, Ltd., TOKYO ELECTRON LIMITED
    Inventors: TAKANORI SAITO, KOJI YOSHII, TSUTOMU KURIHARA, TOMOYA OKAMURA
  • Patent number: 8790008
    Abstract: A device for measuring the temperature of a substrate comprising a thermocouple comprising electric wires joined to each other at least one junction; a fixing element suitable for fixing said junction to said substrate in order to measure its temperature; characterized in that the fixing element comprises a thermally conductive element suitable for bearing a portion of electric wires adjacent to said junction; said thermally conductive element being capable of thermally coupling said portion of electric wires to said substrate.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: July 29, 2014
    Assignee: Astrium SAS
    Inventor: Christian Flemin
  • Publication number: 20140204975
    Abstract: There are provided a plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself which is a product, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature, and a temperature measuring apparatus provided with the same.
    Type: Application
    Filed: August 22, 2012
    Publication date: July 24, 2014
    Applicant: Sumitomo Osaka Cement Co., Ltd.
    Inventors: Mamoru Kosakai, Kazunori Ishimura, Takeshi Watanabe, Hitoshi Kouno, Ryuuji Hayahara
  • Patent number: 8770837
    Abstract: Methods and thermowell systems that can be uses in high dynamic pressure environments. A thermocouple system includes a thermowell configured to enter a structure through which a medium flows; an elongated probe provided partially inside the thermowell and configured to measure a temperature; at least one o-ring disposed around the elongated probe at a first end, the o-ring being configured to dampen a vibration for the elongated probe by contacting the thermowell; and an elastomer disposed around the elongated probe section at a second end, the elastomer being configured to dampen the vibration for the elongated probe by contacting the thermowell.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: July 8, 2014
    Assignee: Nuovo Pignone S.p.A.
    Inventors: William C. Egan, Robert Schultz
  • Patent number: 8764289
    Abstract: A thermocouple includes a first housing defining a first interior with an open end, a second housing having a first end and a second end, wherein the second housing is slidably coupled to the first housing with the first end residing within the first interior and the second end residing exteriorly of the first interior and a temperature sensing element, and a seal.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: July 1, 2014
    Assignee: Unison Industries, LLC
    Inventors: John Patrick Parsons, Denis John O'Flynn, James Timothy Hall
  • Patent number: 8757874
    Abstract: Provided in some embodiment is a thermocouple system that includes a printed circuit board having a terminal component connection to couple to a connector of a terminal component, a temperature sensing component connection to couple to a connector of a temperature sensing component, a signal plane thermally coupled to the terminal component connection, and a thermal plane thermally coupled to the temperature sensing component connection and electrically isolated from the terminal component connection and the signal plane. The surface area of the thermal plane overlaps a substantial portion of a surface area of the signal plane.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: June 24, 2014
    Assignee: National Instruments Corporation
    Inventors: Alvin G. Becker, Daniel H. Ousley
  • Publication number: 20140169404
    Abstract: There is provided a system for detecting presence or absence of a heat emitting object, comprising a platform for receiving the object, and the platform defining an area in which a temperature gradient with the object may exist, a thermoelectric device for generating an electrical voltage indicative of the presence or absence of temperature gradient and/or the magnitude of the temperature gradient, and an indicator for indication of the presence or absence of the object to be detected.
    Type: Application
    Filed: December 17, 2012
    Publication date: June 19, 2014
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Tik Hang LAM, Rui-qin ZHANG
  • Publication number: 20140161153
    Abstract: The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 12, 2014
    Applicant: Honeywell International Inc.
    Inventors: Barrett E. Cole, Robert E. Higashi, Peter Tobias
  • Patent number: 8746966
    Abstract: A thermoanalytical instrument, and especially a differential scanning calorimeter, has first and second measurement positions, a heater and a temperature sensor associated with each of the measurement positions, and a controller. The controller, which has an associated means for setting a predetermined temperature program, controls a heating power of the first heater to cause the temperature measured at the first position to follow the temperature program. The controller also controls both heaters to eliminate any temperature difference between the measured first and second temperatures. The controller also provides a means for determining the lower of the measured first and second measured temperatures and applies additional power to the heater associated with that lower measured temperature.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: June 10, 2014
    Assignee: Mettler-Toledo AG
    Inventors: Ernst Van De Kerkhof, Paul Pieter Willem Van Grinsven
  • Patent number: 8746971
    Abstract: In a device and method for taking temperature readings on an HVAC system, a first probe is connectable in thermal communication with the HVAC system for taking a first temperature reading thereof. A second probe is connectable in thermal communication with the HVAC system for taking a second temperature reading thereof that is independent of the first temperature reading. A digital display is connectable to the first and second probes for displaying the first and second temperature readings.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: June 10, 2014
    Assignee: Irwin Industrial Tool Company
    Inventors: Bryan Alfano, Joseph J. Houle
  • Publication number: 20140153612
    Abstract: There is provided a temperature detector adapted to be provided in a temperature sensor for detecting a temperature of a temperature detection target. The temperature detector includes a cylindrical fixing body made of a metal material, the cylindrical fixing body having a single through hole extending therethrough and one axial end portion serving as a fixing portion, a thermocouple having a pair of wires partially inserted into the through hole and a welding material welded to the fixing portion while being at least partially inserted into the through hole to fix the thermocouple to the fixing portion. An end of the thermocouple is exposed on a surface of the welding material by polishing the welding material together with the thermocouple.
    Type: Application
    Filed: November 29, 2013
    Publication date: June 5, 2014
    Applicant: Futaba Corporation
    Inventor: Takumi YONEKURA
  • Publication number: 20140151557
    Abstract: A photonic sensor, comprising: a platform, a temperature sensor on the platform; and a structure formed on or as part of the platform.
    Type: Application
    Filed: December 3, 2012
    Publication date: June 5, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Paul Martin Lambkin, William Allan Lane
  • Publication number: 20140146854
    Abstract: Non-contact and non-invasive temperature measurement structures and methods for thermal processing systems which neither damage nor contaminate the thermal processing environment are provided.
    Type: Application
    Filed: April 19, 2013
    Publication date: May 29, 2014
    Applicant: Solexel, Inc.
    Inventor: Solexel, Inc.
  • Publication number: 20140146853
    Abstract: A temperature emulator may include a stack assembly having a pair of end plates positioned at an uppermost and lowermost location of the stack assembly, a plurality of heat sink plates disposed between the pair of end plates, each of the heat sink plates having a plurality of heat sink cutouts, a plurality of shim plates separating adjacent pairs of the end plates and the heat sink plates, each of the shim plates having a shim cutout, an open cavity formed by a plurality of adjacent heat sink cutouts and shim cutouts, thermal insulation disposed within the cavity, and at least one temperature sensor coupled to at least one of the plurality of heat sink plates.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: The Boeing Company
    Inventor: The Boeing Company
  • Publication number: 20140146855
    Abstract: A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 29, 2014
    Inventors: Karl M. Nelson, Scott R. Campbell
  • Patent number: 8736139
    Abstract: Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: May 27, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Seung Seoup Lee
  • Publication number: 20140137916
    Abstract: A thermoelectric material including a 3-dimensional nanostructure, wherein the 3-dimensional nanostructure includes a 2-dimensional nanostructure connected to a 1-dimensional nanostructure.
    Type: Application
    Filed: June 25, 2013
    Publication date: May 22, 2014
    Applicants: Industry-Academic Cooperation Foundation, Yonsei University, Samsung Electronics Co., Ltd.
    Inventors: Jong-wook ROH, Jung-young CHO, Weon-ho SHIN, Dae-jin YANG, Kyu-hyoung LEE, Un-yong JEONG